CN212138207U - MOS pipe installation heat radiation structure of control circuit board for electric vehicle - Google Patents

Abstract

The utility model discloses a MOS pipe installation heat radiation structure of control circuit board for electric vehicle, including a plurality of MOS pipes installed on the control circuit board, the control circuit board is installed on the bottom heat radiation base plate in an insulating way, and pin one side of each MOS pipe is welded on the control circuit board, and simultaneously the opposite side output end of the MOS pipe is fixedly installed on an over-current heat radiation aluminum block through a fastener sleeved with an elastic gasket and is electrically connected with the over-current heat radiation aluminum block, and the over-current heat radiation aluminum block is fixedly installed on the control circuit board and is in insulation contact with the bottom heat radiation base plate; the bottom of the bottom radiating substrate is provided with a plurality of radiating reinforcing rib sheets; the utility model discloses a dismouting of simple and the MOS pipe of being convenient for of integral erection structure on MOS pipe realizes the basis that heavy current is connected, has not only avoided the consumption of thick copper, and the structure cost is low, has good radiating effect simultaneously.

Description

MOS pipe installation heat radiation structure of control circuit board for electric vehicle

Technical Field

The utility model belongs to electric vehicle controller field, concretely relates to MOS pipe installation heat radiation structure of control circuit board for electric vehicle.

Background

The current situation of the existing multi-module intelligent driving system of the medium and high power motors is that the technical problems of low reliability and high cost generally exist, although the prior art proposes a motor module with multiple winding units to try to solve the technical problems, the technical problem that the multiple modules are difficult to realize unified management still exists, so the current situation that the medium and high power motors always adopt large-capacity drivers is not actually improved, which is obviously contrary to the future electric vehicle market development direction which seeks to realize higher power and high performance under the premise of low and medium cost, and therefore the market is very urgently required to solve the technical problems.

The applicant is dedicated to the research of the intelligent driving control field of the electric vehicle and also focuses on the technical bottleneck, so that a significant core research and development special subject is established to solve the problem of large and medium power driving. The research and development subject obtains a major breakthrough in 2018, and a plurality of patent application protections are intensively submitted in 2018, 9 and 19, wherein the patent application protections comprise 4 invention patent applications with the patent application numbers of CN201811094616.4, CN201811094626.8, CN201811094627.2, CN201811094649.9 and CN201811097434.2, a multi-module intelligent driving system which is composed of a multi-winding unit and a multi-motor driver unit which is subjected to centralized coordination management control and operates independently is mainly provided to solve the problem of large and medium power driving, the technical bottleneck that the performance of the conventional electric vehicle on the large and medium power market is unreliable and the cost is low can be remarkably improved, and the future electric vehicle market development process which realizes higher power and high performance on the premise of low and medium cost can be effectively promoted. In order to further solve the control problem faced during charging and discharging, CN201911012111.3 and CN201911011607.9 were further proposed in 2019, 10 and 23.

However, as the applicant finds that, after the applicant further applies the dual-multi-module intelligent driving system to a large scale, since the MOS transistor of the controller circuit board in the dual-multi-module intelligent driving system needs to carry a large current, if the copper foil in the prior art is still used for circuit connection, the large current needs to be met by the copper plate with a relatively large size, which results in relatively high cost of circuit devices, and poor heat dissipation effect of the MOS transistor.

To this end, the applicant wishes to seek technical solutions that improve on the above technical problem.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims at providing a MOS pipe installation heat radiation structure of control circuit board for electric motor car, the dismouting of the simple and MOS pipe of being convenient for of overall installation structure on the basis that MOS pipe realized the heavy current connection, has not only avoided the consumption of thick copper, and structural cost is low, has good radiating effect simultaneously.

The technical scheme of the utility model as follows:

a MOS tube installation heat dissipation structure of a control circuit board for an electric vehicle comprises a plurality of MOS tubes installed on the control circuit board, wherein the control circuit board is installed on a bottom heat dissipation substrate in an insulation mode, one side of each MOS tube pin is welded on the control circuit board, meanwhile, the output end of the other side of each MOS tube is fixedly installed on an over-current heat dissipation aluminum block through a fastener sleeved with an elastic gasket and is electrically connected with the over-current heat dissipation aluminum block, and the over-current heat dissipation aluminum block is fixedly installed on the control circuit board and is in insulation contact with the bottom heat dissipation substrate; the bottom of the bottom radiating substrate is provided with a plurality of radiating reinforcing rib pieces.

Preferably, the fastener has cup jointed contact pad and elastic gasket respectively, the fastener will the opposite side output of MOS pipe is equipped with the cartridge hole, the fastener run through behind the cartridge hole with cross electric heat dissipation aluminium pig fastening installation and connection, wherein, the fastener tip with cross electric heat dissipation aluminium pig between be equipped with elastic gasket and contact pad in proper order, the contact pad with cross electric heat dissipation aluminium pig contact connection.

Preferably, the gate pin and the source pin of the MOS transistor are respectively welded on the control circuit board, and the output end on the other side of the MOS transistor is a drain of the MOS transistor, and the drain of the MOS transistor is provided with the insertion hole.

Preferably, the over-current heat dissipation aluminum block is integrally installed and connected with the bottom heat dissipation substrate through an insulation fastening kit, and an insulation glue layer is arranged between the over-current heat dissipation aluminum block and the bottom heat dissipation substrate.

Preferably, the insulation fastening kit adopts a screw fastener sleeved with an insulation sleeve.

Preferably, the bottom heat dissipation substrate is provided with an aluminum block heat dissipation boss corresponding to the over-current heat dissipation aluminum block, the control circuit board is provided with an aluminum block through window for penetrating through the aluminum block heat dissipation boss, and the aluminum block heat dissipation boss penetrates through the aluminum block limiting window and then is in insulation contact with the corresponding over-current heat dissipation aluminum block.

Preferably, the over-current heat dissipation aluminum block is fixedly mounted on the control circuit board through fasteners distributed in a triangular shape, and meanwhile the bottom heat dissipation substrate is provided with an interference prevention groove for avoiding interference of the fasteners.

Preferably, the height of the electric heat dissipation aluminum block is 18-24mm, and the maximum thickness of the bottom heat dissipation substrate ranges from 25 mm to 35 mm.

Preferably, the bottom heat dissipation substrate is provided with a limiting groove for limiting and placing the control circuit board, and meanwhile, an insulating silica gel ring is clamped on the periphery of the limiting groove.

Preferably, the control circuit board is a PCB, and the bottom heat dissipation substrate is an aluminum heat dissipation substrate.

The specific technical solutions of the multi-module intelligent driving system for the electric vehicle according to the present application may be directly described in CN201811094616.4, CN201811094626.8, CN201811094627.2, CN201811094649.9, CN201811097434.2, CN201911012111.3, and CN201911011607.9, but the present application is not particularly limited thereto, and the electric vehicle power according to the present application is usually not less than 1 KW.

Aiming at the problem that a large current needs to be carried out by a multi-module intelligent driving system of an electric vehicle with a first motor driver unit and a second motor driver unit, the utility model creatively provides that an over-current heat dissipation aluminum block is respectively arranged for each phase of MOS tube unit corresponding to the first motor driver unit and the second motor driver unit, the over-current heat dissipation aluminum block is simultaneously used as a power device and a heat dissipation device of an MOS tube, on the basis of realizing the large-current connection, the consumption of a thick copper plate is avoided, the structure cost is low, and meanwhile, the multi-module intelligent driving system has a good heat dissipation effect and is suitable for being used as a control circuit board for driving a medium-power and high-power electric vehicle; the utility model discloses still further preferably propose to correspond for each phase power MOS pipe unit of three phase current MOS nest of tubes and set up the heat dissipation aluminium strip of crossing, should cross the heat dissipation aluminium strip of crossing and regard as the device and the heat dissipation device of walking by electricity of power MOS pipe simultaneously, on realizing that the battery carries out that the heavy current fills, discharge's basis, avoided the consumption of thick copper equally, the structure is with low costs, has further improved control circuit board's radiating effect moreover.

The utility model provides a control circuit board's preferred MOS pipe installation heat radiation structure very much, concrete scheme adopts: the control circuit board is mounted on the bottom radiating substrate in an insulating mode, one side of each MOS tube pin is welded on the control circuit board, meanwhile, the output end of the other side of each MOS tube is fixedly mounted on the over-current radiating aluminum block through a fastener sleeved with an elastic gasket and is electrically connected with the over-current radiating aluminum block, and the over-current radiating aluminum block is fixedly mounted on the control circuit board and is in insulating contact with the bottom radiating substrate; the bottom of the bottom radiating substrate is provided with a plurality of radiating reinforcing rib sheets; the simple dismouting of MOS pipe of just being convenient for of overall structure, the electric installation device of walking of MOS pipe not only is not only regarded as to cross the heat dissipation aluminium pig of electricity simultaneously, crosses the heat dissipation aluminium pig simultaneously and carries out the heat dissipation contact with bottom heat dissipation base plate, on MOS pipe realization heavy current connection's basis, has not only avoided the consumption of thick copper, and structural cost is low, has good radiating effect simultaneously.

Drawings

FIG. 1 is a view of a mounting structure of a control circuit board according to an embodiment of the present invention;

FIG. 2 is an exploded view of FIG. 1 at an angle;

FIG. 3 is an exploded view of FIG. 1 from another angle;

FIG. 4 is an enlarged view of the structure at A in FIG. 1;

fig. 5 is an exploded view of the mounting structure between the MOS transistor of fig. 3 and the contact pad and the elastic pad.

Detailed Description

The embodiment of the utility model discloses a MOS pipe installation heat radiation structure of control circuit board for electric vehicle, including a plurality of MOS pipes installed on the control circuit board, the control circuit board is installed on the bottom heat radiation base plate in an insulating way, and pin one side of each MOS pipe is welded on the control circuit board, and simultaneously the other side output end of the MOS pipe is fixedly installed on the over-current heat radiation aluminum block through the fastener that is cup jointed with the elastic gasket and is electrically connected with the over-current heat radiation aluminum block, and the over-current heat radiation aluminum block is fixedly installed on the control circuit board and is in insulating contact with the bottom heat radiation base plate; the bottom of the bottom radiating substrate is provided with a plurality of radiating reinforcing rib sheets.

In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

Referring to fig. 1, 2 and 3, a control circuit board mounting structure of an electric vehicle multi-module intelligent driving system (not shown, and may specifically adopt the technical solution of CN 201811094627.2) includes a three-phase ac motor and a controller group for controlling the three-phase ac motor, wherein a stator of the three-phase ac motor adopts a first winding unit and a second winding unit; the controller group comprises a first motor driver unit and a second motor driver unit which are respectively and correspondingly electrically connected with the winding units and are used for controlling the operation of the corresponding winding units; the first motor driver unit and the second motor driver unit include a first winding three-phase MOS tube group 20a and a second winding three-phase MOS tube group 20b that are mounted on the control circuit board 10, respectively; the control circuit board 10 is mounted on the bottom heat dissipation substrate 30 in an insulating manner, wherein each winding three-phase MOS tube group 20a,20b comprises a three-phase MOS tube unit, each phase MOS tube unit comprises at least 2 MOS tubes 21 connected in series and a single over-current heat dissipation aluminum block 40 provided with a winding electrical contact output point 41, one side of a pin of each MOS tube 21 is welded on the control circuit board 10, meanwhile, the output end of the other side of each MOS tube 21 is fixedly mounted on the over-current heat dissipation aluminum block 40 and electrically connected with the over-current heat dissipation aluminum block 40, and the over-current heat dissipation aluminum block 40 is fixedly mounted on the control circuit board 10 and is in insulating contact with the bottom heat dissipation substrate;

preferably, in the present embodiment, the first winding three-phase MOS tube group 20a and the second winding three-phase MOS tube group 20b are arranged in parallel; each phase of MOS tube unit comprises 3 MOS tubes 21 which are connected in series and are arranged on a single over-current heat dissipation aluminum block 40 in parallel; certainly, in other embodiments, the number of the MOS transistors 21 to be specifically connected in series may also be selected according to the current setting requirement; a plurality of capacitor devices are disposed on the control circuit board 10 of the present embodiment according to actual needs, which are common knowledge in the field of driving control, and therefore, the present embodiment is not described in detail;

the embodiment also specifically discloses a MOS tube mounting heat dissipation structure of the control circuit board 10, the control circuit board 10 is mounted on the bottom heat dissipation substrate 30 in an insulating manner, one side of each pin of the MOS tube 21 is welded on the control circuit board 10, meanwhile, the output end of the other side of the MOS tube 21 is fixedly mounted on the over-current heat dissipation aluminum block 40 through a fastener 51 sleeved with an elastic gasket 52 and is electrically connected with the over-current heat dissipation aluminum block 40, and the over-current heat dissipation aluminum block 40 is fixedly mounted on the control circuit board 10 and is in insulating contact with the bottom heat dissipation substrate 30; the bottom of the bottom radiating substrate 30 is provided with a plurality of radiating reinforcing ribs 31;

preferably, in the present embodiment, the bottom heat dissipation substrate 30 is provided with a limiting groove 32 for limiting the placement of the control circuit board 10, and an insulating silica gel ring 33 is clamped on the periphery of the limiting groove 32;

preferably, in order to further ensure the heat dissipation effect, in the present embodiment, the height of the over-current heat dissipation aluminum block 40 is 18-24mm, and the maximum thickness (including the heat dissipation reinforcing ribs 31) of the bottom heat dissipation substrate 30 is in the range of 25-35 mm; the control circuit board 10 adopts a PCB, and the bottom radiating substrate 30 adopts an aluminum radiating substrate, so that the quick radiating effect is facilitated;

preferably, as further shown in fig. 4 and fig. 5, in the present embodiment, a fastener 51 is respectively sleeved with a contact pad 53 and an elastic pad 52, the fastener 51 has an insertion hole 22 at an output end of the MOS tube 21 on the other side, the fastener 51 penetrates through the insertion hole and then is fixedly mounted and connected with the electrical over-current heat dissipation aluminum block 40, wherein the elastic pad 52 and the contact pad 53 are sequentially arranged between the fastener end 51a and the electrical over-current heat dissipation aluminum block 40, and the contact pad 53 is in contact connection with the electrical over-current heat dissipation aluminum block 40; particularly preferably, in the present embodiment, the gate pin 21a and the source pin 21b of the MOS transistor are respectively welded on the control circuit board, and the output end on the other side of the MOS transistor is a MOS transistor drain 21c, and the MOS transistor drain 21c is provided with an insertion hole 22;

preferably, in the present embodiment, the over-current heat dissipation aluminum block 40 is integrally mounted and connected to the bottom heat dissipation substrate 30 through an insulating fastening kit, and an insulating adhesive layer (not shown) is disposed between the over-current heat dissipation aluminum block 40 and the bottom heat dissipation substrate 30; particularly preferably, in the present embodiment, the insulating fastening kit employs a screw fastener 42 sleeved with an insulating sleeve 43;

preferably, in the present embodiment, the over-current heat dissipation aluminum block 40 is fixedly mounted on the control circuit board 10 by the fasteners 44 distributed in a triangular shape, and the bottom heat dissipation substrate 30 is provided with the interference prevention groove 34 for avoiding interference of the fasteners;

preferably, in order to ensure the stability of the mounting structure between the control circuit board 10 and the bottom heat dissipation substrate 30 and facilitate the heat dissipation contact effect between the bottom heat dissipation substrate 30 and the over-current heat dissipation aluminum block 40, in this embodiment, a plurality of aluminum block heat dissipation bosses 35 corresponding to the over-current heat dissipation aluminum blocks 40 are disposed on the bottom heat dissipation substrate 30, a plurality of aluminum block through windows 11 for passing through the aluminum block heat dissipation bosses 35 are disposed on the control circuit board 10, and after passing through the aluminum block limiting windows 11, each aluminum block heat dissipation boss 35 is in insulation contact with the corresponding over-current heat dissipation aluminum block 40;

in the embodiment, the control circuit board 10 is installed on the bottom heat dissipation substrate 30 in an insulating manner, one side of each pin of the MOS tube 21 is welded on the control circuit board 10, meanwhile, the output end of the other side of the MOS tube 21 is fixedly installed on the over-current heat dissipation aluminum block 40 through the fastener 51 sleeved with the elastic gasket 52 and is electrically connected with the over-current heat dissipation aluminum block 40, and the over-current heat dissipation aluminum block 40 is fixedly installed on the control circuit board 10 and is in insulating contact with the bottom heat dissipation substrate 30; the bottom of the bottom radiating substrate 30 is provided with a plurality of radiating reinforcing ribs 31; the simple dismouting of MOS pipe 21 of just being convenient for of overall installation structure, the installation device of walking of MOS pipe 21 not only is regarded as to cross electric heat dissipation aluminium pig 40 simultaneously, crosses electric heat dissipation aluminium pig 40 simultaneously and carries out the heat dissipation contact with bottom heat dissipation base plate 30, realizes on the basis that the heavy current is connected at MOS pipe 21, has not only avoided the consumption of thick copper, and the structure cost is low, has good radiating effect simultaneously.

Preferably, in the present embodiment, the first motor driver unit and the second motor driver unit are electrically connected to the electric vehicle battery through a three-phase power MOS tube set 60, respectively, wherein the three-phase power MOS tube set 60 includes three-phase power MOS tube units, each phase power MOS tube unit includes at least 2 power MOS tubes 61 connected in series and a single over-current heat dissipation aluminum bar 62 provided with a power positive electrode electrical contact point 63a, a power negative electrode electrical contact point 63b is provided on a single over-current heat dissipation aluminum block 64, and the over-current heat dissipation aluminum block 64 is mounted on the bottom heat dissipation substrate 30 in an insulated manner; one side of each pin of each power supply MOS tube 61 is welded on the control circuit board 10, meanwhile, the output end of the other side of each power supply MOS tube 61 is respectively and fixedly arranged on the over-current heat dissipation aluminum strip 62 and is electrically connected with the over-current heat dissipation aluminum strip 62, and the over-current heat dissipation aluminum strip 62 is fixedly arranged on the control circuit board 10 and is in insulated contact with the bottom heat dissipation substrate 30; particularly preferably, in the present embodiment, the three-phase power supply MOS tube group 60 is located between the first winding three-phase MOS tube group 20a and the second winding three-phase MOS tube group, and the three groups are arranged in parallel, so as to ensure the heat dissipation effect and facilitate the device layout of the control circuit board 10;

further preferably, in the present embodiment, the over-current heat dissipation aluminum bar 62 is integrally mounted and connected to the bottom heat dissipation substrate 30 through an insulating fastening kit (also using a screw fastener 42 sleeved with an insulating sleeve 43), and an insulating adhesive layer (not shown) is disposed between the over-current heat dissipation aluminum bar 62 and the bottom heat dissipation substrate 30; specifically, in the present embodiment, the bottom heat dissipation substrate 30 is provided with an aluminum bar heat dissipation boss 36 corresponding to the over-current heat dissipation aluminum bar 62, the control circuit board 10 is provided with an aluminum bar through window 12 for penetrating through the aluminum bar heat dissipation boss 36, and the aluminum bar heat dissipation boss 36 penetrates through the aluminum bar through window 12 and then is in insulation contact with the over-current heat dissipation aluminum bar 62.

Aiming at the problem that a multi-module intelligent driving system of an electric vehicle with a first motor driver unit and a second motor driver unit needs to carry large current, the embodiment creatively provides that an over-current heat dissipation aluminum block 40 is respectively arranged for each phase of MOS tube unit corresponding to the first motor driver unit and the second motor driver unit, and the over-current heat dissipation aluminum block 40 is simultaneously used as a power-carrying device and a heat dissipation device of the MOS tube 21; the present embodiment further preferably proposes that an over-current heat dissipation aluminum bar 62 is correspondingly disposed for each phase power MOS transistor unit of the three-phase power MOS transistor group 60, and the over-current heat dissipation aluminum bar 62 is simultaneously used as a power running device and a heat dissipation device of the power MOS transistor 61, so that on the basis of realizing large-current charging and discharging of the battery, consumption of a thick copper plate is also avoided, the structural cost is low, and the heat dissipation effect of the control circuit board 10 is further improved.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. A MOS tube installation heat dissipation structure of a control circuit board for an electric vehicle comprises a plurality of MOS tubes installed on the control circuit board, and is characterized in that the control circuit board is installed on a bottom heat dissipation substrate in an insulation mode, one side of each MOS tube pin is welded on the control circuit board, meanwhile, the output end of the other side of each MOS tube is fixedly installed on an over-current heat dissipation aluminum block through a fastener sleeved with an elastic gasket and is electrically connected with the over-current heat dissipation aluminum block, and the over-current heat dissipation aluminum block is fixedly installed on the control circuit board and is in insulation contact with the bottom heat dissipation substrate; the bottom of the bottom radiating substrate is provided with a plurality of radiating reinforcing rib pieces.

2. The MOS tube installation heat dissipation structure of claim 1, wherein the fastener is respectively sleeved with a contact gasket and an elastic gasket, the fastener is provided with an insertion hole at an output end of the other side of the MOS tube, the fastener penetrates through the insertion hole and is then fixedly installed and connected with the over-current heat dissipation aluminum block, wherein the elastic gasket and the contact gasket are sequentially arranged between the end part of the fastener and the over-current heat dissipation aluminum block, and the contact gasket is in contact connection with the over-current heat dissipation aluminum block.

3. The MOS transistor mounting heat dissipation structure of claim 2, wherein the gate pin and the source pin of the MOS transistor are respectively soldered on the control circuit board, and the output terminal at the other side of the MOS transistor is a drain of the MOS transistor, and the drain of the MOS transistor is provided with the insertion hole.

4. The MOS tube installation heat dissipation structure of claim 1, wherein the over-current heat dissipation aluminum block is integrally installed and connected with the bottom heat dissipation substrate through an insulation fastening kit, and an insulation glue layer is arranged between the over-current heat dissipation aluminum block and the bottom heat dissipation substrate.

5. The MOS tube installation heat dissipation structure of claim 4, wherein the insulation fastening kit employs a screw fastener sleeved with an insulation sleeve.

6. The MOS transistor mounting heat dissipation structure of claim 1, wherein the bottom heat dissipation substrate is provided with an aluminum block heat dissipation boss corresponding to the over-current heat dissipation aluminum block, the control circuit board is provided with an aluminum block through window for passing through the aluminum block heat dissipation boss, and the aluminum block heat dissipation boss passes through the aluminum block limiting window and then is in insulation contact with the corresponding over-current heat dissipation aluminum block.

7. The MOS transistor mounting heat dissipation structure of claim 1, wherein the over-current heat dissipation aluminum block is fixedly mounted on the control circuit board by fasteners distributed in a triangular shape, and the bottom heat dissipation substrate is provided with interference prevention grooves for avoiding interference of the fasteners.

8. The MOS tube mounting heat dissipation structure of claim 1, wherein the height of the over-current heat dissipation aluminum block is 18-24mm, and the maximum thickness of the bottom heat dissipation substrate is in the range of 25-35 mm.

9. The MOS tube mounting heat dissipation structure of claim 1, wherein the bottom heat dissipation substrate is provided with a limiting groove for limiting placement of the control circuit board, and an insulating silica gel ring is clamped on the periphery of the limiting groove.

10. The MOS tube mounting heat dissipation structure of claim 1, wherein the control circuit board is a PCB board, and the bottom heat dissipation substrate is an aluminum heat dissipation substrate.

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