CN215269261U - Heat sink device - Google Patents

Abstract

The application is applicable to new forms of energy heat dissipation equipment technical field, provides a heat abstractor, includes: the heat dissipation device comprises a heat dissipation main body, a liquid containing groove is arranged in the heat dissipation main body, a first through hole is formed in the first end of the liquid containing groove, and a second through hole is formed in the second end of the liquid containing groove; the first radiating plate is covered on the liquid containing groove to form a liquid containing cavity; the bottom of first heating panel is provided with a plurality of fins, and the first end of fin is provided with first fluid drag reduction face, and the second end of fin is provided with second fluid drag reduction face, and first fluid drag reduction face is towards the first end of liquid holding groove, and second fluid drag reduction face is towards the second end of liquid holding groove. Thereby reduce resistance loss and liquid pressure loss, avoid structural loss, both ends all set up the reversible design that fluid drag reduction face can realize influent stream hole and discharge orifice, effectively deal with various operating mode changes.

Description

Heat sink device

Technical Field

The application belongs to the technical field of new forms of energy heat dissipation equipment, and more specifically relates to a heat abstractor.

Background

From the global perspective, new energy automobiles are recognized as the mainstream of the future automobile industry, and many countries are actively developing and guiding new energy automobiles. With the development of new energy vehicles, the electrically-driven and electrically-controlled battery is also attracting attention as three major core technologies of the new energy vehicles.

The electric control and driving system consists of a plurality of power electronic converters and corresponding controllers, wherein a solid-state device transfers a large amount of power energy to the input end of the motor, and the heat loss of the electric device needs to be dissipated in time to ensure the safe operation of the whole system of the automobile, so the high-efficiency heat dissipation design of the electronic device matched with the electric control and driving system is very important.

The existing traditional heat dissipation mode mainly adopts air cooling or water cooling, but the air cooling heat dissipation structure is simple, the number of parts is small, but the heat dissipation is uneven, the efficiency is low, the weather resistance is poor, the fan is easily influenced by the environment, and the noise of the fan is relatively large; the water cooling heat dissipation efficiency is lower, and the local resistance loss is greater.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the present application is to provide a heat dissipation device, which aims to solve the technical problems of low heat dissipation efficiency and large local resistance loss of the heat dissipation device in the prior art.

To achieve the above object, according to one aspect of the present application, there is provided a heat dissipating device including: the heat dissipation device comprises a heat dissipation main body, wherein a liquid containing groove is arranged in the heat dissipation main body, a first through hole is formed in the first end of the liquid containing groove, a second through hole is formed in the second end of the liquid containing groove, one of the first through hole and the second through hole is a liquid inlet hole, and the other one of the first through hole and the second through hole is a liquid outlet hole; the first radiating plate is covered on the liquid containing groove to form a liquid containing cavity; the bottom of first heating panel is provided with a plurality of fins, and the first end of fin is provided with first fluid drag reduction face, and the second end of fin is provided with second fluid drag reduction face, and first fluid drag reduction face is towards the first end of liquid holding groove, and second fluid drag reduction face is towards the second end of liquid holding groove.

Optionally, the plurality of fins are divided into at least two fin groups, the extending direction of the fin groups is the same as the extending direction of the liquid accommodating groove, a gap is formed between every two adjacent fin groups, and a guide plate arranged along the extending direction of the gap is arranged in the gap.

Optionally, the fin group includes a plurality of first fin rows and a plurality of second fin rows, at least one second fin row is arranged between two adjacent first fin rows, each of the first fin rows and the second fin rows is composed of a plurality of fins, and the plurality of fins in the first fin rows and the plurality of fins in the second fin rows are arranged in a staggered manner.

Optionally, the first through hole is an inflow hole, the first end of the liquid accommodating groove is provided with a flow collecting region, the flow collecting region gradually decreases in a direction from the second end of the liquid accommodating groove to the first end of the liquid accommodating groove, and the inflow hole is located in the flow collecting region.

Optionally, the plurality of fins at the bottom of the first heat dissipation plate jointly form a heat exchanging portion, and the shape of the heat exchanging portion is matched with the liquid accommodating groove.

Optionally, a first heat dissipation surface is arranged at the top of the first heat dissipation plate, the first heat dissipation surface is used for mounting electronic components, a second heat dissipation plate is arranged at the side of the heat dissipation main body, the second heat dissipation plate is connected with the heat dissipation main body, a second heat dissipation surface is arranged at the upper portion of the second heat dissipation plate, and the second heat dissipation surface is used for mounting a capacitor device.

Alternatively, the second heat dissipation plate is lower than the first heat dissipation plate, so that a stepped structure is formed between the first heat dissipation plate and the second heat dissipation plate.

Optionally, the sidewall of the liquid accommodating groove is provided with a plurality of convex hulls, the plurality of convex hulls are arranged along the extending direction of the liquid accommodating groove, and the surfaces of the convex hulls are in smooth transition.

Optionally, first heating panel package rubbing board body, plate body bottom are provided with a plurality of axis bodies, axis body perpendicular to plate body, and a plurality of axis body one-to-one wear to establish in a plurality of fins, the fin can use the axis body as the rotation of axes.

Optionally, be provided with the external screw thread on the axis body, the inside screw hole that is provided with of fin, be connected through external screw thread and screw hole cooperation between fin and the axis body.

The application provides a heat abstractor's beneficial effect lies in: compared with the prior art, the heat abstractor of this application sets up a plurality of fins through the bottom at first heating panel, increased with the heat transfer area of liquid, the first end of fin is provided with first fluid drag reduction face simultaneously, first fluid drag reduction face is towards the first end of liquid holding recess, with reduce and the resistance of the liquid that flows to liquid holding recess second end from the first end of liquid holding recess, the second end of fin is provided with second fluid drag reduction face, second fluid drag reduction face is towards the second end of liquid holding recess, with reduce and the resistance of the liquid that flows to liquid holding recess first end from liquid holding recess second end, thereby reduce resistance loss and liquid pressure loss, avoid the structural loss, both ends all set up the reversible design that fluid drag reduction face can realize influent stream hole and discharge orifice, effectively deal with various operating mode changes.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a first heat dissipation plate and fins according to an embodiment of the present application;

fig. 2 is an exploded view of a heat dissipation device according to an embodiment of the present disclosure;

fig. 3 is a schematic overall structure diagram of a heat dissipation device according to an embodiment of the present application;

fig. 4 is a left side view schematically illustrating a heat dissipation device according to an embodiment of the present application.

Reference numerals referred to in the above figures are detailed below:

10. a heat dissipating body; 11. a liquid accommodating groove; 12. a first through hole; 20. a first heat dissipation plate; 21. a fin; 22. a baffle; 23. a fin set; 30. a second heat dissipation plate; 31. a second heat dissipation surface; 40. a pipeline.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. The embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically defined otherwise.

As mentioned in the background art, at present, an electronic control system and an electronic drive system are composed of a plurality of power electronic converters and corresponding controllers, wherein a solid-state device transfers a large amount of power energy to an input end of a motor, and heat loss of the electric device needs to be dissipated in time to ensure the safe operation of the whole system of the automobile, so that the efficient heat dissipation design of the electronic device matched with the electric control system and the electronic device is very important. The existing traditional heat dissipation mode mainly adopts air cooling or water cooling, but the air cooling heat dissipation structure is simple, the number of parts is small, but the heat dissipation is uneven, the efficiency is low, the weather resistance is poor, the fan is easily influenced by the environment, and the noise of the fan is relatively large; the water cooling heat dissipation efficiency is lower, and the local resistance loss is greater.

Referring to fig. 1 to 4, in order to solve the above problems, according to an aspect of the present application, a heat dissipation device is provided, including a heat dissipation body 10 and a first heat dissipation plate 20, a liquid accommodating recess 11 is provided inside the heat dissipation body 10, a first through hole 12 is provided at a first end of the liquid accommodating recess 11, a second through hole is provided at a second end of the liquid accommodating recess 11, one of the first through hole 12 and the second through hole is a liquid inlet hole, and the other is a liquid outlet hole; the outsides of the first through hole 12 and the second through hole are communicated with the pipeline 40, and the first heat dissipation plate 20 is covered on the liquid containing groove 11 to form a liquid containing cavity; the bottom of the first heat dissipation plate 20 is provided with a plurality of fins 21, the first ends of the fins 21 are provided with first fluid resistance reduction surfaces, the second ends of the fins 21 are provided with second fluid resistance reduction surfaces, the first fluid resistance reduction surfaces face the first ends of the liquid accommodating grooves 11, and the second fluid resistance reduction surfaces face the second ends of the liquid accommodating grooves 11, wherein the fins 21 of the present embodiment are flat sheet-shaped structures.

When the heat dissipation device is used, a worker can install an electronic component needing heat dissipation on the first heat dissipation plate 20, heat exchange with liquid in the liquid containing cavity is realized through the first heat dissipation plate 20, and heat dissipation is realized, the heat dissipation device increases the heat exchange area with the liquid by arranging the plurality of fins 21 at the bottom of the first heat dissipation plate 20, meanwhile, the first ends of the fins 21 are provided with first fluid resistance reduction surfaces facing the first end of the liquid containing groove 11 so as to reduce the resistance with the liquid flowing from the first end of the liquid containing groove 11 to the second end of the liquid containing groove 11, the second ends of the fins 21 are provided with second fluid resistance reduction surfaces facing the second end of the liquid containing groove 11 so as to reduce the resistance with the liquid flowing from the second end of the liquid containing groove 11 to the first end of the liquid containing groove 11, thereby reducing resistance loss and liquid pressure loss, avoid structural loss, both ends all set up the reversible design that fluid drag reduction face can realize influent stream hole and discharge orifice, effectively deal with various operating mode changes.

In one embodiment, the two ends of the fin 21 are streamline structures to form a first fluid drag reduction surface and a second fluid drag reduction surface. The streamline structure can be a streamline curved surface structure, such as a wing type, of course, other streamline structures can be adopted, and the streamline structure can be any streamline structure which can reduce the resistance to the liquid. By providing the fins 21 in the shape of the above-described embodiment, it is possible to effectively avoid the formation of a boundary layer on the surfaces of the fins 21 to affect the heat conduction.

Referring to fig. 1, in order to intensively guide the liquid and thus increase the flow rate of the liquid, the plurality of fins 21 in the present embodiment are divided into at least two fin groups 23, the extending direction of the fin groups 23 is the same as the extending direction of the liquid accommodating groove 11, a gap is provided between two adjacent fin groups 23, and a guide plate 22 is provided in the gap along the extending direction of the gap. Through setting up guide plate 22, on the one hand can play the water conservancy diversion effect, improves the velocity of flow through the liquid of each fin group 23, and on the other hand also can play the effect of strengthening rib, effectual improvement heat abstractor's bulk strength.

In a preferred embodiment, there are two fin groups 23, and the first through hole 12 and the second through hole are located between the two fin groups 23 to equalize the liquid flow rate. In other embodiments, the number of fin groups 23 may be three, four, five, six, etc., and the worker may select the fin groups according to the specific situation.

As shown in fig. 1, the flow direction of the fluid in this embodiment is parallel flow, i.e., the liquid flowing in from the inflow holes flows to the two fin groups respectively and finally flows out from the outflow holes of the liquid accommodating groove. In other embodiments, the length of the guide plate can be adjusted to enable the guide plate to be abutted to one end of the liquid accommodating groove to form a serpentine channel, in the embodiment, the flow directions of the fluids are connected in series, and the staff can select the guide plate according to specific working conditions.

In another embodiment, the first heat dissipation plate 20 has multiple types, the number of the fin sets 23 in each type is different, and the worker can select the type according to the specific situation, and mount the first heat dissipation plate 20 on the heat dissipation body 10 to achieve modular production.

On one hand, unnecessary resistance is reduced through the fins 21 with the first fluid resistance reducing surfaces and the second fluid resistance reducing surfaces, and on the other hand, the turbulent flow effect of the fins 21 needs to be ensured so as to improve the heat exchange efficiency. The fin group 23 in this embodiment includes a plurality of first fin rows and a plurality of second fin rows, at least one second fin row is disposed between two adjacent first fin rows, each of the first fin rows and the second fin rows is composed of a plurality of fins 23, the plurality of fins 21 in the first fin rows and the plurality of fins 21 in the second fin rows are arranged in a staggered manner, and the fins 21 having the first fluid drag reduction surface and the second fluid drag reduction surface and the fin rows arranged in a staggered manner realize smooth turbulence of the cooling liquid and avoid forming a boundary layer on the surface of the fins 21 to affect heat conduction.

The first fin rows and the second fin rows can be arranged in a manner that one second fin row is clamped between every two adjacent first fin rows, namely 1 first fin row, 1 second fin row, 1 first fin row and 1 second fin row are arranged in a manner of 1, 2 and 1 for short; the first fin rows and the second fin rows may be arranged in a manner that two second fin rows are sandwiched between every two adjacent first fin rows, that is, 1 first fin row, 2 second fin rows, 1 first fin row, and 2 second fin rows, which are 1, 2, and 1 for short; the first fin rows and the second fin rows may be arranged in a manner that three second fin rows are sandwiched between every two adjacent first fin rows, that is, 1 first fin row, 3 second fin rows, 1 first fin row, and 3 second fin rows, which are referred to as 1, 2, and 1 type arrangement for short, and in other embodiments, the arrangement manner may also be 1, 2, and 1 type, and so on, which is not described herein again.

In order to further improve the flow disturbance effect, in other embodiments, the fin rows at both ends of the whole fin group 23 are the first fin rows, and the thickness of the second fin row in this embodiment is greater than that of the first fin row, where the thickness refers to the dimension perpendicular to the liquid flow direction, that is, the thickness of the fin 21 itself as a sheet structure.

Referring to fig. 2, in order to guide the liquid flowing into the inflow hole to flow to the outflow hole, the present application provides a flow collecting region, specifically, the first through hole 12 in the present embodiment is an inflow hole, the first end of the liquid receiving recess 11 is provided with a flow collecting region, the flow collecting region is gradually reduced in a direction from the second end of the liquid receiving recess 11 to the first end of the liquid receiving recess 11, and the inflow hole is located in the flow collecting region.

In order to make the most of the space, the plurality of fins 21 at the bottom of the first heat dissipation plate 20 in the present embodiment collectively form a heat exchanging portion, the shape of which is fitted to the liquid accommodating recess 11. Occupy each corner of liquid accommodation groove 11 through a plurality of fins 21, the heat transfer of fin 21 is carried out in make full use of space, has effectively improved the radiating efficiency of the heat abstractor of this application.

In the embodiment, a first heat dissipation surface is disposed on the top of the first heat dissipation plate 20, the first heat dissipation surface is used for mounting electronic components, a second heat dissipation plate 30 is disposed on the side of the heat dissipation body 10, the second heat dissipation plate 30 is connected with the heat dissipation body 10, a second heat dissipation surface 31 is disposed on the upper portion of the second heat dissipation plate 30, and the second heat dissipation surface 31 is used for mounting a capacitor device. In one embodiment, the electronic component is a silicon carbide module, the first heat dissipation surface can be subjected to surface treatment, such as metal treatment of silver and the like, and the silicon carbide module can be welded on the first heat dissipation surface through silver brazing, so that failure risk and difficulty in maintenance caused by installation of heat-conducting silicone grease and screws are avoided; in another embodiment, the first heat dissipation surface may be adhered to other electronic components by a glue with better heat conductivity. In a preferred embodiment, the bottom of the second heat dissipation plate 30 is provided with a plurality of ribs, and the extending direction of the ribs is parallel to the extending direction of the flow guide plate 22.

Referring to fig. 3, in order to save materials, in another embodiment of the present application, the second heat dissipation plate 30 is lower than the first heat dissipation plate 20, so that a stepped structure is formed between the first heat dissipation plate 20 and the second heat dissipation plate 30. The stepped structure can also facilitate the positioning and installation of the capacitor device.

In order to further improve the turbulent flow effect, in another embodiment of the present application, the sidewall of the liquid accommodating groove 11 is provided with a plurality of convex hulls, the plurality of convex hulls are arranged along the extending direction of the liquid accommodating groove 11, and the surfaces of the convex hulls are in smooth transition.

The fin 21 all is fixed with the plate body of first heating panel 20 in each embodiment described above, and in order to realize the regulation to the liquid velocity of flow and direction in the liquid holds recess 11, in another embodiment of this application, first heating panel 20 includes the plate body, and the plate body bottom is provided with a plurality of axostylus bodies, and the axostylus body perpendicular to plate body, a plurality of axostylus bodies one-to-one wear to establish in a plurality of fins 21, and fin 21 can use the axostylus body as the rotation of axes. When the heat sink is installed, a worker can rotate one or more fins 21 to achieve specific heat dissipation to a specific area of the first heat dissipation plate 20.

In one embodiment, specifically, an external thread is arranged on the shaft body, a threaded hole is arranged inside the fin 21, and the fin 21 and the shaft body are in fit connection through the external thread and the threaded hole.

In another embodiment, the angle of the rotated fin 21 may be fixed by a pin, and any embodiment may be used as long as the angle of the fin 21 can be fixed.

In a preferred embodiment, the heat dissipation device of the present application has a temperature measurement function, and the heat dissipation device of the present embodiment includes a temperature measurement element, where the temperature measurement element is installed on the first heat dissipation plate 20, and the temperature measurement element and an electronic component installed on the first heat dissipation plate 20 can share a power supply, and perform data transmission, thereby realizing detection of temperature change of the heat dissipation device itself.

In summary, the heat dissipation device provided in this embodiment has at least the following beneficial effects:

when the heat dissipation device is used, a worker can install an electronic component needing heat dissipation on the first heat dissipation plate, heat exchange with liquid in the liquid containing cavity is realized through the first heat dissipation plate, heat dissipation is realized, the heat dissipation device increases the heat exchange area with the liquid by arranging the plurality of fins at the bottom of the first heat dissipation plate, meanwhile, the first ends of the fins are provided with first fluid resistance reduction surfaces facing the first end of the liquid containing groove so as to reduce the resistance with the liquid flowing from the first end of the liquid containing groove to the second end of the liquid containing groove, the second ends of the fins are provided with second fluid resistance reduction surfaces facing the second end of the liquid containing groove so as to reduce the resistance with the liquid flowing from the second end of the liquid containing groove to the first end of the liquid containing groove, so that the resistance loss and the liquid pressure loss are reduced, and the structure loss is avoided, the reversible design of the inflow hole and the outflow hole can be realized by arranging the fluid resistance reducing surfaces at the two ends, and various working condition changes can be effectively coped with.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims (10)

1. A heat dissipating device, comprising:

the heat dissipation device comprises a heat dissipation main body, wherein a liquid containing groove is arranged in the heat dissipation main body, a first through hole is formed in a first end of the liquid containing groove, a second through hole is formed in a second end of the liquid containing groove, one of the first through hole and the second through hole is a liquid inlet hole, and the other one of the first through hole and the second through hole is a liquid outlet hole;

the first radiating plate is covered on the liquid containing groove to form a liquid containing cavity; the bottom of first heating panel is provided with a plurality of fins, the first end of fin is provided with first fluid drag reduction face, the second end of fin is provided with second fluid drag reduction face, first fluid drag reduction face towards the first end of liquid holding groove, second fluid drag reduction face towards the second end of liquid holding groove.

2. The heat dissipating device as claimed in claim 1, wherein the plurality of fins are divided into at least two fin groups, the fin groups extend in the same direction as the liquid accommodating groove, a gap is provided between two adjacent fin groups, and a baffle plate is provided in the gap along the extending direction of the gap.

3. The heat dissipation device according to claim 2, wherein the fin group includes a plurality of first fin rows and a plurality of second fin rows, at least one of the second fin rows is disposed between two adjacent first fin rows, each of the first fin rows and the second fin rows is composed of a plurality of fins, and the plurality of fins in the first fin rows are staggered with the plurality of fins in the second fin rows.

4. The heat dissipating device as claimed in claim 1 or 3, wherein the first through hole is an inflow hole, the first end of the liquid receiving recess is provided with a flow collecting region which is gradually reduced in a direction from the second end of the liquid receiving recess to the first end of the liquid receiving recess, and the inflow hole is located in the flow collecting region.

5. The heat dissipating device according to claim 1 or 3, wherein the plurality of fins at the bottom of the first heat dissipating plate collectively form a heat exchanging portion having a shape adapted to the liquid accommodating groove.

6. The heat dissipation device according to claim 1 or 3, wherein a first heat dissipation surface is disposed on a top of the first heat dissipation plate, the first heat dissipation surface is used for mounting electronic components, a second heat dissipation plate is disposed on a side portion of the heat dissipation body, the second heat dissipation plate is connected with the heat dissipation body, a second heat dissipation surface is disposed on an upper portion of the second heat dissipation plate, and the second heat dissipation surface is used for mounting a capacitor device.

7. The heat dissipating device of claim 6, wherein the second heat dissipating plate is lower than the first heat dissipating plate such that a stepped structure is formed between the first heat dissipating plate and the second heat dissipating plate.

8. The heat dissipating device as claimed in claim 1 or 3, wherein the liquid accommodating groove has a plurality of convex hulls on its side wall, the convex hulls are arranged along the extending direction of the liquid accommodating groove, and the surfaces of the convex hulls are rounded.

9. The heat dissipation device according to claim 1 or 3, wherein the first heat dissipation plate includes a plate body, a plurality of shaft bodies are disposed at a bottom of the plate body, the shaft bodies are perpendicular to the plate body, the shaft bodies are correspondingly inserted into the fins one by one, and the fins can rotate around the shaft bodies.

10. The heat dissipation device as claimed in claim 9, wherein the shaft body has an external thread, the fins have a threaded hole therein, and the fins are connected with the shaft body by the external thread and the threaded hole.

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