CN215345551U

CN215345551U - PCB heat dissipation device for electronic field

Info

Publication number: CN215345551U
Application number: CN202022998985.5U
Authority: CN
Inventors: 朱广秀; 朱金城
Original assignee: Nanjing Institute of Mechatronic Technology
Current assignee: Nanjing Institute of Mechatronic Technology
Priority date: 2020-12-15
Filing date: 2020-12-15
Publication date: 2021-12-28
Anticipated expiration: 2030-12-15

Abstract

The utility model relates to the technical field of PCB heat dissipation, and particularly discloses a PCB heat dissipation device for the electronic field, which comprises a heat dissipation box body; a fixed supporting plate which is used for placing a PCB and is convenient for adjusting the length is arranged in the heat dissipation box body; the heat dissipation box body is internally provided with a heat dissipation mechanism, and the heat dissipation mechanism comprises a plurality of first fans arranged at the bottom of the heat dissipation box body and a second fan arranged at the upper part of the heat dissipation box body. According to the utility model, water supplied into the U-shaped refrigerating pipe is cooled through the refrigerator, low-temperature air outside the heat dissipation box body is sucked into the heat dissipation box body through the second fan, the U-shaped refrigerating pipe has the function of quickly cooling the U-shaped refrigerating pipe, cold air is blown to the surface of the PCB through the blowing pipe to quickly cool the PCB, high-temperature air in the heat dissipation box body is discharged to the outside of the heat dissipation box body through the first fan, and the heat dissipation effect is good.

Description

PCB heat dissipation device for electronic field

Technical Field

The utility model relates to the technical field of PCB heat dissipation, in particular to a PCB heat dissipation device for the electronic field.

Background

The existing PCB needs to be cooled when in use, but the traditional PCB cooling equipment has the disadvantages of slow heat transfer speed, poor temperature equalization performance, high power and high power consumption, so that the manufacturing cost is high, the service life of the PCB is shortened, and the heat dissipation device is inconvenient to install, suitable for cooling of equipment with large volume and poor in practicability because of large volume. For the above situation, the prior patent application numbers are: CN201920762457.4, patent name: the utility model provides a be applied to PCB board heat abstractor's in electron field utility model patent, this patent has proposed one side fixedly connected with fan through the heat dissipation case, the bottom fixedly connected with radiating element of heat dissipation case, radiating element's top fixedly connected with capillary core module, the top of capillary core module is provided with the conveyer pipe, fixedly connected with refrigeration fin between the top of heat dissipation incasement wall and the bottom, improve the radiating effect and the speed of heat transfer of PCB board, the output of PCB board has been improved, the output shaft fixedly connected with bull stick of motor, the fixed surface of bull stick is connected with first gear, the both sides of first gear all mesh there is the second gear.

However, when the PCB heat dissipation equipment is actually used, the heat dissipation mechanism is fixed in structure and cannot meet the heat dissipation requirements of PCBs with different sizes, so that the practicability of the device is low; and the heat dissipation structure is complex, so that the manufacturing cost is high, and the improvement is needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a PCB heat dissipation device for the electronic field, so as to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: a PCB heat dissipation device for the electronic field comprises a heat dissipation box body; a fixed supporting plate which is used for placing a PCB and is convenient for adjusting the length is arranged in the heat dissipation box body; a heat dissipation mechanism is arranged in the heat dissipation box body, the heat dissipation mechanism comprises a plurality of first fans arranged at the bottom of the heat dissipation box body and a second fan arranged at the upper part of the heat dissipation box body, and a first filter screen is arranged above the first fans; a water storage tank is arranged on one side of the outside of the heat dissipation box body, a circulating water pump is arranged in the water storage tank, the circulating water pump is communicated with the U-shaped refrigerating pipe through a water supply pipe, and a refrigerator is arranged on the water supply pipe;

the U-shaped refrigeration pipe is arranged at the top end of the heat dissipation box body, a refrigeration air pipe is arranged on the outer side of the heat dissipation box body at the bottom of the U-shaped refrigeration pipe, an air outlet of the refrigeration air pipe is communicated with a second fan, one end, far away from the refrigeration air pipe, of the second fan is communicated with a blowing pipe, and the blowing pipe is communicated with the moisture-proof box; the top of the blowpipe of PCB below and first filter screen all is provided with rather than being the heat-conducting plate of vertical structure, and the top of heat-conducting plate is connected with and is the absorber plate of vertical structure with the heat-conducting plate, the lower surface butt of absorber plate and PCB board.

Preferably, the top end of the fixed supporting plate is provided with a connecting sliding groove, the inner part of the connecting sliding groove is connected with an extension supporting plate, and the extension supporting plate is matched with the structure of the connecting sliding groove.

Preferably, the bottom of the connecting sliding groove is provided with at least two supporting arms of a strip structure at intervals, and the supporting arms are connected with the bottom of the extension supporting plate in a left-right sliding manner.

Preferably, after the extension supporting plate slides, the extension supporting plate is fixed with the fixed supporting plate and the supporting arm through locking bolts.

Preferably, all be provided with a plurality of fixed screw hole on trailing arm and the fixed layer board, the equidistance is provided with the multiunit and adjusts the screw hole that fixed screw hole position corresponds on the extension layer board, locking bolt and fixed screw hole, regulation screw hole threaded connection.

Preferably, the top end of the heat dissipation box body is provided with an air inlet, the bottom of the air inlet is provided with an air expansion cover with a conical structure, and the air inlet and the air expansion cover are both internally provided with second filter screens.

Preferably, the blowpipe sets up directly over the PCB board, and the bottom of blowpipe is provided with a plurality of blast nozzles, and blast nozzle's air outlet sets up towards the PCB board.

Preferably, a guide plate with an inclined structure is arranged below the U-shaped refrigeration pipe, and a water absorption sponge is laid on the upper surface of the guide plate.

Preferably, the upper part of the bottom end of the guide plate is communicated with a water inlet of a drain pipe, and the drain pipe is communicated with a water storage tank through a water outlet of the U-shaped refrigeration pipe.

Preferably, the moisture-proof box is arranged inside the heat dissipation box body, a plurality of moisture absorption plates filled with moisture-proof agents are arranged inside the moisture-proof box at intervals, the electric heater is arranged at the bottom of the moisture-proof box, and the moisture exhaust pipe is arranged on one side of the top end of the moisture-proof box and arranged outside the heat dissipation box body; and the air blowing pipes and the moisture discharging pipes on the left side and the right side of the moisture-proof box are respectively provided with an electromagnetic valve.

Compared with the prior art, the utility model has the beneficial effects that:

1. the utility model provides a PCB heat dissipation device for the electronic field, which mainly comprises a heat dissipation box body and a heat dissipation mechanism arranged inside the heat dissipation box body, wherein the heat dissipation mechanism mainly comprises a water storage tank arranged outside the heat dissipation box body, a plurality of first fans arranged at the bottom of the heat dissipation box body, a second fan arranged outside the top end of the heat dissipation box body and a U-shaped refrigeration pipe arranged at the top end of the heat dissipation box body.

2. The fixed supporting plate convenient for length adjustment is arranged in the heat dissipation box body, the extension supporting plate connected with the fixed supporting plate in a left-right sliding mode is arranged in the fixed supporting plate, when the heat dissipation mechanism is actually used, the extension supporting plate is pulled and pulled, so that the fixed supporting plate can play a role in supporting PCB plates of various sizes, the stability is high, the heat dissipation mechanism is suitable for cooling requirements of the PCB plates of various sizes, and the heat dissipation mechanism is simple in structure, flexible and practical.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of a specific structure of the fixing plate of the present invention;

FIG. 3 is a schematic view of the U-shaped refrigeration pipe according to the present invention;

fig. 4 is a schematic view showing a specific structure of the moisture-proof box of the present invention.

In the figure: 1. a heat dissipation box body; 2. fixing the supporting plate; 3. a first fan; 4. a second fan; 5. a first filter screen; 6. a water storage tank; 7. a water circulating pump; 8. a U-shaped refrigeration tube; 9. a refrigeration air duct; 10. a blowpipe; 11. connecting the sliding chute; 12. extending the supporting plate; 13. a bracket arm; 14. locking the bolt; 15. fixing the threaded hole; 16. adjusting the threaded hole; 17. a second filter screen; 18. an air expanding cover; 19. a blowing nozzle; 20. a baffle; 21. a water-absorbing sponge; 22. a drain pipe; 23. a water supply pipe; 24. a refrigerator; 25. a heat conducting plate; 26. a heat absorbing plate; 27. a moisture-proof box; 28. a moisture absorption plate; 29. an electric heater; 30. and (4) a moisture removal pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Any one embodiment of the present invention is described below in conjunction with figures 1-4 for further illustration:

example 1: a PCB heat dissipating double-fuselage for electronic field, including the heat-dissipating container body 1; a heat dissipation mechanism is arranged inside the heat dissipation box body 1, the heat dissipation mechanism comprises a plurality of first fans 3 arranged at the bottom of the heat dissipation box body 1 and a second fan 4 arranged at the upper part of the heat dissipation box body 1, a water storage tank 6 is arranged at one side of the outside of the heat dissipation box body 1, a circulating water pump 7 is arranged inside the water storage tank 6, the circulating water pump 7 is communicated with a U-shaped refrigeration pipe 8 through a water supply pipe 23, and a refrigerator 24 is arranged on the water supply pipe 23; the U-shaped refrigeration pipe 8 is installed on the top end of the heat dissipation box body 1, a refrigeration air pipe 9 is arranged on the outer side of the heat dissipation box body 1 at the bottom of the U-shaped refrigeration pipe 8, an air outlet of the refrigeration air pipe 9 is communicated with the second fan 4, and one end, far away from the refrigeration air pipe 9, of the second fan 4 is communicated with the blowing pipe 10.

In this embodiment: when the heat dissipation mechanism is used, water in the water storage tank 6 is pumped into the U-shaped refrigeration pipe 8 through the water supply pipe 23 by the circulating water pump 7, and in the process, the temperature of the water supplied into the U-shaped refrigeration pipe 8 is reduced by the refrigerator 24; low temperature air outside the heat dissipation box body 1 is through air intake suction heat dissipation box body 1 through second fan 4, under the effect of U-shaped refrigeration pipe 8, play rapid cooling's effect to the air that gets into heat dissipation box body 1, the air after will cooling via refrigeration tuber pipe 9 again is leading-in to the blowing pipe 10 in, spout 19 the surface of jetting cold air to the PCB board through blowing, play rapid cooling's effect to PCB, the outside of high temperature air discharge to heat dissipation box body 1 in rethread first fan 3 will dispel the heat the box body 1, moreover, the steam generator is simple in structure, the radiating effect is better.

In this embodiment: first filter screen 5 is installed to the top of first fan 3, prevents that external dust from getting into the inside of heat dissipation box 1, plays dirt-proof effect.

In this embodiment: an air inlet is formed in the top end of the heat dissipation box body 1, an air expansion cover 18 with a conical structure is arranged at the bottom of the air inlet, and second filter screens 17 are arranged inside the air inlet and the air expansion cover 18.

The air diffuser 18 and the second filter screen 17 arranged in the air inlet play a further dustproof role on the heat dissipation box body 1.

In this embodiment: the blowpipe 10 is arranged right above the PCB, the bottom of the blowpipe 10 is provided with a plurality of blowing nozzles 19, and the air outlets of the blowing nozzles 19 are arranged towards the PCB.

The setting of blow nozzle 19 further improves the homogeneity and the pertinence of PCB board cooling, improves the cooling effect.

In this embodiment: a guide plate 20 with an inclined structure is arranged below the U-shaped refrigeration pipe 8, and water-absorbing sponge 21 is paved on the upper surface of the guide plate 20; the upper part of the bottom end of the guide plate 20 is communicated with the water inlet of a drain pipe 22, and the drain pipe 22 and the water outlet of the U-shaped refrigeration pipe 8 are communicated with the water storage tank 6.

The condensed water on the U-shaped refrigeration pipe 8 is guided to the bottom of the guide plate 20 through the guide plate 20, and the condensed water is recycled to the water storage tank 6 through the drain pipe 22 for reuse, so that the energy is saved and the environment is protected.

In this embodiment: the top of the blowpipe 10 and the first filter screen 5 below the PCB board all is provided with rather than being the heat-conducting plate 25 of vertical structure, and the top of heat-conducting plate 25 is connected with and is the absorber plate 26 of vertical structure with heat-conducting plate 25, and the lower surface butt of absorber plate 26 and PCB board.

Partial heat generated by the PCB is guided out to the heat-conducting plate 25 through the heat-absorbing plate 26, and the heat-conducting plate 25 is arranged on the blowpipe 10 and the first filter screen 5, so that the low-temperature environment on the blowpipe 10 and the first filter screen 5 can play a role in quickly cooling the heat-conducting plate 25.

Example 2: the blowpipe is communicated with the damp-proof box, the damp-proof box 27 is arranged in the heat radiation box body 1, a plurality of moisture absorption plates 28 filled with damp-proof agent are arranged in the damp-proof box 27 at intervals, the bottom of the damp-proof box 27 is provided with an electric heater 29, one side of the top end of the damp-proof box 27 is provided with a moisture exhaust pipe 30, and the moisture exhaust pipe 30 is arranged outside the heat radiation box body 1; electromagnetic valves are arranged on the blowpipes 10 and the moisture exhaust pipes 30 on the left side and the right side of the moisture-proof box 27.

Before blowing the cooling to the PCB board through blowing pipe 10, the low temperature air advanced gets into dampproofing case 27 and carries out dampproofing processing work, and after the dampproofing case 27 of low temperature air entering, a plurality of hygroscopic plates 28 in the dampproofing case 27 adsorb, dehumidify layer upon layer, prevent that moist air from causing the damage to the PCB board.

When the heat dissipation box body 1 is idle, the electromagnetic valves on the blowing pipes 10 on the left side and the right side of the moisture-proof box 27 can be closed, the electromagnetic valve on the moisture exhaust pipe 30 is opened, then the moisture-proof box 27 is heated and dried by the electric heater 29, and the moisture air in the moisture-proof box is exhausted to the outside of the heat dissipation box body 1 through the moisture exhaust pipe 30, so that the dehumidification performance of the moisture absorption plate 28 is guaranteed.

Example 3: the inside of the heat dissipation box body 1 is provided with a fixed supporting plate 2 which is used for placing a PCB and is convenient for adjusting the length.

In this embodiment: play the effect of bearing to the PCB board through fixed layer board 2, because the design of this fixed layer board 2 adjustable length for this fixed layer board 2 can play the effect of bearing to the PCB board of multiple size, and stability is stronger, makes this heat dissipation mechanism be applicable to the cooling demand of the PCB board of multiple size, and simple structure has flexibility and practicality concurrently.

In this embodiment: the top end of the fixed supporting plate 2 is provided with a connecting sliding chute 11, the inside of the connecting sliding chute 11 is connected with an extension supporting plate 12 in a sliding manner, and the extension supporting plate 12 is matched with the connecting sliding chute 11 in structure; the purpose of adjusting the length of the fixed supporting plate 2 is achieved by drawing and extending the supporting plate 12.

In this embodiment: one end of the fixed supporting plate 2, which is far away from the inner wall of the heat dissipation box body 1, is provided with at least two supporting arms 13 with strip structures at intervals, and the supporting arms 13 are connected with the bottom of the extension supporting plate 12 in a left-right sliding manner.

Further supporting and fixing effects are achieved on the extension supporting plate 12 through the supporting arm 13, and the stability of the extension supporting plate 12 is improved.

In this embodiment: a plurality of fixing threaded holes 15 are formed in the supporting arm 13 and the fixing supporting plate 2, a plurality of groups of adjusting threaded holes 16 corresponding to the positions of the fixing threaded holes 15 are formed in the extension supporting plate 12 at equal intervals, and the locking bolts 14 are in threaded connection with the fixing threaded holes 15 and the adjusting threaded holes 16.

After the extension supporting plate 12 slides, the extension supporting plate 12 is fixed with the fixed supporting plate 2 and the supporting arm 13 through the locking bolt 14.

It is worth noting that: the whole device realizes control over the device through the controller, and because the equipment matched with the controller is common equipment, the device belongs to the existing mature technology, and the electrical connection relation and the specific circuit structure are not repeated.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a PCB board heat abstractor for the electron field which characterized in that: comprises a heat radiation box body (1); a fixed supporting plate (2) which is used for placing a PCB and is convenient for adjusting the length is arranged in the heat dissipation box body (1); a heat dissipation mechanism is arranged in the heat dissipation box body (1), the heat dissipation mechanism comprises a plurality of first fans (3) arranged at the bottom of the heat dissipation box body (1) and a second fan (4) arranged at the upper part of the heat dissipation box body (1), and a first filter screen (5) is arranged above the first fans (3); a water storage tank (6) is arranged on one side of the outer part of the heat dissipation tank body (1), a circulating water pump (7) is arranged in the water storage tank (6), the circulating water pump (7) is communicated with a U-shaped refrigerating pipe (8) through a water supply pipe (23), and a refrigerator (24) is arranged on the water supply pipe (23);

the U-shaped refrigeration pipe (8) is installed at the top end of the heat dissipation box body (1), a refrigeration air pipe (9) is arranged on the outer side of the heat dissipation box body (1) at the bottom of the U-shaped refrigeration pipe (8), an air outlet of the refrigeration air pipe (9) is communicated with a second fan (4), one end, far away from the refrigeration air pipe (9), of the second fan (4) is communicated with a blowing pipe (10), and the blowing pipe (10) is communicated with a moisture-proof box (27); the top of blowing pipe (10) and first filter screen (5) of PCB board below all is provided with rather than being heat-conducting plate (25) of vertical structure, and the top of heat-conducting plate (25) is connected with and is heat-absorbing plate (26) of vertical structure with heat-conducting plate (25), and heat-absorbing plate (26) and the lower surface butt of PCB board.

2. The PCB heat dissipation device for the electronic field according to claim 1, wherein: the top end of the fixed supporting plate (2) is provided with a connecting sliding groove (11), the inside of the connecting sliding groove (11) is connected with an extension supporting plate (12) in a sliding mode, and the extension supporting plate (12) is matched with the structure of the connecting sliding groove (11).

3. The PCB heat dissipation device for the electronic field according to claim 2, wherein: the bottom of the connecting sliding groove (11) is provided with at least two supporting arms (13) with strip structures at intervals, and the supporting arms (13) are connected with the bottom of the extension supporting plate (12) in a left-right sliding mode.

4. The PCB heat dissipation device for the electronic field according to claim 3, wherein: after the extension supporting plate (12) finishes sliding, the extension supporting plate (12) is fixed with the fixed supporting plate (2) and the supporting arm (13) through a locking bolt (14).

5. The PCB heat dissipation device for the electronic field according to claim 3, wherein: the supporting arm (13) and the fixing supporting plate (2) are provided with a plurality of fixing threaded holes (15), a plurality of groups of adjusting threaded holes (16) corresponding to the fixing threaded holes (15) are arranged on the extension supporting plate (12) at equal intervals, and the locking bolts (14) are in threaded connection with the fixing threaded holes (15) and the adjusting threaded holes (16).

6. The PCB heat dissipation device for the electronic field according to claim 1, wherein:

an air inlet is formed in the top end of the heat dissipation box body (1), an air expansion cover (18) with a conical structure is arranged at the bottom of the air inlet, and second filter screens (17) are arranged inside the air inlet and the air expansion cover (18).

7. The PCB heat dissipation device for the electronic field according to claim 1, wherein: the blowing pipe (10) is arranged right above the PCB, the bottom of the blowing pipe (10) is provided with a plurality of blowing nozzles (19), and air outlets of the blowing nozzles (19) are arranged towards the PCB.

8. The PCB heat dissipation device for the electronic field according to claim 1, wherein: a guide plate (20) with an inclined structure is arranged below the U-shaped refrigeration pipe (8), and a water-absorbing sponge (21) is laid on the upper surface of the guide plate (20).

9. The PCB heat dissipation device for the electronic field according to claim 8, wherein: the upper part of the bottom end of the guide plate (20) is communicated with a water inlet of a drain pipe (22), and the drain pipe (22) is communicated with a water outlet of the U-shaped refrigerating pipe (8) to form a water storage tank (6).

10. The PCB heat dissipation device for the electronic field according to claim 1, wherein: the damp-proof box (27) is arranged inside the heat dissipation box body (1), a plurality of moisture absorption plates (28) filled with a damp-proof agent are arranged inside the damp-proof box (27) at intervals, an electric heater (29) is arranged at the bottom of the damp-proof box (27), a moisture exhaust pipe (30) is arranged on one side of the top end of the damp-proof box (27), and the moisture exhaust pipe (30) is arranged outside the heat dissipation box body (1); the air blowing pipes (10) and the moisture discharging pipes (30) on the left side and the right side of the moisture-proof box (27) are respectively provided with an electromagnetic valve.