CN215287406U

CN215287406U - Winding device for flexible semiconductor package

Info

Publication number: CN215287406U
Application number: CN202023211514.1U
Authority: CN
Inventors: 庄文凯
Original assignee: Shanghai Xinpan Semiconductor Technology Co ltd
Current assignee: Shanghai Xinpan Semiconductor Technology Co ltd
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2021-12-24
Anticipated expiration: 2030-12-28

Abstract

The utility model discloses a winding roll-up device of compliance semiconductor package, the power distribution box comprises a box body, a plurality of supporting legss of lower wall fixedly connected with of box, the lateral wall fixedly connected with connecting plate of box, the lateral wall fixedly connected with motor of connecting plate, the output shaft of motor runs through the fixedly connected with pivot, the pivot runs through the box, the first reel of one end fixedly connected with of motor is kept away from to first pivot, the inside wall of box rotates and is connected with the second reel, the inside wall of box rotates and is connected with first guide pulley, second guide pulley and third guide pulley, the upper wall fixedly connected with backup pad of box, the lateral wall of backup pad rotates and is connected with the third reel, the upper wall of box is equipped with the opening. The utility model discloses guaranteed the leakproofness of winding after by the roll-up, reduced the problem of non-bonding greatly to dust and moisture and semiconductor contact have been avoided.

Description

Winding device for flexible semiconductor package

Technical Field

The utility model relates to a roll-up device technical field especially relates to roll-up device of compliance semiconductor package.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature, and the semiconductor package refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The coiling of the coiling tape can be carried out after the semiconductor packaging is finished, and the existing coiling device has the following defects:

1. dust exists on a winding tape of the produced semiconductor package, and when the protective tape is used for bonding the semiconductor package, the place with the dust can be bonded loosely, so that the semiconductor can be exposed in the air and can not be protected;

2. when a semiconductor is closely protected by a protective tape, the protective tape and the tape are not pressed by the device during winding, and therefore, a part of the semiconductor is damaged due to dust and moisture coming into contact with the semiconductor in a non-tight place between the wound tape and the protective tape.

Therefore, a tape winding device for flexible semiconductor package is required to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art, and providing a winding and reeling device for flexible semiconductor packaging.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

roll up device of winding of compliance semiconductor package, the power distribution box comprises a box body, a plurality of supporting legss of lower wall fixedly connected with of box, the lateral wall fixedly connected with connecting plate of box, the lateral wall fixedly connected with motor of connecting plate, the output shaft of motor runs through the fixedly connected with pivot, the pivot runs through the box, the first winding wheel of one end fixedly connected with of motor is kept away from in the pivot, the inside wall of box rotates and is connected with the second winding wheel, the inside wall of box rotates and is connected with first guide pulley, second guide pulley and third guide pulley, the upper wall fixedly connected with backup pad of box, the lateral wall of backup pad rotates and is connected with the third winding wheel, the upper wall of box is equipped with the opening, be equipped with hold-down mechanism on the box, be equipped with clean mechanism in the box.

Preferably, hold-down mechanism is including fixing first fixed plate and the second fixed plate at the box lateral wall, the lateral wall of first fixed plate runs through and is equipped with reciprocal lead screw, the one end of reciprocal lead screw is rotated with the lateral wall of second fixed plate and is connected, the lateral wall threaded connection of reciprocal lead screw has the slider, the upper wall fixedly connected with connecting rod of slider, the lateral wall of box is equipped with two parallel removal mouths, two all be equipped with the cylinder in the removal mouth, two the cylinder is located the outer one end of box and all is connected with the lateral wall of connecting rod in the rotation.

Preferably, the cleaning mechanism comprises a brush bar fixedly connected to the side wall of the box body, and a dust collection box is arranged below the brush bar.

Preferably, a protective tape is wound on the second winding wheel, a winding tape is wound on the third winding wheel, and a semiconductor is fixedly connected to the side wall of the winding tape.

Preferably, the protection rubber belt is connected with the first reel through a second guide wheel, and the winding belt penetrates through the opening and is connected with the first reel through a third guide wheel and the first guide wheel in sequence.

Preferably, a first bevel gear is fixedly connected to a side wall of the rotating shaft, a second bevel gear is fixedly connected to one end of the reciprocating lead screw, and the first bevel gear is meshed with the second bevel gear.

The utility model discloses following beneficial effect has:

1. in the utility model, the motor rotates to drive the first winding wheel to rotate, the first guide wheel, the second guide wheel and the third guide wheel play a role in protecting the adhesive tape and the winding tape to be orderly wound into the first winding wheel, and when the winding tape moves to the first winding wheel, the brush strip can well brush the semiconductor and the dust on the winding tape, so that the protective adhesive tape can better stick the winding tape tightly when the winding tape is bonded;

2. the utility model discloses in, the motor rotates the slider reciprocating motion that can make on the reciprocating screw to drive two cylinders and carry out the roll back and forth with the protection sticky tape and compress tightly, just so guaranteed the leakproofness of winding after by the roll-up, the unbonded problem has been reduced greatly, thereby has avoided dust and moisture and semiconductor contact.

Drawings

Fig. 1 is a schematic structural view of a tape winding device for flexible semiconductor package according to the present invention;

fig. 2 is an enlarged view of a structure at a position a of the tape winding device for flexible semiconductor package according to the present invention;

fig. 3 is a front view of the tape winding device for flexible semiconductor package according to the present invention;

fig. 4 is a sectional view taken along line B-B of fig. 3.

In the figure: the device comprises a box body 1, supporting legs 2, a first winding wheel 3, a motor 4, a second winding wheel 5, a moving port 6, a roller 7, a first guide wheel 8, a second guide wheel 9, a protective adhesive tape 10, a third guide wheel 11, a winding belt 12, a supporting plate 13, a third winding wheel 14, a first fixing plate 15, a second fixing plate 16, a brush strip 17, a dust collection box 18, a semiconductor 19, a connecting plate 20, a sliding block 21, a connecting rod 22 and a reciprocating lead screw 23.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-4, a winding device for flexible semiconductor packaging comprises a box body 1, a plurality of supporting legs 2 are fixedly connected to the lower wall of the box body 1, a connecting plate 20 is fixedly connected to the outer side wall of the box body 1, a motor 4 is fixedly connected to the side wall of the connecting plate 20, an output shaft of the motor 4 is fixedly connected with a rotating shaft, a first bevel gear is fixedly connected to the side wall of the rotating shaft, the rotating shaft penetrates through the box body 1, the rotating shaft is rotatably connected with the box body 1 through a first bearing, a first winding wheel 3 is fixedly connected to one end of the rotating shaft far away from the motor 4, the first winding wheel 3 is a combined body formed by bonding and protecting a semiconductor 19 on a winding belt 12 through a protective adhesive tape 10, a second winding wheel 5 is rotatably connected to the inner side wall of the box body 1, the protective adhesive tape 10 is wound on the second winding wheel 5, the protective adhesive tape 10 is connected with the first winding wheel 3 through a second guide wheel 9, and a first guide wheel 8 is rotatably connected to the inner side wall of the box body 1, Second guide pulley 9 and third guide pulley 11, the guide pulley plays the guide effect to protection sticky tape 10 and winding belt 12 in the transmission, prevent positional deviation, lead to the bonding dislocation, the upper wall fixedly connected with backup pad 13 of box 1, the lateral wall of backup pad 13 rotates and is connected with third reel 14, third reel 14 is rolled up there is winding belt 12, winding belt 12 runs through the opening and loops through third guide pulley 11, first guide pulley 8 is connected with first reel 3, the lateral wall fixedly connected with semiconductor 19 of winding belt 12, the upper wall of box 1 is equipped with the opening, be equipped with hold-down mechanism on the box 1, be equipped with cleaning mechanism in the box 1, cleaning mechanism includes the brush strip 17 of fixed connection at the box 1 lateral wall, the brush hair hardness on the brush strip 17 is softer, avoid scraping colored semiconductor 19, the below of brush strip 17 is equipped with dust collection box 18.

Hold-down mechanism is including fixing first fixed plate 15 and the second fixed plate 16 at 1 lateral wall of box, the lateral wall of first fixed plate 15 runs through and is equipped with reciprocal lead screw 23, the one end fixedly connected with second bevel gear of reciprocal lead screw 23, first bevel gear and second bevel gear meshing, the one end of reciprocal lead screw 23 is rotated with the lateral wall of second fixed plate 16 and is connected, the lateral wall threaded connection of reciprocal lead screw 23 has slider 21, the upper wall fixedly connected with connecting rod 22 of slider 21, the lateral wall of box 1 is equipped with the removal mouth 6 of two parallels, all be equipped with cylinder 7 in two removal mouths 6, the lateral wall of cylinder is equipped with the cushion, avoid crushing semiconductor 19, two outer one ends of cylinder 7 bit in box 1 all rotate with the lateral wall of connecting rod 22 and are connected.

The utility model discloses in, starter motor 4, motor 4 drives first reel 3 and rotates, thereby be drawn into first reel 3 with protection sticky tape 10 on the second reel 5 and winding 12 on the third reel 14 together, first guide pulley 8, second guide pulley 9 can play the guide effect well with third guide pulley 11, can bond protection sticky tape 10 and winding 12 together neatly, take semiconductor 19 to the in-process that first reel 3 removed at winding 12, brush 17 constantly clears up its surface, fall into dust collection box 18 with the dust brush on surface, like this when the bonding that follows, protection sticky tape 10 can bond better.

The motor 4 rotates, the reciprocating lead screw 23 is driven to rotate through the first bevel gear and the second bevel gear, so that the sliding block 21 reciprocates, the connecting rod 22 can drive the two rollers 7 to move back and forth in the moving port 6, when the two rollers 7 move, the protective adhesive tape 10 and the winding tape 12 which are clamped between the two rollers are pressed back and forth, the protective adhesive tape 10 and the winding tape 12 are bonded tightly, the sealing performance of the winding tape 12 after being wound is guaranteed, the problem of non-bonding is greatly reduced, and the contact of dust and moisture with the semiconductor 19 is avoided.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A winding device for flexible semiconductor packaging comprises a box body (1) and is characterized in that a plurality of supporting legs (2) are fixedly connected to the lower wall of the box body (1), a connecting plate (20) is fixedly connected to the outer side wall of the box body (1), a motor (4) is fixedly connected to the side wall of the connecting plate (20), an output shaft of the motor (4) penetrates through a rotating shaft which penetrates through the box body (1), a first winding wheel (3) is fixedly connected to one end, away from the motor (4), of the rotating shaft, a second winding wheel (5) is rotatably connected to the inner side wall of the box body (1), a first guide wheel (8), a second guide wheel (9) and a third guide wheel (11) are rotatably connected to the inner side wall of the box body (1), a supporting plate (13) is fixedly connected to the upper wall of the box body (1), and a third winding wheel (14) is rotatably connected to the side wall of the supporting plate (13), the upper wall of the box body (1) is provided with an opening, the box body (1) is provided with a pressing mechanism, and a cleaning mechanism is arranged in the box body (1).

2. The roll-up device for the flexible semiconductor package according to claim 1, wherein the compressing mechanism comprises a first fixing plate (15) and a second fixing plate (16) fixed on the outer side wall of the box (1), a reciprocating lead screw (23) penetrates through the side wall of the first fixing plate (15), one end of the reciprocating lead screw (23) is rotatably connected with the side wall of the second fixing plate (16), a sliding block (21) is connected with the side wall of the reciprocating lead screw (23) in a threaded manner, a connecting rod (22) is fixedly connected to the upper wall of the sliding block (21), two parallel moving ports (6) are arranged on the side wall of the box (1), rollers (7) are arranged in the two moving ports (6), and one ends of the rollers (7) located outside the box (1) are rotatably connected with the side wall of the connecting rod (22).

3. A tape winding device for flexible semiconductor package according to claim 2, wherein said cleaning mechanism comprises a brush bar (17) fixedly connected to the side wall of the case (1), and a dust collecting box (18) is arranged under said brush bar (17).

4. A tape winding device for a flexible semiconductor package according to claim 1, wherein a protective tape (10) is wound on the second winding wheel (5), a tape (12) is wound on the third winding wheel (14), and a semiconductor (19) is fixedly connected to a side wall of the tape (12).

5. A tape winding device for flexible semiconductor package according to claim 4, wherein the protective tape (10) is connected to the first winding wheel (3) via the second guide wheel (9), and the tape (12) is connected to the first winding wheel (3) via the third guide wheel (11) and the first guide wheel (8) in sequence.

6. The winding device for the flexible semiconductor package according to claim 2, wherein a first bevel gear is fixedly connected to the side wall of the rotating shaft, a second bevel gear is fixedly connected to one end of the reciprocating lead screw (23), and the first bevel gear is engaged with the second bevel gear.