CN215220726U

CN215220726U - Image sensing chip packaging structure

Info

Publication number: CN215220726U
Application number: CN202120975865.5U
Authority: CN
Inventors: 王凯厚; 王鑫琴; 沈忠明; 王蔚
Original assignee: China Wafer Level CSP Co Ltd
Current assignee: China Wafer Level CSP Co Ltd
Priority date: 2021-05-08
Filing date: 2021-05-08
Publication date: 2021-12-17
Anticipated expiration: 2031-05-08

Abstract

The utility model provides an image sensing chip packaging structure, packaging structure includes: a substrate having opposing first and second faces; the image sensing chip is arranged on the first surface of the substrate, is electrically connected with the substrate, and is provided with a first surface facing the substrate and a second surface opposite to the first surface, and a light sensing area is arranged on the first surface of the image sensing chip; a light absorption support member, which is arranged on the first surface of the substrate, is made of a light absorption material and surrounds the image sensing chip; and the transparent cover plate is erected on the light absorption supporting piece and forms a closed cavity for accommodating the image sensing chip together with the light absorption supporting piece. The light absorption supporting piece can absorb light incident on the light absorption supporting piece, so that the light is prevented from being further reflected to the photosensitive area to cause interference on the photosensitive area, the influence of stray light on image direct light is reduced, and the imaging effect is improved.

Description

Image sensing chip packaging structure

Technical Field

The utility model relates to the field of semiconductor technology, specifically relate to an image sensing chip packaging structure.

Background

With the development of light and shadow technologies such as photographing and shooting, the image sensing chip can be used in a camera of an electronic product as a functional image sensing chip capable of converting a received optical signal into an electrical signal, and has huge market demands. The prior image sensing chip packaging structure generally comprises a chip and a transparent glass cover plate for protecting a chip photosensitive area, wherein the transparent glass cover plate is suspended on the chip through a supporting structural member, the transparent glass cover plate and the supporting structural member jointly form a closed cavity for accommodating the chip, however, when part of stray light sources are obliquely incident to the inner wall surface of the supporting structural member, the stray light sources can be further reflected to the photosensitive area of the chip, the interference to the photosensitive area is caused, and therefore the image imaging effect is achieved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an image sensing chip packaging structure.

The utility model provides an image sensing chip packaging structure, include:

a substrate having opposing first and second faces;

the image sensing chip is arranged on the first surface of the substrate, is electrically connected with the substrate, and is provided with a first surface facing the substrate and a second surface opposite to the first surface, and a light sensing area is arranged on the first surface of the image sensing chip;

a light absorption support member, which is arranged on the first surface of the substrate, is made of a light absorption material and surrounds the image sensing chip;

and the transparent cover plate is erected on the light absorption supporting piece and forms a closed cavity for accommodating the image sensing chip together with the light absorption supporting piece.

As a further improvement of the present invention, the light absorption supporting member has an upper end facing the cover plate groove recessed downward on one side of the image sensor chip for placing the transparent cover plate.

As a further improvement of the present invention, the cover plate groove depth is smaller than the thickness of the transparent cover plate.

As a further improvement of the present invention, the light absorbing support member is a black plastic member.

As a further improvement of the present invention, the image sensor chip includes a first solder pad located outside the photosensitive area, the substrate includes a second solder pad located outside the image sensor chip, the first solder pad with electric connection between the second solder pad, the light absorption support member is located outside the second solder pad.

As a further improvement of the present invention, the package structure further includes at least one functional chip disposed on the first surface of the substrate and located in the sealed cavity, wherein the functional chip is electrically connected to the second pad.

As a further improvement of the present invention, the package structure further includes a plastic package layer, the plastic package layer covers the substrate, the light absorption supporting member and the transparent cover plate, and at least exposes the transparent cover plate is located in the region above the photosensitive area.

The utility model has the advantages that: the utility model discloses an use the extinction support piece that has the extinction effect to support transparent cover plate in image sensing chip packaging structure, can be with inciding the light absorption on the extinction support piece to avoid it further to reflect the sensitization district and cause the interference to the sensitization district, reduced stray light to the influence of image direct light, improved the formation of image effect.

Drawings

Fig. 1 is a schematic view of an image sensor chip package structure according to an embodiment of the present invention.

Fig. 2 is a schematic flow chart illustrating a method for packaging an image sensor chip according to an embodiment of the present invention.

Fig. 3 to 6 are schematic diagrams illustrating steps of a method for packaging an image sensor chip according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, the technical solutions of the present application will be clearly and completely described below with reference to the detailed description of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

For convenience in explanation, the description herein uses terms indicating relative spatial positions, such as "upper," "lower," "rear," "front," and the like, to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "above" other elements or features would then be oriented "below" or "above" the other elements or features. Thus, the exemplary term "below" can encompass both a spatial orientation of below and above.

As shown in fig. 1, the present invention provides an image sensor chip 2 package structure, including: the image sensor comprises a substrate 1, an image sensing chip 2, a light absorption support 3, a transparent cover plate 4 and a plastic package layer 5.

The substrate 1 has a first surface and a second surface opposite to each other, the first surface of the substrate 1 is provided with a second pad 12 for electrically connecting with the image sensing chip 2, and the second surface of the substrate 1 is provided with a bonding bump 11 such as a solder ball for electrically connecting with the outside.

The image sensing chip 2 is arranged on the first surface of the substrate 1 and electrically connected with the substrate 1, and has a first surface facing the substrate 1 and a second surface opposite to the first surface, the first surface of the image sensing chip 2 is provided with a photosensitive area 21 and a first welding pad 22 positioned outside the photosensitive area 21, and the first welding pad 22 is electrically coupled with the photosensitive area 21.

The light sensing region 21 may include a plurality of photodiode array arrangements for converting optical signals irradiated to the light sensing region 21 into electrical signals. The first pads 22 serve as input and output terminals for devices within the photosensitive region 21 to connect to external circuitry. In other embodiments of the present invention, the image sensor chip 2 may further include other electronic components, which is not limited by the present invention.

In other embodiments of the present invention, an electrical connection member such as a solder ball may be disposed on the back surface of the image sensor chip 2, a conduction structure such as a through silicon via is formed inside the electrical connection member, which conducts the photosensitive area 21 and the electrical connection member, and the image sensor chip 2 and the substrate 1 are electrically connected by a flip-chip method.

The light absorption supporting member 3 is disposed on the first surface of the substrate 1, is disposed outside the second pad 12, is made of a light absorption material, and is disposed around the image sensing chip 2. The transparent cover plate 4 is erected on the light absorption supporting member 3, and forms a closed cavity for accommodating the image sensing chip 2 together with the light absorption supporting member 3.

Specifically, in this embodiment, the light absorbing support member 3 is a black plastic member, and in other embodiments, the light absorbing support member 3 may also be made of other light absorbing materials with certain structural strength, so as to absorb light irradiated thereon while playing a role of structural support.

The transparent cover plate 4 is made of transparent materials with specific strength such as inorganic glass and organic glass, and plays a role in protecting the photosensitive area 21 and transmitting light. The upper and lower surfaces of the transparent cover plate 4 are smooth surfaces to avoid scattering, diffuse reflection and other effects on incident light, so that the sensing precision of the image sensing chip 2 is influenced.

By adopting the light absorption support member 3 as the support structure of the transparent cover plate 4, the closed cavity where the image sensing chip 2 is located can have a side wall with good light absorption effect, and the light absorption support member 3 absorbs light incident on the inner wall surface thereof, so that the light is prevented from further entering the light sensing area 21 to interfere the light sensing area 21 and influence the imaging effect.

Further, the upper end of the light absorption support member 3 is provided with a cover plate groove 31 which is concave downwards towards one side of the image sensing chip 2, so that the transparent cover plate 4 can be placed, and the nesting structure is formed between the transparent cover plate 4 and the light absorption support member 3 by arranging the cover plate groove 31, so that the assembly relation between the transparent cover plate 4 and the light absorption support member 3 is firmer.

The molding layer 5 covers the substrate 1, the light absorbing support 3 and the transparent cover plate 4, and exposes at least a region of the transparent cover plate 4 above the photosensitive region 21.

Furthermore, the depth of the cover plate groove 31 is smaller than the thickness of the transparent cover plate 4, that is, the transparent cover plate 4 is partially embedded in the cover plate groove 31 and partially protrudes out of the light absorption support 3, so that the plastic package layer 5 can fix the transparent cover plate 4, thereby further improving the reliability of the package structure.

In some embodiments of the present invention, the package structure further includes at least one functional chip 6 disposed on the first surface of the substrate 1 and located in the sealed cavity, the functional chip 6 is electrically connected to the second pad 12, and the functional chip is also located in the sealed cavity surrounded by the transparent cover plate 4, the light absorption support member 3 and the substrate 1.

As shown in fig. 2, the present invention further provides a method for packaging an image sensor chip 2, which includes the steps of:

s1: as shown in fig. 3, a substrate 1 is provided, and an image sensing chip 2 is disposed on the substrate 1.

In some embodiments of the present invention, the method further comprises the steps of: at least one functional chip 6 is disposed on the substrate 1 and electrically connected to the substrate 1.

S2: as shown in fig. 4, a light absorbing support member 3 is disposed on the first surface of the substrate 1 at the periphery of the image sensing chip 2, and the light absorbing support member 3 is made of a light absorbing material.

Further, in some embodiments of the present invention, the method further comprises the steps of: a cover plate groove 31 is formed at the upper end of the light absorbing supporter 3, and the transparent cover plate 4 is placed in the cover plate groove 31. The structure of the cover plate groove 31 can be formed by integral injection molding, or by mechanical cutting, laser cutting, etc., according to different light absorbing materials used.

S3: as shown in fig. 5, the transparent cover 4 is disposed on the light absorbing support 3, such that the transparent cover 4, the light absorbing support 3 and the substrate 1 enclose a closed cavity for accommodating the image sensor chip 2.

S4: as shown in fig. 5, the substrate 1, the light absorbing support 3 and the transparent cover 4 are plastic-sealed by filling a plastic package material, and at least an area of the transparent cover 4 above the photosensitive area 21 is exposed.

The substrate 1 is cut to form individual package structures.

To sum up, the utility model discloses an use extinction support piece that has the extinction effect to support the clear cover in image sensing chip packaging structure, can be with inciding the light absorption on the extinction support piece to avoid it further to reflect the sensitization district and cause the interference to the sensitization district, reduced stray light to the influence of image direct light, improved the formation of image effect.

It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.

The above list of details is only for the feasible embodiments of the present invention, and is not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present invention are intended to be included within the scope of the present invention.

Claims

1. An image sensing chip package structure, comprising:

a substrate having opposing first and second faces;

it is characterized by also comprising:

2. The image sensor chip package of claim 1, wherein a cover plate groove recessed downward is formed at a side of the upper end of the light absorbing support facing the image sensor chip for accommodating the transparent cover plate.

3. The image sensor chip package of claim 2, wherein the cover plate groove depth is less than the thickness of the transparent cover plate.

4. The image sensor chip package according to any one of claims 1 to 3, wherein the light absorbing support is a black plastic member.

5. The image sensor chip package structure of claim 1, wherein the image sensor chip comprises a first bonding pad located outside the photosensitive region, the substrate comprises a second bonding pad located outside the image sensor chip, the first bonding pad is electrically connected to the second bonding pad, and the light absorbing support is disposed outside the second bonding pad.

6. The image sensor chip package structure of claim 5, further comprising at least one functional chip disposed on the first surface of the substrate and located in the sealed cavity, wherein the functional chip is electrically connected to the second pad.

7. The image sensor chip package structure of claim 5, further comprising a molding compound covering the substrate, the light absorbing support and the transparent cover, and exposing at least a region of the transparent cover above the photosensitive region.