CN215187602U - High-power IGBT module fixed knot constructs - Google Patents
High-power IGBT module fixed knot constructs Download PDFInfo
- Publication number
- CN215187602U CN215187602U CN202121550319.3U CN202121550319U CN215187602U CN 215187602 U CN215187602 U CN 215187602U CN 202121550319 U CN202121550319 U CN 202121550319U CN 215187602 U CN215187602 U CN 215187602U
- Authority
- CN
- China
- Prior art keywords
- sliding
- clamping plate
- fixedly connected
- grip block
- igbt module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-power IGBT module fixed knot constructs, comprising a main body, main part one side both ends are sliding connection respectively have first grip block and second grip block, circular through-hole has all been seted up with first grip block one side to the second grip block, the first spring strip of fixedly connected with between second grip block and the first grip block, the second grip block has the slip post at circular through-hole department sliding connection, slip post bottom end fixedly connected with gasket, first grip block has the slip cardboard in the equal sliding connection in both sides department of circular through-hole, slip cardboard one side top fixedly connected with platform shape block rubber, the sliding tray has been seted up in the below department of slip cardboard to first grip block, first grip block has the slip strip in sliding tray department sliding connection. The utility model discloses a set up first grip block and second grip block, utilize the block between slip cardboard and the tooth's socket to work efficiency when the fixing device of device has been improved.
Description
Technical Field
The utility model relates to a high-power IGBT module fixed knot constructs technical field, especially relates to a high-power IGBT module fixed knot constructs.
Background
The IGBT module is an insulated gate bipolar transistor, is a composite full-control voltage-driven power semiconductor device consisting of a BJT and an MOS, and has the advantages of both high input impedance of an MOSFET and low conduction voltage drop of a GTR.
Through retrieval, when the existing IGBT module is fixed with a circuit board, the existing IGBT module is generally fixed inside a screw hole which is formed in the circuit board in advance by bolts, but the fixing time is long, and the fixing efficiency is not high.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, and the high-power IGBT module fixed knot who provides constructs.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a high-power IGBT module fixing structure comprises a main body, wherein two ends of one side of the main body are respectively connected with a first clamping plate and a second clamping plate in a sliding manner, circular through holes are arranged on one sides of the second clamping plate and the first clamping plate, a first spring strip is fixedly connected between the second clamping plate and the first clamping plate, the second clamping plate is connected with a sliding column in a sliding way at the round through hole, the bottom end of the sliding column is fixedly connected with a gasket, the first clamping plate is connected with sliding clamping plates at the two sides of the circular through hole in a sliding way, the top end of one side of each sliding clamping plate is fixedly connected with a table-shaped rubber block, the first clamping plate is provided with a sliding groove at the lower part of the sliding clamping plate, the first clamping plate is connected with a sliding strip at the sliding groove in a sliding way, and a second spring strip is fixedly connected between one end of the sliding strip and the first clamping plate at the sliding groove, and tooth grooves are formed in two sides of the sliding column.
Further, a plurality of heat conduction sleeves are fixedly connected to one side of the top end of the main body, connecting terminals are fixedly connected to the inner portions of the heat conduction sleeves, and one ends of the connecting terminals are fixedly connected with the inner portions of the main body.
Further, the inside fixedly connected with heat-conducting plate of main part, the rectangle radiating groove has been seted up in the below department of heat-conducting plate to the main part bottom.
Further, the heat conducting plate and the heat conducting sleeve are made of ceramic materials.
Furthermore, the main body is fixedly connected with a plurality of partition plates at the rectangular heat dissipation grooves.
Further, the equal fixedly connected with sheet rubber in gasket top both sides, and sheet rubber top fixedly connected with a plurality of rubber is protruding.
The utility model has the advantages that:
1. through setting up first grip block, the second grip block, the slip post, the sliding tray, the tooth's socket, platform shape block rubber and slip cardboard, when needs device is in the use, at first according to the thickness of external circuit board, adjust the distance between first grip block and the second grip block, take out the slip post, utilize the elasticity of first spring strip to aim at the circuit board and centre gripping, pull open the slip cardboard simultaneously, the slip post loosens the slip cardboard after getting into through the fixed orifices of circuit board, under the elastic action of second spring strip, second spring strip drives the mutual block of tooth's socket of slip cardboard slip post both sides, the work efficiency when the block of device has been improved.
2. Through setting up the rectangle radiating groove, heat-conducting plate and heat conduction cover, when the device carries out the during operation, because the material of heat-conducting plate and heat conduction cover is the ceramic structure that heat conductivility is good, heat-conducting plate and heat conduction cover are in time derived the temperature of the inside of main part and binding post department to utilize a plurality of baffle of rectangle radiating groove department to increase the area of contact of device main part with the outside air, thereby improved the heat exchange efficiency of device.
3. Through setting up the sheet rubber and the rubber is protruding, when mutual centre gripping between slip post and the circuit board, the sheet rubber and the rubber of gasket top both sides are protruding, have reduced the device because when vibrations, to the pressure of circuit board to reduce the damage that the circuit board received, improved the protection of device to the circuit board.
Drawings
Fig. 1 is a front view of a fixing structure of a high-power IGBT module according to embodiment 1;
fig. 2 is a side view of a first clamping plate of the fixing structure of the high-power IGBT module according to embodiment 1;
FIG. 3 is an enlarged view of portion A of FIG. 1;
fig. 4 is a front view of a rubber sheet of the fixing structure of the high-power IGBT module proposed in embodiment 2.
In the figure: the heat dissipation device comprises a main body 1, a first clamping plate 2, a heat conduction sleeve 3, a connecting terminal 4, a second clamping plate 5, a heat conduction plate 6, a partition plate 7, a rectangular heat dissipation groove 8, a first spring strip 9, a gasket 10, a sliding column 11, a tooth socket 12, a sliding clamping plate 13, a table-shaped rubber block 14, a sliding strip 15, a second spring strip 16, a sliding groove 17, a rubber sheet 18 and a rubber bulge 19.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1
Referring to fig. 1-3, a high-power IGBT module fixing structure includes a main body 1, a first clamping plate 2 and a second clamping plate 5 are slidably connected to two ends of one side of the main body 1, circular through holes are respectively formed in two sides of the first clamping plate 2 and the second clamping plate 5, a first spring strip 9 is bonded between the first clamping plate 2 and the second clamping plate 5, a sliding column 11 is slidably connected to the second clamping plate 5 at the circular through hole, a gasket 10 is bonded to the bottom end of the sliding column 11, a sliding clamping plate 13 is slidably connected to the first clamping plate 2 at two sides of the circular through hole, a table-shaped rubber block 14 is bonded to the top end of one side of the sliding clamping plate 13, a sliding groove 17 is formed in the first clamping plate 2 below the sliding clamping plate 13, a sliding strip 15 is slidably connected to the first clamping plate 2 at the sliding groove 17, and a second spring strip 16 is bonded to the first clamping plate 2 at the sliding groove 17 between one end of the sliding strip 15 and the first clamping plate 2, tooth's socket 12 has all been seted up to 11 both sides of slip post, when needing the device when using, at first according to the thickness of external circuit board, adjust the distance between first grip block 2 and the second grip block 5, take out slip post 11, utilize the elasticity of first spring strip 9 to aim at the circuit board and the centre gripping, pull open slip cardboard 13 simultaneously, slip post 11 loosens slip cardboard 13 after getting into through the fixed orifices of circuit board, under the elastic action of second spring strip 16, second spring strip 16 drives the mutual block of tooth's socket 12 of slip cardboard 13 slip post 11 both sides, the work efficiency when the block of device has been improved.
Wherein, 1 top one side of main part bonds and has a plurality of heat conduction cover 3, 3 inside bonds of heat conduction cover have binding post 4, and binding post 4 one end bonds with 1 inside of main part, 1 inside bonding of main part has heat-conducting plate 6, 1 bottom of main part has seted up rectangle radiating groove 8 in the below department of heat-conducting plate 6, heat-conducting plate 6 is ceramic material with heat conduction cover 3, main part 1 bonds in 8 departments of rectangle radiating groove has a plurality of baffle 7, when the device carries out the during operation, because heat-conducting plate 6 and heat conduction cover 3's material are the ceramic construction that the heat conductivility is good, heat-conducting plate 6 and heat conduction cover 3 in time derive the temperature of 1 inside of main part and binding post 4 department, and utilize a plurality of baffle 7 of rectangle radiating groove 8 department to increase the area of contact of main part 1 with the outside air, thereby the heat exchange efficiency of device has been improved.
The working principle is as follows: when the device is used, firstly, according to the thickness of an external circuit board, the distance between the first clamping plate 2 and the second clamping plate 5 is adjusted, the sliding column 11 is drawn out, the circuit board is aligned and clamped by utilizing the elasticity of the first spring strip 9, the sliding clamping plate 13 is pulled open simultaneously, the sliding column 11 loosens the sliding clamping plate 13 after entering through the fixing hole of the circuit board, under the action of the elasticity of the second spring strip 16, the second spring strip 16 drives the tooth grooves 12 on the two sides of the sliding column 11 of the sliding clamping plate 13 to be mutually clamped, and the clamping work efficiency of the device is improved.
When the device is operated, the heat conducting plate 6 and the heat conducting sleeve 3 are made of ceramic structures with good heat conducting performance, the heat conducting plate 6 and the heat conducting sleeve 3 timely guide out the temperature inside the main body 1 and at the position of the wiring terminal 4, and the contact area between the main body 1 and the outside air is increased by the aid of the plurality of partition plates 7 at the rectangular heat radiating grooves 8, so that the heat exchange efficiency of the device is improved.
Example 2
Referring to fig. 4, a high-power IGBT module fixed knot constructs, this embodiment compares in embodiment 1, in order to reduce the device after fixed, because the damage that vibrations caused the circuit board, gasket 10 top both sides all bond there is sheet rubber 18, and sheet rubber 18 top bonds there is protruding 19 of a plurality of rubber, when centre gripping each other between slip post and the circuit board, sheet rubber 18 and the protruding 19 of rubber of gasket 10 top both sides have reduced the device because when vibrations, to the pressure of circuit board, thereby the damage that the circuit board received has been reduced, the protection of device to the circuit board has been improved.
The working principle is as follows: when the device is used, firstly, according to the thickness of an external circuit board, the distance between the first clamping plate 2 and the second clamping plate 5 is adjusted, the sliding column 11 is drawn out, the circuit board is aligned and clamped by utilizing the elasticity of the first spring strip 9, the sliding clamping plate 13 is pulled open simultaneously, the sliding column 11 loosens the sliding clamping plate 13 after entering through the fixing hole of the circuit board, under the action of the elasticity of the second spring strip 16, the second spring strip 16 drives the tooth grooves 12 on the two sides of the sliding column 11 of the sliding clamping plate 13 to be mutually clamped, and the clamping work efficiency of the device is improved.
When the device is operated, the heat conducting plate 6 and the heat conducting sleeve 3 are made of ceramic structures with good heat conducting performance, the heat conducting plate 6 and the heat conducting sleeve 3 timely guide out the temperature inside the main body 1 and at the position of the wiring terminal 4, and the contact area between the main body 1 and the outside air is increased by the aid of the plurality of partition plates 7 at the rectangular heat radiating grooves 8, so that the heat exchange efficiency of the device is improved.
When the sliding column and the circuit board are clamped mutually, the rubber sheets 18 and the rubber bulges 19 on the two sides of the top end of the gasket 10 reduce the pressure on the circuit board when the device vibrates, so that the damage to the circuit board is reduced, and the protection of the device on the circuit board is improved.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A high-power IGBT module fixing structure comprises a main body (1) and is characterized in that two ends of one side of the main body (1) are respectively connected with a first clamping plate (2) and a second clamping plate (5) in a sliding mode, circular through holes are formed in one sides of the second clamping plate (5) and the first clamping plate (2), a first spring strip (9) is fixedly connected between the second clamping plate (5) and the first clamping plate (2), a sliding column (11) is connected to the position, where the circular through holes are formed, of the second clamping plate (5), a gasket (10) is fixedly connected to the bottom end of the sliding column (11), sliding clamping plates (13) are respectively connected to two sides of the circular through holes of the first clamping plate (2) in a sliding mode, a table-shaped rubber block (14) is fixedly connected to the top end of one side of each sliding clamping plate (13), and a sliding groove (17) is formed in the position, below the sliding clamping plates (13), of the first clamping plate (2), first grip block (2) have sliding strip (15) at sliding tray (17) department sliding connection, and fixedly connected with second spring strip (16) in sliding tray (17) department between sliding strip (15) one end and first grip block (2), tooth's socket (12) have all been seted up to slip post (11) both sides.
2. The fixing structure of the high-power IGBT module according to claim 1, characterized in that a plurality of heat conducting sleeves (3) are fixedly connected to one side of the top end of the main body (1), the terminals (4) are fixedly connected to the inside of the heat conducting sleeves (3), and one end of each terminal (4) is fixedly connected to the inside of the main body (1).
3. The fixing structure of the high-power IGBT module according to claim 2, characterized in that a heat conducting plate (6) is fixedly connected inside the main body (1), and a rectangular heat dissipation groove (8) is formed at the bottom end of the main body (1) below the heat conducting plate (6).
4. A high power IGBT module fixing structure according to claim 3, characterized in that the heat conducting plate (6) and the heat conducting sleeve (3) are made of ceramic material.
5. A high power IGBT module fixing structure according to claim 4, characterized in that the main body (1) is fixedly connected with a plurality of partition plates (7) at the rectangular heat sink (8).
6. The fixing structure of the high-power IGBT module according to claim 5, characterized in that rubber sheets (18) are fixedly connected to both sides of the top end of the gasket (10), and a plurality of rubber protrusions (19) are fixedly connected to the top ends of the rubber sheets (18).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121550319.3U CN215187602U (en) | 2021-07-08 | 2021-07-08 | High-power IGBT module fixed knot constructs |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121550319.3U CN215187602U (en) | 2021-07-08 | 2021-07-08 | High-power IGBT module fixed knot constructs |
Publications (1)
Publication Number | Publication Date |
---|---|
CN215187602U true CN215187602U (en) | 2021-12-14 |
Family
ID=79396615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202121550319.3U Active CN215187602U (en) | 2021-07-08 | 2021-07-08 | High-power IGBT module fixed knot constructs |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN215187602U (en) |
-
2021
- 2021-07-08 CN CN202121550319.3U patent/CN215187602U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1986234A3 (en) | Power semiconductor module for inverter circuit system | |
CN106033934B (en) | Integrated power conversion circuit assembles module | |
CN215187602U (en) | High-power IGBT module fixed knot constructs | |
CN211208417U (en) | A kind of tool | |
CN212229295U (en) | Suction device for collimator fixing block | |
JP4152575B2 (en) | Semiconductor device | |
US20100155924A1 (en) | Semiconductor module | |
CN210722187U (en) | Backlight source for automobile central control display screen | |
CN210073917U (en) | Light-emitting diode support structure | |
CN215496734U (en) | Over-current prevention MOS device | |
CN214627482U (en) | MOS tube with quick plug-in structure | |
CN213028175U (en) | Multifunctional mobile phone glass backboard with clamping groove structure | |
JP2014192976A (en) | Semiconductor device | |
CN215496688U (en) | Packaging structure of semiconductor MOS device | |
CN214008069U (en) | Silicon rubber motor sealing ring for robot with efficient heat dissipation | |
CN111651024A (en) | Heat radiation structure for computer | |
CN217776092U (en) | Mos pipe parallel installation device | |
CN221125200U (en) | Radiator supporting structure, power calculating plate assembly and equipment using same | |
CN212298170U (en) | Base for elevator | |
CN218351540U (en) | Heat radiator for be used for secondary thin film battery | |
CN215644460U (en) | Triode with high heat dissipation structure | |
CN216213388U (en) | Simple to operate's 5G's WIFI chip | |
CN215265940U (en) | Be used in new energy automobile's condenser | |
CN216163051U (en) | LED driver connecting device | |
CN216269691U (en) | Balance car control device and balance car |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |