CN215149393U - Semiconductor chip cutting device - Google Patents
Semiconductor chip cutting device Download PDFInfo
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- CN215149393U CN215149393U CN202121387162.7U CN202121387162U CN215149393U CN 215149393 U CN215149393 U CN 215149393U CN 202121387162 U CN202121387162 U CN 202121387162U CN 215149393 U CN215149393 U CN 215149393U
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Abstract
The utility model discloses a semiconductor chip cutting device, the on-line screen storage device comprises a base, fixedly connected with U template on the base, two pairs of supporting legs of fixedly connected with on the base are every right install rotatory roller, two between the supporting leg the common cover of outer wall of rotatory roller is equipped with the conveyer belt, be equipped with a plurality of spacing grooves on the conveyer belt, fixedly connected with L type backup pad on the base, fixedly connected with electric telescopic handle on the U template, electric telescopic handle's output fixedly connected with fixed plate, the bottom fixedly connected with cutting machine of fixed plate, be equipped with dust removal mechanism between fixed plate and the U template, be equipped with positioning mechanism on the fixed plate. The utility model can convey the semiconductor through the conveyor belt, is convenient for subsequent processing and has wide application range; the dust removal mechanism can remove the generated dust, thereby ensuring the health of workers; the semiconductor cutting device can limit the cut semiconductor through the positioning mechanism, and the cutting effect is guaranteed.
Description
Technical Field
The utility model relates to a semiconductor processing technology field especially relates to a semiconductor chip cutting device.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor, and the existing semiconductor needs to be cut in the production and processing process to meet the use requirement.
The conventional method for cutting the semiconductor generally comprises the steps of manually cutting the semiconductor, and the cutting efficiency is low through manual cutting; the part is cut by a cutting device, and when the semiconductor is cut, the semiconductor needs to be limited so as to ensure good cutting effect; dust is generated during cutting, and the health of workers is harmed; therefore, a semiconductor chip dicing apparatus has been devised to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects in the prior art, and provides a semiconductor chip cutting device which can convey semiconductors through a conveyor belt, is convenient for subsequent processing and has wide application range; the dust removal mechanism can remove the generated dust, thereby ensuring the health of workers; the semiconductor cutting device can limit the cut semiconductor through the positioning mechanism, and the cutting effect is guaranteed.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a semiconductor chip cutting device, includes the base, fixedly connected with U template on the base, two pairs of supporting legs of fixedly connected with on the base, it is every right install rotatory roller, two between the supporting leg the outer wall of rotatory roller is overlapped jointly and is equipped with the conveyer belt, be equipped with a plurality of spacing grooves on the conveyer belt, fixedly connected with L type backup pad on the base, fixedly connected with electric telescopic handle on the U template, electric telescopic handle's output fixedly connected with fixed plate, the bottom fixedly connected with cutting machine of fixed plate, be equipped with dust removal mechanism between fixed plate and the U template, be equipped with positioning mechanism on the fixed plate.
Through adopting above-mentioned technical scheme, can carry the semiconductor through the conveyer belt, the follow-up processing of being convenient for, application scope is wide.
Preferably, the dust removal mechanism includes the intake pipe with the bottom fixed connection of fixed plate, intake pipe fixedly connected with rather than the conveyer pipe that is linked together, the conveyer pipe runs through the fixed plate and rather than fixed connection, fixedly connected with dust collection box on the U template, the conveyer pipe runs through the dust collection box and rather than fixed connection, install the filter screen in the dust collection box, run through being equipped with rather than fixed connection's connecting pipe on the dust collection box, fixedly connected with piston cylinder on the U template, the connecting pipe runs through piston cylinder and rather than fixed connection, sliding connection has the piston in the piston cylinder, the bottom fixedly connected with connecting rod of piston, connecting rod and fixed plate fixed connection.
By adopting the technical scheme, the dust generated can be removed through the dust removal mechanism, and the health of workers is guaranteed.
Preferably, positioning mechanism is including running through the fixed plate and rather than sliding connection's slide bar, the top fixedly connected with fixed block of slide bar, the bottom fixedly connected with limiting plate of slide bar, the outer wall cover of slide bar is equipped with the spring, the both ends of spring respectively with fixed plate and limiting plate fixed connection.
Through adopting above-mentioned technical scheme, can carry out spacingly to the semiconductor of cutting through positioning mechanism, ensure the effect of cutting.
Preferably, the bottom of the air inlet pipe is provided with a plurality of collecting spray heads communicated with the air inlet pipe.
Through adopting above-mentioned technical scheme, collect the dust through collecting the shower nozzle.
Preferably, a first one-way valve is installed in the connecting pipe.
Preferably, a plurality of exhaust ports penetrate through the piston, and second one-way valves are installed in the exhaust ports.
Compared with the prior art, the utility model, its beneficial effect does:
1. starting electric telescopic handle and cutting machine, electric telescopic handle's output drives fixed plate and cutting machine and moves down, cuts the semiconductor through the cutting machine, moves down the in-process at the fixed plate and can drive slide bar, spring, limiting plate and move down, makes the spring compression until limiting plate and semiconductor contact, and the slide bar takes place to slide with the fixed plate, can carry on spacingly to the semiconductor this moment, guarantees that follow-up cutting process semiconductor keeps static, guarantees the effect of cutting.
2. The connecting rod and the piston can be driven to move downwards by the downward movement of the fixing plate, so that the space on the upper side of the piston is enlarged to generate negative pressure, and the outside air enters the piston cylinder through the collecting nozzle, the air inlet pipe, the conveying pipe, the dust collecting box and the connecting pipe, so that dust generated in the cutting process is absorbed into the dust collecting box.
In summary, the utility model can convey the semiconductor through the conveyor belt, which is convenient for subsequent processing and has wide application range; the dust removal mechanism can remove the generated dust, thereby ensuring the health of workers; the semiconductor cutting device can limit the cut semiconductor through the positioning mechanism, and the cutting effect is guaranteed.
Drawings
Fig. 1 is a cross-sectional view of a semiconductor chip cutting apparatus according to the present invention;
fig. 2 is a side view of a semiconductor chip cutting apparatus according to the present invention;
fig. 3 is a schematic view of a part of the structure of a semiconductor chip cutting device according to the present invention.
In the figure: the device comprises a base 1, a U-shaped plate 2, 3 supporting legs, 4 rotating rollers, a conveying belt 5, a limiting groove 6, a 7L-shaped supporting plate, an 8 electric telescopic rod, a 9 fixing plate, a 10 cutting machine, an 11 air inlet pipe, a 12 conveying pipe, a 13 dust collection box, a 14 filter screen, a 15 connecting pipe, a 16 piston cylinder, a 17 piston, an 18 exhaust port, a 19 connecting rod, a 20 sliding rod, a 21 spring and a 22 limiting plate.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-3, a semiconductor chip cutting device, including base 1, fixedly connected with U template 2 on the base 1, two pairs of supporting legs 3 of fixedly connected with on the base 1, every installs rotatory roller 4 between 3 to the supporting leg, the outer wall of two rotatory rollers 4 overlaps jointly and is equipped with conveyer belt 5, be equipped with a plurality of spacing grooves 6 on the conveyer belt 5, spacing groove 6 cooperatees with the semiconductor, fixedly connected with mounting panel on the supporting leg 3 of left front side, install the motor on the mounting panel, the output shaft of motor runs through supporting leg 3 and rotates rather than and be connected, the output shaft and the rotatory roller 4 fixed connection of motor, through the starter motor, it rotates to make the output shaft drive conveyer belt 5, carry processing to the semiconductor, fixedly connected with L type backup pad 7 on the base 1, support the semiconductor that carries out the cutting through setting up L type backup pad 7.
An electric telescopic rod 8 is fixedly connected to the U-shaped plate 2, a fixing plate 9 is fixedly connected to the output end of the electric telescopic rod 8, a cutting machine 10 is fixedly connected to the bottom of the fixing plate 9, a dust removing mechanism is arranged between the fixing plate 9 and the U-shaped plate 2 and comprises an air inlet pipe 11 fixedly connected to the bottom of the fixing plate 9, a plurality of collecting nozzles communicated with the air inlet pipe 11 are mounted at the bottom of the air inlet pipe 11, the air inlet pipe 11 is fixedly connected with a conveying pipe 12 communicated with the air inlet pipe 11, the conveying pipe 12 is a telescopic pipe, the conveying pipe 12 penetrates through the fixing plate 9 and is fixedly connected with the fixing plate, a dust collecting box 13 is fixedly connected to the U-shaped plate 2, the conveying pipe 12 penetrates through the dust collecting box 13 and is fixedly connected with the dust collecting box 13, a filter screen 14 is mounted in the dust collecting box 13 to prevent dust from entering a piston cylinder 16, a connecting pipe 15 fixedly connected to the dust collecting box 13 is arranged in a penetrating manner, and a first check valve is mounted in the connecting pipe 15, fixedly connected with piston cylinder 16 on the U template 2, connecting pipe 15 runs through piston cylinder 16 and rather than fixed connection, sliding connection has piston 17 in the piston cylinder 16, run through on the piston 17 and be equipped with a plurality of gas vents 18, all install the second check valve in a plurality of gas vents 18, piston 17's bottom fixedly connected with connecting rod 19, connecting rod 19 and fixed plate 9 fixed connection, the dust that produces can be detached through dust removal mechanism, guarantee staff's health.
Be equipped with positioning mechanism on fixed plate 9, positioning mechanism including running through fixed plate 9 and rather than sliding connection's slide bar 20, slide bar 20's top fixedly connected with fixed block, slide bar 20's bottom fixedly connected with limiting plate 22, slide bar 20's outer wall cover is equipped with spring 21, spring 21's both ends respectively with fixed plate 9 and limiting plate 22 fixed connection, can carry on spacingly to the semiconductor of cutting through positioning mechanism, the effect of guarantee cutting.
The utility model discloses in, the staff at first places the semiconductor in spacing groove 6, the starter motor, the output shaft of motor drives rotatory roller 4, conveyer belt 5 rotates, thereby carry the semiconductor, when the semiconductor moves under cutting machine 10, the motor is closed this moment, start electric telescopic handle 8 and cutting machine 10, the output of electric telescopic handle 8 drives fixed plate 9 and cutting machine 10 and moves down, cut the semiconductor through cutting machine 10, can drive slide bar 20, spring 21, limiting plate 22 moves down in the fixed plate 9 process that moves down, until limiting plate 22 contacts with the semiconductor and makes the spring 21 compress, slide bar 20 and fixed plate 9 take place to slide, can carry out spacing to the semiconductor this moment, guarantee that the semiconductor keeps static in the follow-up cutting process, guarantee the effect of cutting; meanwhile, the fixed plate 9 moves downwards to drive the connecting rod 19 and the piston 17 to move downwards, the space on the upper side of the piston 17 is enlarged to generate negative pressure, the outside air passes through the collecting nozzle, the air inlet pipe 11, the conveying pipe 12, the dust collecting box 13, the connecting pipe 15 and the piston cylinder 16, so that dust generated in the cutting process is absorbed into the dust collecting box 13, after the cutting is completed, the output end of the electric telescopic rod 8 drives the fixed plate 9 and the cutting machine 10 to move upwards, the spring 21 resets at the moment, the limiting plate 22 is separated from the semiconductor body, the fixed plate 9 drives the connecting rod 19 and the piston 17 to move upwards, the gas in the space on the upper side of the piston 17 is discharged through the exhaust port 18, and the starting motor drives the next semiconductor to move to the lower side of the cutting machine 10 to cut the semiconductor.
Claims (6)
1. A semiconductor chip cutting device comprises a base (1) and is characterized in that a U-shaped plate (2) is fixedly connected to the base (1), two pairs of supporting legs (3) are fixedly connected on the base (1), a rotating roller (4) is arranged between each pair of supporting legs (3), a conveying belt (5) is sleeved on the outer wall of each rotating roller (4) together, a plurality of limiting grooves (6) are arranged on the conveyor belt (5), an L-shaped supporting plate (7) is fixedly connected to the base (1), an electric telescopic rod (8) is fixedly connected to the U-shaped plate (2), a fixing plate (9) is fixedly connected to the output end of the electric telescopic rod (8), the bottom fixedly connected with cutting machine (10) of fixed plate (9), be equipped with dust removal mechanism between fixed plate (9) and U template (2), be equipped with positioning mechanism on fixed plate (9).
2. The semiconductor chip cutting device according to claim 1, wherein the dust removing mechanism comprises an air inlet pipe (11) fixedly connected with the bottom of the fixing plate (9), the air inlet pipe (11) is fixedly connected with a conveying pipe (12) communicated with the air inlet pipe, the conveying pipe (12) penetrates through the fixing plate (9) and is fixedly connected with the fixing plate, a dust collecting box (13) is fixedly connected with the U-shaped plate (2), the conveying pipe (12) penetrates through the dust collecting box (13) and is fixedly connected with the dust collecting box, a filter screen (14) is installed in the dust collecting box (13), a connecting pipe (15) fixedly connected with the dust collecting box (13) penetrates through the dust collecting box (13), a piston cylinder (16) is fixedly connected with the U-shaped plate (2), the connecting pipe (15) penetrates through the piston cylinder (16) and is fixedly connected with the piston cylinder (17), and a piston (17) is slidably connected with the piston cylinder (16), the bottom of piston (17) fixedly connected with connecting rod (19), connecting rod (19) and fixed plate (9) fixed connection.
3. The semiconductor chip cutting device according to claim 1, wherein the positioning mechanism comprises a sliding rod (20) penetrating through and slidably connected with the fixing plate (9), a fixing block is fixedly connected to the top of the sliding rod (20), a limiting plate (22) is fixedly connected to the bottom of the sliding rod (20), a spring (21) is sleeved on the outer wall of the sliding rod (20), and two ends of the spring (21) are respectively fixedly connected with the fixing plate (9) and the limiting plate (22).
4. The semiconductor chip cutting device according to claim 2, wherein a plurality of collecting nozzles communicated with the air inlet pipe (11) are installed at the bottom of the air inlet pipe.
5. The semiconductor chip dicing apparatus according to claim 2, wherein a first check valve is installed in the connection pipe (15).
6. The semiconductor chip cutting device according to claim 2, wherein a plurality of exhaust ports (18) are formed through the piston (17), and a second check valve is installed in each of the plurality of exhaust ports (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121387162.7U CN215149393U (en) | 2021-06-22 | 2021-06-22 | Semiconductor chip cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121387162.7U CN215149393U (en) | 2021-06-22 | 2021-06-22 | Semiconductor chip cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215149393U true CN215149393U (en) | 2021-12-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121387162.7U Active CN215149393U (en) | 2021-06-22 | 2021-06-22 | Semiconductor chip cutting device |
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| CN (1) | CN215149393U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116277519A (en) * | 2023-05-18 | 2023-06-23 | 山东烨达耐火材料有限公司 | Dust removal equipment for refractory brick processing |
-
2021
- 2021-06-22 CN CN202121387162.7U patent/CN215149393U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116277519A (en) * | 2023-05-18 | 2023-06-23 | 山东烨达耐火材料有限公司 | Dust removal equipment for refractory brick processing |
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