CN215220664U - Cleaning device for be arranged in semiconductor packaging process on equipment of removing glue - Google Patents
Cleaning device for be arranged in semiconductor packaging process on equipment of removing glue Download PDFInfo
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- CN215220664U CN215220664U CN202121236424.XU CN202121236424U CN215220664U CN 215220664 U CN215220664 U CN 215220664U CN 202121236424 U CN202121236424 U CN 202121236424U CN 215220664 U CN215220664 U CN 215220664U
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Abstract
The utility model relates to a cleaning device that is arranged in semiconductor packaging process to remove on gluey equipment, include: a support frame supported on the frame; the blowing mechanism is arranged on the supporting frame, faces the platform and blows air to the platform through the blowing mechanism so as to blow away residues on the platform; the collecting barrel and the supporting frame are arranged on two opposite sides of the platform; keep off and locate the baffle of keeping away from one side of platform on the collecting vessel, establish in the frame immediately, the top of baffle is higher than the top of platform, the baffle size and the size looks adaptation of frame. The utility model discloses a product frame of cleaning device on the platform takes away the back away, realizes automatic blowing in order to blow away the residue on the platform, and sets up collecting vessel and baffle that corresponds at the opposite side of platform, utilizes the baffle to block the residue and lets the residue fall into the collecting vessel and collect, has saved manual operation's step, can improve clear efficiency.
Description
Technical Field
The utility model relates to an equipment field of using in the semiconductor package process refers in particular to a cleaning device that is arranged in the semiconductor package process to remove on the equipment of glue.
Background
The semiconductor Molding (plastic package) process is used for placing a semiconductor product frame into an injection Molding machine for injection Molding, a manual degumming device (De-cutter) is arranged in the process, the degumming device is used for removing waste glue on the product frame after the product frame completes injection Molding, the product frame is taken away, residues such as removed glue scraps and the like fall on the degumming device, the residues on the degumming device need to be cleaned before the next product frame is subjected to degumming operation, the existing cleaning method is that the residues on the degumming device are manually swept away or blown away by a cleaning brush or an air gun, the operation is inconvenient, the cleaning time is long, and the efficiency is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's defect, provide a cleaning device that is arranged in semiconductor packaging process to go on the equipment of glue, there is inconvenient, the long and problem of efficiency of influence of clearance time in the way of solving current artifical manual clearance.
The technical scheme for realizing the purpose is as follows:
the utility model provides a cleaning device that is arranged in semiconductor packaging process on equipment of removing glue, the equipment of removing glue includes the frame and arranges in platform in the frame, cleaning device includes:
the supporting frame is supported on the rack;
the blowing mechanism is arranged on the supporting frame, faces the platform and blows air to the platform through the blowing mechanism so as to blow away residues on the platform;
the collecting barrel is detachably arranged on the rack, and the collecting barrel and the supporting frame are arranged on two opposite sides of the platform; and
keep off and locate keep away from on the collecting vessel the baffle of one side of platform, the baffle is established immediately in the frame, the top of baffle is higher than the top of platform, the baffle size with the size looks adaptation of frame.
The utility model discloses a cleaning device is at the frame mounting of the equipment of glue removing and is swept the mechanism, and the product frame on the platform takes away the back away, realizes blowing automatically in order to blow away the residue on the platform, and sets up collecting vessel and baffle that corresponds at the opposite side of platform, utilizes the baffle to block the residue and lets the residue fall into the collecting vessel in collect, has saved manual operation's step, can improve clear efficiency.
The cleaning device for the photoresist removing equipment in the semiconductor packaging procedure of the utility model is further improved in that the purging mechanism comprises a purging shell fixedly connected on the supporting frame, a purging port arranged on one side of the purging shell facing the platform and an air inlet arranged on one side of the purging shell far away from the platform;
an air cavity communicated with the purging port and the air inlet is formed in the purging shell;
the size of the purge port is matched with that of the platform;
the air inlet is connected with an air supply structure.
The utility model is used for the cleaning device on the equipment that strips among the semiconductor packaging process is improved further and lies in, sweep the bottom of mouth with the top surface looks parallel and level setting of platform.
The utility model is used for cleaning device on the equipment of removing glue in the semiconductor packaging process's further improvement lies in, still including install in the frame and be located the dust catcher of platform below, the dust absorption mouth of dust catcher is connected the bottom of collecting vessel.
The utility model is used for the cleaning device on the equipment that strips among the semiconductor packaging process is improved further and lies in, still including install in control switch on the platform, control switch with sweep the mechanism control connection.
The utility model is used for cleaning device on the equipment that strips among the semiconductor packaging process further improves and lies in, be close to on the collecting vessel the border of baffle is equipped with the deflector, the deflector is the slope form setting, just the tip of deflector with the baffle pastes.
The utility model is used for the cleaning device on the equipment that strips among the semiconductor packaging process further improves and lies in, the both sides of baffle be equipped with the guide plate that the lateral part that the frame corresponds meets, the guide plate is the slope form setting.
Drawings
Fig. 1 is a side view of the cleaning device and the photoresist stripping device of the photoresist stripping device in the semiconductor packaging process of the present invention.
Fig. 2 is a schematic structural view of the cleaning device of the present invention, which is used in the semiconductor packaging process and is installed on the photoresist removing device and omits the upper frame body shown in fig. 1.
Detailed Description
The invention will be further explained with reference to the drawings and the specific embodiments.
Referring to fig. 1, the utility model provides a cleaning device for removing on the equipment of glue among the semiconductor packaging process for the residues such as the jiao dong on the equipment of removing glue of clearance saves artifical manual cleanness, has easy operation convenience, clean efficient advantage. This cleaning device sets up in one side of the equipment that strips and sweeps the mechanism, sets up collecting vessel and baffle at the opposite side, utilizes to sweep the mechanism and blow to the collecting vessel with the residue on the platform of the equipment that strips, and in the effect of sheltering from through the baffle let the residue fall into the collecting vessel, realized the self-cleaning of the equipment that strips. The cleaning device for removing glue on the semiconductor packaging process is described below with reference to the accompanying drawings.
Referring to fig. 1, a side view of the cleaning device and the photoresist stripping apparatus of the present invention used in the photoresist stripping apparatus in the semiconductor packaging process is shown. Referring to fig. 2, a schematic structural diagram of the cleaning device for the photoresist removing device in the semiconductor packaging process of the present invention is shown installed on the photoresist removing device and omitting the upper frame body shown in fig. 1. The structure of the cleaning device used in the stripping equipment in the semiconductor packaging process according to the present invention will be described with reference to fig. 1 and 2.
As shown in fig. 1 and 2, the utility model discloses a cleaning device 20 that is arranged in semiconductor package process on the equipment of removing glue is used for realizing clearing up the residue on the equipment of removing glue 10, this equipment of removing glue 10 includes frame 11 and arranges platform 12 in on frame 11, this platform 12 is used for holding the product frame, still be equipped with the upper portion support body in this equipment of removing glue 10's frame 11, this upper portion support body corresponds this platform 12 and is provided with down the substructure, this structure of pushing down realizes the plastic envelope to the product frame with platform 12 together, after the plastic envelope is accomplished, it upwards moves and exposes the product frame to push down the substructure, need the manual work to clear away the waste glue on the product frame this moment, the waste glue that clears away forms the scrap rubber and has stayed on the platform, the product frame just is taken away after removing glue in order to get into next process flow.
The utility model discloses a cleaning device 20 includes support frame 21, sweeps mechanism 22, collecting vessel 23 and baffle 24, and support frame 21 props up and locates on frame 11, sweeps mechanism 22 and installs on support frame 21, should sweep mechanism 22 and set up towards platform 12, blows in order to blow away the residue on platform 12 through sweeping mechanism 22 to platform 12 for platform 12's the clean no any residue in surface is so that place the product frame. The collecting barrel 23 is detachably mounted on the frame 11, the collecting barrel 23 and the supporting frame 21 are disposed on opposite sides of the platform 12, and the collecting barrel 23 is used for collecting residues blown by the blowing mechanism 22. The baffle 24 is arranged on the collecting barrel 23 far away from one side of the platform 12, the baffle 24 is vertically arranged on the rack 11, the top of the baffle 24 is higher than the top of the platform 12, the size of the baffle 24 is matched with that of the rack 11, one side of the rack 11 is completely shielded by the baffle 24, so that when the blowing mechanism 22 is used for blowing air towards the baffle 24, residues on the platform 12 and the rack 11 can be blown onto the baffle 24, and then the residues just fall into the collecting barrel 23 when falling from the baffle 24, and the collection of the residues is completed.
Further, collecting vessel 23 is detachably mounted on frame 11, and when the residue in collecting vessel 23 is more, can dismantle collecting vessel 23 and empty, later install on frame 11 again can.
In one embodiment of the present invention, the purging mechanism 22 includes a purging shell 221 fixedly connected to the supporting frame 21, a purging opening disposed on a side of the purging shell 221 facing the platform 12, and an air inlet disposed on a side of the purging shell 221 away from the platform 12; an air cavity communicated with the purging port and the air inlet is formed in the purging shell 221, the size of the purging port is matched with that of the platform 12, and the air inlet is connected with an air supply structure.
When in use, the gas supply structure supplies gas to the gas cavity in the blowing shell 221 through the gas inlet, the gas passes through the gas cavity and is blown out from the blowing port, and the blowing port is arranged opposite to the platform 12, so that the gas blown out from the blowing port can blow away residues on the surface of the platform 12, and the surface of the platform 12 can be automatically cleaned.
Preferably, the purge housing 221 is a closed housing structure, and an air cavity is formed inside the housing structure. The side of the housing structure away from the platform 12 is provided with an air inlet which is communicated with an air supply structure through an air pipe 222, one side of the housing structure facing the platform 12 is provided with a long strip-shaped purging opening, and the purging opening is just opposite to the surface of the platform 12, so that high-pressure air provided by the air supply structure is blown to the surface of the platform 12 through the purging opening to complete the cleaning work of the platform 12.
In a preferred embodiment, the air supply structure is an air compressor, which is connected to the air pipe 222, and the air compressor is used to supply compressed air into the housing structure.
In another preferred embodiment, the gas supply structure is a gas supply pipeline at the photoresist stripping equipment, a plurality of equipments in the semiconductor packaging process need to use high-pressure gas, the gas supply pipeline is arranged in the production workshop to provide high-pressure gas for each equipment, and the purging shell 221 is connected with the gas supply pipeline through a gas pipe 222.
Further, the bottom of the purge port is disposed flush with the top surface of the platform 12. Preferably, the top of the purge port is located above the platform 12, so that the purge area of the purge port can cover the surface of the platform 12, and the surface of the platform 12 can be purged completely.
Still further, the gas pipe 222 is provided with a switch valve, the switch valve can control the communication and the closing of the gas pipe 222, and the communication and the closing of the gas pipe 222 can be controlled by the switch of the switch valve, so as to control the switch of the purging mechanism 22.
Furthermore, a control switch is installed on the platform 12 and is in control connection with the purging mechanism 22, the control switch can detect whether a product frame is on the platform 12, and when no product frame is on the platform 12, the control switch controls the purging mechanism 22 to start to operate so as to complete automatic purging of the platform 12. Preferably, the control switch is connected with a switch valve on the gas pipe 222 in a control manner, and when the control switch detects that no product frame exists, the control switch valve opens the gas pipe 222, so that high-pressure gas is blown out from the blowing opening to blow the platform 12. After the switch valve is opened, the switch valve is closed after a set time, so that blowing is stopped after the set time is reached.
In a preferred embodiment, the control switch is a pressure sensor mounted on the platform 12, and when the product frame is placed on the platform 12, the product frame presses on the pressure sensor, so that the pressure sensor can sense the pressure, and when the product frame is taken away, the pressure sensor cannot sense the pressure to form a control signal, and the switch valve can be controlled to be opened.
In another preferred embodiment, the control switch is a photo sensor, and when the product frame is placed on the platform 12, the product frame blocks the photo sensor, so that the photo sensor senses that the product frame is present, and after the product frame is taken away, the photo sensor is not blocked, so that a control signal is formed, and the switch valve can be controlled to be opened.
In a specific embodiment of the present invention, the cleaning device 20 further includes a dust collector 25 installed on the frame 11 and located below the platform 12, a dust suction port of the dust collector 25 is connected to the bottom of the collecting barrel 23, and the dust collector 25 is started to form suction force at the top surface of the frame 11, i.e. at the mouth of the collecting barrel 23, so as to suck the residue into the collecting barrel 23 and further into the dust collector 25. By providing the vacuum cleaner 25, a strong suction force is formed at the mouth of the collection tub 23, and the residue blown by the purge mechanism 22 can be completely sucked away.
Preferably, a connection port is formed at the bottom of the collection tub 23, and an end of a suction pipe of the vacuum cleaner 25 is hermetically connected to the connection port.
Further, the control switch is also in control connection with the vacuum cleaner 25, so that the control switch can control the operation of the vacuum cleaner 25 simultaneously with the operation of the purging mechanism 22.
The utility model discloses an among the concrete implementation mode, the top of frame 11 is equipped with the working plate, and on this working plate was arranged in to platform 12, the assembly mouth had been seted up on this working plate, and collecting vessel 23 wears to put in assembly mouth department, and the oral area 231 of this collecting vessel 23 is located the upper surface of working plate, and collecting vessel 23's border card is at the upper surface of working plate.
In order to facilitate the residues to fall into the collecting barrel 23, a guiding plate 232 is arranged on the edge of the collecting barrel 23 close to the baffle plate 24, the guiding plate 232 is arranged in an inclined manner, and the end part of the guiding plate 232 is attached to the baffle plate 24. The inclined guide plate 232 guides the residue, and the residue is blown onto the baffle plate 24 by the blowing mechanism 22 and then falls down into the collection barrel 23 along the guide plate 232.
Furthermore, the baffle 241 connected to the side of the frame 11 is disposed on both sides of the baffle 24, and the baffle 241 is disposed in an inclined shape.
Preferably, the supporting frame is a pair of vertical rods vertically fixed on the frame 11, and the blowing shell 221 is supported by the pair of vertical rods.
The present invention has been described in detail with reference to the embodiments shown in the drawings, and those skilled in the art can make various modifications to the present invention based on the above description. Therefore, certain details of the embodiments should not be construed as limitations of the invention, which are intended to be covered by the following claims.
Claims (7)
1. A cleaning device for a stripping device in a semiconductor packaging process, the stripping device comprising a frame and a platform arranged on the frame, the cleaning device comprising:
the supporting frame is supported on the rack;
the blowing mechanism is arranged on the supporting frame, faces the platform and blows air to the platform through the blowing mechanism so as to blow away residues on the platform;
the collecting barrel is detachably arranged on the rack, and the collecting barrel and the supporting frame are arranged on two opposite sides of the platform; and
keep off and locate keep away from on the collecting vessel the baffle of one side of platform, the baffle is established immediately in the frame, the top of baffle is higher than the top of platform, the baffle size with the size looks adaptation of frame.
2. The cleaning apparatus as claimed in claim 1, wherein the purging mechanism comprises a purging housing fixedly connected to the supporting frame, a purging opening disposed on a side of the purging housing facing the platen, and an air inlet disposed on a side of the purging housing away from the platen; an air cavity communicated with the purging port and the air inlet is formed in the purging shell; the size of the purge port is matched with that of the platform; the air inlet is connected with an air supply structure.
3. The cleaning apparatus as claimed in claim 2, wherein a bottom of the purge port is flush with a top surface of the platen.
4. The cleaning apparatus as claimed in claim 1, further comprising a vacuum cleaner mounted on the frame and located under the platform, wherein a suction opening of the vacuum cleaner is connected to a bottom of the collecting tub.
5. The cleaning apparatus as claimed in claim 1, further comprising a control switch mounted on the platform, wherein the control switch is in control connection with the purging mechanism.
6. The cleaning apparatus as claimed in claim 1, wherein a guiding plate is disposed on the collecting barrel at a position close to the edge of the baffle, the guiding plate is inclined, and an end of the guiding plate is attached to the baffle.
7. The cleaning apparatus as claimed in claim 1, wherein the baffle plates are disposed on two sides of the baffle plate and connected to the corresponding side portions of the frame, and the baffle plates are disposed in an inclined manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121236424.XU CN215220664U (en) | 2021-06-03 | 2021-06-03 | Cleaning device for be arranged in semiconductor packaging process on equipment of removing glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121236424.XU CN215220664U (en) | 2021-06-03 | 2021-06-03 | Cleaning device for be arranged in semiconductor packaging process on equipment of removing glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215220664U true CN215220664U (en) | 2021-12-17 |
Family
ID=79423274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121236424.XU Active CN215220664U (en) | 2021-06-03 | 2021-06-03 | Cleaning device for be arranged in semiconductor packaging process on equipment of removing glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215220664U (en) |
-
2021
- 2021-06-03 CN CN202121236424.XU patent/CN215220664U/en active Active
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