CN215299196U

CN215299196U - Silicon chip washs recovered water reuse device

Info

Publication number: CN215299196U
Application number: CN202121237750.2U
Authority: CN
Inventors: 龚大成
Original assignee: Sichuan Jingmei Silicon Industry Technology Co ltd
Current assignee: Sichuan Jingmei Silicon Industry Technology Co ltd
Priority date: 2021-06-03
Filing date: 2021-06-03
Publication date: 2021-12-24
Anticipated expiration: 2031-06-03

Abstract

The application provides a silicon chip washs recovery water reuse device belongs to silicon chip and washs recovery technical field. The device comprises a base and a cleaning and recovering mechanism, wherein the first motor is in transmission connection with the telescopic rod, the fixed box is arranged at the top of the telescopic rod, the motor output shaft penetrates through the fixed box and is connected with a bidirectional screw rod, the surface of the two-way screw is connected with two clamping plates by bolts, the collecting box is arranged at one side of the telescopic rod, the top of the collecting box is provided with a collecting pipe communicated with the fixed box, one side of the collecting box is provided with a sleeve, an inner pipe movably connected with the sleeve is arranged at one side of the water tank, a water pump is connected at the other side of the water tank through a hose, the water pump is communicated with a water gun through a hose, the top of the upright rod is rotationally connected with the water gun, the driving piece is in transmission connection with the water gun, and the device is convenient for adjusting the washing angle of the silicon wafer and can collect water after washing.

Description

Silicon chip washs recovered water reuse device

Technical Field

The application relates to the technical field of silicon wafer cleaning and recycling, in particular to a silicon wafer cleaning and recycling water recycling device.

Background

The silicon wafer can be cleaned under high pressure by spraying liquid on the surface of the wafer. The high-pressure cleaning is realized by the spraying effect, and the chips are not easy to scratch and damage. However, high pressure spraying can generate electrostatic effect, and is avoided by adjusting the distance and angle between the nozzle and the sheet or adding antistatic agent. The conventional device is not easy to adjust the water jet angle during operation. In addition, the silicon wafer is impacted by water flow during cleaning, so that the silicon wafer needs to be well fixed, and the silicon wafer cannot be completely cleaned because the conventional device is difficult to adjust after being fixed. In addition, the water cleaned by the prior device is easy to directly run off, cannot be collected and utilized well, and has certain limitation.

How to invent a silicon wafer cleaning and recycling water recycling device to improve the problems becomes a problem to be solved urgently by the technical personnel in the field.

SUMMERY OF THE UTILITY MODEL

In order to make up for the defects, the application provides a silicon wafer cleaning and recycling device, and aims to solve the problems that the angle of cleaning of the device is not easy to adjust, the silicon wafer is not easy to adjust after being fixed, and water after cleaning is not easy to collect.

The embodiment of the application provides a silicon wafer cleaning and recycling water recycling device, which comprises a base and a cleaning and recycling mechanism, wherein the cleaning and recycling mechanism comprises a telescopic rod, a first motor, a fixed box, a collecting box, a water tank, a vertical rod and a driving piece, the telescopic rod is rotatably arranged at the top of the base, the first motor is in transmission connection with the telescopic rod, the fixed box is arranged at the top of the telescopic rod, one side of the fixed box is provided with a motor, an output shaft of the motor penetrates through the fixed box and is connected with a bidirectional screw rod, the surfaces of the bidirectional screw rod are in bolted connection with two clamping plates, the collecting box is arranged at one side of the telescopic rod, the top of the collecting box is provided with a collecting pipe communicated with the fixed box, one side of the collecting box is provided with a sleeve, one side of the water tank is provided with an inner pipe movably connected with the sleeve, the water tank opposite side has the water pump through hose connection, the water pump has the squirt through hose intercommunication, the pole setting is fixed in the base top, the pole setting top with the squirt rotates to be connected, the driving piece with the squirt transmission is connected.

In the implementation process, the silicon chip is placed above the fixed box and is positioned between the two clamp plates, the two clamp plates are designed to be sleeved with the two-way screw through two sections of threads in opposite directions on the two-way screw, the motor rotates to drive the two-way screw to rotate and further drive the two clamp plates to approach each other so as to achieve the effect of clamping and fixing the silicon chip, water in the water tank is fed into the water gun through the pressure of the water pump, the output end of the water gun faces towards the silicon chip so as to wash the silicon chip, the water gun is rotationally connected with the top of the upright rod, the driving piece drives one end of the water gun to move up and down so as to enable the output end of the water gun to move up and down, the regulation of a washing angle is completed, the first motor rotates to drive the fixed box at the top of the telescopic rod to rotate, so that the silicon chip can rotate after being fixed, the telescopic rod can be set to be driven by hydraulic pressure or electric power, so as to regulate the lifting height of the silicon chip, with the washing of the different position of intact silicon chip, because the silicon chip is fixed in fixed box top, the water majority that the squirt washed will fall into fixed box in to discharge into the collecting box through the collecting pipe, after the silicon chip washs, stop the rotation of telescopic link, make the telescopic link get back to the initial position, with inner tube and bushing, thereby accomplish the intercommunication of water tank and collecting box, the water drainage water tank of retrieving the collecting box, and in the squirt is discharged to the pressure through the water pump once more, thereby accomplish the recycle of water resource.

In a specific embodiment, the first motor output shaft is connected with a first bevel gear, the bottom of the telescopic rod is provided with a second bevel gear, the second bevel gear is rotatably mounted on the top of the base through a bearing, and the second bevel gear is meshed with the first bevel gear.

In the implementation process, the first motor rotates to drive the first bevel gear to rotate, the first bevel gear is meshed with the second bevel gear, the second bevel gear rotates to drive the telescopic rod at the top of the second bevel gear to rotate, and the telescopic rod rotates at the top of the base better due to the arrangement of the bearing.

In a specific embodiment, the bottom of the first motor is provided with a mounting seat, and the mounting seat is fixed on the top of the base.

In the implementation process, the first motor is easy to vibrate during operation, and the stability of connection between the first motor and the base is enhanced and the vibration amplitude of the first motor is reduced by arranging the mounting seat.

In a specific embodiment, the driving piece includes slide bar, sliding sleeve, framework, block, diaphragm and second motor, the slide bar set up in the base top, the sliding sleeve slide cup joint in the slide bar, the framework is fixed in sliding sleeve one side, the block set up in the squirt front end, block swing joint in the framework is inboard, the diaphragm is fixed in the slide bar top, second motor output shaft runs through the diaphragm is connected with the lead screw, the lead screw bottom with the base rotates to be connected, sliding sleeve one side is provided with the slide, the slide screw thread cup joint in the lead screw.

In the above-mentioned realization process, the second motor rotates and drives the lead screw and rotates, because the slide screw thread cup joints in the lead screw, so the lead screw rotates and can drive the slide and reciprocate to make the framework of sliding sleeve one side reciprocate, the block activity is inboard in the framework this moment, the block inclines upwards or the decurrent motion of slope, thereby make the output of squirt reciprocate, thereby accomplish the regulation of squirt angle, this kind of mode is convenient for drive squirt through the electric power of second motor and rotates.

In a specific embodiment, a vertical rod is arranged at one end of the transverse plate, a sliding groove is formed in one side of the vertical rod, and a sliding block which slides in the sliding groove is arranged at one end of the sliding plate.

In the implementation process, when the sliding plate moves up and down, the sliding block slides in the sliding groove, so that the vertical sliding stability of the sliding plate is convenient to keep, and the lead screw is prevented from rotating to drive the sliding plate to rotate.

In a specific embodiment, the water tank is movably arranged on the top of the base, and the outer wall of the inner pipe slides on the inner wall of the sleeve.

In the implementation process, the sleeve can be plugged in the process that the collecting box is not communicated with the water tank, and when water flow in the collecting box needs to be utilized, the inner pipe is inserted into the sleeve, so that the water tank is communicated with the collecting box.

In a specific embodiment, the mutually facing sides of the two clamping plates are provided with rubber pads.

In the implementation process, the rubber pad has anti-slip property and elasticity, so that the silicon wafer can be prevented from being damaged due to the fact that the silicon wafer is excessively clamped by the clamping plate, and the friction force between the clamping plate and the silicon wafer can be increased.

In a specific embodiment, the bottom parts of the two clamping plates are slidably connected with the bottom part of the inner wall of the fixed box.

In the implementation process, the design that the clamping plate slides on the fixing box enables the clamping plate to smoothly move transversely in the fixing box.

In a specific embodiment, the top of the water tank is provided with a liquid feeding pipe, and the top of the liquid feeding pipe is provided with a sealing cover.

In the above-mentioned realization process, can add the cleaning solution to the water tank in through the liquid feeding pipe, the water mixing in cleaning solution and the water tank to wash the silicon chip, after the cleaning solution adds, can cover sealed lid in order to prevent that external impurity from getting into the water tank.

In a specific embodiment, the bottom of the base is provided with a self-locking pulley.

In the implementation process, the self-locking pulley is convenient for moving the base, so that the whole device is convenient to move.

Drawings

In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.

FIG. 1 is a schematic structural diagram of a silicon wafer cleaning and recycling apparatus according to an embodiment of the present disclosure;

FIG. 2 is an elevational view of the apparatus as a whole provided by an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a top portion of a second bevel gear according to an embodiment of the present disclosure;

fig. 4 is a partial structural schematic diagram of the whole device provided in the embodiment of the present application.

In the figure: 100-a base; 110-self-locking pulley; 200-a cleaning and recovering mechanism; 210-a telescoping rod; 211-a second bevel gear; 220-a first motor; 221-a first bevel gear; 222-a mount; 230-a stationary box; 231-a motor; 232-bidirectional screw; 233-clamping plate; 240-collection box; 241-a collecting pipe; 242-a sleeve; 250-a water tank; 251-an inner tube; 252-a water pump; 253-water gun; 254-liquid feeding tube; 260-erecting a rod; 270-a drive member; 271-a slide bar; 272-a sliding sleeve; 2721-a skateboard; 2722-sliding block; 273-frame body; 274-mass; 275-a transverse plate; 2751-vertical bar; 2752-chute; 276-a second motor; 2761-lead screw.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus should not be considered limiting.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, the present application provides a silicon wafer cleaning and recycling apparatus, which includes a base 100 and a cleaning and recycling mechanism 200.

Referring to fig. 2-4, the cleaning and recycling mechanism 200 includes a telescopic rod 210, a first motor 220, a fixing box 230, a collecting box 240, a water tank 250, a vertical rod 260 and a driving member 270, the telescopic rod 210 is rotatably mounted on the top of the base 100, the first motor 220 is in transmission connection with the telescopic rod 210, the fixing box 230 is disposed on the top of the telescopic rod 210, one side of the fixing box 230 is provided with a motor 231, an output shaft of the motor 231 penetrates through the fixing box 230 and is connected with a two-way screw 232, the surfaces of the two-way screw 232 are connected with clamping plates 233 by bolts, the two clamping plates 233 are symmetrically disposed, the collecting box 240 is disposed on one side of the telescopic rod 210, the top of the collecting box 240 is provided with a collecting pipe 241 communicated with the fixing box 230, one side of the collecting box 240 is provided with a casing 242, one side of the water tank 250 is provided with an inner pipe 251 movably connected with the casing 242, the other side of the water tank 250 is connected with a water pump 252 through a hose, the water gun 253 is communicated with the water pump 252 through a hose, the vertical rod 260 is fixed on the top of the base 100, the top of the vertical rod 260 is rotatably connected with the water gun 253, and the driving member 270 is in transmission connection with the water gun 253.

In some specific embodiments, the output shaft of the first motor 220 is connected with a first bevel gear 221, the bottom of the telescopic rod 210 is provided with a second bevel gear 211, the second bevel gear 211 is rotatably mounted at the top of the base 100 through a bearing, the second bevel gear 211 is meshed with the first bevel gear 221, the first motor 220 rotatably drives the first bevel gear 221 to rotate, the first bevel gear 221 is meshed with the second bevel gear 211, so that the second bevel gear 211 rotates to drive the telescopic rod 210 at the top of the telescopic rod to rotate, and the bearing is arranged to enable the telescopic rod 210 to rotate at the top of the base 100 better.

In some specific embodiments, the mounting seat 222 is disposed at the bottom of the first motor 220, the mounting seat 222 is fixed to the top of the base 100, the first motor 220 is prone to generate vibration during operation, and the mounting seat 222 enhances the stability of the connection between the first motor 220 and the base 100 and reduces the vibration amplitude of the first motor 220.

In some specific embodiments, the driving member 270 includes a sliding rod 271, a sliding sleeve 272, a frame 273, a block 274, a horizontal plate 275 and a second motor 276, the sliding rod 271 is disposed on the top of the base 100, the sliding sleeve 272 is slidably sleeved on the sliding rod 271, the frame 273 is fixed on one side of the sliding sleeve 272, the block 274 is disposed at the front end of the water gun 253, the block 274 is movably connected to the inside of the frame 273, the horizontal plate 275 is fixed on the top of the sliding rod 271, an output shaft of the second motor 276 is connected to a lead screw 2761 through the horizontal plate 275, the bottom of the lead screw 2761 is rotatably connected to the base 100, a sliding plate 2721 is disposed on one side of the sliding sleeve 272, the sliding plate 2721 is threadedly sleeved on the lead screw 2761, the lead screw 2761 rotates to drive the sliding plate 2721 to move up and down, so that the frame 273 on one side of the sliding sleeve 272 moves up and down, the block 274 moves inside of the frame 273, the block 274 performs an upward tilting or downward tilting motion, thereby make the output of squirt 253 reciprocate to accomplish the regulation of squirt 253 angle, this kind of mode is convenient for drive squirt 253 through the electric power of second motor 276 and is rotated.

In some specific embodiments, transverse plate 275 one end is provided with montant 2751, and montant 2751 one side is provided with spout 2752, and slide 2721 one end is provided with the slider 2722 that slides in spout 2752, and when slide 2721 reciprocated, slider 2722 slided in spout 2752, was convenient for keep the vertical gliding stability of slide 2721, has avoided lead screw 2761 to rotate and has driven slide 2721 and rotate.

In some embodiments, the water tank 250 is movably disposed on the top of the base 100, the outer wall of the inner tube 251 slides on the inner wall of the sleeve 242, the sleeve 242 can be blocked when the collection box 240 is not communicated with the water tank 250, and the inner tube 251 is inserted into the sleeve 242 when the water flow in the collection box 240 is needed, so as to complete the communication between the water tank 250 and the collection box 240.

In some specific embodiments, the rubber pads are disposed on the surfaces of the two clamping plates 233 facing each other, and the rubber pads have anti-slip property and elasticity, so that the silicon wafer can be prevented from being damaged due to the excessive clamping of the silicon wafer by the clamping plates 233, and the friction between the clamping plates 233 and the silicon wafer can be increased.

In some embodiments, the bottom of each of the clamping plates 233 is slidably connected to the bottom of the inner wall of the fixing box 230, and the clamping plates 233 are slidably connected to the fixing box 230 such that the clamping plates 233 can smoothly move laterally inside the fixing box 230.

In some embodiments, a liquid feeding pipe 254 is disposed on the top of the water tank 250, a sealing cap is disposed on the top of the liquid feeding pipe 254, a cleaning liquid is added into the water tank 250 through the liquid feeding pipe 254, the cleaning liquid is mixed with water in the water tank 250 to clean silicon wafers, and after the cleaning liquid is added, the sealing cap is covered to prevent foreign substances from entering the water tank 250.

In some specific embodiments, the bottom of the base 100 is provided with a self-locking pulley 110, and the self-locking pulley 110 facilitates the movement of the base 100, and thus the movement of the whole device.

The working principle of the silicon wafer cleaning and recycling device is as follows: the silicon chip is placed above the fixing box 230 and is positioned between the two clamping plates 233, the two clamping plates 233 are designed to be sleeved with the two-way screw 232 through two sections of opposite-direction threads on the two-way screw 232, the motor 231 rotates to drive the two-way screw 232 to rotate and further drive the two clamping plates 233 to approach each other so as to achieve the effect of clamping and fixing the silicon chip, water in the water tank 250 is fed into the water gun 253 through the pressure of the water pump 252, the output end of the water gun 253 faces towards the silicon chip so as to wash the silicon chip, the water gun 253 is rotatably connected with the top of the upright rod 260, the driving piece 270 drives one end of the water gun 253 to move up and down so as to vertically move the output end of the water gun 253 and complete the regulation of the washing angle, the first motor 220 rotates to drive the fixing box 230 at the top of the telescopic rod 210 to rotate after the silicon chip is fixed, and the telescopic rod 210 can be set to be driven by hydraulic pressure or electric power, therefore, the lifting height of the silicon wafer is adjusted, the silicon wafer is cleaned in different directions, the silicon wafer is fixed above the fixed box 230, most of water flushed by the water gun 253 falls into the fixed box 230 and is discharged into the collecting box 240 through the collecting pipe 241, after the silicon wafer is cleaned, the rotation of the telescopic rod 210 is stopped, the telescopic rod 210 returns to the initial position, the inner pipe 251 is connected with the sleeve 242, the water tank 250 is communicated with the collecting box 240, the water recovered by the collecting box 240 is discharged into the water tank 250 and is discharged into the water gun 253 through the pressure of the water pump 252 again, and therefore the water resource is recycled.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A silicon wafer cleaning and recycling device is characterized by comprising

A base (100);

the cleaning and recycling mechanism (200) comprises a telescopic rod (210), a first motor (220), a fixed box (230), a collecting box (240), a water tank (250), a vertical rod (260) and a driving piece (270), wherein the telescopic rod (210) is rotatably installed at the top of the base (100), the first motor (220) is in transmission connection with the telescopic rod (210), the fixed box (230) is arranged at the top of the telescopic rod (210), a motor (231) is arranged at one side of the fixed box (230), an output shaft of the motor (231) penetrates through the fixed box (230) to be connected with a bidirectional screw (232), clamping plates (233) are bolted on the surfaces of the bidirectional screw (232), two clamping plates (233) are symmetrically arranged, the collecting box (240) is arranged at one side of the telescopic rod (210), and a collecting pipe (241) communicated with the fixed box (230) is arranged at the top of the collecting box (240), the water gun is characterized in that a sleeve (242) is arranged on one side of the collecting box (240), an inner pipe (251) movably connected with the sleeve (242) is arranged on one side of the water tank (250), a water pump (252) is connected to the other side of the water tank (250) through a hose, the water pump (252) is communicated with a water gun (253) through a hose, the vertical rod (260) is fixed to the top of the base (100), the top of the vertical rod (260) is rotatably connected with the water gun (253), and a driving piece (270) is in transmission connection with the water gun (253).

2. The silicon wafer cleaning and recycling device of claim 1, wherein the output shaft of the first motor (220) is connected with a first bevel gear (221), the bottom of the expansion link (210) is provided with a second bevel gear (211), the second bevel gear (211) is rotatably mounted on the top of the base (100) through a bearing, and the second bevel gear (211) is meshed with the first bevel gear (221).

3. The silicon wafer cleaning and recycling device as claimed in claim 2, wherein a mounting seat (222) is provided at the bottom of the first motor (220), and the mounting seat (222) is fixed at the top of the base (100).

4. The silicon wafer cleaning and recycling device of claim 1, wherein the driving member (270) comprises a sliding rod (271), a sliding sleeve (272), a frame (273), a block (274), a horizontal plate (275) and a second motor (276), the sliding rod (271) is disposed on the top of the base (100), the sliding sleeve (272) is slidably sleeved on the sliding rod (271), the frame (273) is fixed on one side of the sliding sleeve (272), the block (274) is disposed at the front end of the water gun (253), the block (274) is movably connected to the inner side of the frame (273), the horizontal plate (275) is fixed on the top of the sliding rod (271), an output shaft of the second motor (276) penetrates through the horizontal plate (275) and is connected with a lead screw (2761), the bottom of the lead screw (2761) is rotatably connected with the base (100), a sliding plate 2721 is disposed on one side of the sliding sleeve (272), the sliding plate (2721) is sleeved on the screw rod (2761) in a threaded manner.

5. The silicon wafer cleaning and recycling device as claimed in claim 4, wherein a vertical rod (2751) is disposed at one end of the horizontal plate (275), a sliding groove (2752) is disposed at one side of the vertical rod (2751), and a sliding block (2722) sliding in the sliding groove (2752) is disposed at one end of the sliding plate (2721).

6. The silicon wafer cleaning and recycling device as claimed in claim 1, wherein said water tank (250) is movably disposed on the top of said base (100), and the outer wall of said inner tube (251) slides on the inner wall of said sleeve (242).

7. The silicon wafer cleaning and recycling device as claimed in claim 1, wherein the surfaces of the two clamping plates (233) facing each other are provided with rubber pads.

8. The silicon wafer cleaning and recycling device as claimed in claim 1, wherein the bottoms of the two clamping plates (233) are slidably connected to the bottom of the inner wall of the fixing box (230).

9. The silicon wafer cleaning and recycling device as claimed in claim 1, wherein a liquid feeding pipe (254) is arranged on the top of the water tank (250), and a sealing cover is arranged on the top of the liquid feeding pipe (254).

10. The silicon wafer cleaning and recycling device according to claim 1, wherein the bottom of the base (100) is provided with a self-locking pulley (110).