CN215335883U

CN215335883U - LED photoelectric module

Info

Publication number: CN215335883U
Application number: CN202121926012.9U
Authority: CN
Inventors: 赵玉博; 马瑾; 吴丹; 吴昌
Original assignee: Jiangsu Tianrunda Photoelectric Technology Co Ltd
Current assignee: Jiangsu Tianrunda Photoelectric Technology Co Ltd
Priority date: 2021-08-17
Filing date: 2021-08-17
Publication date: 2021-12-28
Anticipated expiration: 2031-08-17

Abstract

The utility model relates to the technical field of LED photoelectricity, in particular to an LED photoelectric module, which comprises an LED module, wherein a waterproof photoelectric mechanism is arranged on the LED module, a back clamping mechanism capable of assisting heat dissipation is arranged on the LED module, the photoelectric mechanism comprises a packaging groove, the packaging groove is arranged in the LED module, an LED lamp is arranged on the bottom surface of the inner side wall of the packaging groove, a power wire is arranged at the end part of the LED module, a packaging circuit board is arranged on the side surface of the inner side wall of the LED module, a liquid guiding groove is formed in the LED module, and a water flowing roof is fixedly arranged at the end part of the liquid guiding groove. The LED module is used for outdoor illumination, the LED lamp is mounted in the packaging groove in a plastic packaging mode, the LED module has a good illumination system, good anti-seismic performance and good waterproof performance, compared with the traditional LED module, the plastic packaging device saves plastic on the back of the LED module, saves cost and labor, and meanwhile, the plastic packaging device is used at the front LED lamp, so that the illumination brightness of the LED lamp can not be influenced while the LED module is waterproof.

Description

LED photoelectric module

Technical Field

The application relates to the technical field of LED photoelectricity, in particular to an LED photoelectric module.

Background

The LED module is formed by arranging a certain number of LEDs together according to rules and then packaging the LEDs, the LED module is a product formed by waterproof treatment, the LED module is a product widely applied in LED products, the structural difference and the electronic difference are great, the LED module is simply formed by a circuit board provided with LEDs and a shell, the LED module is complex and is provided with a plurality of controls, the constant current source and the related heat dissipation treatment enable the service life and the luminous intensity of the LEDs to be better, the LED module is mainly used for displaying the night effect of advertising fonts (acrylic and plastic uptake) and marks, the LED module takes characters or marks as media and is arranged on the top or the wall surface of a building, the day effect can be represented, the LEDs can be used as a luminous light source, the other effect can be represented at night, and an LED illumination application control system is matched for carrying out dynamic video control on the characters or the marks, in some places with a strong entertainment atmosphere, the LED light source module has become one of the most important choices for enterprises to display self images, and can be classified into waterproof and non-waterproof according to the sealing property. Waterproof and waterproof module mainly sees the application environment to distinguish, and general waterproof LED module can apply to outdoor illumination and propaganda and use, and it can not take place the problem because of intaking, more is fit for abominable environment and uses, and waterproof module is then mainly indoor more, and current LED module back is light plastic device, and the back plastic device is difficult for the heat dissipation.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to an LED optoelectronic module to solve the above-mentioned problems.

The embodiment of the application adopts the following technical scheme:

LED photoelectric module, including the LED module, be equipped with on the LED module can waterproof photoelectric mechanism, be equipped with on the LED module and can assist radiating back splint mechanism, photoelectric mechanism includes the encapsulation groove, the encapsulation groove is installed in the LED module, the LED lamp is installed to the bottom surface of encapsulation inslot lateral wall, the power cord is installed to the tip of LED module, the side-mounting of LED module inside wall has the encapsulation circuit board, seted up on the LED module and drawn the cistern, the tip fixed mounting who draws the cistern has the flowing water top.

Preferably, be equipped with the circuit board in the LED module, install the fin on the circuit board, back splint mechanism includes heating panel one, heating panel one is installed in the LED module, run through on the LED module and seted up the radiating groove, heating panel one laminates with the encapsulation circuit board mutually, the tip fixed mounting of heating panel one has two heating panels two, the tip of heating panel two is located the radiating groove, install the feed liquor hole on the heating panel one.

Preferably, the side fixed mounting of LED module inside wall has the inner frame, fixed mounting has miniature spring on the inner frame, install the bottom plate on the LED module, bottom plate tip and miniature spring laminating, install the double faced adhesive tape on the bottom plate, fixed mounting has the mount on the LED module.

The embodiment of the application adopts at least one technical scheme which can achieve the following beneficial effects:

one of them, the LED module is used for the outdoor illumination, and the LED lamp adopts the plastic envelope installation in the encapsulation groove, has good lighting system and anti-seismic performance, waterproof performance, compares in traditional LED module, has saved the plastics at back on this LED module basis, has saved cost and manpower, adopts the plastic envelope device in positive LED lamp department simultaneously, can not influence the illumination luminance of LED lamp when waterproof.

And the second heat dissipation groove is communicated with the outside, so that the second heat dissipation plate can quickly dissipate heat, the heat dissipation speed of the LED module is further improved, a user can tear off the double-faced adhesive tape, the glue layer at the bottom of the double-faced adhesive tape can enable the bottom plate to be adhered to the wall, and meanwhile, when the bottom plate is vibrated, the miniature spring on the inner side frame can play a role in buffering through self elasticity, so that the anti-seismic effect is further improved.

Thirdly, this LED module compares with traditional LED module and removes the lamp shade, improves luminance, and lamp portion adopts the immersion type to glue and seals, glues (resin glue) and seals effectually, and is not fragile.

Compared with the traditional LED module, the LED module has less plastic, less plastic consumption, reduced labor and cost and simple process steps; the welding point of the wire is contained in the inner part and is not easy to expose, and the service life is prolonged.

Fifthly, the LED module plastic shell is light in weight, reduces cost, is integrally formed, is light in weight, thinner and better in heat dissipation effect, so that the passing current is large, and the LED brightness is higher.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic structural diagram of an LED module according to the present invention;

FIG. 2 is a schematic structural diagram of a second heat dissipation plate of the present invention;

FIG. 3 is a schematic structural diagram of a first heat dissipation plate of the present invention;

FIG. 4 is an enlarged view of the structure of FIG. 2 at A;

FIG. 5 is an enlarged view of FIG. 3 at B according to the present invention;

fig. 6 is a schematic structural diagram of the heat sink of the present invention.

In the figure: 1. an LED module; 11. a liquid drainage tank; 12. a water flowing roof; 13. a packaging groove; 14. an LED lamp; 15. a power line; 16. packaging the circuit board; 2. a heat sink; 21. a first heat dissipation plate; 22. a second heat dissipation plate; 23. a liquid inlet hole; 24. a fixed mount; 25. an inner side frame; 26. a micro-spring; 27. double-sided adhesive tape; 28. a base plate; 29. a heat sink; 3. a circuit board.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.

Example 1: referring to fig. 1 and 6, the LED photoelectric module includes an LED module 1, a waterproof photoelectric mechanism is disposed on the LED module 1, a back-clip mechanism capable of assisting heat dissipation is disposed on the LED module 1, the photoelectric mechanism includes a package groove 13, the package groove 13 is disposed in the LED module 1, an LED lamp 14 is disposed on a bottom surface of an inner side wall of the package groove 13, a power line 15 is disposed at an end portion of the LED module 1, a package circuit board 16 is disposed on a side surface of an inner side wall of the LED module 1, a liquid guiding groove 11 is disposed on the LED module 1, a water flowing roof 12 is fixedly disposed at an end portion of the liquid guiding groove 11, a circuit board 3 is disposed in the LED module 1, and a heat dissipation fin 29 is disposed on the circuit board 3. .

When in use, the LED module 1 is used for outdoor illumination, the LED lamp 14 is installed in the packaging groove 13 by adopting plastic packaging, and the LED module 1 has good illumination system, shock resistance and waterproof performance, compared with the traditional LED module 1, the LED module 1 saves plastic on the back on the basis of the LED module 1, saves cost and manpower, and simultaneously adopts a plastic packaging device at the position of the front LED lamp 14, and can prevent water and not influence the illumination brightness of the LED lamp 14, the LED lamp 14 is welded on the circuit board 3 of the LED module 1, a plastic shell is wrapped outside the circuit board, and is communicated with current, wherein the circuit board 3, the radiating fin 29 and the high-thermal-conductivity adhesive between the PCB board and the radiating fin 29 belong to room-temperature curing organic silicon rubber, and single-component high-thermal-conductivity silica gel refined by high-quality heat-conduction materials, filling materials and the like is vulcanized into a high-performance elastomer by condensation reaction with moisture in the air, the reinforced neutral organic silicon elastic adhesive is completely cured, has excellent high and low temperature change resistance, does not reduce the heat dissipation effect due to the contact gap generated after the element is fixed, has excellent heat conduction performance (heat dissipation performance), has the heat conduction coefficient [ w/(m.k) ] of up to 1.5 after being cured, provides a high-guarantee heat dissipation coefficient for electronic products, plays a role in guaranteeing the stability of high-power electronic products in the use process, and improves the service performance and the service life of the products; the adhesive has excellent bonding strength, particularly has good adhesive force on electronic components, aluminum, ABS, PBT and other plastics, has excellent sealing property and excellent bonding and heat conducting effects, and is mainly used for high-heat-conductivity bonding and filling between a CPU and a radiator, between a thyristor intelligent control module and a radiator, between a high-power electrical appliance module and a radiator, between a high-power LED drive module and a radiator, between an LED lamp aluminum substrate and a radiator, and between a PCB board and a radiating fin; the traditional card and screw connection mode has been replaced to heat conduction silica gel.

Example 2: referring to fig. 1, 2, 3, 4 and 5, on the basis of the first embodiment, a back-clamping mechanism capable of assisting heat dissipation is arranged on the LED module 1, the back-clamping mechanism includes a first heat dissipation plate 21, the first heat dissipation plate 21 is installed in the LED module 1, a heat dissipation groove 2 is formed in the LED module 1 in a penetrating manner, the first heat dissipation plate 21 is attached to the package circuit board 16, two second heat dissipation plates 22 are fixedly installed at end portions of the first heat dissipation plate 21, end portions of the second heat dissipation plates 22 are located in the heat dissipation groove 2, a liquid inlet hole 23 is installed on the first heat dissipation plate 21, an inner side frame 25 is fixedly installed on a side surface of an inner side wall of the LED module 1, a micro spring 26 is fixedly installed on the inner side frame 25, a bottom plate 28 is installed on the LED module 1, end portions of the bottom plate 28 are attached to the micro spring 26, a double-sided adhesive tape 27 is installed on the bottom plate 28, and a fixing frame 24 is fixedly installed on the LED module 1.

When the LED module 1 is used, when water exists on the LED module 1, a part of water flows into the liquid guiding groove 11 and gathers at the position of the flowing water roof 12, because the flowing water roof 12 is a sharp angle, when the flowing water roof 12 faces downwards, the water can drip downwards along the flowing water roof 12, the retention time of rainwater is reduced, a user can inject cooling liquid into the first heat dissipation plate 21 through the liquid inlet hole 23, the first heat dissipation plate 21 is communicated with the second heat dissipation plate 22, a part of the cooling liquid enters the second heat dissipation plate 22, the packaging circuit board 16 can emit a large amount of heat during operation, the first heat dissipation plate 21 is attached to the packaging circuit board 16, the heat of the packaging circuit board 16 can be absorbed, meanwhile, the end part of the second heat dissipation plate 22 is arranged in the heat dissipation groove 2, the heat dissipation groove 2 is communicated with the outside, the second heat dissipation plate 22 can dissipate heat quickly, the heat dissipation speed of the LED module 1 is further improved, and the user can tear off the double faced adhesive tape 27, the glue layer at the bottom of the double-sided adhesive 27 can make the bottom plate 28 adhere to the wall, and at the same time, when the bottom plate 28 is vibrated, the micro spring 26 on the inner side frame 25 can play a role of buffering through self elasticity, so as to further improve the anti-vibration effect.

As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.

It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

LED photovoltaic module, including LED module (1), its characterized in that: the LED module (1) is provided with a waterproof photoelectric mechanism, and the LED module (1) is provided with a back clamp mechanism capable of assisting in heat dissipation;

photoelectric mechanism includes encapsulation groove (13), install in LED module (1) encapsulation groove (13), LED lamp (14) are installed to the bottom surface of encapsulation groove (13) inside wall, power cord (15) are installed to the tip of LED module (1), the side-mounting of LED module (1) inside wall has packaging circuit board (16).
2. The LED photovoltaic module of claim 1, wherein: the LED module is characterized in that a circuit board (3) is arranged in the LED module (1), radiating fins (29) are mounted on the circuit board (3), a liquid guiding groove (11) is formed in the LED module (1), and a water flowing roof (12) is fixedly mounted at the end of the liquid guiding groove (11).
3. The LED photovoltaic module of claim 1, wherein: the back splint mechanism includes heating panel (21), install in LED module (1) heating panel (21), heating panel (21) and encapsulation circuit board (16) are laminated mutually, run through on LED module (1) and seted up radiating groove (2).
4. The LED optoelectronic module of claim 3, wherein: two second heat dissipation plates (22) are fixedly mounted at the end parts of the first heat dissipation plates (21), and the end parts of the second heat dissipation plates (22) are located in the heat dissipation grooves (2).
5. The LED optoelectronic module of claim 4, wherein: and a liquid inlet hole (23) is arranged on the first heat dissipation plate (21).
6. The LED photovoltaic module of claim 1, wherein: the side face of the inner side wall of the LED module (1) is fixedly provided with an inner side frame (25), and the inner side frame (25) is fixedly provided with a miniature spring (26).
7. The LED optoelectronic module of claim 6, wherein: install bottom plate (28) on LED module (1), bottom plate (28) tip and miniature spring (26) laminating, install double faced adhesive tape (27) on bottom plate (28), fixed mounting has mount (24) on LED module (1).