CN215301037U

CN215301037U - Controller with novel heat dissipation structure

Info

Publication number: CN215301037U
Application number: CN202121624440.6U
Authority: CN
Inventors: 徐有询
Original assignee: Sangu Technology Dongguan Co ltd
Current assignee: Sangu Technology Dongguan Co ltd
Priority date: 2021-07-16
Filing date: 2021-07-16
Publication date: 2021-12-24
Anticipated expiration: 2031-07-16

Abstract

The utility model discloses a take novel heat radiation structure's controller, including control circuit board and heat dissipation mechanism, control circuit board's last surface mounting has a plurality of paster devices, control circuit board's lower surface mounting has a plurality of plug-in components devices, and a plurality of plug-in components devices include insulated gate bipolar transistor, heat dissipation mechanism includes the bottom plate, preceding curb plate and posterior lateral plate are installed to the upside of bottom plate, be provided with the heat radiation fins array between preceding curb plate and the posterior lateral plate, the preceding curb plate outside is provided with outside heat radiation fins. The utility model discloses an upper surface at control circuit board sets up the paster device, and the lower surface sets up plug-in components device to can save space, make the device compacter, accord with product dimensional requirement, the setting of bottom plate, a plurality of heat radiation fins array, outside heat radiation fins and heat-conducting plate among the cooperation heat dissipation mechanism, thereby can promote the radiating effect, promoted the practicality of this controller.

Description

Controller with novel heat dissipation structure

Technical Field

The utility model relates to a controller field specifically is a take novel heat radiation structure's controller.

Background

The control circuit board of the treadmill is a core component for controlling the motor on the treadmill to work, in order to be suitable for product miniaturization and flat plate, the brushless motor high-voltage control board of the treadmill needs to be arranged on a circuit board with the length of 100 plus 105mm and the width of 73-78mm, most of the existing motor control boards have large volume, are difficult to meet the size requirement of products, and have poor heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

The utility model discloses solve the technical problem that above-mentioned prior art exists, provide a take novel heat radiation structure's controller.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a take novel heat radiation structure's controller, includes control circuit board and heat dissipation mechanism, control circuit board's last surface mounting has a plurality of paster devices, control circuit board's lower surface mounting has a plurality of plug-in components devices, and a plurality of plug-in components devices include insulated gate bipolar transistor, heat dissipation mechanism includes the bottom plate, preceding curb plate and posterior lateral plate are installed to the upside of bottom plate, be provided with the heat radiation fins array between preceding curb plate and the posterior lateral plate, the preceding curb plate outside is provided with outside heat radiation fins.

Preferably, the heat dissipation mechanism is arranged at the bottom of the control circuit board, the connecting column is installed on the upper side of the bottom plate, and the connecting column is fixedly connected with the control circuit board through a screw.

Preferably, the number of the insulated gate bipolar transistors is multiple, and the multiple insulated gate bipolar transistors are distributed at intervals in a linear array.

Preferably, the surface of the front side plate is provided with a plurality of locking holes matched with the insulated gate bipolar transistor, and the insulated gate bipolar transistor is connected with the front side plate through the locking holes.

Preferably, the number of the outer side heat dissipation fins is multiple, and the multiple outer side heat dissipation fins are distributed in parallel at intervals.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses an upper surface at control circuit board sets up the paster device, and the lower surface sets up plug-in components device to can save space, make the device compacter, accord with product dimensional requirement, the setting of bottom plate, a plurality of heat radiation fins array, outside heat radiation fins and heat-conducting plate among the cooperation heat dissipation mechanism, thereby can promote the radiating effect, promoted the practicality of this controller.

Drawings

FIG. 1 is a schematic structural view of the installation state of the present invention;

fig. 2 is a first three-dimensional structural schematic diagram of the heat dissipation mechanism of the present invention;

fig. 3 is a second three-dimensional structural schematic diagram of the heat dissipation mechanism of the present invention;

fig. 4 is a schematic structural diagram of the control circuit board of the present invention.

In the figure: the structure comprises a control circuit board 1, an insulated gate bipolar transistor 2, a bottom plate 3, a front side plate 4, a rear side plate 5, a radiating fin array 6, radiating fins on the outer side 7, a connecting column 8, a locking hole 9 and a heat conducting plate 10.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a controller with a novel heat dissipation structure comprises a control circuit board 1 and a heat dissipation mechanism, wherein a plurality of patch devices are mounted on the upper surface of the control circuit board 1, a plurality of plug-in devices are mounted on the lower surface of the control circuit board 1, the patch devices are arranged on the upper surface of the control circuit board 1, and the plug-in devices are arranged on the lower surface of the control circuit board 1, so that space can be saved, and the devices are more compact and meet the size requirement of a product, the plurality of plug-in devices comprise insulated gate bipolar transistors 2, the number of the insulated gate bipolar transistors 2 is multiple, the plurality of insulated gate bipolar transistors 2 are distributed at intervals in a linear array, the heat dissipation mechanism comprises a bottom plate 3, a front side plate 4 and a rear side plate 5 are mounted on the upper side of the bottom plate 3, a heat dissipation fin array 6 is arranged between the front side plate 4 and the rear side plate 5, and the number of the heat dissipation fin array 6 is multiple, and a plurality of heat radiation fin arrays 6 are parallel interval distribution, the outside of the front side plate 4 is provided with outside heat radiation fins 7, the number of outside heat radiation fins 7 is a plurality of, and a plurality of outside heat radiation fins 7 are parallel interval distribution, the middle of the heat radiation fin array 6 is provided with a heat conduction plate 10, the heat conduction plate 10 is used for the heat radiation of MOS pipe and rectifier bridge on the control circuit board 1, cooperate the setting of bottom plate 3, a plurality of heat radiation fin arrays 6, outside heat radiation fins 7 and heat conduction plate 10 in the heat radiation mechanism, thereby can promote the heat radiation effect, the practicality of the controller is promoted.

The insulated gate bipolar transistor integrates the advantages of a power transistor and a power field effect transistor, has good characteristics, has wide application fields, also is a three-terminal device, a grid electrode, a collector electrode and an emitter electrode, is a bipolar device with an MOS structure, belongs TO a power device with high-speed performance and bipolar low-resistance performance of a power field effect transistor, generally has the application range of over 600V withstand voltage, over 10A current and over 1kHz frequency, is mostly used in the fields of industrial motors, civil small-capacity motors, inverters, stroboscopes of cameras, induction heating electric cookers and the like, is roughly divided into two types according TO different packaging, one type is a three-terminal single body packaging type sealed by molding resin, forms a series from TO-3P TO small surface mounting, and the other type is a module type in which the insulated gate bipolar transistor and a fly wheel diode are packaged in pairs, the insulated gate bipolar transistor is mainly applied to the industry, the types of modules are divided into various shapes and packaging modes according to different purposes, the modules are serialized, and the insulated gate bipolar transistor can be used in the controller of the embodiment.

Referring to fig. 1-4, the heat dissipation mechanism is disposed at the bottom of the control circuit board 1, the connection posts 8 are mounted on the upper side of the bottom plate 3, the connection posts 8 are fixedly connected to the control circuit board 1 through screws, and the control circuit board 1 is conveniently connected to the heat dissipation mechanism through the arrangement of the connection posts 8.

Referring to fig. 1-4, the surface of the front side plate 4 is provided with a plurality of locking holes 9 adapted to the insulated gate bipolar transistor 2, the insulated gate bipolar transistor 2 is connected to the front side plate 4 through the locking holes 9, and the surface of the front side plate 4 is provided with a plurality of fastening holes 9, so that the insulated gate bipolar transistor 2 can be conveniently fixed.

To sum up, this take novel heat radiation structure's controller, with spliced pole 8 through screw and 1 fixed connection of control circuit board, realize the installation between control circuit board 1 and the heat dissipation mechanism, insulated gate bipolar transistor 2 is connected with the locking hole 9 on preceding curb plate 4 surface, set up the paster device through the upper surface at control circuit board 1, the lower surface sets up plug-in components device, thereby can save space, it is compacter to make the device, accord with product size requirement, cooperation heat radiation mechanism middle base plate 3, a plurality of heat radiation fin array 6, outside heat radiation fin 7 and heat-conducting plate 10's setting, thereby can promote the radiating effect.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a take novel heat radiation structure's controller, includes control circuit board (1) and heat dissipation mechanism, its characterized in that: the utility model discloses a heat dissipation device, including control circuit board (1), the last surface mounting of control circuit board (1) has a plurality of paster devices, and a plurality of plugin devices include insulated gate bipolar transistor (2), heat dissipation mechanism includes bottom plate (3), preceding curb plate (4) and posterior lateral plate (5) are installed to the upside of bottom plate (3), be provided with between preceding curb plate (4) and posterior lateral plate (5) heat radiation fin array (6), preceding curb plate (4) outside is provided with outside heat radiation fin (7).

2. The controller with the novel heat dissipation structure as claimed in claim 1, wherein: the heat dissipation mechanism is arranged at the bottom of the control circuit board (1), the connecting column (8) is installed on the upper side of the bottom plate (3), and the connecting column (8) is fixedly connected with the control circuit board (1) through screws.

3. The controller with the novel heat dissipation structure as claimed in claim 1, wherein: the number of the insulated gate bipolar transistors (2) is multiple, and the insulated gate bipolar transistors (2) are distributed at intervals in a linear array.

4. The controller with the novel heat dissipation structure as claimed in claim 1, wherein: the number of the radiating fin arrays (6) is multiple, and the radiating fin arrays (6) are distributed in parallel at intervals.

5. The controller with the novel heat dissipation structure as claimed in claim 1, wherein: the surface of the front side plate (4) is provided with a plurality of locking holes (9) matched with the insulated gate bipolar transistors (2), and the insulated gate bipolar transistors (2) are connected with the front side plate (4) through the locking holes (9).

6. The controller with the novel heat dissipation structure as claimed in claim 1, wherein: the number of the outer side radiating fins (7) is multiple, and the outer side radiating fins (7) are distributed in parallel at intervals.

7. The controller with the novel heat dissipation structure as claimed in claim 1, wherein: and a heat conducting plate (10) is arranged in the middle of the radiating fin array (6).