CN215305160U

CN215305160U - Refrigeration assembly and air oven

Info

Publication number: CN215305160U
Application number: CN202121284718.XU
Authority: CN
Inventors: 吕挺; 陈锡雁; 梁郁庆; 唐明辉
Original assignee: Zhejiang Tianxi Kitchen Appliance Co Ltd
Current assignee: Zhejiang Tianxi Kitchen Appliance Co Ltd
Priority date: 2021-06-09
Filing date: 2021-06-09
Publication date: 2021-12-28
Anticipated expiration: 2031-06-09

Abstract

The present invention provides a refrigeration assembly comprising: the semiconductor refrigeration piece comprises a cold end and a hot end, and can transfer heat from the cold end to the hot end in a power-on state; the cold guide sheet can be attached to the cold end of the semiconductor refrigeration sheet in a cold transmission manner; the heat conducting sheet can be attached to the hot end of the semiconductor refrigerating sheet in a heat conducting manner; and the heat radiation fan is arranged on one side of the heat conducting sheet far away from the semiconductor refrigeration sheet and is configured to blow air to the outside of the heat conducting sheet. The utility model also provides an air oven. The semiconductor refrigeration piece is arranged, so that the refrigeration function can be realized with smaller size and lower cost, and the semiconductor refrigeration piece can be applied to an air oven to refrigerate and keep food fresh before baking, so that the taste of food baking is improved.

Description

Refrigeration assembly and air oven

Technical Field

The utility model relates to the field of manufacturing and processing of electric appliances, in particular to a refrigerating assembly and an air oven.

Background

The need for refrigeration is common throughout the storage, transport and sale of food processing, such as refrigerators, freezers and crispers used in the domestic environment to keep or refrigerate food. With the increasingly higher living standard, people are increasingly pursuing the taste and health of food, so that occasions requiring food refrigeration and fresh keeping are more and more, and particularly for meat food, the reduction of the temperature of the food can effectively inhibit the biological activity of microorganisms and enzymes and prevent the food from being rotten and deteriorated.

For the kitchen appliance, rarely set up refrigeration function at the cooking terminal, this one side is that the volume of considering conventional refrigeration subassembly is great, needs bulky compressor and motor, and on the other hand is that the refrigeration demand of cooking terminal is not vigorous, and the user often only puts into food before the culinary art and has refrigerated demand occasionally, and under the idle state of cooking process and cooking appliance, all do not have the refrigeration demand to food.

Therefore, the refrigeration assembly of the kitchen appliance has the technical problems of difficult miniaturization, high cost and insufficient utilization rate at present. However, the applicant has found that if a cooling function is added to the air oven, the food can be cooled and kept fresh before being baked, so that the taste of the baked food is improved, and therefore, a cooling component suitable for the air oven is needed to meet the requirement of a user on cooking effect.

SUMMERY OF THE UTILITY MODEL

In view of the above, the utility model provides a refrigeration assembly and an air oven, which can realize the refrigeration function with smaller size and lower cost, and can be applied in the air oven to refrigerate and keep food fresh before baking, thereby improving the taste of food baking.

In one aspect of the present invention, there is provided a refrigeration assembly comprising:

the semiconductor refrigeration piece comprises a cold end and a hot end, and can transfer heat from the cold end to the hot end in a power-on state;

the cold guide sheet can be attached to the cold end of the semiconductor refrigeration sheet in a cold transmission manner;

the heat conducting sheet can be attached to the hot end of the semiconductor refrigerating sheet in a heat conducting manner; and

and the heat radiation fan is arranged on one side of the heat conducting fin, which is far away from the semiconductor refrigeration fin, and is configured to blow air to the outside of the heat conducting fin.

Preferably, the cold-conducting fin and the heat-conducting fin comprise heat-radiating aluminum sheets.

In another aspect of the present invention, there is provided an air oven comprising a refrigeration assembly as described in any of the previous embodiments.

Preferably, the air oven further comprises:

a housing assembly;

the cavity assembly is arranged inside the shell assembly, and a cooking space for food is formed inside the cavity assembly; and

and the air-frying assembly is arranged in the shell assembly, is positioned above the cavity assembly and is configured to blow hot air to the interior of the cavity assembly.

Preferably, the refrigeration assembly is arranged inside the shell assembly and below the cavity assembly, the cold conducting sheet of the refrigeration assembly is attached to the bottom of the cavity assembly, and the heat conducting sheet and the cooling fan of the refrigeration assembly are arranged close to the bottom of the shell assembly.

Preferably, the bottom of the housing assembly is provided with heat dissipation holes corresponding to the positions of the heat dissipation fans, so as to facilitate the heat conduction from the refrigeration assembly to the outside of the housing assembly.

Preferably, the air-frying assembly comprises:

heating a tube; and

a hot air fan disposed above the heating pipe and configured to blow air downward so that the air flows to the inside of the chamber body assembly after being heated by the heating pipe;

and the top of the cavity assembly is provided with a hot air hole corresponding to the position of the hot air fan, so that hot air formed by the air-frying assembly flows into the cavity assembly.

Preferably, the air-frying assembly further comprises:

the heat insulation cover is fixed in the shell assembly and covers the upper part of the hot air fan;

a cooling fan disposed above the heat shield and configured to blow air radially outward; and

and the motor frame is fixed in the shell assembly, arranged above the cooling fan and arranged at an interval with the heat insulation cover to form an air outlet channel of the cooling fan.

Preferably, the rear portion of the housing assembly is further provided with an air outlet, and the air-frying assembly further comprises:

and the air outlet pipe is arranged outside the motor frame and is right opposite to the air outlet at the rear part of the shell component so as to form a channel from the air outlet channel to the air outlet.

Preferably, the cooling fan is disposed coaxially with the hot air fan, and the air-frying assembly further includes:

the motor is arranged above the motor frame, and the rotating shaft penetrates through the motor cover and the heat insulation cover downwards and is coaxially connected with the cooling fan and the hot air fan.

Therefore, the semiconductor refrigeration piece is arranged, so that the refrigeration function can be realized with smaller size and lower cost, and the semiconductor refrigeration piece can be applied to an air oven to refrigerate and keep food fresh before baking, so that the taste of food baking is improved.

Drawings

The accompanying drawings are included to provide a further understanding of the claimed subject matter and are incorporated in and constitute a part of this specification, illustrate embodiments of the subject matter and together with the description serve to explain the principles of the subject matter and not to limit the subject matter.

FIG. 1 is an exploded view of the air oven of the present invention;

fig. 2 is a schematic structural view of an air oven of the present invention.

Description of reference numerals:

1-a refrigeration component; 11-semiconductor refrigerating sheet; 111-cold end; 112-hot side; 12-a cold conducting sheet; 13-a thermally conductive sheet; 14-a heat dissipation fan; 2-a housing assembly; 21-heat dissipation holes; 22-air outlet; 3-a cavity assembly; 31-hot air holes; 4-air frying component; 41-heating pipe; 42-hot air fan; 43-a heat shield; 44-a cooling fan; 45-motor frame; 46-a motor.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is in no way intended to limit the utility model, its application, or uses. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments are to be construed as merely illustrative, and not as limitative, unless specifically stated otherwise.

As shown in fig. 1-2: in one aspect of the present invention, there is provided a refrigeration assembly including a semiconductor refrigeration sheet 11, a cold-guiding sheet 12, a heat-guiding sheet 13, and a heat-radiating fan 14. The semiconductor refrigeration piece 11 comprises a cold end 111 and a hot end 112, and can transfer heat from the cold end 111 to the hot end 112 in a power-on state; the cold guide sheet 12 can be attached to the cold end 111 of the semiconductor refrigeration sheet 11 in a cold transmission manner; the heat conducting sheet 13 can be attached to the hot end 112 of the semiconductor refrigeration sheet 11 in a heat conducting manner; the heat dissipation fan 14 is disposed on a side of the heat conductive sheet 13 away from the semiconductor cooling sheet 11, and configured to blow air to the outside of the heat conductive sheet 13.

The working principle of the semiconductor refrigerating sheet 11 is the Peltier effect, that is, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively. Based on Peltier principles, the semiconductor cooling plate 11 can be used as a means of heat transfer, creating a temperature difference between the cold side 111 and the hot side 112.

However, since the semiconductor itself has a certain resistance, heat is generated by an electrothermal effect when current passes through the semiconductor, thereby affecting heat transfer from the cold end 111 to the hot end 112. Also, spontaneous reverse heat transfer between cold end 111 and hot end 112 is effected by ambient air and the semiconductor material itself. It can be seen that when the temperature difference between the cold end 111 and the hot end 112 reaches a certain temperature, the forward heat transfer and the reverse heat transfer generated by the Peltier principle are equal in quantity, and a balance point is reached, so that the forward heat transfer and the reverse heat transfer are mutually offset. At this point, the temperature difference between cold end 111 and hot end 112 will not continue to change.

To achieve a lower temperature, heat dissipation or the like may be used to lower the temperature of hot side 112. Based on this, the utility model realizes the heat dissipation of the semiconductor refrigeration sheet 11 to the outside by arranging the heat dissipation fan 14 to make the heat dissipation fan 14 blow air to the outside of the heat conduction sheet 13, thereby continuously reducing the temperature of the hot end 112, making the cold end 111 correspondingly reach a lower temperature, and improving the refrigeration cooling effect of the refrigeration assembly 1.

In order to further increase the rate of heat or cold transferred from the semiconductor cooling fins 11 to the outside and reduce the thermal resistance of the cold conducting fins 12 and the heat conducting fins 13, it is preferable that the cold conducting fins 12 and the heat conducting fins 13 comprise heat-dissipating aluminum fins.

The applicant has found that both electric ovens and air fryers are cooking appliances that are widely available in the kitchen and are highly appreciated by users. Distinguishing from the cooking principle and effect: the electric oven utilizes the high temperature in the closed space to bake the food, and the finished product is scorched outside and tender inside and has the flavor and taste of baking; the air fryer blows hot air circulating at high speed to the surface of food for frying, and the skin of the finished product becomes crisp after deoiling and dehydration and has flavor and mouthfeel similar to fried food. In principle, the electric oven and the air fryer mostly use the electric heating tube as the main heating element to cook food, and the main differences between the electric oven and the air fryer are mainly focused on: how to organize the air flow conditions inside the food cooking chamber and how to arrange the food-holding container.

Along with the continuous development of the integrated trend of kitchen appliances, more and more kitchen appliances are moving to the way of function combination, wherein the electric oven and the air fryer are designed and manufactured into an air oven in a more integrated manner due to the similarity of the working principle, so that the functions of the electric oven and the air fryer are taken into consideration, the kitchen space occupied by products is saved, the utilization rate of the products is improved, and the market demand is met as much as possible.

Thus, in another aspect of the present invention, there is provided an air oven comprising a refrigeration assembly as in any one of the preceding embodiments.

In addition, the refrigeration assembly 1 is arranged, the refrigeration function can be realized by using the characteristics of the semiconductor refrigeration piece 11 and with smaller size and lower cost, and the refrigeration assembly can be applied to an air oven to refrigerate and keep food fresh before baking, so that the taste of food baking is improved.

Preferably, to better achieve the air-frying function of the air oven, the air oven further comprises a housing assembly 2, a cavity assembly 3 and an air-frying assembly 4. The cavity assembly 3 is arranged inside the shell assembly 2, and a cooking space for food is formed inside the cavity assembly; and the air-frying unit 4 is disposed inside the housing unit 2 above the cavity unit 3 and configured to blow hot air into the cavity unit 3.

On the basis of the mechanism, in order to avoid the influence of the heat generated by the air-frying assembly 4 on the refrigerating assembly 1, the refrigerating assembly 1 is preferably arranged inside the shell assembly 2 and below the cavity assembly 3. In order to improve the refrigeration and fresh-keeping effect of the refrigeration assembly 1 on food, the cold guide sheet 12 of the refrigeration assembly 1 is attached to the bottom of the cavity assembly 3, and the heat guide sheet 13 and the heat dissipation fan 14 of the refrigeration assembly 1 are arranged close to the bottom of the shell assembly 2.

Preferably, in order to improve the heat dissipation effect of the heat dissipation fan 14 of the refrigeration assembly 1, the bottom of the housing assembly 2 is provided with a heat dissipation hole 21 corresponding to the position of the heat dissipation fan 14, so as to promote the heat conduction of the refrigeration assembly 1 to the outside of the housing assembly 2.

Preferably, the air-frying unit 4 comprises a heating pipe 41 and a hot air fan 42. The hot air fan 42 is disposed above the heating pipe 41 and configured to blow air downward so that the air flows into the inside of the chamber assembly 3 after being heated by the heating pipe 41; in order to smoothly feed the hot air generated by the air-frying unit 4 into the cavity unit 3, a hot air hole 31 is formed in the top of the cavity unit 3 at a position corresponding to the hot air fan 42, so that the hot air generated by the air-frying unit 4 flows into the cavity unit 3.

In order to reduce the influence of the high temperature of the air-frying unit 4 on the motor 46, the air-frying unit 4 preferably further comprises a heat shield 43, a cooling fan 44 and a motor frame 45. Wherein, the heat shield 43 is fixed inside the housing assembly 2 and is covered above the hot air fan 42; a cooling fan 44 is provided above the heat shield 43, configured to blow air radially outward; the motor frame 45 is fixed inside the housing assembly 2, disposed above the cooling fan 44, and spaced from the heat shield 43 to form an air outlet channel of the cooling fan 44. On this basis, the motor 46 is disposed above the motor frame 45, and the rotating shaft passes downward through the motor frame 45 and the heat shield 43 to coaxially connect the cooling fan 44 and the hot air fan 42.

Therefore, the heat insulation cover 43 blocks the heat of the cooking cavity, and the cooling fan 44 further reduces the temperature between the heat insulation cover 43 and the motor frame 45, so that the temperature of the working environment where the motor 46 is located is lower, and the operation stability and the service life of the motor 46 are effectively improved.

In order to facilitate the cooling fan 44 to discharge air outwards, preferably, the rear portion of the casing assembly 2 is further provided with an air outlet 22, and the air-frying assembly 4 further comprises an air outlet pipe, wherein the air outlet pipe is arranged outside the motor frame 45 and is opposite to the air outlet 22 at the rear portion of the casing assembly 2, so as to form a channel from the air outlet channel to the air outlet 22.

So far, some specific embodiments of the present invention have been described in detail by way of examples, but it should be understood by those skilled in the art that the above examples are only for illustrative purposes and are not intended to limit the scope of the present invention. It will be understood by those skilled in the art that various changes may be made in the above embodiments or equivalents may be substituted for elements thereof without departing from the scope and spirit of the utility model. The scope of the utility model is defined by the appended claims.

Claims

1. A refrigeration assembly, comprising:

a semiconductor chilling plate (11) comprising a cold end (111) and a hot end (112) capable of transferring heat from the cold end (111) to the hot end (112) in an energized state;

the cold guide sheet (12) can be attached to the cold end (111) of the semiconductor refrigeration sheet (11) in a cold transmission manner;

the heat conducting sheet (13) can be attached to the hot end (112) of the semiconductor refrigerating sheet (11) in a heat conducting manner; and

and a heat radiation fan (14) which is arranged on one side of the heat conducting sheet (13) far away from the semiconductor refrigeration sheet (11) and is configured to blow air to the outside of the heat conducting sheet (13).

2. A refrigeration assembly as claimed in claim 1, characterized in that said cold-conducting fins (12) and said heat-conducting fins (13) comprise heat-radiating aluminium fins.

3. An air oven characterized in that it comprises a refrigeration assembly according to claim 1 or 2.

4. The air oven of claim 3, further comprising:

a housing assembly (2);

the cavity assembly (3) is arranged inside the shell assembly (2), and a cooking space for food is formed inside the cavity assembly; and

a blank frying unit (4) disposed inside the casing unit (2) above the cavity unit (3) and configured to blow hot air into the cavity unit (3).

5. The air oven according to claim 4, characterized in that the cooling assembly (1) is arranged inside the housing assembly (2) and below the cavity assembly (3), the cold-conducting fins (12) of the cooling assembly (1) are attached to the bottom of the cavity assembly (3), and the heat-conducting fins (13) and the heat-dissipating fan (14) of the cooling assembly (1) are arranged close to the bottom of the housing assembly (2).

6. The air oven according to claim 5, characterized in that the bottom of the housing assembly (2) is provided with heat dissipation holes (21) at positions corresponding to the heat dissipation fan (14) for facilitating the heat conduction of the cooling assembly (1) to the outside of the housing assembly (2).

7. An air oven according to claim 4, characterized in that the frying assembly (4) comprises:

a heating pipe (41); and

a hot air fan (42) disposed above the heating pipe (41) and configured to blow air downward so that the air flows into the cavity assembly (3) after being heated by the heating pipe (41);

the top of the cavity assembly (3) is provided with a hot air hole (31) corresponding to the position of the hot air fan (42) so that hot air formed by the air-frying assembly (4) flows into the cavity assembly (3).

8. The air oven of claim 7, characterized in that the frying assembly (4) further comprises:

a heat shield (43) fixed inside the housing assembly (2) and covering the hot air fan (42);

a cooling fan (44) disposed above the heat shield (43) and configured to blow air radially outward; and

and the motor frame (45) is fixed in the shell assembly (2), arranged above the cooling fan (44) and arranged at an interval with the heat insulation cover (43) to form an air outlet channel of the cooling fan (44).

9. The air oven according to claim 8, characterized in that the rear portion of the housing assembly (2) is further provided with an air outlet (22), the frying assembly (4) further comprising:

and the air outlet pipe is arranged outside the motor frame (45) and is right opposite to the air outlet (22) at the rear part of the shell component (2) so as to form a channel from the air outlet channel to the air outlet (22).

10. The air oven according to claim 8, characterized in that said cooling fan (44) is arranged coaxially to said hot air fan (42), said blank assembly (4) further comprising:

and the motor (46) is arranged above the motor frame (45), a rotating shaft downwards penetrates through the motor frame (45) and the heat insulation cover (43), and the cooling fan (44) and the hot air fan (42) are coaxially connected.