CN215177577U - Chip detection device for unmanned aerial vehicle - Google Patents

Abstract

A chip detection device for an unmanned aerial vehicle comprises a base, a three-axis moving assembly, a visual detection assembly, a chip transfer assembly and a brittle disc, wherein the three-axis moving assembly is arranged on the base, the visual detection assembly, the chip transfer assembly and the brittle disc are arranged on the three-axis moving assembly, the three-axis moving assembly is used for driving the visual detection assembly and the chip transfer assembly to move in a first direction, a second direction and a third direction which are perpendicular to each other relative to the brittle disc, the brittle disc is used for placing chips, the visual detection assembly is used for shooting the brittle disc to obtain images of the chips on the brittle disc, the images of the chips are used for identifying abnormal chips, the chip transfer assembly is used for removing the abnormal chips from the brittle disc, so that the visual detection assembly can detect the chips placed on the brittle disc and detect the abnormal chips from the normal chips without manual naked eyes, the chip detection efficiency can be improved, and the condition of missed inspection is avoided.

Description

Chip detection device for unmanned aerial vehicle

Technical Field

The application relates to the technical field of chip detection, in particular to a chip detection device for an unmanned aerial vehicle.

Background

Before the chip is burned in the burning room, whether the chip has the situations of reverse prevention, pin deformation and the like needs to be checked. At present, the chip is mainly detected manually by naked eyes, the efficiency is low, the possibility of missing detection exists, the bad chip is not detected, and the subsequent burned chip is bad.

SUMMERY OF THE UTILITY MODEL

The utility model provides a chip detection device for unmanned aerial vehicle solves the problem that chip detection efficiency is low and leak to look over.

In order to achieve the purpose of the application, the application provides the following technical scheme:

the application provides a chip detection device for unmanned aerial vehicle, remove subassembly, visual detection subassembly, chip transfer subassembly and brittle disc including base, triaxial, the triaxial removes the subassembly setting and is in on the base, the visual detection subassembly the chip transfer subassembly with brittle disc sets up on the triaxial removes the subassembly, the triaxial removes the subassembly and is used for driving the visual detection subassembly with the chip transfers the subassembly relatively brittle disc removes in mutually perpendicular's first direction, second direction and third direction, brittle disc is used for placing the chip, the visual detection subassembly is used for shooting brittle disc, in order to obtain on the brittle disc the image of chip, the image of chip is used for discerning out unusually the chip, the chip transfer subassembly is used for with unusually the chip follow remove on the brittle disc.

In one embodiment, the three-axis moving assembly comprises a first axis assembly, a second axis assembly and a third axis assembly, the first axis assembly is connected with the base through a support, the second axis assembly is connected with the first axis assembly, the third axis assembly is arranged on the base, the visual detection assembly and the chip transfer assembly are connected with the second axis assembly, and the brittle disc is connected with the third axis assembly; the first shaft assembly is used for driving the second shaft assembly to move in the first direction, the second shaft assembly is used for driving the visual detection assembly and the chip transfer assembly to move in the second direction, and the third shaft assembly is used for driving the brittle disc to move in the third direction.

In one embodiment, the visual detection assembly comprises a light source and a shooting piece, the light source and the shooting piece are both connected with the second shaft assembly, the light source and the shooting piece are arranged along the second direction, the shooting piece is arranged on one side, opposite to the base, of the light source, a hollow space is formed in the middle of the light source and is annular, and the shooting piece is used for shooting the brittle disc through the hollow space.

In one embodiment, the chip detection apparatus further includes a first moving assembly and a second moving assembly, the first moving assembly and the second moving assembly are arranged along the second direction, the light source is connected to the second shaft assembly through the first moving assembly, the camera is connected to the second shaft assembly through the second moving assembly, and the first moving assembly and the second moving assembly are relatively movable in the second direction.

In one embodiment, the chip transfer assembly comprises a suction cup, the suction cup is connected with the second shaft assembly or the visual inspection assembly, and the suction cup is used for sucking the chip.

In one embodiment, the chip detection device further includes a dotting and dispensing assembly, the dotting and dispensing assembly is disposed on the second shaft assembly and spaced from the visual detection assembly, and the dotting and dispensing assembly is used for dotting or dispensing the chip on the brittle disc.

In one embodiment, the dispensing assembly includes a first dispensing member and a second dispensing member, and the first dispensing member and the second dispensing member are disposed on two sides of the visual inspection assembly along the first direction.

In one embodiment, the chip detection apparatus further includes a third moving assembly and a fourth moving assembly, both the third moving assembly and the fourth moving assembly are connected to the second shaft assembly, the first dispensing member is connected to the second shaft assembly through the third moving assembly, the second dispensing member is connected to the second shaft assembly through the fourth moving assembly, and the third moving assembly and the fourth moving assembly are relatively movable in the second direction.

In one embodiment, the chip detection apparatus further includes a recovery tray disposed on the third shaft assembly and located at one side of the brittle tray, and the abnormal chip removed by the chip transfer assembly is placed on the recovery tray.

In one embodiment, the recycling tray includes a plurality of recycling areas, and the chip transfer assembly is configured to place the chips of the same abnormal type in the same recycling area.

In one embodiment, the chip detection apparatus further includes a controller, and the controller is configured to receive an image of the chip captured by the visual detection component, and compare the image with a pre-stored image of the chip that is normal to identify the abnormal chip.

In one embodiment, the chip detection device further comprises an outer cover, the outer cover is arranged on the base and covers the three-axis moving assembly, the visual detection assembly, the chip transfer assembly and the brittle disc, the outer cover is provided with an opening for placing and taking out the brittle disc, and a safety grating is arranged at the opening of the outer cover.

This application removes the subassembly through setting up the triaxial, and visual detection subassembly and brittle disc produce relative movement through the triaxial removal subassembly for the chip of placing on the brittle disc can be detected to the visual detection subassembly, and detect out and remove the unusual chip of unusual subassembly through the chip transfer from the normal chip with unusual chip, thereby realized the detection and the screening of chip. The detection is carried out without manual naked eyes, the chip detection efficiency can be improved, and the condition of missing detection is avoided.

Drawings

FIG. 1 is a schematic diagram of a chip detection apparatus according to an embodiment;

FIG. 2 is a schematic structural diagram of a chip detection apparatus according to an embodiment;

FIG. 3 is a schematic diagram of an internal structure of a chip detection apparatus according to an embodiment;

fig. 4 is a schematic partial structure diagram of a chip detection apparatus according to an embodiment.

Description of reference numerals:

10-base, 11-rubber cushion, 121-power button, 122-start button, 123-pause button, 124-computer button, 125-first glue dripping button, 126-second glue dripping button, 13-cooling fan outlet, 14-foldable handle, 15-touch display screen, 16-pressure gauge and 17-pressure regulating valve.

20-housing, 201-opening, 21-safety grating, 211-emission grating, 212-receiving grating, 22-first maintenance door, 221-hinge, 222-first door handle, 223-display screen, 23-second maintenance door, 231-second door handle, 232-transparent window and 24-control button.

31-first axis component, 311-drive, 312-guide, 313-transmission, 32-second axis component, 33-third axis component, 36-first movement component, 37-second movement component, 38-third movement component, 39-fourth movement component;

40-visual detection component, 41-light source, 42-shooting piece;

50-chip transfer assembly, 51-suction cup;

61-a first dispensing and dispensing member, 62-a second dispensing and dispensing member;

70-brittle disc, 71-chip, 75-recovery disc, 76-stitch deformation recovery area, and 77-chip reverse recovery area;

80-a first limiting piece, 81-a first support plate, 82-a second support plate, 83-a first limiting piece, 84-a second limiting piece, 85-a second limiting piece;

91-support, 92-dispensing controller, 93-miniature industrial personal computer, 94-small keyboard, 95-indicator light.

Detailed Description

The technical solutions in the embodiments of the present application will be described below clearly with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1 to 3, an embodiment of the present application provides a chip inspection apparatus for an unmanned aerial vehicle, including a base 10, a three-axis moving assembly, a visual inspection assembly 40, a chip transfer assembly 50, and a brittle disc 70.

A three-axis moving assembly is provided on the base 10, and a vision inspection assembly 40, a chip transfer assembly 50, and a brittle disc 70 are provided on the three-axis moving assembly. The three-axis moving assembly is used for driving the visual inspection assembly 40 and the chip transfer assembly 50 to move relative to the brittle disc 70 in a first direction X-X, a second direction Z-Z and a third direction Y-Y which are perpendicular to each other.

The brittle disc 70 is used for placing the chip 71, the visual inspection assembly 40 is used for shooting the brittle disc 70 to obtain an image of the chip 71 on the brittle disc 70, the image of the chip 71 is used for identifying the abnormal chip 71, and the chip transfer assembly 50 is used for removing the abnormal chip 71 from the brittle disc 70.

Specifically, referring to fig. 2, the bottom of the base 10 is provided with a plurality of foot pads 11, the foot pads 11 may be made of rubber, and are used for the base 10 and parts thereon, and the rubber pads have the functions of buffering impact force and preventing slipping. The top of the base 10 is provided with a housing 20, and the housing 20 is used for housing the components of the three-axis moving assembly, the visual inspection assembly 40, the chip transfer assembly 50, the brittle disc 70 and the like. Various operation buttons are provided on the outer periphery of the base 10. Specifically, the operation buttons may include a power button 121, a start button 122, a pause button 123, an emergency stop button, a computer button 124, a first glue-dropping button 125, a second glue-dropping button 126, and the like, and the operation buttons may be pressed or operated to implement various corresponding functions. The periphery of the base 10 may further be provided with a cooling fan outlet 13, a foldable handle 14, a touch display screen 15, a pressure gauge 16, a pressure regulating valve 17, and the like. The devices may be disposed on the same surface or different surfaces as required, and are not particularly limited.

The brittle disc 70 is used for placing the chip 71, a plurality of chips 71 can be placed on the brittle disc 70, and a plurality of chips 71 can be arranged on the brittle disc 70 in an array. The three-axis moving assembly drives the visual detection assembly 40 and the brittle disc 70 to move relatively, so that the visual detection assembly 40 can photograph the chips 71 one by one to obtain an image of each chip 71. By identifying each chip 71, when the chip 71 is a normal good product, it remains on the brittle disc 70, and when the chip 71 is an abnormal bad product, the chip transfer assembly 50 removes the abnormal chip 71 from the brittle disc 70. Thereby detecting the abnormal chip 71 from the normal chip 71, so as to facilitate the subsequent operations of burning and the like on the chip 71.

Therefore, in the present application, by providing the three-axis moving assembly, the visual inspection assembly 40 and the brittle disc 70 are relatively moved by the three-axis moving assembly, so that the visual inspection assembly 40 can inspect the chips 71 placed on the brittle disc 70, detect abnormal chips 71 from the normal chips 71 and remove the abnormal chips 71 through the chip transfer assembly 50, thereby realizing the inspection and screening of the chips 71. The detection is carried out without manual naked eyes, the detection efficiency of the chip 71 can be improved, and the condition of missing detection is avoided.

In one embodiment, referring to fig. 1 and 3, the three-axis moving assembly includes a first axis assembly 31, a second axis assembly 32, and a third axis assembly 33.

The first shaft assembly 31 is connected with the base 10 through a support, the second shaft assembly 32 is connected with the first shaft assembly 31, the third shaft assembly 33 is arranged on the base 10, the visual inspection assembly 40 and the chip transfer assembly 50 are connected with the second shaft assembly 32, and the brittle disc 70 is connected with the third shaft assembly 33.

The first shaft assembly 31 is used for driving the second shaft assembly 32 to move in the first direction X-X, the second shaft assembly 32 is used for driving the vision inspection assembly 40 and the chip transfer assembly 50 to move in the second direction Z-Z, and the third shaft assembly 33 is used for driving the brittle disc 70 to move in the third direction Y-Y.

In particular, the first shaft assembly 31 may include a driving member 311, a guide rail 312, and a transmission member 313. The driving member 311 may be a motor, etc., the guide rail 312 extends along the first direction X-X, the driving member 311 is installed on the guide rail 312, two ends of the guide rail 312 are respectively connected to an end portion of a supporting member away from the base 10, the transmission member 313 may be a drag chain, etc., and the driving member 311 is connected to the transmission member 313 and is used for driving the transmission member 313 to move on the guide rail 312. In order to reinforce the strength of the support, a reinforcing rib may be provided to connect the base 10 and the support. The second shaft assembly 32 is connected to the transmission member 313 and slidably connected to the guide rail 312. The driving member 311 drives the transmission member 313 to move on the guide rail 312, and the transmission member 313 drives the second shaft assembly 32 to slide on the guide rail 312, so as to realize the function of the first shaft assembly 31 driving the second shaft assembly 32 to move in the first direction X-X.

The second shaft assembly 32 and the third shaft assembly 33 may be similar in structure to the first shaft assembly 31, and may be arranged with reference to the structure of the first shaft assembly 31. Of course, the first shaft assembly 31, the second shaft assembly 32 and the third shaft assembly 33 may have any other feasible driving and connecting manners, and are not limited herein.

The first shaft assembly 31 drives the second shaft assembly 32 to move in the first direction X-X, the second shaft assembly 32 drives the visual detection assembly 40 and the chip transfer assembly 50 to move in the second direction Z-Z, and the third shaft assembly 33 drives the brittle disc 70 to move in the third direction Y-Y, so that the visual detection assembly 40 and the brittle disc 70 can relatively move in the first direction X-X, the second direction Z-Z and the third direction Y-Y, and the visual detection assembly 40 can detect the chip 71 at any position on the brittle disc 70. The mode of setting up first axle subassembly 31, second axle subassembly 32 and third axle subassembly 33 still has simple structure, and easy control fixes a position effects such as accurate.

In one embodiment, referring to fig. 1 and 3, the visual inspection assembly 40 includes a light source 41 and a camera 42. The light source 41 and the shooting piece 42 are both connected with the second shaft assembly 32, the light source 41 and the shooting piece 42 are arranged along the second direction Z-Z, the shooting piece 42 is arranged on one side of the light source 41, which faces away from the base 10, the middle of the light source 41 is provided with a hollow space and is annular, and the shooting piece 42 is used for shooting the fragile disc 70 through the hollow space.

Specifically, the light source 41 may be an LED (light-emitting diode), and the light-emitting portion of the light source 41 may be an inner wall of the annular structure thereof, or the inner wall of the annular structure thereof and a surface facing the brittle disc 70, so that the light source 41 can illuminate the brittle disc 70. The camera 42 may be an industrial camera, a webcam, or the like. The light source 41 is annular and has a hollow space, and the photographing part 42 can photograph the fragile plate 70 through the hollow space to obtain an image of the chip 71 on the fragile plate 70. Since the light source 41 illuminates the fragile plate 70, the camera 42 can capture a clear image of the chip 71, and can better identify the image of the chip 71 to pick out defective products.

Optionally, referring to fig. 3, the chip detection apparatus further includes a first moving assembly 36 and a second moving assembly 37. The first moving assembly 36 and the second moving assembly 37 are arranged along the second direction Z-Z, the light source 41 is connected with the second shaft assembly 32 through the first moving assembly 36, the photographic member 42 is connected with the second shaft assembly 32 through the second moving assembly 37, and the first moving assembly 36 and the second moving assembly 37 are relatively movable in the second direction Z-Z.

Specifically, the structure of the first moving assembly 36 and the second moving assembly 37 may refer to the first shaft assembly 31, or refer to any feasible scheme, and the embodiment is not particularly limited. On the one hand, the first moving assembly 36 and the second moving assembly 37 can move in the second direction Z-Z along with the second shaft assembly 32, and on the other hand, the first moving assembly 36 can drive the light source 41 to move in the second direction Z-Z, and the second moving assembly 37 can drive the shooting element 42 to move in the second direction Z-Z, that is, the light source 41 and the shooting element 42 can be moved relatively in the second direction Z-Z by the driving of the first moving assembly 36 and the second moving assembly 37. With this arrangement, the positions of the light source 41 and the camera 42 can be flexibly adjusted according to the height of the brittle disc 70, the height of the chip 71, and the like.

For example, when taking an image of a chip 71 that is thinner (i.e., smaller in dimension in the second direction Z-Z), the second shaft assembly 32 can drive the light source 41 and the camera 42 to take an image at a position closer to the base 10 in the second direction Z-Z; when a thicker chip 71 (i.e., a larger size in the second direction Z-Z) is photographed, the second shaft assembly 32 can drive the light source 41 and the photographing element 42 to photograph at a position slightly distant from the base 10 in the second direction Z-Z. When a panoramic view or a partial detail view of the chip 71 needs to be photographed, it can be realized by relative movement of the photographing member 42 and the light source 41. For example, when a panoramic view of the chip 71 needs to be photographed, the first moving assembly 36 can drive the light source 41 to be close to the chip 71 to illuminate the chip 71, and the second moving assembly 37 can drive the photographing element 42 to be farther away from the chip 71 to photograph. When a partial detail view of the chip 71 needs to be photographed, the first moving assembly 36 can drive the light source 41 to be close to the chip 71 to illuminate the chip 71, and meanwhile, the second moving assembly 37 drives the photographing element 42 to be photographed at a position close to the chip 71. In summary, by providing the first moving assembly 36 and the second moving assembly 37, the relative position between the photographic part 42 and the light source 41 can be flexibly adjusted to meet the photographic requirement.

In one embodiment, referring to fig. 1 and 3, the chip transfer assembly 50 includes a suction cup 51, the suction cup 51 is connected to the second shaft assembly 32 or the vision inspection assembly 40, and the suction cup 51 is used for sucking the chip 71.

When the visual inspection module 40 detects an abnormal chip 71 among the plurality of chips 71 on the brittle disc 70, the suction cup 51 moves the module three-axially to suck the abnormal chip 71, and the abnormal chip 71 is taken out from the brittle disc 70, thereby ensuring that the chips 71 on the brittle disc 70 after being detected are all normal good products. Specifically, the suction cup 51 may be connected to a vacuum-pumping member (not shown), which is used to suck vacuum to the suction cup 51 so as to firmly hold the chip 71. Since the positions of the chips 71 on the brittle disc 70 are different, the suction cup 51 is connected with the light source 41 or the second shaft assembly 32, so that the suction cup 51 is closer to the brittle disc 70, and the suction cup 51 is driven to move by the movement of the second shaft assembly 32 or the light source 41. Of course, the suction cup 51 may also be connected to the first moving assembly 36.

In an embodiment, referring to fig. 1 and 3, the chip detection apparatus further includes a dispensing component. The dotting and dispensing assembly is arranged on the second shaft assembly 32 and is arranged at a distance from the visual detection assembly 40. The dotting and dispensing assembly is used for dotting or dispensing the chips 71 on the brittle disc 70.

Dotting is to mark the chip 71 to facilitate subsequent process identification and confirmation. The dispensing is to dispense the chips 71 for mounting with other components. When the detection of the visual detection device is completed and the abnormal chip 71 is removed from the brittle disc 70 through the chip transfer assembly 50, the normal chip 71 on the brittle disc 70 can be subjected to dotting and dispensing through the dotting and dispensing assembly, so that the functions of detection, dotting and dispensing of the chip 71 are realized on one device, and the function integration of the device is realized.

Alternatively, the dotting may be performed before the visual inspection assembly 40 inspects the chip 71.

Referring to fig. 1 and 3, the dispensing assembly includes a first dispensing member 61 and a second dispensing member 62, and the first dispensing member 61 and the second dispensing member 62 are disposed on two sides of the visual inspection assembly 40 along a first direction X-X.

Specifically, the first dispensing member 61 is substantially in the form of a needle or pen, and includes a cylindrical main body and a needle connected to the cylindrical main body and facing the base 10, and the liquid for dispensing or the glue for dispensing can be transported into the cylindrical main body through a pipeline and dispensed onto the surface of the chip 71 through the needle. The second dispensing member 62 has substantially the same structure as the first dispensing member 61, as a reference.

Since the brittle disc 70 is generally large in size, the number of chips 71 placed thereon is large, and the chips 71 are distributed at various positions of the brittle disc 70, and the stroke range of the three-axis moving assembly is limited, the first dispensing member 61 and the second dispensing member 62 are respectively responsible for the dispensing and the dispensing of the chips 71 in the half area of the brittle disc 70. Therefore, the stroke range of the three-axis moving assembly does not need to be large, the size can be reduced, the overall size of the chip detection device is reduced, and the miniaturization is facilitated.

In one embodiment, referring to fig. 1 and fig. 3, the chip detection apparatus further includes a third moving assembly 38 and a fourth moving assembly 39. The third moving assembly 38 and the fourth moving assembly 39 are both connected with the second shaft assembly 32, the first dispensing member 61 is connected with the second shaft assembly 32 through the third moving assembly 38, the second dispensing member 62 is connected with the second shaft assembly 32 through the fourth moving assembly 39, and the third moving assembly 38 and the fourth moving assembly 39 are relatively movable in the second direction Z-Z.

The third moving assembly 38 and the fourth moving assembly 39 may refer to the first shaft assembly 31, and may refer to any feasible scheme, and the embodiment is not limited in detail. On the one hand, the third moving assembly 38 and the fourth moving assembly 39 can move in the second direction Z-Z along with the second shaft assembly 32, and on the other hand, the third moving assembly 38 can drive the first dispensing member 61 to move in the second direction Z-Z, and the fourth moving assembly 39 can drive the second dispensing member 62 to move in the second direction Z-Z, that is, the first dispensing member 61 and the second dispensing member 62 can move relatively in the second direction Z-Z by the driving of the third moving assembly 38 and the fourth moving assembly 39. So set up, can make first point of beating glue piece 61 and second point of beating glue piece 62 can beat separately and a point is glued, also can beat simultaneously and a point is glued, conveniently carries out nimble adjustment.

Referring to fig. 1 and 3, the second shaft assembly 32 is connected to a connecting member in the form of a massive plate, and the first moving assembly 36 to the fourth moving assembly 39 are connected to the connecting member. The connecting piece is arranged, so that the visual detection assembly 40, the dotting and dispensing assembly and the like can be conveniently installed. The second shaft assembly 32 drives the visual inspection assembly 40, the dotting and dispensing assembly and the like to move by driving the connecting piece to move.

In one embodiment, referring to fig. 3 and 4, the chip detecting apparatus further includes a recycling tray 75, the recycling tray 75 is disposed on the third shaft assembly 33 and is located at one side of the brittle plate 70, and the abnormal chip 71 removed by the chip transferring assembly 50 is placed on the recycling tray 75.

In particular, the recovery pan 75 is generally similar in structure to the brittle disc 70, and the recovery pan 75 may be smaller in size than the brittle disc 70, since the number of abnormal chips 71 is typically smaller than the number of normal chips 71. The recovery tray 75 is disposed on the third shaft assembly 33 and is also movable in the third direction Y-Y by the third shaft assembly 33. The brittle disk 70 and the recovery disk 75 may move synchronously or asynchronously. The brittle tray 70 and the recovery tray 75 may be arranged in layers, the brittle tray 70 is arranged on the upper layer, and the recovery tray 75 is arranged on the lower layer, that is, the recovery tray 75 is arranged between the base 10 and the brittle tray 70, so that interference between the visual inspection assembly 40, the chip transfer assembly 50 or the dotting and dispensing assembly and the recovery tray 75 can be avoided.

The brittle plate 70 may be connected to the third shaft assembly 33 through a first retaining member 80, and the recovery plate 75 may be connected to the third shaft assembly 33 through a second retaining member 85. The first limiting member 80 and the second limiting member 85 have substantially the same structure, and the first limiting member 80 is taken as an example for description. The first limiting member 80 includes a first supporting plate 81, a second supporting plate 82, a first limiting block 83 and a second limiting block 84. The first support plate 81 and the second support plate 82 are disposed on the third shaft assembly 33 in a spaced relationship along the third direction Y-Y, and the first support plate 81 is relatively movable between the second support plates 82 in the third direction Y-Y. Two opposite ends of the first supporting plate 81 and the second supporting plate 82 along the first direction X-X are respectively provided with a first limiting block 83, one end of the first supporting plate 81 far away from the second supporting plate 82 is provided with a second limiting block 84, and one end of the second supporting plate 82 far away from the first supporting plate 81 is provided with a second limiting block 84. So that the first support plate 81, the second support plate 82, the plurality of first stoppers 83 and the second stoppers 84 support and fix the brittle disc 70 together and form a space for limiting the movement of the brittle disc 70. Since the first support plate 81 and the second support plate 82 are relatively movable in the third direction Y-Y, they can be flexibly adjusted to fit brittle discs 70 of various sizes.

Optionally, the recycle tray 75 includes a plurality of recycle areas, and the chip transfer assembly 50 is used to place the same abnormal type of chip 71 in the same recycle area.

When the visual inspection assembly 40 inspects the chip 71 on the brittle disc 70, the abnormality of the chip 71 on the brittle disc 70 generally includes the types of the chip 71 being placed upside down, the pin deformation of the chip 71, and the like. Chip 71 flip-chip may generally be sufficient to flip chip 71, and chip 71 itself may be normal; the deformed pins cause the chip 71 to be defective, which is a defective product and may require rework or scrap processing. For different abnormal type chips 71, the processing modes are usually different, so a plurality of recovery areas are provided to recover different types of chips 71 respectively, so as to facilitate the subsequent processing. As shown in fig. 3, a chip set-back recovery area 77 and a stitch deformation recovery area 76 are provided on the recovery tray 75 with a space therebetween.

In one embodiment, referring to fig. 1 to 3, the chip inspection apparatus further includes a controller (not shown) for receiving the image of the chip 71 captured by the vision inspection assembly 40 and comparing the image with a pre-stored image of a normal chip 71 to identify an abnormal chip 71.

The controller may be a computer, which may be located inside the base 10, or may be located elsewhere. After the visual inspection assembly 40 obtains the image of the chip 71 on the brittle disc 70, the comparison with the pre-stored normal image can identify whether the chip 71 is abnormal. Specifically, how to compare the two images can adopt various feasible algorithms, which is not limited herein. The method is simple and easy to implement.

Optionally, after images of all the chips 71 on the brittle disc 70 are captured, the chips are identified one by one. The chips 71 on the brittle disc 70 all have corresponding positions, and when an abnormality is identified, the abnormal chip 71 can be quickly positioned and removed. Optionally, the chip 71 on the brittle disc 70 may be identified after being photographed, if the chip 71 is normal, the next chip 71 may be photographed and identified, and if the chip 71 is abnormal, the chip 71 may be removed.

Referring to fig. 2, the chip detecting apparatus of the present application further includes a plurality of accessories, a support 91 is disposed on the top of the outer cover 20 opposite to the base 10, a dispensing controller 92 is disposed on the support 91, the number of the dispensing controllers 92 is the same as the number of the dispensing pieces, and one dispensing controller 92 controls one dispensing piece. The support 91 or the top of the outer cover 20 are also provided with a miniature industrial personal computer 93, and the miniature industrial personal computer 93 can be the controller and can also control other structures. The mini-industrial computer 93 may be connected to a keypad 94. The top of the outer cover 20 is further provided with an indicator light 95, and the indicator light 95 may have various colors, such as red, green, etc., for indicating the working state of the chip detection device, wherein red may indicate abnormal working, and green may indicate normal working.

The outer cover 20 is provided with an opening 201, the brittle disc 70 can be manually put in and taken out through the opening 201, and a safety grating 21 is arranged at the opening 201 for ensuring safety. The safety grating 21 may include an emission grating 211 and a receiving grating 212 respectively disposed at opposite sides of the opening 201, the emission grating 211 emitting light, and the receiving grating 212 receiving light. When the hand holds the brittle disc 70 and extends into the outer cover 20, light is shielded, the chip detection device is not started, when the hand takes out of the outer cover 20 and leaves the position of the opening 201, the receiving grating 212 can receive the light, and the chip detection device can be set to be started automatically.

A plurality of maintenance doors may also be provided on the enclosure 20, as shown in fig. 2 by a first maintenance door 22 and a second maintenance door 23. The first maintenance door 22 comprises a hinge 221, a display screen 223 and a first door handle 222, the first maintenance door 22 can be opened through the first door handle 222 to check and maintain the components inside the outer cover 20, the first maintenance door 22 rotates by taking the hinge 221 as a shaft, and the display screen 223 can display various parameters. The second maintenance door 23 comprises a second door handle 231 and a transparent window 232, the second maintenance door 23 is opened through the second door handle 231 to check and maintain the parts inside the outer cover 20, and when the second maintenance door 23 is closed, the operation conditions of the parts inside the outer cover 20 can be observed through the transparent window 232.

The housing 20 may further include a control button 24, and the control button 24 may control the movement of the triaxial moving element in various directions.

The chip detection apparatus provided by the present application is introduced in detail above, and a specific example is applied in the description to explain the principles and embodiments of the present application, and the description of the above embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (12)

1. The utility model provides a chip detection device for unmanned aerial vehicle, its characterized in that, includes base, triaxial removal subassembly, visual detection subassembly, chip transfer subassembly and brittle disc, triaxial removal subassembly sets up on the base, visual detection subassembly chip transfer subassembly with brittle disc sets up on the triaxial removal subassembly, triaxial removal subassembly is used for driving visual detection subassembly with the chip transfer subassembly is relative brittle disc moves in mutually perpendicular's first direction, second direction and third direction, brittle disc is used for placing the chip, visual detection subassembly is used for shooing brittle disc, in order to obtain on the brittle disc the image of chip, the image of chip is used for discerning unusual the chip, chip transfer subassembly is used for with unusual the chip follow brittle disc removes.

2. The chip detection apparatus according to claim 1, wherein the three-axis moving assembly comprises a first axis assembly, a second axis assembly and a third axis assembly, the first axis assembly is connected with the base through a support, the second axis assembly is connected with the first axis assembly, the third axis assembly is arranged on the base, the visual detection assembly and the chip transfer assembly are connected with the second axis assembly, and the brittle disc is connected with the third axis assembly; the first shaft assembly is used for driving the second shaft assembly to move in the first direction, the second shaft assembly is used for driving the visual detection assembly and the chip transfer assembly to move in the second direction, and the third shaft assembly is used for driving the brittle disc to move in the third direction.

3. The chip detection device according to claim 2, wherein the visual detection assembly comprises a light source and a shooting piece, the light source and the shooting piece are both connected with the second shaft assembly, the light source and the shooting piece are arranged along the second direction, the shooting piece is arranged on one side of the light source, which faces away from the base, the middle of the light source is provided with a hollow space and is annular, and the shooting piece is used for shooting the brittle disc through the hollow space.

4. The chip detecting apparatus according to claim 3, further comprising a first moving assembly and a second moving assembly, the first moving assembly and the second moving assembly being arranged along the second direction, the light source being connected to the second shaft assembly through the first moving assembly, the camera being connected to the second shaft assembly through the second moving assembly, the first moving assembly and the second moving assembly being relatively movable in the second direction.

5. The apparatus for inspecting chips as claimed in claim 2, wherein the chip transferring assembly includes a suction cup, the suction cup is connected to the second shaft assembly or the vision inspection assembly, and the suction cup is used for sucking the chip.

6. The apparatus of claim 2, further comprising a dispensing assembly disposed on the second shaft assembly and spaced apart from the vision inspection assembly, the dispensing assembly being configured to dispense or dispense the chips on the brittle disc.

7. The chip detection apparatus according to claim 6, wherein the dispensing assembly includes a first dispensing member and a second dispensing member, and the first dispensing member and the second dispensing member are disposed on both sides of the visual detection assembly along the first direction.

8. The apparatus for inspecting chips of claim 7, further comprising a third moving assembly and a fourth moving assembly, both of which are connected to the second shaft assembly, wherein the first dispensing member is connected to the second shaft assembly through the third moving assembly, and wherein the second dispensing member is connected to the second shaft assembly through the fourth moving assembly, and wherein the third moving assembly and the fourth moving assembly are relatively movable in the second direction.

9. The chip detecting apparatus according to claim 2, further comprising a recovery tray provided on the third shaft assembly and located at one side of the brittle tray, the abnormal chip removed by the chip transferring assembly being placed on the recovery tray.

10. The chip detection apparatus according to claim 9, wherein the recovery tray includes a plurality of recovery areas, and the chip transfer unit is configured to place the chips of the same abnormal type in the same recovery area.

11. The chip detection apparatus according to claim 1, further comprising a controller for receiving an image of the chip taken by the vision inspection assembly and comparing the image with a pre-stored image of the chip in normal condition to identify the chip in abnormal condition.

12. The chip detection device according to claim 1, further comprising a cover, wherein the cover is disposed on the base and covers the three-axis moving assembly, the visual detection assembly, the chip transfer assembly and the brittle disc, the cover is opened for placing in and taking out the brittle disc, and the cover is provided with a safety grating at the opening.

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