CN215268982U - Backing plate for optical module, packaging structure and optical module - Google Patents
Backing plate for optical module, packaging structure and optical module Download PDFInfo
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- CN215268982U CN215268982U CN202120736239.0U CN202120736239U CN215268982U CN 215268982 U CN215268982 U CN 215268982U CN 202120736239 U CN202120736239 U CN 202120736239U CN 215268982 U CN215268982 U CN 215268982U
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Abstract
The utility model discloses a backing plate for an optical module, which comprises a backing plate body, wherein the side part of the backing plate body is provided with a plurality of through holes for heat dissipation; an optical module packaging structure comprises a shell, a base plate body and a base plate, wherein the shell consists of a bottom plate and a shell cover; the base plate bodies are fixedly arranged on the bottom plate of the shell; an optical module comprises a shell, an optical fiber connector, an optical attenuator, a total reflection sheet, a first coupling lens, an optical amplifier, a lens, a translation prism, an optical splitter, a second coupling lens, an optical detector and an optical signal plug; the beneficial effects are as follows: the heat dissipation efficiency is accelerated, the influence of thermal expansion on optical path transmission is reduced, the influence on the sensitivity of an optical module is reduced, and the transmission quality of optical signals is ensured.
Description
Technical Field
The utility model relates to an optical communication equips technical field, concretely relates to backing plate, packaging structure and optical module for optical module.
Background
In optical communication, an optical module plays a very important role, and a 100G short-distance transmission CFP optical module is widely used in the market at present. The transmitting link comprises a 4-path 25G electric absorption modulation laser EML, a high-speed electric driver, a 10:4 data converter and an optical multiplexer. The receive chain includes an optical demultiplexer, a 4-way PIN/TIA receiver, and a 4:10 data converter. The transmission link of the distance transmission CFP optical module in 100G can be the same as that of the short-distance CFP optical module. The receive chain includes an optical attenuator, an optical amplifier, an isolator, an optical demultiplexer, a 4-way PIN/TIA receiver, and a 4:10 data converter.
At present, the optical module has high power and high heat productivity, heat is transmitted to a mounting base plate, the base plate is easy to generate thermal expansion, and then the relative position of each component is changed, so that the sensitivity of the optical module is influenced, and the transmission quality of signals is directly influenced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to the technical problem who exists more than, aim at provides a backing plate, packaging structure and optical module for optical module to realize accelerating the radiating efficiency, reduce the influence of thermal energy to the light path transmission, reduce the influence to the sensitivity of optical module, guarantee optical signal's transmission quality.
The utility model discloses a following technical scheme realizes:
a base plate for an optical module comprises a base plate body, wherein a plurality of through holes for heat dissipation are formed in the side portion of the base plate body.
The lateral part of the base plate body is provided with a plurality of through holes, so that heat can be quickly dissipated through the through holes, and the temperature is quickly reduced.
Further, the base plate body comprises a plurality of specifications, and at least one geometric dimension of the length, the width or the thickness of the base plate body of any one specification is not equal to that of the base plate body of any other specification.
The base plate body is set to be of various specifications, and the corresponding base plate body can be selected for use according to the use conditions.
An optical module packaging structure comprises a shell, a base plate body and a packaging structure, wherein the shell consists of a bottom plate and a shell cover; the base plate bodies are fixedly arranged on the bottom plate of the shell.
The base plate body is arranged on the bottom plate of the shell, so that the shell has good heat dissipation performance.
Further, the base plate bodies are fixedly arranged on the bottom plate of the shell in an interval distribution mode.
The base plate is characterized in that the base plate body is arranged on the bottom plate of the shell at intervals, and different components can be dispersedly installed on different base plate bodies, so that the components with large heat productivity only generate thermal deformation in the area where the components are located, and other components are not affected.
Preferably, the bottom plate of the shell is provided with three backing plate bodies, namely a first backing plate body, a second backing plate body and a third backing plate body.
Three backing plate bodies are arranged on a bottom plate of the shell and used for installing corresponding optical devices.
An optical module comprises the shell of the packaging structure for the optical module, an optical fiber connector, an optical attenuator, a total reflection sheet, a first coupling lens, an optical amplifier, a lens, a translation prism, an optical splitter, a second coupling lens, an optical detector and an optical signal plug; the optical fiber connector is mounted at one end of the shell; the optical attenuator, the total reflection sheet, the first coupling lens, the optical amplifier and the lens are arranged on the first base plate body; the translation prism and the optical splitter are arranged on the second base plate body; the second coupling lens and the optical detector are arranged on the third base plate body, and the optical signal plug is arranged at the other end part of the shell; an optical signal enters from the optical fiber connector, sequentially passes through the optical attenuator, the total reflection sheet, the first coupling lens, the optical amplifier, the lens, the translation prism, the optical splitter and the second coupling lens, and then reaches the optical detector, and the optical detector transmits the detected optical signal to the optical signal plug.
Through the layout arrangement, the optical attenuator, the total reflection sheet, the first coupling lens, the optical amplifier and the lens are arranged on the first base plate body; the translation prism and the optical splitter are arranged on the second base plate body; the second coupling lens and the optical detector are arranged on the third base plate body; the heat generated by the optical attenuator is large, and only the total reflection sheet, the first coupling lens, the optical amplifier and the lens which have high relative position accuracy requirements are arranged on the first base plate body, so that the thermal deformation of the optical components on one base plate body has the same direction, and the influence on the optical path is small; similarly, the translation prism and the optical splitter are arranged on the second base plate body, and the requirement on the relative position precision of the translation prism and the optical splitter is high; a second coupling lens and a light detector are arranged on the third backing plate body, and the requirement on the relative position precision of the second coupling lens and the light detector is high; meanwhile, the precision requirements of the relative positions of the optical amplifier on the first base plate body, the translation prism on the second base plate body, the optical splitter on the second base plate body and the second coupling lens on the third base plate body are relatively low, and micro dislocation is allowed, so that the optical amplifiers are respectively installed on different base plate bodies, optical devices installed on the base plate bodies are relatively independent, and thermal deformation caused by heating of the optical devices on other base plate bodies cannot be influenced. And further, the influence of thermal expansion on the whole optical path transmission is reduced, the influence on the sensitivity of the optical module is reduced, and the transmission quality of the optical signal is ensured.
Meanwhile, an optical amplifier is integrated on the basis of a traditional 4 × 25G PIN-TIA receiving optical device, a weak signal at a receiving end is amplified, receiving sensitivity is improved, transmission distance of 40Km is realized, light amplified by an SOA is prevented from damaging a PD chip under the condition of receiving larger input light by using an optical attenuator, the optical amplifier and the optical attenuator are simultaneously integrated into an optical module, smaller packaging size is realized, and the integration into a QSFP28 module is facilitated.
Further, all be equipped with thermistor and thermoelectric cooler on first backing plate body, second backing plate body and the third backing plate body, thermistor and thermoelectric cooler are used for adjusting the temperature of corresponding backing plate body.
By arranging the thermistor and the thermoelectric cooler on each base plate body, each base plate body can independently adjust and control the temperature by the thermistor and the thermoelectric cooler on the base plate body.
Further, the inner end of the optical fiber connector is further packaged with a collimating lens and an optical isolator, and light passes through the collimating lens and the optical isolator from the optical fiber and then reaches the optical attenuator.
The arrangement of the collimating lens and the optical isolator is added at the inner end of the optical fiber joint, so that after light comes out of the optical fiber, all the light can be transmitted to the optical isolator through the collimating lens and then reaches the optical attenuator.
Compared with the prior art, the utility model, following advantage and beneficial effect have: a backing plate for an optical module, a packaging structure and the optical module are provided to realize the purposes of accelerating the heat dissipation efficiency, reducing the influence of thermal expansion on optical path transmission, reducing the influence on the sensitivity of the optical module and ensuring the transmission quality of optical signals.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
fig. 1 is the utility model relates to a structural schematic of backing plate for optical module.
Fig. 2 is a schematic structural diagram of the packaging structure for optical module of the present invention.
Fig. 3 is an exploded view of the optical module assembly of the present invention.
Reference numbers and corresponding part names in the drawings:
the optical fiber packaging structure comprises a base plate body 1, a through hole 1001, a first base plate body 100, a second base plate body 101, a third base plate body 102, an optical fiber connector 2, an optical attenuator 3, a total reflection sheet 4, a first coupling lens 5, an optical amplifier 6, a lens 70, a translation prism 7, an optical splitter 8, a second coupling lens 9, an optical detector 10 and an optical signal plug 11.
Detailed Description
To make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the following examples and drawings, and the exemplary embodiments and descriptions thereof of the present invention are only used for explaining the present invention, and are not intended as limitations of the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that: it is not necessary to employ these specific details to practice the present invention. In other instances, well-known structures, circuits, materials, or methods have not been described in detail so as not to obscure the present invention.
Throughout the specification, reference to "one embodiment," "an embodiment," "one example," or "an example" means: the particular features, structures, or characteristics described in connection with the embodiment or example are included in at least one embodiment of the invention. Thus, the appearances of the phrases "one embodiment," "an embodiment," "one example" or "an example" in various places throughout this specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and/or sub-combination in one or more embodiments or examples. Further, those of ordinary skill in the art will appreciate that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the description of the present invention, the terms "front", "back", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inner", "outer", etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the scope of the present invention.
Examples
As shown in fig. 1, the utility model relates to a backing plate for optical module, including the backing plate body, the lateral part of backing plate body is equipped with and is used for radiating a plurality of perforating holes 1001.
In a preferred embodiment, the shim plate body comprises a plurality of specifications, and the length or width or thickness of the shim plate body of any one specification is not equal to at least one geometric dimension of the shim plate body of any other specification.
As shown in fig. 2, an optical module package structure includes a housing 1, where the housing 1 is composed of a bottom plate and a housing cover, and further includes a pad body of the pad for an optical module described above; the base plate bodies are fixedly arranged on the bottom plate of the shell 1.
In a preferred embodiment, the plurality of pad bodies are fixedly mounted on the bottom plate of the housing 1 in a spaced distribution.
In a preferred embodiment, three pad bodies, namely a first pad body 100, a second pad body 101 and a third pad body 102, are disposed on the bottom plate of the housing 1.
As shown in fig. 3, an optical module includes the housing 1 of the above-described optical module package, an optical fiber connector 2, an optical attenuator 3, a total reflection sheet 4, a first coupling lens 5, an optical amplifier 6, a lens 70, a translation prism 7, an optical splitter 8, a second coupling lens 9, an optical detector 10, and an optical signal plug 11; the optical fiber connector 2 is mounted at one of the ends of the housing 1; the optical attenuator 3, the total reflection sheet 4, the first coupling lens 5, the optical amplifier 6 and the lens 70 are mounted on the first base plate body 100; the translation prism 7 and the optical splitter 8 are mounted on the second base plate body 101; the second coupling lens 9 and the optical detector 10 are mounted on the third pad body 102, and the optical signal plug 11 is mounted at the other end of the housing 1; an optical signal enters from the optical fiber connector 2, sequentially passes through the optical attenuator 3, the total reflection sheet 4, the first coupling lens 5, the optical amplifier 6, the translation prism 7, the optical splitter 8 and the second coupling lens 9, and then reaches the optical detector 10, and the optical detector 10 transmits the detected optical signal to the optical signal plug 11.
The optical module arranges the optical devices which are easy to generate heat on different backing plate bodies respectively, and arranges the optical devices which are adjacent to the optical modules and have higher relative position precision requirement on the same backing plate body, thereby forming each independent optical device group, having smaller relative influence with each other, reducing the influence of thermal expansion on optical path transmission, reducing the influence on the sensitivity of the optical module, and ensuring the transmission quality of optical signals.
In a preferred embodiment, each of the first, second, and third pad bodies 100, 101, and 102 is provided with a thermistor and a thermoelectric cooler for adjusting the temperature of the corresponding pad body.
In a preferred embodiment, a collimating lens and an optical isolator are further packaged at the inner end of the optical fiber connector 2, and light passes through the collimating lens and the optical isolator from the optical fiber and then reaches the optical attenuator 3.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above description is only the embodiments of the present invention, and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (8)
1. A base plate for an optical module comprises a base plate body, and is characterized in that a plurality of through holes (1001) for heat dissipation are formed in the side portion of the base plate body.
2. The pad for an optical module according to claim 1, wherein the pad body includes a plurality of specifications, and at least one of the geometric dimensions of the length, the width, and the thickness of the pad body of any one of the specifications is not equal to that of the pad body of any other one of the specifications.
3. An optical module package structure, comprising a housing (1), wherein the housing (1) is composed of a bottom plate and a housing cover, and is characterized by further comprising a plurality of pad bodies of the pad for an optical module according to claim 1 or 2; the base plate bodies are fixedly arranged on the bottom plate of the shell (1).
4. The package structure of claim 3, wherein the plurality of pad bodies are fixedly mounted on the bottom plate of the housing (1) in a spaced-apart manner.
5. The optical module package according to claim 4, wherein three pad bodies, namely a first pad body (100), a second pad body (101) and a third pad body (102), are disposed on the bottom plate of the housing (1).
6. An optical module comprising the housing (1), the optical fiber connector (2), the optical attenuator (3), the total reflection sheet (4), the first coupling lens (5), the optical amplifier (6), the lens (70), the translation prism (7), the optical splitter (8), the second coupling lens (9), the optical detector (10), and the optical signal plug (11) of the package for an optical module according to claim 5; the optical fiber connector (2) is installed at one end of the shell (1); the optical attenuator (3), the total reflection sheet (4), the first coupling lens (5), the optical amplifier (6) and the lens (70) are arranged on the first base plate body (100); the translation prism (7) and the optical splitter (8) are arranged on the second base plate body (101); the second coupling lens (9) and the optical detector (10) are mounted on the third pad body (102), and the optical signal plug (11) is mounted at the other end of the housing (1); an optical signal enters from the optical fiber connector (2), sequentially passes through the optical attenuator (3), the total reflection sheet (4), the first coupling lens (5), the optical amplifier (6), the lens (70), the translation prism (7), the optical branching device (8) and the second coupling lens (9), and then reaches the optical detector (10), and the optical detector (10) transmits the detected optical signal to the optical signal plug (11).
7. A light module according to claim 6, characterized in that the first (100), second (101) and third (102) pad bodies are each provided with a thermistor and a thermo-electric cooler for regulating the temperature of the respective pad body.
8. An optical module according to claim 6, characterized in that the inner end of the optical fiber connector (2) is further packaged with a collimating lens and an optical isolator, and the light passes through the collimating lens and the optical isolator from the optical fiber to the optical attenuator (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120736239.0U CN215268982U (en) | 2021-04-12 | 2021-04-12 | Backing plate for optical module, packaging structure and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120736239.0U CN215268982U (en) | 2021-04-12 | 2021-04-12 | Backing plate for optical module, packaging structure and optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215268982U true CN215268982U (en) | 2021-12-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120736239.0U Active CN215268982U (en) | 2021-04-12 | 2021-04-12 | Backing plate for optical module, packaging structure and optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215268982U (en) |
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2021
- 2021-04-12 CN CN202120736239.0U patent/CN215268982U/en active Active
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