CN215209604U

CN215209604U - Thermal deformation prevention device for magnetron sputtering

Info

Publication number: CN215209604U
Application number: CN202120743297.6U
Authority: CN
Inventors: 刘文龙; 王斌; 张明华
Original assignee: Suzhou Jingbote Coated Glass Co ltd
Current assignee: Suzhou Jingbote Coated Glass Co ltd
Priority date: 2021-04-13
Filing date: 2021-04-13
Publication date: 2021-12-17
Anticipated expiration: 2031-04-13

Abstract

The application relates to the field of magnetron sputtering film forming technology, especially, relate to a thermal deformation prevention device for magnetron sputtering, it includes the cavity, be equipped with two fender pipes that are located substrate and target both sides in the cavity, the both ends that keep off the pipe all are equipped with the shutoff board, the shutoff board forms the heat conduction chamber jointly with keeping off the pipe. This application can block low energy particle at the fender pipe that sets up in the cavity, and the hydroenergy that sets up in the heat conduction intracavity can absorb the heat on keeping off the pipe, can be with the heat fast dispersion on keeping off the pipe simultaneously, has effectively reduced and has kept off the pipe and take place the possibility that thermal deformation takes place to can promote the filming quality of magnetron sputtering filming.

Description

Thermal deformation prevention device for magnetron sputtering

Technical Field

The application relates to the field of magnetron sputtering film forming technology, in particular to a thermal deformation preventing device for magnetron sputtering.

Background

The working principle of magnetron sputtering is that electrons collide with argon atoms in the process of flying to a substrate under the action of an electric field, so that the argon atoms are ionized to generate argon positive ions and new electrons; new electrons fly to the substrate, argon ions are accelerated to fly to the cathode target under the action of an electric field, and bombard the surface of the target at high energy, so that the target is sputtered. In the sputtered particles, neutral target atoms or molecules are deposited on the substrate to form a thin film.

In magnetron sputtering, particles with lower energy are deflected to both sides on their way to the target, resulting in a waste of particles and energy. Therefore, in the related art, L-shaped baffles are disposed at both sides of the substrate and the target in the magnetron sputtering chamber to block part of the particles from escaping.

In view of the above-mentioned related art, the inventors believe that a large amount of energy is converted into heat energy when the particles strike the target and the shutter, so that the L-shaped shutter is easily thermally deformed, thereby reducing the uniformity of the film formed by sputtering.

SUMMERY OF THE UTILITY MODEL

The application provides a thermal deformation preventing device for magnetron sputtering for the quality of magnetron sputtering film formation.

The application provides a thermal deformation prevention device for magnetron sputtering, adopts following technical scheme:

the utility model provides a thermal deformation prevention device for magnetron sputtering, includes the cavity, be equipped with two fender pipes that are located substrate and target both sides in the cavity, the both ends that keep off the pipe all are equipped with the closure plate, the closure plate forms the heat conduction chamber with keeping off the pipe jointly.

Through adopting above-mentioned technical scheme, one of them lateral wall of keeping off the pipe is used for blockking the particle of sputter, and the flourishing form water of heat conduction intracavity, the specific heat capacity of water is higher, can follow and keep off the pipe and absorb a large amount of heats to play the effect of protection to keeping off the pipe, reduced and kept off the pipe because of being heated the possibility of warping. Meanwhile, water can rapidly guide heat into other side walls of the blocking pipe, so that the heating uniformity of the blocking pipe is improved, the thermal deformation resistance of the blocking pipe is further improved, and the quality of magnetron sputtering film forming is effectively improved.

Optionally, an installation plate for installing the blocking pipe is arranged on one side of the blocking pipe, which is far away from the other blocking pipe, and the installation plate is arranged on the inner wall of the cavity;

the cross section of the blocking pipe is a right triangle, the blocking pipe comprises a first right-angle plate, a second right-angle plate and an inclined plate, the inclined plate is arranged on the side face, close to the other baffle, of the blocking pipe, and the first right-angle plate is installed on the installation plate.

Through adopting above-mentioned technical scheme, the particle is used on the swash plate, and the heat of production is less, and first straight-bar plate is installed and is being lifted the stability that keeps off the pipe at the mounting panel.

Optionally, an expansion cavity is formed in the mounting plate, a connecting pipe penetrates through the first straight angle plate, and the connecting pipe is communicated with the expansion cavity.

Through adopting above-mentioned technical scheme, the dilatation chamber passes through the connecting pipe and communicates in heat conduction cavity to the dilatation intracavity also can splendid attire part water be used for absorbing the heat on keeping off the pipe, and keep off the heat on the pipe and also can conduct on the mounting panel.

Optionally, wear to be equipped with first external pipe on the mounting panel, the one end of first external pipe communicates in the dilatation chamber, and the other end is located the chamber outdoor.

Through adopting above-mentioned technical scheme, first outer takeover communicates in the dilatation chamber to can change water after the temperature of water rises to certain degree, and then can dispel the heat to keeping off the pipe more effectively, further reduce the possibility that keeps off the pipe thermal deformation.

Optionally, a second external connection pipe penetrates through the blocking plate, one end of the second external connection pipe is communicated with the heat conduction cavity, and the other end of the second external connection pipe is located outside the cavity.

Through adopting above-mentioned technical scheme, the second is outer to take over and is communicate in the heat conduction chamber to water can be followed first outer takeover and enters into the heat conduction intracavity, and outside the chamber was flowed out to the outer takeover of heat conduction chamber and second again, has realized the quick circulation of water, has further promoted the endothermic efficiency of water in the flange.

Optionally, the first external connecting pipe and the second external connecting pipe are both provided with valves.

Through adopting above-mentioned technical scheme, when need not changing water, the valve can seal first external pipe and the external pipe of second.

Optionally, one side of the first straight angle plate, which is far away from the mounting plate, is provided with a plurality of mounting blocks, the mounting plate is provided with screws in a penetrating manner, and the screws are in threaded connection with the mounting blocks.

Through adopting above-mentioned technical scheme, keep off the pipe and can realize the fixed with the mounting panel through being connected of screw and installation piece.

Optionally, a plurality of sealing pipes are arranged on the inner wall of the expansion cavity, and the screws penetrate through the sealing pipes.

Through adopting above-mentioned technical scheme, the sealed tube has reduced the possibility that water permeates outside the dilatation chamber along the screw, has reduced the screw simultaneously and has taken place the possibility of corrosion.

In summary, the present application includes at least one of the following beneficial technical effects:

1. according to the magnetron sputtering film forming device, the baffle pipe arranged in the cavity can block low-energy particles, water arranged in the heat conduction cavity can absorb heat on the baffle pipe, and meanwhile, the heat can be rapidly dispersed on the baffle pipe, so that the possibility of thermal deformation of the baffle pipe is effectively reduced, and the film forming quality of magnetron sputtering film forming can be improved;

2. the dilatation chamber that this application was seted up on the mounting panel communicates in heat conduction chamber to can promote the capacity of water, further promote the guard action to keeping off the pipe.

Drawings

Fig. 1 is a schematic structural diagram of an overall thermal deformation preventing device for magnetron sputtering according to an embodiment of the present application.

FIG. 2 is a cross-sectional view of a chamber of an embodiment of the present application.

FIG. 3 is a cross-sectional view of a baffle tube according to an embodiment of the present application.

Fig. 4 is a cross-sectional view of a sealing tube according to an embodiment of the present application.

Fig. 5 is an enlarged schematic view of a portion a in fig. 1.

Description of reference numerals: 1. a chamber; 2. a base; 3. a substrate; 4. a target material; 5. a field chamber; 6. mounting a plate; 7. blocking the pipe; 8. a first gusset; 9. a second rectangular plate; 10. a sloping plate; 11. a plugging plate; 12. a heat conducting cavity; 13. expanding the cavity; 14. a connecting pipe; 15. a first external pipe; 16. a valve; 17. a second outer adapter tube; 18. mounting blocks; 19. a screw hole; 20. a screw hole; 21. a screw; 22. and (5) sealing the tube.

Detailed Description

The present application is described in further detail below with reference to figures 1-5.

The embodiment of the application discloses a thermal deformation prevention device for magnetron sputtering. Referring to fig. 1 and 2, the thermal deformation preventing device for magnetron sputtering comprises a chamber 1, wherein a base 2 positioned on the bottom wall of the chamber 1 is arranged in the chamber 1, and a substrate 3 is placed on the base 2. The inner wall of the chamber 1 is also provided with a target 4 positioned above the base 2, when the chamber works, the surface of the target 4 is bombarded by charged energy particles, and the bombarded particles on the target 4 can be deposited on the surface of the substrate 3, so that the film coating effect is achieved.

Referring to fig. 2 and 3, a field cavity 5 is formed between the base 2 and the target 4, two mounting plates 6 respectively located at two sides of the field cavity 5 are arranged on the inner wall of the chamber 1, a blocking pipe 7 is arranged on the side wall of one mounting plate 6 close to the other mounting plate 6, and the blocking pipe 7 is used for blocking low-energy particles. The cross section of the blocking pipe 7 is a right triangle, the blocking pipe 7 comprises a first right-angle plate 8, a second right-angle plate 9 and an inclined plate 10, and an included angle between the first right-angle plate 8 and the second right-angle plate 9 is a right angle. First right-angle board 8 laminating is on mounting panel 6, and second right-angle board 9 is located and is kept off pipe 7 and be close to one of substrate 3 and serve, and one side of swash plate 10 is connected in first right-angle board 8, and the opposite side is connected in second right-angle board 9, and the swash plate 10 is located and is kept off pipe 7 and be close to another one side of keeping off pipe 7. The first right-angle plate 8 and the second right-angle plate 9 can support the inclined plate 10, so that the stability of the baffle pipe 7 is improved, and the possibility of thermal deformation of the baffle pipe 7 is reduced.

Referring to fig. 2 and 3, both ends of the blocking pipe 7 are provided with blocking plates 11, the two blocking plates 11 and the blocking pipe 7 form a heat conducting cavity 12 together, and water is contained in the heat conducting cavity 12. Water has a high specific heat capacity and can absorb a large amount of heat from the swash plate 10, thereby reducing the possibility of thermal deformation of the swash plate 10. Meanwhile, water is a good heat-conducting medium, and can quickly conduct heat on the inclined plate 10 to the first right-angle plate 8 and the second right-angle plate 9, so that the heating uniformity of the baffle pipe 7 can be improved, and the possibility of thermal deformation of the baffle pipe 7 is further reduced.

Referring to fig. 2 and 3, an expansion cavity 13 is formed in the mounting plate 6, a connecting pipe 14 communicated with the heat conducting cavity 12 penetrates through the baffle pipe 7, and the connecting pipe 14 penetrates through the mounting plate 6 and is communicated with the expansion cavity 13. The expansion cavity 13 can also contain water, so that the protection capability of the water in the heat conduction cavity 12 on the baffle pipe 7 can be improved, and the possibility of thermal deformation of the baffle pipe 7 is further reduced.

Referring to fig. 1 and 4, a first external pipe 15 penetrates through the mounting plate 6, the first external pipe 15 is communicated with the expansion cavity 13, one end of the first external pipe 15 penetrates through the side wall of the chamber 1 and extends into the chamber 1, and in combination with fig. 5, a valve 16 located outside the chamber 1 is further arranged on the first external pipe 15. Whether valve 16 can control dilatation chamber 13 and external intercommunication, when the water in dilatation chamber 13 rose certain temperature, the staff can change the water in dilatation chamber 13 through first external pipe 15. One of the plugging plates 11 is provided with a second external connecting pipe 17 in a penetrating way, the second external connecting pipe 17 is communicated with the heat conducting cavity 12 and the outside of the chamber 1, and the second external connecting pipe 17 is also provided with a valve 16. When keeping off the heat on the pipe 7 when too much, the staff can pour into the dilatation chamber 13 with water from the second external pipe 17 in, water can flow out outside the cavity 1 through heat conduction chamber 12 and first external pipe 15 to realized keeping off the effect of pipe 7 rapid cooling, further reduced and kept off the possibility that pipe 7 takes place the heat altered shape.

Referring to fig. 3 and 4, a plurality of mounting blocks 18 located in the heat conducting cavity 12 are arranged on the side wall of the first straight angle plate 8, screw holes 19 are formed in the side faces, close to the first straight angle plate 8, of the mounting blocks 18, screw holes 20 communicated with the screw holes 19 are formed in the mounting plate 6, screws 21 located in the screw holes 20 penetrate through the mounting plate 6, and the screws 21 are in threaded connection with the mounting blocks 18, so that the baffle pipe 7 can be fixed to the mounting plate 6. The inner wall of the expansion cavity 13 is provided with a sealing tube 22 communicated with the screw hole 20, the screw 21 is arranged in the sealing tube 22 in a penetrating mode, and the sealing tube 22 can reduce the possibility that water seeps out of the expansion cavity 13 through the screw hole 20 along the screw 21.

The implementation principle of the thermal deformation preventing device for magnetron sputtering in the embodiment of the application is as follows: can realize the circulation of water in heat conduction chamber 12 through first external pipe 15 and second external pipe 17, water can absorb the heat on the swash plate 10 in heat conduction chamber 12 to conduct the heat outside chamber 1, thereby effectively reduced and kept off pipe 7 and take place the possibility of thermal deformation because of being heated.

Compared with the prior art, the baffle pipe 7 that this application set up in cavity 1 can block low energy particle, and the hydroenergy that sets up in the heat conduction chamber 12 can absorb the heat on the baffle pipe 7, can be with the heat fast dispersion on baffle pipe 7 simultaneously, has effectively reduced the possibility that the thermal deformation takes place for baffle pipe 7 to can promote the filming quality of magnetron sputtering film formation.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A thermal deformation prevention device for magnetron sputtering is characterized in that: the device comprises a chamber (1), two blocking pipes (7) which are positioned on two sides of a substrate (3) and a target (4) are arranged in the chamber (1), blocking plates (11) are arranged at two ends of each blocking pipe (7), and the blocking plates (11) and the blocking pipes (7) jointly form a heat conducting cavity (12).

2. The thermal deformation preventing device for magnetron sputtering according to claim 1, wherein: one side of the baffle pipe (7) departing from the other baffle pipe (7) is provided with a mounting plate (6) for mounting the baffle pipe (7), and the mounting plate (6) is arranged on the inner wall of the chamber (1);

the cross section of the blocking pipe (7) is a right-angled triangle, the blocking pipe (7) comprises a first right-angle plate (8), a second right-angle plate (9) and an inclined plate (10), the side face, close to the other baffle, of the blocking pipe (7) is the inclined plate (10), and the first right-angle plate (8) is installed on the installation plate (6).

3. The thermal deformation preventing device for magnetron sputtering according to claim 2, wherein: the expansion cavity (13) is formed in the mounting plate (6), a connecting pipe (14) is arranged on the first right-angle plate (8) in a penetrating mode, and the connecting pipe (14) is communicated with the expansion cavity (13).

4. The thermal deformation preventing device for magnetron sputtering according to claim 3, wherein: wear to be equipped with first external pipe (15) on mounting panel (6), the one end of first external pipe (15) communicates in dilatation chamber (13), and the other end is located outside chamber (1).

5. The thermal deformation preventing device for magnetron sputtering according to claim 4, wherein: a second external connecting pipe (17) penetrates through the blocking plate (11), one end of the second external connecting pipe (17) is communicated with the heat conducting cavity (12), and the other end of the second external connecting pipe is positioned outside the cavity (1).

6. The thermal deformation preventing device for magnetron sputtering according to claim 5, wherein: and valves (16) are arranged on the first external connecting pipe (15) and the second external connecting pipe (17).

7. The thermal deformation preventing device for magnetron sputtering according to claim 3, wherein: one side of the first straight angle plate (8) departing from the mounting plate (6) is provided with a plurality of mounting blocks (18), the mounting plate (6) is provided with a screw (21) in a penetrating manner, and the screw (21) is in threaded connection with the mounting blocks (18).

8. The thermal deformation preventing device for magnetron sputtering according to claim 7, wherein: a plurality of sealing pipes (22) are arranged on the inner wall of the expansion cavity (13), and the screws (21) penetrate through the sealing pipes (22).