CN215316510U - Welding assembly quality of miniature car rule level semiconductor power module - Google Patents
Welding assembly quality of miniature car rule level semiconductor power module Download PDFInfo
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- CN215316510U CN215316510U CN202121123566.5U CN202121123566U CN215316510U CN 215316510 U CN215316510 U CN 215316510U CN 202121123566 U CN202121123566 U CN 202121123566U CN 215316510 U CN215316510 U CN 215316510U
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Abstract
The utility model provides a welding assembly device of a miniature vehicle-scale semiconductor power module, which comprises an A-layer carrying disc, a B-layer AMB limiting plate and a terminal positioning device C, wherein the A-layer carrying disc, the B-layer AMB limiting plate and the terminal positioning device C are sequentially arranged from bottom to top; the high-temperature magnets enabling the B-layer AMB limiting plate and the A-layer carrying plate to be adsorbed mutually are arranged in the B-layer AMB limiting plate and the A-layer carrying plate respectively, positioning guide holes for power terminals to pass through are formed in the C upper-layer terminal positioning plate and the C lower-layer terminal positioning plate in the terminal positioning device C, magnetic limiting supporting sheets II are arranged between the front end of the C lower-layer terminal positioning plate and the front end of the C upper-layer terminal positioning plate and between the front end of the C lower-layer terminal positioning plate and the front end of the B-layer AMB limiting plate respectively, and magnetic limiting supporting sheets I are arranged between the rear end of the C lower-layer terminal positioning plate and the rear end of the C upper-layer terminal positioning plate and between the rear end of the C lower-layer terminal positioning plate and the rear end of the B-layer AMB limiting plate respectively. The device has reasonable structural design and can improve the manufacturing efficiency and quality of products.
Description
Technical Field
The utility model relates to a welding assembly device for a miniature vehicle gauge semiconductor power module, and belongs to the technical field of power module production.
Background
In the power module sealing and testing industry, particularly in the manufacturing of power modules using new-generation semiconductor materials such as silicon nitride, silicon carbide, zero-flux preformed soldering lugs and the like, ceramic plate damage, semiconductor chip damage, inaccurate power terminal assembly, excessive welding times and a series of product defects caused by using alloy solder rich in organic matters frequently occur in the welding manufacturing process of semiconductor chips, active metal copper clad plates and power terminals, such as: power terminal deviation, ceramic plate cracks, ceramic plate unfilled corners, product insulation and pressure resistance failure, semiconductor chip damage, chip function degradation, ion residues in a circuit and the like. The common coping method comprises the steps of reducing the product performance, degrading acceptance, even scrapping the product and the like by reworking, repeatedly cleaning and replacing a tool, so that the product output rate and reliability are influenced, and a large amount of manpower and material resources are consumed; on the other hand, the yield is low, which results in low manufacturing efficiency and small delivery quantity of products, which is the disadvantage existing in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem of the prior art, and provides a welding assembly device for a miniature vehicle-scale semiconductor power module, which has reasonable structural design and can improve the manufacturing efficiency and quality of products.
The scheme is realized by the following technical measures: a welding assembly device of a miniature vehicle-scale semiconductor power module comprises an A-layer carrying disc, a B-layer AMB limiting plate and a terminal positioning device C which are sequentially arranged from bottom to top;
the power module comprises a power module substrate and two power terminals, wherein two zero-soldering-flux pre-formed soldering lugs are attached to the end face of the power module substrate, a silicon nitride ceramic copper-clad plate is respectively attached to the two zero-soldering-flux pre-formed soldering lugs, and the two power terminals are respectively arranged on the two silicon nitride ceramic copper-clad plates;
the end surface of the A-layer carrying disc is provided with a mounting groove matched with the power module substrate;
limiting areas which are equal to the number of the zero-flux preformed soldering lugs in number and correspond to the positions of the zero-flux preformed soldering lugs are formed in the B-layer AMB limiting plate, and high-temperature magnets which enable the B-layer AMB limiting plate and the A-layer carrying disc to be adsorbed to each other are arranged in the B-layer AMB limiting plate and the A-layer carrying disc respectively;
the terminal positioning device C comprises a C upper-layer terminal positioning plate and a C lower-layer terminal positioning plate, wherein the C upper-layer terminal positioning plate and the C lower-layer terminal positioning plate are respectively provided with a positioning guide hole for a power terminal to pass through, a magnetic limiting supporting sheet II is respectively arranged between the front end of the C lower-layer terminal positioning plate and the front end of the C upper-layer terminal positioning plate and between the front end of the C lower-layer terminal positioning plate and the front end of the B-layer AMB limiting plate, a magnetic limiting supporting sheet I is respectively arranged between the rear end of the C lower-layer terminal positioning plate and the rear end of the C upper-layer terminal positioning plate and between the rear end of the C lower-layer terminal positioning plate and the rear end of the B-layer AMB limiting plate, and high-temperature magnets enabling the magnetic limiting supporting sheet I and the magnetic limiting supporting sheet II to be mutually adsorbed with the C lower-layer terminal positioning plate are respectively arranged in the magnetic limiting supporting sheet I, the magnetic limiting supporting sheet II and the C lower-layer terminal positioning plate, the left end and the right end of the C upper-layer terminal positioning plate and the C lower-layer terminal positioning plate and the left end and the right end of the A-layer carrying disc are connected with a clamping connection structure respectively.
Preferably, block connection structure includes the connecting rod, both ends about C upper strata terminal locating plate and C lower floor's terminal locating plate seted up respectively with connecting rod clearance fit's through-hole, the upper end of connecting rod has linked firmly the lock and has attached knob, the lower extreme has linked firmly bar knob buckle, the breach that supplies bar knob buckle to pass through is seted up respectively at both ends about the B layer AMB limiting plate, the A layer carries the dish about both ends to set up respectively and supplies the bar hole that bar knob buckle passes through, and the length of bar knob buckle is greater than the width in bar hole.
Preferably, the zero-flux preformed soldering lug is of a rectangular structure.
Preferably, two long edges of the zero-flux pre-forming soldering lug are respectively provided with an opening extending along the width direction of the zero-flux pre-forming soldering lug, the length of the opening is greater than half of the width of the zero-flux pre-forming soldering lug, and the openings on the two long edges are arranged in a staggered mode.
Preferably, be connected with the reference column between the four corners of C upper terminal locating plate and C lower floor's terminal locating plate, the lower extreme of reference column extends to A layer and carries the dish, and A layer carries and sets up on the dish and reference column complex locating hole A.
Preferably, a plurality of reinforcing columns are connected between the C upper layer terminal positioning plate and the C lower layer terminal positioning plate.
Preferably, the four corners of the bottom of the AMB limiting plate on the layer B are fixedly connected with guide positioning columns respectively, and the carrying plate on the layer A is provided with positioning holes B matched with the guide positioning columns.
The utility model has the beneficial effects that:
1. the utility model has simple structure, but can realize one-time welding assembly of parts such as the silicon nitride ceramic copper-clad plate, the power module substrate, the power terminal and the like of the vehicle-scale semiconductor power module, thereby saving labor and time;
2. the processing is convenient, the economic advantage is achieved, the assembly and the maintenance are convenient, and the device maintenance time of technicians is shortened;
3. when the power module product is welded and assembled, the yield is high, and the rejection rate of the product and the material is greatly reduced;
4. the device has small volume, fast heat conduction, high heating and temperature rising rate, high cooling rate during cooling, time saving and high production efficiency of products;
5. the device has light weight, small heat capacity and more energy conservation.
Therefore, compared with the prior art, the utility model has substantive characteristics and progress, and the beneficial effects of the implementation are also obvious.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a partial structural schematic diagram of an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a power module.
Fig. 4 is a schematic structural diagram of a layer B AMB limiting plate.
Fig. 5 is a schematic structural diagram of the terminal positioning device C.
FIG. 6 is a schematic view of a layer A carrier.
Fig. 7 is a schematic structural diagram of a magnetic limiting supporting sheet I.
Fig. 8 is a schematic structural diagram of a zero flux pre-formed solder tab.
In the figure, 1-power module, 2-magnetic limit supporting sheet I, 3-terminal positioning device C, 4-positioning column, 5-clamping connection structure, 6-C lower layer terminal positioning plate, 7-B layer AMB limiting plate, 8-A layer carrying disc, 9-C upper layer terminal positioning plate, 10-magnetic limit supporting sheet II, 11-2# clamping area, 12-1# clamping area, 13-positioning hole A, 14-strip hole, 15-notch, 16-zero scaling powder preformed welding sheet, 17-silicon nitride ceramic copper-clad plate, 18-power terminal, 19-power module substrate, 20-limit area, 21-connecting rod, 22-strip knob buckle, 23-locking knob, 24-reinforcing column mounting hole and 25-positioning guide hole, 27-mounting groove, 28-opening.
Detailed Description
In order to clearly illustrate the technical features of the present solution, the following explains the present solution by way of specific embodiments and with reference to the accompanying drawings.
A welding assembly device of a miniature vehicle-scale semiconductor power module comprises an A-layer carrying disc 8, a B-layer AMB limiting plate 7 and a terminal positioning device C3 which are sequentially arranged from bottom to top as shown in the figure.
The power module 1 comprises a power module substrate 19 and two power terminals 18, two zero-soldering-flux pre-forming soldering lugs 16 are attached to the end face of the power module substrate 19, a silicon nitride ceramic copper-clad plate 17 is attached to each of the two zero-soldering-flux pre-forming soldering lugs 16, and the two power terminals 18 are arranged on the two silicon nitride ceramic copper-clad plates 17 respectively. The zero-flux pre-forming soldering lug 16 is of a rectangular structure, two long sides of the zero-flux pre-forming soldering lug 16 are respectively provided with an opening 28 extending along the width direction of the zero-flux pre-forming soldering lug, the length of each opening 28 is greater than half of the width of the zero-flux pre-forming soldering lug 16, and the openings 28 on the two long sides are arranged in a staggered mode.
The end surface of the A-layer carrying disc 8 is provided with a mounting groove 27 which is matched with the power module substrate 19.
Limiting areas 20 which are equal to the number of the zero-soldering-flux preformed soldering lugs 16 and correspond to the positions of the zero-soldering-flux preformed soldering lugs are formed in the B-layer AMB limiting plate 7, and high-temperature magnets which enable the B-layer AMB limiting plate 7 and the A-layer carrying disc 8 to be adsorbed to each other are arranged in the B-layer AMB limiting plate and the A-layer carrying disc 8 respectively. The four corners of the bottom of the B-layer AMB limiting plate 7 are fixedly connected with guide positioning columns (not shown in the figure), and the A-layer carrying disc 8 is provided with positioning holes B matched with the guide positioning columns.
Terminal positioner C3 includes C upper terminal locating plate 9 and C lower floor terminal locating plate 6, all be provided with the location guiding hole 25 that supplies power terminal 18 to pass through on C upper terminal locating plate 9 and the C lower floor terminal locating plate 6, be provided with magnetism spacing support piece II 10 between the front end of C lower floor terminal locating plate 6 and the front end of C upper terminal locating plate 9 and between the front end of C lower floor terminal locating plate 6 and the front end of B layer AMB limiting plate 7 respectively, be provided with magnetism spacing support piece I2 respectively between the rear end of C lower floor terminal locating plate 6 and the rear end of C lower floor terminal locating plate 9 and between the rear end of C lower floor terminal locating plate 6 and the rear end of B layer AMB limiting plate 7, magnetism spacing support piece I2 and magnetism spacing support piece II 10's structural similarity, it has to make magnetism spacing support piece I2 and magnetism spacing support piece II 10 of magnetism respectively to embed in magnetism spacing support piece I2, magnetism spacing support piece II 10 and the C lower floor terminal locating plate 6 The high-temperature magnet can adsorb each other with C lower floor terminal locating plate 6, be connected with reference column 4 between the four corners of C upper strata terminal locating plate 9 and C lower floor terminal locating plate 6, the lower extreme of reference column 4 extends to A layer and carries a dish 8, and A layer carries and sets up on the dish 8 and carries a locating hole A13 with reference column 4 complex, carries the dish 8 fixed through reference column 4 and locating hole A13 cooperation realization terminal positioner C3, B layer AMB limiting plate 7 and A layer, be connected with many enhancement posts between C upper strata terminal locating plate 9 and the C lower floor terminal locating plate 6, the fastness of assembly can be strengthened to the enhancement post.
Clamping connection structures 5 are connected between the left end and the right end of the C upper-layer terminal positioning plate 9 and the C lower-layer terminal positioning plate 6 and the left end and the right end of the A-layer carrying disc 8 respectively. Block connection structure 5 includes connecting rod 21, both ends about C upper terminal locating plate 9 and C lower floor terminal locating plate 6 seted up respectively with connecting rod 21 clearance fit's through-hole, the upper end of connecting rod 21 has linked firmly lock and has attached knob 23, the lower extreme has linked firmly bar knob buckle 22, the breach 15 that supplies bar knob buckle to pass through is seted up respectively at both ends about B layer AMB limiting plate 7, the A layer carries that both ends are seted up respectively about dish 8 and supplies bar knob buckle 22 to pass through bar hole 14, and bar knob buckle 22's length is greater than the width in bar hole 14.
The welding assembly steps of the welding assembly device of the miniature vehicle-scale semiconductor power module are as follows.
The method comprises the following steps: after the power module substrate 19 is loaded to the mounting groove 27 of the layer A carrying disc 8, the layer B AMB limiting plate 7 is positioned on the layer A carrying disc 8 through the matching of the guide positioning column and the positioning hole B, and then the high-temperature magnet arranged in the layer B AMB limiting plate 7 is attracted with the high-temperature magnet arranged in the layer A carrying disc 8, so that the layer A carrying disc 8 is tightly attached to the layer B AMB limiting plate 7. The zero-flux pre-formed soldering lug 16 is attached to the position, corresponding to the limiting area 20 of the B-layer AMB limiting plate 7, of the power module substrate 19, the silicon nitride ceramic copper-clad plate 17 is attached to the zero-flux pre-formed soldering lug 16, and the opposite ends of the two silicon nitride ceramic copper-clad plates 17 on the same power module substrate 19 are welding areas.
Step two: the terminal positioning device C3 is turned over and horizontally placed on an operation table board, the power terminal 18 is reversely inserted into the positioning guide hole 25 on the terminal positioning device C3, and the high-temperature magnets arranged in the magnetic limiting supporting sheet I2 and the magnetic limiting supporting sheet II 10 are attracted with the high-temperature magnets arranged in the lower-layer terminal positioning plate 6, so that the pins of the power terminal 18 are pressed by the magnetic limiting supporting sheet I2 and the magnetic limiting supporting sheet II 10.
Step three: the terminal positioning device C3 is turned over integrally, and is clamped into a positioning hole A13 on the A-layer carrying disc 8 through the positioning column 4, the lock attaching knob 23 is pressed, after the strip-shaped knob buckle 22 passes through the strip-shaped hole 14 on the A-layer carrying disc 8, the lock attaching knob 23 is rotated by 90 degrees, the strip-shaped knob buckle 22 is clamped onto the bottom surface of the A-layer carrying disc 8, and the clamping butt joint of the terminal positioning device C3 and the A-layer carrying disc 8 is achieved.
Step four: and drawing out the magnetic limiting supporting sheet I2 and the magnetic limiting supporting sheet II 10, and enabling the power terminal 18 to fall on the corresponding zero-soldering-flux pre-forming soldering lug 16. Then, the magnetic limiting supporting sheet I2 is pushed into a No. 1 clamping area 12 (namely an area between the rear end of the C lower-layer terminal positioning plate 6 and the rear end of the C upper-layer terminal positioning plate 9 and an area between the rear end of the C lower-layer terminal positioning plate 6 and the rear end of the B-layer AMB limiting plate 7) of the terminal positioning device C3, the magnetic limiting supporting sheet I2 and the C lower-layer terminal positioning plate 6 attract each other, accurate positioning of the power terminal 18 in the No. 1 clamping area 12 is achieved, and disassembly is convenient; the spacing die shoe II 10 of magnetism pushes into 2# screens district 11 (the region between the front end of C lower floor's terminal locating plate 6 and the front end of C upper strata terminal locating plate 9 and the region between the front end of C lower floor's terminal locating plate 6 and the front end of B layer AMB limiting plate 7 promptly) of terminal positioner C3, the spacing die shoe II 10 of magnetism attracts mutually with C lower floor's terminal locating plate 6, the realization is to the accurate location of the power terminal 18 in 2# screens district 11, and convenient the dismantlement.
The welding assembly device of the miniature vehicle-scale semiconductor power module is strong in operability, convenient to use and good in return no matter production efficiency, capacity improvement, production cost reduction and the like.
Technical features not described in the present invention can be implemented by the prior art, and are not described in detail herein. The present invention is not limited to the above-described embodiments, and variations, modifications, additions and substitutions which are within the spirit of the utility model and the scope of the utility model may be made by those of ordinary skill in the art are also within the scope of the utility model.
Claims (7)
1. The utility model provides a welding assembly quality of miniature car scale level semiconductor power module which characterized in that: the device comprises an A-layer carrying disc, a B-layer AMB limiting plate and a terminal positioning device C which are sequentially arranged from bottom to top;
the power module comprises a power module substrate and two power terminals, wherein two zero-soldering-flux pre-formed soldering lugs are attached to the end face of the power module substrate, a silicon nitride ceramic copper-clad plate is respectively attached to the two zero-soldering-flux pre-formed soldering lugs, and the two power terminals are respectively arranged on the two silicon nitride ceramic copper-clad plates;
the end surface of the A-layer carrying disc is provided with a mounting groove matched with the power module substrate;
limiting areas which are equal to the number of the zero-flux preformed soldering lugs in number and correspond to the positions of the zero-flux preformed soldering lugs are formed in the B-layer AMB limiting plate, and high-temperature magnets which enable the B-layer AMB limiting plate and the A-layer carrying disc to be adsorbed to each other are arranged in the B-layer AMB limiting plate and the A-layer carrying disc respectively;
the terminal positioning device C comprises a C upper-layer terminal positioning plate and a C lower-layer terminal positioning plate, wherein the C upper-layer terminal positioning plate and the C lower-layer terminal positioning plate are respectively provided with a positioning guide hole for a power terminal to pass through, a magnetic limiting supporting sheet II is respectively arranged between the front end of the C lower-layer terminal positioning plate and the front end of the C upper-layer terminal positioning plate and between the front end of the C lower-layer terminal positioning plate and the front end of the B-layer AMB limiting plate, a magnetic limiting supporting sheet I is respectively arranged between the rear end of the C lower-layer terminal positioning plate and the rear end of the C upper-layer terminal positioning plate and between the rear end of the C lower-layer terminal positioning plate and the rear end of the B-layer AMB limiting plate, and high-temperature magnets enabling the magnetic limiting supporting sheet I and the magnetic limiting supporting sheet II to be mutually adsorbed with the C lower-layer terminal positioning plate are respectively arranged in the magnetic limiting supporting sheet I, the magnetic limiting supporting sheet II and the C lower-layer terminal positioning plate, the left end and the right end of the C upper-layer terminal positioning plate and the C lower-layer terminal positioning plate and the left end and the right end of the A-layer carrying disc are connected with a clamping connection structure respectively.
2. The welding assembly device of the miniature vehicle-scale semiconductor power module according to claim 1, wherein: block connection structure includes the connecting rod, both ends seted up respectively about C upper strata terminal locating plate and C lower floor terminal locating plate with connecting rod clearance fit's through-hole, the upper end of connecting rod has linked firmly the lock and has attached knob, the lower extreme has linked firmly bar knob buckle, the breach that supplies bar knob buckle to pass through is seted up respectively at both ends about the B layer AMB limiting plate, the A layer carries the dish about both ends to set up the bar hole that supplies bar knob buckle to pass through respectively, and the length of bar knob buckle is greater than the width in bar hole.
3. The welding assembly device of the miniature vehicle-scale semiconductor power module according to claim 2, wherein: the zero-flux preformed soldering lug is of a rectangular structure.
4. The welding assembly device of the miniature vehicle-scale semiconductor power module according to claim 3, wherein: two long edges of the zero-soldering-flux preforming soldering lug are respectively provided with an opening extending along the width direction of the zero-soldering-flux preforming soldering lug, the length of the opening is larger than half of the width of the zero-soldering-flux preforming soldering lug, and the openings on the two long edges are arranged in a staggered mode.
5. The welding assembly device of the miniature vehicle-scale semiconductor power module according to claim 4, wherein: and positioning columns are connected between the four corners of the C upper-layer terminal positioning plate and the C lower-layer terminal positioning plate, the lower ends of the positioning columns extend to the A layer carrying disc, and positioning holes A matched with the positioning columns are formed in the A layer carrying disc.
6. The welding assembly device of the miniature vehicle-scale semiconductor power module according to claim 5, wherein: and a plurality of reinforcing columns are connected between the upper-layer terminal positioning plate C and the lower-layer terminal positioning plate C.
7. The welding assembly device of the miniature vehicle-scale semiconductor power module according to claim 6, wherein: and the four corners at the bottom of the AMB limiting plate on the layer B are fixedly connected with guide positioning columns respectively, and the carrier plate on the layer A is provided with positioning holes B matched with the guide positioning columns.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121123566.5U CN215316510U (en) | 2021-05-24 | 2021-05-24 | Welding assembly quality of miniature car rule level semiconductor power module |
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| CN202121123566.5U CN215316510U (en) | 2021-05-24 | 2021-05-24 | Welding assembly quality of miniature car rule level semiconductor power module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115283920A (en) * | 2022-08-22 | 2022-11-04 | 瓷金科技(河南)有限公司 | Clamp for dual in-line ceramic tube shell brazing |
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2021
- 2021-05-24 CN CN202121123566.5U patent/CN215316510U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115283920A (en) * | 2022-08-22 | 2022-11-04 | 瓷金科技(河南)有限公司 | Clamp for dual in-line ceramic tube shell brazing |
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