CN215264688U - Be used for notebook power adapter heat dissipation mechanism - Google Patents
Be used for notebook power adapter heat dissipation mechanism Download PDFInfo
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- CN215264688U CN215264688U CN202121454221.8U CN202121454221U CN215264688U CN 215264688 U CN215264688 U CN 215264688U CN 202121454221 U CN202121454221 U CN 202121454221U CN 215264688 U CN215264688 U CN 215264688U
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- heat dissipation
- fin body
- strip
- power adapter
- plug connector
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Abstract
The utility model discloses a be used for notebook power adapter heat dissipation mechanism, including the fin body, the left side edge fastening of this fin body trailing flank has first plug connector the middle part of fin body leading flank is fixed with the second plug connector the fixed orifices has been seted up on the fin body between first plug connector and the second plug connector, the upside edge of fin body is buckled backward and is extended to form a plurality of first heat dissipation strips and second heat dissipation strip, just first heat dissipation strip sets up with second heat dissipation strip interval, just first heat dissipation strip place plane is located the top of second heat dissipation strip. The remarkable effects are as follows: under the premise of not increasing the occupied space, the space distribution is more reasonable after the power adapter is manufactured, and the heat dissipation effect is enhanced.
Description
Technical Field
The utility model relates to computer parts processing technology field, concretely relates to be used for notebook power adapter heat dissipation mechanism.
Background
In recent years, notebook computers have been developed rapidly, have smaller sizes and lighter weights, and have more powerful functions, and due to these excellent performances, notebook computers have become more popular and are favored by the knowledge that computers are required to work due to their portability.
When the notebook computer is used for a long time, the power adapter is required to be used for connecting the power supply, and the power adapter can generate a lot of heat in the using process. In the prior art, the power adapter is not provided with a special heat dissipation device, if the power adapter cannot perform good heat dissipation, the working stability of an internal electronic circuit is affected, the stability of output voltage is affected, the working performance and the service life of the notebook computer are further affected, and even fire hazard is caused.
Disclosure of Invention
To the not enough of prior art, the utility model aims at providing a be used for notebook power adapter heat dissipation mechanism can solve the shortcoming that exists among the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a be used for notebook power adapter heat dissipation mechanism which the key lies in: including the fin body, the left side edge of this fin body trailing flank is fixed with first plug connector the middle part of fin body leading flank is fixed with the second plug connector the fixed orifices has been seted up on the fin body between first plug connector and the second plug connector, the upside edge of fin body is buckled backward and is extended to form a plurality of first heat dissipation strips and second heat dissipation strip, just first heat dissipation strip sets up with second heat dissipation strip interval, just first heat dissipation strip place plane is located the top of second heat dissipation strip.
Furthermore, the radiating fin body is rectangular, and the first radiating strip and the second radiating strip are arranged along the length direction of the radiating fin body.
Further, the first plug connector is consistent with the second plug connector in structure, wherein the first plug connector comprises a connecting portion and an inserting portion connected with the connecting portion, and the connecting portion is provided with a connecting hole used for being connected with the radiating fin body.
Furthermore, the thickness of the connecting part is consistent with that of the inserting part, the length ratio is 3:1, and the width ratio is 5: 2.
Furthermore, the bending angle of the first heat dissipation strip and the second heat dissipation strip is 90 degrees.
Furthermore, the width and the length of the first heat dissipation strip and the second heat dissipation strip are consistent, and the thickness of the first heat dissipation strip and the thickness of the second heat dissipation strip are consistent with those of the radiating fin body.
Furthermore, both ends of the fixing hole adopt horn-shaped structures.
The utility model discloses a show the effect and be: simple structure, easily realize, low in production cost through the rational design to the fin structure, compares in traditional adapter fin structure, effectively under the prerequisite that does not increase occupation space, can make to make power adapter back spatial distribution more reasonable, has strengthened the radiating effect to carry out waste heat discharge effectively at power adapter during operation, reached quick radiating purpose.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a right side view of the present invention;
fig. 3 is a top view of the present invention;
fig. 4 is a schematic structural view of the first connector.
Detailed Description
The following provides a more detailed description of the embodiments and the operation of the present invention with reference to the accompanying drawings.
As shown in fig. 1-3, a heat dissipation mechanism for a notebook power adapter comprises a heat sink body 1, wherein the heat sink body 1 is attached to a transistor of a circuit board to increase the heat transfer area of the circuit board and improve the heat transfer efficiency, a first connector 2 is fixed at the left edge of the rear side of the heat sink body 1, a second connector 3 is fixed at the middle of the front side of the heat sink body 1, a fixing hole 4 is formed in the heat sink body 1 between the first connector 2 and the second connector 3, the upper edge of the heat sink body 1 is bent backwards and extends to form a plurality of first heat dissipation strips 5 and second heat dissipation strips 6, the bending angle between the first heat dissipation strips 5 and the second heat dissipation strips 6 is 90 degrees, the first heat dissipation strips 5 and the second heat dissipation strips 6 are arranged at intervals, and the plane where the first heat dissipation strips 5 are located is located above the second heat dissipation strips 6, through the first heat dissipation strip 5 and the second heat dissipation strip 6 that set up and stagger by height at interval, effectively improved the area of contact between fin and the air, improved the radiating efficiency of fin.
As can be seen from fig. 1, the heat sink body 1 is rectangular, and the first heat dissipation strip 5 and the second heat dissipation strip 6 are disposed along the length direction of the heat sink body 1.
In the present embodiment, the first connector 2 and the second connector 3 have the same structure, and as shown in fig. 4, the first connector 2 includes a connection portion 21 and an insertion portion 22 connected to the connection portion 21, and the connection portion 21 is provided with a connection hole 23 for connecting to the heat sink body 1.
Furthermore, the connecting portion 21 and the inserting portion 22 have the same thickness, the length ratio is 3:1, and the width ratio is 5: 2.
Preferably, the width and the length of the first heat dissipation strip 5 and the second heat dissipation strip 6 are consistent, and the thickness of the first heat dissipation strip is consistent with that of the heat sink body 1.
In this example, both ends of the fixing hole 4 are in a horn-shaped structure.
In this example, the first connector 2 and the second connector 3 are used for realizing the tin soldering fixation with the adapter circuit board, the radiating fins are fixed on the transistor by screws through the fixing holes 4, the radiating fin body 1 is attached to the transistor, and the circuit board has enough heat transfer area, the first radiating strips 5 and the second radiating strips 6 which are arranged at intervals and staggered in height are combined, the contact area between the radiating fins and the air is effectively increased, the radiating efficiency of the radiating fins is improved, the radiating effect of the radiating fin structure is effectively improved, the power adapter has good space layout on the premise of not increasing the size, and the phenomena that the size of the adapter is increased and the using effect is reduced due to the pursuit of the radiating rate are avoided.
The technical scheme provided by the utility model is introduced in detail above. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
Claims (7)
1. The utility model provides a be used for notebook power adapter heat dissipation mechanism which characterized in that: including the fin body, the left side edge of this fin body trailing flank is fixed with first plug connector the middle part of fin body leading flank is fixed with the second plug connector the fixed orifices has been seted up on the fin body between first plug connector and the second plug connector, the upside edge of fin body is buckled backward and is extended to form a plurality of first heat dissipation strips and second heat dissipation strip, just first heat dissipation strip sets up with second heat dissipation strip interval, just first heat dissipation strip place plane is located the top of second heat dissipation strip.
2. The heat dissipation mechanism for a notebook power adapter according to claim 1, wherein: the radiating fin body is rectangular, and the first radiating strip and the second radiating strip are arranged along the length direction of the radiating fin body.
3. The heat dissipation mechanism for a notebook power adapter according to claim 1, wherein: the structure of the first plug connector is consistent with that of the second plug connector, wherein the first plug connector comprises a connecting portion and an inserting portion connected with the connecting portion, and the connecting portion is provided with a connecting hole used for being connected with the radiating fin body.
4. The heat dissipation mechanism for a notebook power adapter according to claim 3, wherein: the connecting part and the inserting part are consistent in thickness, the length ratio is 3:1, and the width ratio is 5: 2.
5. The heat dissipation mechanism for a notebook power adapter according to claim 1, wherein: the bending angle of the first heat dissipation strip and the second heat dissipation strip is 90 degrees.
6. The heat dissipation mechanism for the notebook power adapter according to claim 1 or 5, wherein: the width and the length of the first heat dissipation strip and the second heat dissipation strip are consistent, and the thickness of the first heat dissipation strip and the thickness of the second heat dissipation strip are consistent with those of the radiating fin body.
7. The heat dissipation mechanism for a notebook power adapter according to claim 1, wherein: and both ends of the fixing hole are of horn-shaped structures.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121454221.8U CN215264688U (en) | 2021-06-29 | 2021-06-29 | Be used for notebook power adapter heat dissipation mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121454221.8U CN215264688U (en) | 2021-06-29 | 2021-06-29 | Be used for notebook power adapter heat dissipation mechanism |
Publications (1)
Publication Number | Publication Date |
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CN215264688U true CN215264688U (en) | 2021-12-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202121454221.8U Active CN215264688U (en) | 2021-06-29 | 2021-06-29 | Be used for notebook power adapter heat dissipation mechanism |
Country Status (1)
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CN (1) | CN215264688U (en) |
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2021
- 2021-06-29 CN CN202121454221.8U patent/CN215264688U/en active Active
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