CN215281992U

CN215281992U - Sucker gripper device and semiconductor processing equipment

Info

Publication number: CN215281992U
Application number: CN202023041600.2U
Authority: CN
Inventors: 方欣
Original assignee: Wuxi China Resources Micro Assembly Tech Ltd
Current assignee: Wuxi China Resources Micro Assembly Tech Ltd
Priority date: 2020-12-16
Filing date: 2020-12-16
Publication date: 2021-12-24
Anticipated expiration: 2030-12-16

Abstract

The application provides a sucking disc tongs and semiconductor processing equipment. The sucker gripping device comprises a sucker assembly and a cleaning device at least partially arranged on the outer peripheral side of the sucker assembly, the sucker assembly is used for grabbing a semiconductor product, and the cleaning device is used for blowing air to the surface of the sucker assembly or the surface of the semiconductor product. The sucker gripping device is provided with the cleaning device to blow air to the surface of the sucker assembly or the surface of the semiconductor product, so that the surface of the sucker assembly and the semiconductor product are cleaner, and the risk of pollution or scratch of the surface of the semiconductor caused by chips or impurities on the surface of the sucker assembly or the semiconductor product is avoided.

Description

Sucker gripper device and semiconductor processing equipment

Technical Field

The application relates to the technical field of semiconductors, in particular to a sucker gripper device and semiconductor processing equipment.

Background

In the production process of semiconductor products, the semiconductor products or structures are usually moved to perform different processes at different stations. In moving the semiconductor products, a gripper is typically used to grasp the semiconductor product or structure and move it to the next station. In the related art, when the gripping device grips a semiconductor product or a structure, the surface of the semiconductor product or the structure is easily polluted and scratched.

SUMMERY OF THE UTILITY MODEL

One aspect of the application provides a sucking disc tongs, and it includes that sucking disc subassembly and at least part locate the cleaning device of sucking disc subassembly periphery side, the sucking disc subassembly is used for snatching the semiconductor product, cleaning device be used for to the surface of sucking disc subassembly or semiconductor product surface blow.

Optionally, the cleaning device comprises a cleaning device seat arranged on two opposite sides of the sucker component, the cleaning device seat is provided with an air outlet, and an opening of the air outlet is located on one side of the cleaning device seat facing the sucker component.

Optionally, the cleaning device base includes a first exhaust hole and a second exhaust hole which are arranged up and down, and the extending direction of the first exhaust hole is different from the extending direction of the second exhaust hole.

Optionally, the first air outlet hole extends obliquely upwards in a direction from the outer end of the cleaning device seat to the inner end of the cleaning device seat; and/or the second exhaust air hole extends obliquely downward in a direction from the outer end of the cleaning device seat to the inner end of the cleaning device seat.

Optionally, the sucker assembly comprises a sucker supporting seat and a sucker, and the sucker is arranged on the sucker supporting seat and extends out of the lower end of the sucker supporting seat.

Optionally, the number of the suckers is multiple, and the suckers are arranged on the sucker supporting seat at intervals.

Optionally, the sucker is detachably mounted on the sucker support seat through the sucker mounting seat.

Optionally, the sucker gripper device comprises a cushion pad arranged on the lower surface of the sucker support seat, the cushion pad is provided with a plurality of holes for penetrating the suckers, and the lower surface of the sucker is lower than the lower surface of the cushion pad.

Optionally, the sucker gripper comprises an elastic resetting device, the sucker assembly is arranged below the elastic resetting device, and the elastic resetting device provides upward resetting elastic force for the sucker assembly when the sucker assembly puts down the grabbed semiconductor product.

Optionally, the elastic resetting device comprises a plurality of elastic resetting pieces and a fixing plate, the upper parts of the elastic resetting pieces are arranged on the fixing plate, and the sucker assembly is arranged at the lower end of the elastic resetting piece.

Optionally, the sucker gripper device comprises a vacuum pumping device, the vacuum pumping device comprises a vacuum pipeline, the sucker assembly comprises an annular sucker with an air channel in the middle, and the vacuum pipeline is communicated with the air channel of the sucker; or the like, or, alternatively,

the sucker gripper device comprises a semiconductor product positioning detection device, the semiconductor product positioning detection device comprises a positioning detection needle, and the positioning detection needle is arranged on one side of the sucker component.

One aspect of the present application provides a semiconductor processing apparatus, which includes an apparatus supporting main body, and a conveying device, a mechanical arm, a target work tray, a control device, and a suction cup gripper device, which are disposed on the apparatus supporting main body, wherein the suction cup gripper device is the above-mentioned suction cup gripper device;

the sucker gripper device is arranged at the outer end of the mechanical arm, a cleaning device, the mechanical arm and a transmission device of the sucker gripper device are electrically connected with the control device, and the control device is used for controlling the transmission device to transmit the semiconductor product to a preset position to be grabbed, controlling the mechanical arm to drive the sucker gripper device to move so as to grab the semiconductor product at the position to be grabbed, and transferring the semiconductor product to the target working plate; and the control device is used for controlling the cleaning device to blow air to the surface of the semiconductor product before the semiconductor product is grabbed by the suction disc grabbing device, and blow air to the surface of the suction disc assembly after the semiconductor product is placed on the target working disc by the suction disc grabbing device.

According to the sucker gripper and the semiconductor processing equipment provided by the embodiment of the application, the sucker gripper is provided with the cleaning device to blow air to the surface of the sucker component or the surface of a semiconductor product, so that the surface of the sucker component and the semiconductor product are cleaner, and the risk of pollution or scratch of the surface of the semiconductor caused by scraps or impurities existing on the surface of the sucker component or the semiconductor product is avoided.

Drawings

Fig. 1 is a perspective view of a suction cup gripper according to an exemplary embodiment of the present application;

FIG. 2 is a front view of the suction cup gripper of FIG. 1;

FIG. 3 is a side view of the suction cup gripper of FIG. 1;

FIG. 4 is a perspective view of the suction cup gripper of FIG. 1 from another perspective;

FIG. 5 is a bottom view of the suction cup gripper of FIG. 1;

FIG. 6 is a cross-sectional view taken along section line A-A of the suction cup gripper of FIG. 5;

FIG. 7 is an enlarged schematic view of FIG. 6 at B;

FIG. 8 is a schematic diagram of a combination of a suction cup gripper and a transfer device and a semiconductor product according to an exemplary embodiment of the present application;

FIG. 9 is a schematic view of the combination of FIG. 8 with the suction cup gripper about to grip the semiconductor product;

FIG. 10 is a schematic view of a combination of a suction cup gripper with a target work plate and a semiconductor product for unloading the semiconductor product according to an exemplary embodiment of the present application;

FIG. 11 is a schematic view of the combination of FIG. 10 with the suction cup gripper raised;

FIG. 12 is a schematic structural view of a cleaning apparatus proposed in accordance with an exemplary embodiment of the present application with an air outlet control valve in a closed state;

FIG. 13 is a schematic view showing an operating state of the air control valve shown in FIG. 12;

FIG. 14 is a schematic view of another operating state of the air control valve shown in FIG. 12.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of the terms "a" or "an" and the like in the description and in the claims of this application do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" means two or more. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper" and/or "lower," and the like, are used for convenience of description and are not limited to a single position or orientation in space. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

In semiconductor packaging processes, the semiconductor product or structure is typically moved to perform different processes at different stations. In moving the semiconductor products, a gripper is typically used to grasp the semiconductor product or structure and move it to the next station. In the related art, when the gripping device grips a semiconductor product or a structure, the surface of the semiconductor product or the structure is easily polluted and scratched.

In order to solve the above problems, the present application provides a sucker gripper device. Fig. 1 is a perspective view of a suction cup gripper 100 according to an exemplary embodiment of the present disclosure, as shown in fig. 1. The suction cup gripper 100 can be applied to semiconductor manufacturing equipment such as semiconductor cutting equipment, and can be used for gripping and moving semiconductor products.

Referring to fig. 1, and as necessary with reference to fig. 2-7 and 12-14, the suction cup gripper 100 includes a suction cup assembly 20 and a cleaning device at least partially disposed on an outer circumferential side of the suction cup assembly 20. The suction cup assembly 20 is used for grasping the semiconductor product, and the cleaning device is used for blowing air to the surface of the suction cup assembly 20 or the surface of the semiconductor product.

In some embodiments, as shown in fig. 2 to 7, the cleaning device comprises a cleaning device base 10 disposed on two opposite sides of the suction cup assembly 20. The cleaning device base 10 is provided with an air outlet, and an opening of the air outlet is located on one side of the cleaning device base 10 facing the suction cup assembly 20.

Further, as shown in fig. 2 to 4 and fig. 6 and 7, the cleaning device base 10 includes a first air outlet hole 111 and a second air outlet hole 112 arranged up and down. The first and second

air outlet holes

111 and 112 are used to blow air to the surface of the suction cup assembly 20 and the surface of the semiconductor product, respectively. In some embodiments, the first air outlet holes 111 at the upper row are used for blowing air to the surface of the chuck assembly 20, and the second air outlet holes 112 at the lower row are used for blowing air to the surface of the semiconductor product.

In some embodiments, the first discharge holes 111 extend in a different direction than the second discharge holes 112.

Referring to fig. 6 and 7, in some embodiments, the first air outlet hole 111 extends obliquely upward in a direction from the outer end of the cleaning device holder 10 to the inner end of the cleaning device holder 10. The second discharge air hole 112 extends obliquely downward in a direction from the outer end of the cleaner base 10 to the inner end of the cleaner base 10. The outer end of the cleaning device base 10 as referred to herein is understood to be the end relatively remote from the suction cup assembly and the inner end is understood to be the end relatively close to the suction cup assembly. The outer and inner ends are opposite ends of the cleaning device base 10.

Of course, in other embodiments, the first exhaust hole and the second exhaust hole may be arranged in only one row or not in two rows, and the outer end of the cleaning device seat extends laterally to the inner end of the cleaning device seat, or the first exhaust hole extends obliquely downward in a direction from the outer end of the cleaning device seat to the inner end of the cleaning device seat, and the second exhaust hole extends obliquely upward in a direction from the outer end of the cleaning device seat to the inner end of the cleaning device seat. The present application is not limited to this, and may be set according to a specific application environment.

It should be noted that in other embodiments, the first exhaust holes located at the upper row may also be used for blowing air onto the surface of the semiconductor product, and the second exhaust holes located at the lower row may also be used for blowing air onto the surface of the chuck assembly. Accordingly, the first discharge holes may be inclined downward in a direction from the outer end of the cleaning device base to the inner end of the cleaning device base, and the second discharge holes may be inclined upward in a direction from the outer end of the cleaning device base to the inner end of the cleaning device base. The present application is not limited to this, and may be set according to a specific application environment. In addition, the cleaning device base is also provided with a gas outlet which can be used for blowing gas to the surface of the sucker assembly 20 and can also be used for blowing gas to the surface of a semiconductor product.

Further, in some embodiments, a first air duct 113 extending along the arrangement direction of the first air outlet holes 111 and a second air duct 114 diffracting along the arrangement direction of the second air outlet holes 112 are provided in the cleaning device base. Wherein the first discharge air hole 111 communicates with the first air duct 113, and the second discharge air hole 112 communicates with the second air duct 114.

Furthermore, in some embodiments, the cleaning device further comprises a first tube 12 in communication with the first air duct 113, and a second tube 13 in communication with the second air duct 114. The first pipe 12 is used for ventilating the first ventilating duct 113 to the first exhaust hole 111, and the second pipe 13 is used for ventilating the second ventilating duct 114 to the second exhaust hole 112.

Further, please refer to fig. 12 to 14. In some embodiments, the cleaning apparatus further includes an air outlet control valve 60. The air outlet control valve 60 controls an operation state of air to be supplied to the first pipe 12 and the second pipe 13. The control valve 60 includes a valve body 604, an inlet 601, a first outlet 602, and a second outlet 603. Wherein the first air outlet 602 communicates with the first pipe 12, and the second air outlet 603 communicates with the second pipe 13. The valve body 604 controls the opening and closing of the air inlet 601, the first air outlet 602, and the second air outlet 603, thereby controlling the operation state of air supply to the first pipe 12 and the second pipe 13.

For example, as shown in fig. 12, the valve body 604 of the control valve 60 is closed at the air inlet 601 so that the air inlet 601 is in a closed state, in this case, no air is introduced into both the first pipe 12 and the second pipe 13, no air is blown out from both the first exhaust hole 111 and the second exhaust hole 112, and the cleaning device is in a state where the cleaning operation is not performed. As shown in fig. 13, the valve body 604 of the control valve 60 is blocked at the second air outlet 603, so that the second air outlet 603 is in a closed state, in this case, the first pipe 12 is ventilated, no air is introduced into the second pipe 13, so that the first air outlet hole 111 is in an air blowing state, and no air is blown into the second air outlet hole 112. As shown in fig. 14, the valve body 604 of the control valve 60 is blocked at the first air outlet 602, so that the first air outlet 602 is in a closed state, in which case no air is introduced into the first pipe 12, the second pipe 13 is vented, so that the first air outlet hole 111 does not blow air, and the second air outlet hole 112 is in an air blowing state.

The ventilation state of the first tube 12 and the second tube 13 may be controlled by other means, and the present application is not limited thereto and may be set according to the specific situation.

Further, as shown in fig. 2 and fig. 4 to fig. 6, the suction cup assembly 20 includes a suction cup supporting base 21 and a suction cup 22. The suction cup 22 is disposed on the suction cup support base 21 and extends out of the lower end of the suction cup support base 21. The sucking disc gripper device mainly sucks the semiconductor product through the sucking disc 22 to realize the function of gripping the semiconductor product.

In some embodiments, there are a plurality of suction cups 22, and the plurality of suction cups 22 are disposed on the suction cup supporting base 21 at intervals. The sucking discs 22 are arranged at intervals, so that the sucking discs 22 can suck and grab semiconductor products with radian or warping well, and the conveying stability of the sucking disc grabbing device is improved.

In some embodiments, the suction cup 22 is removably mounted to the suction cup support base 21 by a suction cup mount 23 to facilitate suction cup removal, replacement, etc.

In some embodiments, the material of the suction cup 22 may be foam, but may also be other flexible materials with elasticity, so as to protect the semiconductor product and reduce the touch force of the suction cup on the semiconductor product when the suction cup is in contact with the semiconductor product.

Further, the sucking disc subassembly 20 is including locating the blotter 24 of sucking disc supporting seat 21 lower surface, and a plurality of holes that set up that are used for wearing to establish a plurality of sucking discs 22 are seted up to blotter 24. The suction cup 22 passes through the arrangement hole and the lower surface of the suction cup 22 is lower than the lower surface of the buffer pad 24 so that the suction cup can suck the semiconductor product.

In some embodiments, cushion 24 may be made of rubber or other flexible material. This application does not do the restriction to the concrete material of blotter, can set up according to particular case.

Further, the sucker gripping device comprises an elastic resetting device 30, and the sucker assembly 20 is arranged below the elastic resetting device 30. The elastic restoring means 30 provides an upward restoring elastic force to the chuck assembly 20 when the chuck assembly 20 drops the grasped semiconductor product, so that the chuck assembly 20 is lifted up. And when the semiconductor product is sucked by the sucker gripping device, the buffer force can be provided for the sucker so as to protect the semiconductor product from being touched by the sucker.

In some embodiments, the elastic restoring device 30 includes a plurality of elastic restoring members 31 and a fixing plate 32. The upper or upper ends of the plurality of elastic restoring members 31 are provided on the fixed plate 32. Accordingly, the suction cup assembly 20 is provided at the lower end of the elastic restoring member 31. The resilient return member 31 may comprise a spring member.

Further, the sucker gripper comprises a vacuum pumping device. The vacuum means comprises a vacuum line 40. Accordingly, the suction cup assembly 20 includes a ring-shaped suction cup 22 having an air passage 221 at the center. The vacuum pipe 40 is communicated with the air passage 221 of the suction cup 22 to vacuumize the contact portion of the suction cup 22 and the semiconductor product, so that the suction cup 22 can be stably attracted to the semiconductor product. The suction cup supporting base 21 is also provided with a passage for communicating the air passage 221 with the vacuum duct 40. For the suction cup 22 mounted to the suction cup supporting base 21 through the suction cup mounting base 23, a corresponding passage structure may be provided in the middle of the suction cup mounting base 23 so that the vacuum duct 40 can communicate with the air passage 221 of the suction cup 22.

Further, the sucker gripper comprises a semiconductor product positioning detection device. Semiconductor product location detection device includes location detection needle 50, and location detection needle 50 locates one side of sucking disc subassembly 20 for whether supplementary semiconductor product that detects is located treats the position of snatching. The positioning detection pin 50 may also be used to fix and limit the semiconductor product and the suction cup gripper when the suction cup gripper grips the semiconductor product.

The present application further provides a semiconductor processing apparatus. The semiconductor processing equipment may be semiconductor cutting equipment, or may be equipment with other semiconductor processing functions, which is not limited in this application. Referring to fig. 8 to 14, the semiconductor processing apparatus includes an apparatus support body (not shown), and a transfer device 200, a robot arm (not shown), a target work plate 400, and a suction cup gripper, which are provided to the apparatus support body. Wherein the suction cup gripper is the suction cup gripper 100 as described above.

The suction cup gripper 100 is arranged at the outer end of the mechanical arm. In particular, for a suction cup gripper with a resilient return means 30, the suction cup gripper may be fixedly connected to the robot arm by means of a fixing plate 32. For embodiments without the elastic restoring device 30, the robot arm is configured to drive the suction cup gripper 100 to move to grip the semiconductor product 300 located at the position to be gripped and transfer the semiconductor product 300 to the target work tray 400 when the transferring device 200 transfers the semiconductor product 300 to a predetermined position to be gripped. The cleaning device is configured to blow air onto the surface of the semiconductor product before the semiconductor product is gripped by the suction cup gripper 100, and blow air onto the surface of the suction cup assembly 20 after the semiconductor product is placed on the target work plate 400 by the suction cup gripper.

Further, the semiconductor processing apparatus may further include a control device. The conveying device, the mechanical arm and the cleaning device of the sucker gripper pair can be electrically connected with the control device. The control device can control the working state of the transmission device, the working state of the mechanical arm and the working state of the cleaning device. The control device may be an integral control unit, or may be a plurality of control units that are interconnected to control the transport device, the robot arm, and the cleaning device, respectively.

Further, the semiconductor processing apparatus further includes a product detecting device for detecting whether the semiconductor product is located at a position to be gripped on the transferring device 200. The product detection device can be electrically connected with the control device, and can also be electrically connected with other control units which can be electrically connected with the control device. The product detection means may be located close to the transport means, for example at the side or end of the transport means. The specific setting position of the product detection device can be set according to specific conditions, and the application is not limited to this.

Based on the above structure, when the semiconductor product 300 is not transferred to the position to be gripped, the suction cup gripper 100 may be located above (e.g., directly above) the position to be gripped, and at this time, the cleaning device is in a closed state under the control of the control device. Specifically, as shown in fig. 12, the valve body 604 of the control valve 60 blocks the intake port 601. Of course, when the semiconductor product 300 is moved to the position to be gripped as shown in fig. 8 and the suction cup gripper 100 is not performing the gripping operation, the cleaning device may still be in the closed state under the control of the control device. Of course, in other embodiments, the suction cup gripper may be located at other positions while waiting to grip the semiconductor product, and the semiconductor product to be gripped may be moved to the position right above the position to be gripped by the robot arm under the control of the control device while being moved to the position to be gripped by the transfer device.

Further, after the semiconductor product 300 to be grabbed is located at the position to be grabbed on the conveying device 200, when the suction cup gripper 100 needs to grab the semiconductor product 300, under the control of the control device, the robot arm may drive the suction cup gripper 100 to move downward, and at this time, the control device may simultaneously control the cleaning device to blow air onto the surface of the semiconductor product 300. Specifically, please refer to fig. 13, the control device can control the valve body 604 of the control valve 60 to move to block the first air outlet 602, and the air inlet 601 and the second air outlet 603 are in an open state. The second pipe 13 is in the ventilating state, and the second exhaust holes 112 blow air obliquely downward to blow toward the semiconductor product 300 to clean the surface of the semiconductor product 300, as shown in fig. 9. When the suction cup gripper 100 descends until the suction cup 22 contacts the upper surface of the semiconductor product 300, the control device starts the vacuum pumping device to perform vacuum pumping operation until the suction cup 22 is attracted to the semiconductor product 300. Since the suction cup 22 is made of a flexible material, the surface of the semiconductor product can be effectively prevented from being scratched when the suction cup contacts with the upper surface of the semiconductor product 300.

Further, after the semiconductor product 300 is firmly held by the suction cup 22, the control device then controls the robot arm to drive the suction cup gripper 100 to move up to the horizontal position, and further moves to the position above the target work plate 400, so as to unload the semiconductor product 300 into the target work plate 400, and the control device controls the robot arm to drive the suction cup gripper 100 to move up, as shown in fig. 10. At this point, the suction cup 22 is returned to the relative rest position with respect to the fixed plate 32 by the elastic return means 30.

In turn, the control device can control the cleaning device to blow air onto the surface of the chuck assembly 20, as shown in FIG. 11. Specifically, as shown in fig. 13, the control device may control the valve body 604 of the control valve 60 to move to close the second air outlet 603, so that the air inlet 601 and the first air outlet 602 are in the open state. The first pipe 12 is in the ventilating state, and the first exhaust holes 111 blow air obliquely upward to blow toward the chuck assembly 20, so that the chuck assembly 20 is cleaned.

It should be noted that the above-mentioned cleaning device can be used to blow air onto the surface of the semiconductor product 300 from the time when the product detecting device detects that the semiconductor product 300 is located at the position to be grasped until the suction cup contacts the semiconductor product 300. That is, when the suction cup gripper 100 descends until the suction cup 22 contacts the upper surface of the semiconductor product 300, the control device controls the cleaning device 300 to stop blowing air onto the surface of the semiconductor product 300.

In the present application, the structural embodiments and the method embodiments may be complementary to each other without conflict.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims

1. The suction disc gripper is characterized by comprising a suction disc assembly (20) and a cleaning device at least partially arranged on the outer peripheral side of the suction disc assembly (20), wherein the suction disc assembly (20) is used for gripping a semiconductor product, and the cleaning device is used for blowing air to the surface of the suction disc assembly (20) or the surface of the semiconductor product.

2. Suction cup gripper according to claim 1, characterized in that the cleaning means comprise cleaning means seats (10) arranged on opposite sides of the suction cup assembly (20), said cleaning means seats (10) being provided with air outlet holes, the openings of said air outlet holes being located on the side of the cleaning means seats (10) facing the suction cup assembly (20).

3. Suction cup gripper device according to claim 2, characterized in that the cleaning device base (10) comprises a first discharge aperture (111) and a second discharge aperture (112) arranged one above the other, the first discharge aperture (111) extending in a direction different from the second discharge aperture (112).

4. Suction cup gripper according to claim 3, characterized in that the first exhaust aperture (111) extends obliquely upwards in the direction from the outer end of the cleaning means seat (10) to the inner end of the cleaning means seat (10); and/or the second discharge air hole (112) extends obliquely downward in a direction from an outer end of the cleaning device base (10) to an inner end of the cleaning device base (10).

5. The suction cup gripper as claimed in claim 1, wherein the suction cup assembly (20) comprises a suction cup support base (21) and a suction cup (22), the suction cup (22) being disposed on the suction cup support base (21) and extending beyond a lower end of the suction cup support base (21).

6. The suction cup gripper as claimed in claim 5, characterized in that the number of suction cups (22) is plural, and the plural suction cups are arranged on the suction cup support base (21) at intervals; or the like, or, alternatively,

the sucker (22) is detachably arranged on the sucker support seat (21) through a sucker mounting seat (23); or the like, or, alternatively,

sucking disc subassembly (20) are including locating blotter (24) of sucking disc supporting seat (21) lower surface, blotter (24) are offered and are used for wearing to establish a plurality of holes that set up of sucking disc (22), sucking disc (22) pass set up the hole just sucking disc (22) lower surface is less than the lower surface of blotter (24).

7. Suction cup gripper according to claim 5, characterized in that it comprises elastic return means (30), said suction cup assembly (20) being provided below said elastic return means (30).

8. The suction cup gripper as claimed in claim 7, characterized in that said elastic return means (30) comprise a plurality of elastic return members (31) and a fixed plate (32), the upper part of said plurality of elastic return members (31) being provided on said fixed plate (32), said suction cup assembly (20) being provided at the lower end of said elastic return members (31).

9. The suction cup gripper as claimed in claim 1, characterized in that the suction cup gripper comprises a vacuum means comprising a vacuum duct (40), the suction cup assembly (20) comprising a ring-shaped suction cup (22) with an air passage (221) in the middle, the vacuum duct (40) communicating with the air passage (221) of the suction cup (22); or the like, or, alternatively,

the sucker gripper device comprises a semiconductor product positioning detection device, the semiconductor product positioning detection device comprises a positioning detection needle (50), and the positioning detection needle (50) is arranged on one side of the sucker component (20).

10. A semiconductor processing apparatus, characterized in that the semiconductor processing apparatus comprises an apparatus support body and a transport device (200), a robot arm, a target work plate (400), a control device and a suction cup gripper device arranged on the apparatus support body, wherein the suction cup gripper device is a suction cup gripper device (100) according to any one of claims 1 to 9;

the sucker gripper device (100) is arranged at the outer end of the mechanical arm, a cleaning device, the mechanical arm and a transmission device of the sucker gripper device are all electrically connected with the control device, the control device is used for controlling the transmission device (200) to transmit the semiconductor product (300) to a preset position to be grabbed, controlling the mechanical arm to drive the sucker gripper device (100) to move so as to grab the semiconductor product (300) positioned at the position to be grabbed, and transferring the semiconductor product (300) to the target working disc (400); and the control device is used for controlling the cleaning device to blow air to the surface of the semiconductor product before the semiconductor product is grabbed by the sucker grabbing device (100), and blow air to the surface of the sucker assembly (20) after the semiconductor product is placed on the target working plate (400) by the sucker grabbing device.