CN215249544U

CN215249544U - Packaging structure of semiconductor device

Info

Publication number: CN215249544U
Application number: CN202120802884.8U
Authority: CN
Inventors: 杨玉婷; 梅嘉欣
Original assignee: Memsensing Microsystems Suzhou China Co Ltd
Current assignee: Memsensing Microsystems Suzhou China Co Ltd
Priority date: 2021-04-19
Filing date: 2021-04-19
Publication date: 2021-12-21
Anticipated expiration: 2031-04-19

Abstract

The application provides a packaging structure of a semiconductor device, which solves the problem of residual bubbles in a sealed shell in the prior art. The packaging structure comprises a first opening for injecting sealing filler into the shell; the inner space of the case includes a first space and a second space that are stacked in a filling direction of the sealing filler; a sidewall including a first portion enclosing a first space and a second portion enclosing a second space; the first portion and the second portion form a first curved corner on the inner wall of the housing facing into the housing, the first curved corner having an arc of less than pi/2.

Description

Packaging structure of semiconductor device

Technical Field

The application relates to the technical field of semiconductor devices, in particular to a packaging structure of a semiconductor device.

Background

With the development of electronic technology, the requirements for the packaging process of semiconductor end products have been increased. In the prior art, a common packaging process includes: the chip is first placed in the housing, and then sealing glue is injected into the housing through an opening in the housing to achieve sealing. For the packaging structure, a small amount of gas is often sealed in the shell in the glue filling process to generate bubbles, so that the product performance is influenced.

Content of application

In view of the above, embodiments of the present application are directed to providing a package structure of a semiconductor device to solve the problem of air bubbles remaining in a sealed housing in the prior art.

The application provides a packaging structure of semiconductor device, includes: a housing, the housing comprising: a first opening for injecting a sealing filler into the housing; the inner space of the case includes a first space and a second space that are stacked in a filling direction of the sealing filler; a sidewall including a first portion enclosing a first space and a second portion enclosing a second space; the first portion and the second portion form a first curved corner on the inner wall of the housing facing into the housing, the first curved corner having an arc of less than pi/2. Through setting up the radian at first arc turning and being less than pi/2, compare in the first arc turning that the radian is pi/2, the junction of first portion and second part is more level and smooth, is favorable to the packing of sealed filler, avoids the bubble to produce, has improved product reliability.

In one embodiment, the cross-sectional area of the first portion decreases gradually in the filling direction. Like this, on the one hand, on the gradual filling direction L of sealed filler, the cross sectional area of first portion reduces gradually, can play the effect of gathering together sealed filler gradually to further avoid producing the bubble, promote the reliability of product. On the other hand, in the direction of gradually approaching the second opening, the section area of the first part is gradually increased, so that the preparation process of the shell is not limited to a cutting process, and stamping forming can be adopted, so that the process difficulty is reduced, and the cost is reduced.

In one embodiment, the cross-section of the first portion in the filling direction is an isosceles trapezoid. Simple structure and convenient industrial realization.

In one embodiment, a first chip and a second chip stacked in a filling direction are disposed within the housing. The first chip and the second chip are overlapped, so that the miniaturization of the device is facilitated.

In one embodiment, the first chip and the second chip are located in a first space, an orthographic projection of the second chip in a direction away from the filling direction falling within the first chip. In this case, the overall shape of the first chip and the second chip after being stacked is adapted to the shape of the first space, thereby improving the utilization ratio of the internal space of the housing.

In one embodiment, an edge of the first portion distal to the second portion forms a second opening of the housing. By providing such a second opening, the preparation of the housing is facilitated.

In one embodiment, the package structure of the semiconductor device further includes: the circuit board is positioned on the second opening side of the shell and seals the second opening; and a first chip and a second chip stacked on the circuit board in this order. The structure is compact, and the miniaturization of the device is facilitated.

In one embodiment, the first chip is in a flip-chip package. In this case, the functional layer of the first chip is located on the side close to the circuit board, so that the functional layer can be protected by the circuit board.

In one embodiment, the inner space of the housing further includes a third space located at a side of the second space away from the first space; the side wall further comprises a third part enclosing a third space; the third part and the second part form a second arc-shaped corner deviating from the shell on the inner wall of the shell, and the radian of the second arc-shaped corner is less than or equal to pi/2; the edge of the third portion remote from the second portion forms a ledge extending outwardly of the housing. In this case, the third portion forms a waist which is concave inwards for the whole housing, facilitating the fixing of the annular seal.

In one embodiment, in the filling direction, the cross-section of the shell comprises a side extending in the filling direction, the side comprising a first section corresponding to the first portion, a second section corresponding to the second portion, and a third section corresponding to the third portion; the second portion includes a first arcuate segment connected to the first segment, a second arcuate segment connected to the second segment, and a linear segment connecting the first arcuate segment and the second arcuate segment, the linear segment being inclined relative to the fill direction. This makes the second part-structure smoother, further avoiding the generation of bubbles.

According to the packaging structure of the semiconductor device, the radian of the first arc-shaped corner is smaller than pi/2, and compared with the first arc-shaped corner with the radian of pi/2, the joint of the first part and the second part is smoother, so that the filling of sealing filler is facilitated, the generation of bubbles is avoided, and the reliability of the product is improved.

Drawings

Fig. 1 is a schematic cross-sectional view of a package structure of a semiconductor device according to a first embodiment of the present application.

Fig. 2 is a top view of a package structure of the semiconductor device shown in fig. 1.

Fig. 3 is a schematic view of a package structure of a semiconductor device according to a second embodiment of the present application.

Fig. 4 is a schematic view of a package structure of a semiconductor device according to a third embodiment of the present application.

Fig. 5 is a schematic view of a package structure of a semiconductor device according to a fourth embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Fig. 1 is a schematic cross-sectional view of a package structure of a semiconductor device according to a first embodiment of the present application. Fig. 2 is a top view of a package structure of the semiconductor device shown in fig. 1. As shown in fig. 1 and 2, the package structure 100 of the semiconductor device includes a case 11. The housing 11 includes a first opening for injecting the sealing filler 10 into the housing 11. The inner space of the housing 11 includes a first space and a second space that are stacked in the filling direction L of the sealing filler. The filling direction L of the sealing filler refers to a direction in which the sealing filler gradually fills the inner space of the housing 11, i.e., a direction from the bottom of the housing 11 toward the top of the housing 11. The first space and the second space are parallel to each other, and the first space and the second space can be parallel to the plane of the first opening or inclined relative to the plane of the first opening.

The side wall of the housing 11 includes a first portion 111 enclosing a first space and a second portion 112 enclosing a second space, the first portion 111 and the second portion 112 form a first arc-shaped corner θ facing the inside of the housing 11 on the inner wall of the housing 11, and the radian of the first arc-shaped corner θ is equal to pi/2. The radian of the first arc-shaped corner theta refers to an included angle between two end points of an arc forming the first arc-shaped corner theta and a circle center connecting line corresponding to the arc. For example, in the filling direction L of the sealing filler 10, the cross section of the case 11 includes a side extending in the filling direction L, the side including a first section corresponding to the first portion 111 and a second section corresponding to the second portion 112. As shown in fig. 1, the first section is a straight line and the second section includes a first arcuate section ab connected to the first section, the first arcuate section ab forming a first arcuate corner. Accordingly, the radian of the first arc-shaped section ab is the radian of the first arc-shaped corner θ.

The inner space of the housing 11 further includes a third space overlapping the first space and the second space, the third space being located on a side of the second space remote from the first space. Accordingly, the side wall of the housing 11 further includes a third portion 113 enclosing a third space. The second portion 112 and the third portion 113 form a second curved corner β on the inner wall of the housing 11 facing away from the inside of the housing 11, the second curved corner β having a radian equal to pi/2. The radian of the second arc-shaped corner beta is an included angle between two end points of an arc corresponding to the second arc-shaped corner beta and a circle center connecting line corresponding to the arc. For example, in the filling direction L of the sealing filler 10, the cross section of the case 11 includes a side extending in the filling direction L, and the side includes a second section corresponding to the second portion 112 and a third section corresponding to the third portion 113. As shown in fig. 1, the third segment is a straight line, the second segment includes a second arc segment cd connected with the third segment, and the second arc segment cd forms a second arc corner. Accordingly, the curvature of the second curved section cd is the curvature of the second curved corner β.

In one embodiment, the second portion 112 is an arc-shaped surface formed by an S-shaped generatrix, and one end of the second portion 112 is connected with the first portion 111, and the other end is connected with the third portion 113. For example, the second segment corresponding to the second portion 112 further includes a straight line segment bc connecting the first arcuate segment ab and the second arcuate segment cd. The third portion 113 extends away from the edge of the second portion 112 in a direction parallel to the straight line segment away from the interior space of the housing 11 to form a protruding edge 114. In this case, the third portion 113 forms a waist portion inwardly concave with respect to the entire housing 11, and the convex edge 114 forms an annular flat surface on the top surface of the housing 11. The waist is matched with the annular plane and can be used for installing the annular sealing ring.

In one embodiment, as shown in fig. 1, the housing 11 has a plane of symmetry parallel to the filling direction L of the sealing filler 10. For example, the first portion 111 and the third portion 113 are both rectangular cylindrical, and two adjacent faces of the rectangular cylindrical side walls are in smooth transition through a curved surface; for another example, the first portion 111 and the third portion 113 are cylindrical.

The housing 11 further includes a second opening disposed opposite the first opening. In one embodiment, the edge of the first portion 111 distal to the second portion 112 forms a second opening of the housing 11. For example, as shown in fig. 1 and 2, the case 11 has a substantially convex shape, a first opening is provided on an upper end surface of the convex case 11, and a second opening is provided on a lower end surface of the convex case 11. The provision of the second opening may facilitate the preparation of the housing 11.

As shown in fig. 1, the package structure 100 of the semiconductor device further includes a circuit board 12, and the circuit board 12 is located at the second opening side of the housing 11 and is hermetically connected to an edge of the first portion 111 forming the second opening to close the second opening. In one embodiment, the circuit board 12 is perpendicular to the filling direction L of the sealing filler 10.

As shown in fig. 1, the package structure 100 of the semiconductor device further includes an integrated circuit and an encapsulation filler 10. The Integrated Circuit is located in the housing 11 and includes a first chip 13 and a second chip 14, the first chip 13 is, for example, a Micro Electro Mechanical Systems (MEMS) chip, and the second chip 14 is, for example, an Application Specific Integrated Circuit (ASIC) chip. The first chip 13 and the second chip 14 are respectively fixed on the circuit board 12, and the first chip 13 and the second chip 14, and the second chip 14 and the circuit board 12 are respectively electrically connected through bonding wires 15. The sealing filler 10 at least partially fills the inner space of the housing 11 and covers the integrated circuit.

The semiconductor device as shown in fig. 1 and 2 may be, for example, a pressure sensor, a temperature sensor, a humidity sensor, a microphone, or the like. Taking a pressure sensor as an example, the working principle of the semiconductor device comprises the following steps: the integrated circuit collects the pressure signal, analyzes and processes the pressure signal to obtain a corresponding voltage signal or current signal, and finally outputs the voltage signal or current signal through the circuit board 5.

Fig. 3 is a schematic view of a package structure of a semiconductor device according to a second embodiment of the present application. The package structure 200 of the semiconductor device shown in fig. 3 is different from the package structure 100 of the semiconductor device shown in fig. 1 only in that, in the present embodiment, the radian of the first arc-shaped corner θ is smaller than pi/2. Specifically, in the filling direction L of the sealing filler 10, the side of the cross section of the case 11 extending in the filling direction L includes: a first segment corresponding to the first portion 111, a second segment corresponding to the second portion 112; and a third section corresponding to the third portion 113. Wherein the first section and the third section are respectively parallel to the filling direction L of the sealing filler. The second section comprises a first curved section ab connected with the first section, a second curved section cd connected with the second section, and a straight line section bc connecting the first curved section ab and the second curved section cd, wherein the straight line section bc is obliquely arranged relative to the filling direction L of the sealing filler, namely the straight line section bc is not parallel or perpendicular to the filling direction L of the sealing filler. In this case, as shown in FIG. 3, the radian of the second curved corner β is less than π/2.

According to the package structure 200 of the semiconductor device provided by the embodiment, compared with the package structure 100 of the semiconductor device shown in fig. 1 and 2, the first arc-shaped corner θ is smoother, which is beneficial to filling of the sealing filler, avoiding generation of bubbles, and improving product reliability.

In one embodiment, the first chip 13 and the second chip 14 within the housing 11 are stacked along the filling direction L. For example, as shown in fig. 3, the first chip 13 and the second chip 14 are sequentially stacked on the circuit board 12, the second chip 14 is electrically connected to the first chip 13, and the first chip 13 is electrically connected to the circuit board 12. Thus, the miniaturization of the device is facilitated.

The first chip 13 is in the form of a flip-chip package, i.e. the functional layers of the first chip 13 are facing the circuit board 12. The pads of the first chip 13 are electrically connected to the pads on the circuit board 12 by silver paste or solder paste. Therefore, on one hand, the connection process is simple, and the use of bonding wires is reduced, so that the cost is reduced; on the other hand, the circuit board 12 may provide protection for the functional layers of the first chip 13 from scratches.

The second chip 14 is electrically connected to the first chip 13 through the circuit board 12, that is, the second chip 14 is connected to the circuit board 12, and the circuit board 12 is further connected to the first chip 13. Specifically, the back surface of the second chip 14, i.e. the surface opposite to the functional layer, is fixed on the back surface of the first chip 13 by bonding with glue 16, the pad on the front surface of the second chip 14 is electrically connected to the circuit board 12 by the bonding wire 15, and the circuit board 12 electrically connects the second chip 14 to the first chip 13 by internal circuit traces.

Fig. 4 is a schematic view of a package structure of a semiconductor device according to a third embodiment of the present application. The package structure 300 of the semiconductor device shown in fig. 4 is different from the package structure 200 of the semiconductor device shown in fig. 3 in that a first segment corresponding to the first portion 111 is disposed obliquely with respect to the filling direction L of the sealing filler. In this case, the cross-sectional area of the first portion 111 gradually decreases in the filling direction L of the sealing filler, that is, the cross-sectional area of the first portion 111 gradually increases in a direction gradually approaching the second opening. In one embodiment, the cross section of the first portion 111 in the filling direction L of the sealing filler is an isosceles trapezoid. The structure is simple and is convenient for industrial realization.

In one embodiment, the difference between the package structure 300 of the semiconductor device shown in fig. 4 and the package structure 200 of the semiconductor device shown in fig. 3 further includes that the second segment corresponding to the second portion 112 only includes the first arc-shaped segment ab connected to the first segment and the second arc-shaped segment cd connected to the second segment, and does not include the straight line segment connecting the first arc-shaped segment ab and the second arc-shaped segment cd, i.e., the point b and the point c coincide.

According to the package structure 300 of the semiconductor device provided by the embodiment, compared with the package structure 200 of the semiconductor device shown in fig. 3, on one hand, in the gradual filling direction L of the sealing filler 10, the cross-sectional area of the first portion 111 is gradually reduced, which can play a role of gradually gathering the sealing filler 10, thereby further avoiding generating bubbles and improving the reliability of the product. On the other hand, in the direction gradually approaching the second opening, the cross-sectional area of the first portion 111 is gradually increased, so that the preparation process of the housing 11 is not limited to the cutting process, and the housing can be formed by punching, thereby reducing the process difficulty and further reducing the cost.

In one embodiment, the second chip 14 and the first chip 13 are located in the first space. The orthographic projection of the second chip 14 in the direction away from the filling direction L falls into the first chip 13, that is, the stacking shape of the second chip 14 and the first chip 13 is adapted to the shape of the first space surrounded by the first portion 111, so that the utilization rate of the inner space of the housing 11 is improved. In other embodiments, as shown in fig. 4, the first chip 13 is located in the first space, and at least a portion of the second chip 14 is located in the second space. In this case, the second space can be used to accommodate at least a part of the second chip 14, thereby further improving the utilization of the space inside the housing 11.

Fig. 5 is a schematic view of a package structure of a semiconductor device according to a fourth embodiment of the present application. The package structure 400 of the semiconductor device shown in fig. 5 differs from the package structure 100 of the semiconductor device shown in fig. 1 only in that, in the present embodiment, the radian of the first arc-shaped corner θ is smaller than pi/2. Specifically, in the filling direction L of the sealing filler 10, the side of the cross section of the case 11 extending in the filling direction L includes: a first segment corresponding to the first portion 111, a second segment corresponding to the second portion 112; and a third section corresponding to the third portion 113.

Wherein the first segment is arranged obliquely with respect to the filling direction L of the sealing compound. In this case, the cross-sectional area of the first portion 111 gradually decreases in the filling direction L of the sealing filler, that is, the cross-sectional area of the first portion 111 gradually increases in a direction gradually approaching the second opening. In one embodiment, the cross section of the first portion 111 in the filling direction L of the sealing filler is an isosceles trapezoid.

The second section comprises a first curved section ab connected with the first section, a second curved section cd connected with the second section, and a straight section bc connecting the first curved section ab and the second curved section cd, the straight section bc being perpendicular to the filling direction L of the sealing filler.

The third segment is parallel to the filling direction L of the sealing filler.

According to the package structure 400 of the semiconductor device provided by the embodiment, compared with the package structure 100 of the semiconductor device shown in fig. 1, the first arc-shaped corner θ is smoother, which is beneficial to filling of the sealing filler, avoiding generation of bubbles, and improving product reliability. Meanwhile, compared with the package structure 100 of the semiconductor device shown in fig. 3 and 4, the annular seal ring is more easily fixed to the waist portion of the housing 11 and is less likely to slide.

It should be understood that the terms "first", "second" and "third" used in the description of the embodiments of the present application are only used for clearly illustrating the technical solutions and are not used for limiting the protection scope of the present application. The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.

Claims

1. A package structure of a semiconductor device, comprising: a housing, the housing comprising:

a first opening for injecting a sealing filler into the housing; the inner space of the case includes a first space and a second space that are stacked in a filling direction of the sealing filler;

a sidewall including a first portion enclosing the first space and a second portion enclosing the second space; the first portion and the second portion form a first curved corner on the inner wall of the housing facing into the housing, the arc of the first curved corner being less than pi/2.

2. The package structure of a semiconductor device according to claim 1, wherein a cross-sectional area of the first portion is gradually reduced in the filling direction.

3. The package structure of a semiconductor device according to claim 2, wherein a cross section of the first portion in the filling direction is an isosceles trapezoid.

4. The package structure of a semiconductor device according to any one of claims 1 to 3, wherein a first chip and a second chip stacked in the filling direction are provided in the case.

5. The package structure of the semiconductor device according to claim 4, wherein the first chip and the second chip are located in the first space, and an orthographic projection of the second chip in a direction away from the filling direction falls within the first chip.

6. The package structure of the semiconductor device according to any one of claims 1 to 3, wherein an edge of the first portion remote from the second portion forms a second opening of the housing.

7. The package structure of a semiconductor device according to claim 6, further comprising: a circuit board positioned at the second opening side of the housing and sealing the second opening; and a first chip and a second chip stacked on the circuit board in this order.

8. The package structure of a semiconductor device according to claim 7, wherein the first chip is electrically connected to the circuit board in a flip-chip manner.

9. The package structure of a semiconductor device according to any one of claims 1 to 3, wherein the internal space of the housing further includes a third space located on a side of the second space remote from the first space; the sidewall further comprises a third portion enclosing the third space; the third portion and the second portion form a second arc-shaped corner on the inner wall of the shell, wherein the second arc-shaped corner faces away from the shell, and the radian of the second arc-shaped corner is smaller than or equal to pi/2; the edge of the third portion remote from the second portion forms a protruding edge extending outward of the housing.

10. The package structure of a semiconductor device according to claim 9, wherein in the filling direction, a cross section of the case includes a side extending in the filling direction, the side including a first section corresponding to the first portion, a second section corresponding to the second portion, and a third section corresponding to the third portion; the second portion includes a first arcuate segment connected to the first segment, a second arcuate segment connected to the second segment, and a linear segment connecting the first arcuate segment and the second arcuate segment, the linear segment being inclined with respect to the filling direction.