CN215141533U - Adhesive dispensing and bonding device and packaging equipment - Google Patents
Adhesive dispensing and bonding device and packaging equipment Download PDFInfo
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- CN215141533U CN215141533U CN202120944657.9U CN202120944657U CN215141533U CN 215141533 U CN215141533 U CN 215141533U CN 202120944657 U CN202120944657 U CN 202120944657U CN 215141533 U CN215141533 U CN 215141533U
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Abstract
The utility model discloses a glue is glued and is bonded device and encapsulation equipment, glue is glued and is bonded device and includes the frame and locate the frame bear the seat, detection mechanism and injecting glue mechanism weigh, the frame has machining station and detection station, it is located machining station to bear the seat, detection mechanism weighs is located detection station, injecting glue mechanism includes movably the injecting glue head of locating the frame, with the first operating condition who is located machining station has, and be located the second operating condition who detects the station, under first operating condition, the injecting glue head is used for carrying out the injecting glue to the work piece that bonds of treating that bears on the seat, under second operating condition, the injecting glue head carries out the injecting glue for weighing detection mechanism, so that the injecting glue volume that detection mechanism detected injecting glue mechanism weighs. The utility model provides an among the technical scheme, through setting up the detection mechanism that weighs, intermittent type nature is measured the injecting glue volume of injecting glue head, guarantees the injecting glue volume of injecting glue mechanism at the default within range for adhesive deposite bonding device can the accurate control injecting glue volume.
Description
Technical Field
The utility model relates to an electronic component production facility field especially relates to adhesive deposite bonding device and encapsulation equipment.
Background
In the process of packaging the pressure sensor, the sensing element needs to be assembled, that is, the sensing element is placed in a shell of the sensor, and the sensing element can be fixed in the shell of the sensor by means of glue injection and bonding.
Because the sensitive element is usually very small in size and very precise, the glue injection amount needs to be strictly controlled in the bonding process so as to ensure the bonding firmness.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a point is glued bonding device and encapsulation equipment, aims at providing one kind and can the glue dispensing bonding device of accurate control glue injection volume.
In order to achieve the above object, the utility model provides a glue dispensing and bonding device, wherein glue dispensing and bonding device includes:
the device comprises a machine base, a detection device and a control device, wherein the machine base is provided with a processing station and a detection station;
the bearing seat is arranged on the machine base and positioned at the processing station, and is used for bearing a workpiece to be bonded;
the weighing detection mechanism is arranged on the base and is positioned at the detection station; and the number of the first and second groups,
injecting glue mechanism, including the injecting glue head, the injecting glue head movably locates the frame is in order to have and to be located the first operating condition of processing station and be located the second operating condition of detection station under the first operating condition, the injecting glue head is used for right bear on the seat treat that the work piece that bonds carries out the injecting glue under the second operating condition, the injecting glue head is used for right the detection mechanism that weighs carries out the injecting glue, so that the detection mechanism that weighs detects the injecting glue volume of injecting glue mechanism.
Optionally, the weighing detection mechanism includes a monitoring control unit and a weighing tray, the monitoring control unit is disposed on the base, the glue injection head is configured to inject glue into the weighing tray in the second working state, and the weighing tray is configured to obtain a glue injection amount of the glue injection mechanism in the second working state;
the monitoring control unit is electrically connected with the weighing tray and the glue injection mechanism, and when the glue injection amount acquired by the weighing tray is within a preset range value, the monitoring control unit controls the glue injection mechanism to be switched to the first working state; and when the glue injection amount acquired by the weighing tray is out of a preset range value, the monitoring control unit controls the glue injection mechanism to adjust the glue injection amount and glue the weighing tray again.
Optionally, the glue injection mechanism further comprises a glue barrel, the glue barrel is provided with an accommodating cavity for accommodating glue solution, and the glue injection head is located at the lower end of the glue barrel and communicated with the accommodating cavity;
the glue injection mechanism further comprises a limiting plate arranged on the base, the limiting plate is located below the glue cylinder, and a limiting groove for the glue injection head to penetrate through is formed in the limiting plate.
Optionally, a plurality of fixing units are arranged on the bearing seat, and each fixing unit is used for bearing the workpieces to be bonded in corresponding models.
Optionally, an accommodating groove with an upward opening is formed in the upper side of each fixing unit, and each accommodating groove is used for accommodating the workpieces to be bonded in corresponding models.
Optionally, the adhesive dispensing and bonding device further comprises an image acquisition device, the image acquisition device is arranged on the base and is located above the bearing seat, and the image acquisition device is used for acquiring images of the workpieces to be bonded on the bearing seat so as to detect the glue injection quality of the adhesive dispensing and bonding device.
Optionally, the glue injection mechanism further comprises a driving assembly, the driving assembly is arranged on the base and is in driving connection with the glue injection head so as to drive the glue injection head to switch between the first working state and the second working state.
Optionally, the driving assembly includes a first electric sliding table, a second electric sliding table, and a third electric sliding table;
the first electric sliding table is arranged on the base and is in driving connection with the second electric sliding table so as to drive the second electric sliding table to move along the left and right directions;
the second electric sliding table is in driving connection with the third electric sliding table and is used for driving the third electric sliding table to move along the front and back directions;
and the third electric sliding table is in driving connection with the glue injection head and is used for driving the glue injection head to move up and down.
Optionally, the adhesive dispensing and bonding device further comprises a monitoring device, the monitoring device is arranged on the base and is arranged at an interval with the glue injection head, and the monitoring device is used for monitoring the glue outlet amount of the glue injection head so as to monitor the allowance of glue liquid in the glue cylinder.
The utility model also provides an encapsulation equipment, encapsulation equipment includes foretell point gluing bonding device, encapsulation equipment is used for right point gluing bonding device injecting glue treat that the work piece that bonds encapsulates, point gluing bonding device includes:
the device comprises a machine base, a detection device and a control device, wherein the machine base is provided with a processing station and a detection station;
the bearing seat is arranged on the machine base and positioned at the processing station, and is used for bearing a workpiece to be bonded;
the weighing detection mechanism is arranged on the base and is positioned at the detection station; and the number of the first and second groups,
injecting glue mechanism, including the injecting glue head, the injecting glue head movably locates the frame is in order to have and to be located the first operating condition of processing station and be located the second operating condition of detection station under the first operating condition, the injecting glue head is used for right bear on the seat treat that the work piece that bonds carries out the injecting glue under the second operating condition, the injecting glue head is used for right the detection mechanism that weighs carries out the injecting glue, so that the detection mechanism that weighs detects the injecting glue volume of injecting glue mechanism.
The utility model provides a technical scheme in, set up bearing seat, weighing detection mechanism and injecting glue mechanism on the frame, the frame has processing station and detection station, bearing seat is located processing station, weighing detection mechanism is located detection station, injecting glue mechanism includes the injecting glue head, the injecting glue head movably is located the frame, so as to have the first operating condition that is located processing station, and the second operating condition that is located detection station, the injecting glue head is in when normally working in the first operating condition, at this moment the injecting glue head injects the glue to the work piece that will bond on the bearing seat, after injecting the glue and carrying out a period, the point gluing bonding device carries out the selective examination to the injecting glue volume of injecting glue mechanism, the injecting glue head switches to the second operating condition, at this moment the injecting glue head injects the glue to the weighing detection mechanism, so that the weighing detection mechanism detects the glue injection amount of the glue injection mechanism, and through the arrangement of the weighing detection mechanism, the intermittent glue injection amount of the glue injection head is detected to ensure that the glue injection amount of the glue injection mechanism is within a preset value range, so that the glue injection amount of the glue dispensing bonding device can be accurately controlled.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic perspective view of an embodiment of a dispensing and bonding apparatus provided by the present invention;
fig. 2 is a perspective view of a part of the dispensing and bonding apparatus shown in fig. 1;
fig. 3 is a perspective view of a part of the dispensing and bonding apparatus shown in fig. 1.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Adhesive dispensing and |
42 | Rubber cylinder |
| 1 | |
43 | |
| 2 | |
401 | First electric sliding table |
| 21 | |
402 | Second electric sliding table |
| 3 | |
403 | Third electric sliding table |
| 31 | Weighing |
5 | Image acquisition device |
| 4 | Glue injection mechanism | 6 | |
| 41 | Glue injection head |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
In the packaging process of the pressure sensor, the sensitive element, the upper cover and the like generally need to be mounted in a bonding manner, taking the packaging of the sensitive element as an example, in the packaging process of the sensitive element, the sensitive element needs to be assembled, that is, the sensitive element is placed in the shell of the sensor, and the sensitive element can be fixed in the shell of the sensor in a glue injection bonding manner.
In order to solve the above problems, the present invention provides a glue dispensing and bonding apparatus 100, and fig. 1 to 3 illustrate specific embodiments of the glue dispensing and bonding apparatus 100.
Referring to fig. 1 to 2, the dispensing and bonding apparatus 100 includes a base 1, a carrying seat 2, a weighing and detecting mechanism 3, and a glue injecting mechanism 4, wherein the base 1 has a processing station and a detecting station, the carrying seat 2 is disposed on the base 1 and located at the processing station, the carrying seat 2 is used for carrying a workpiece to be bonded, the weighing and detecting mechanism 3 is disposed on the base 1 and located at the detecting station, the glue injecting mechanism 4 includes a glue injecting head 41, the glue injecting head 41 is movably disposed on the base 1 to have a first working state located at the processing station and a second working state located at the detecting station, in the first working state, the glue injecting head 41 is used for injecting glue to the workpiece to be bonded on the carrying seat 2, in the second working state, the glue injecting head 41 is used for injecting glue to the weighing and detecting mechanism 3, so that the weighing detection mechanism 3 detects the glue injection amount of the glue injection mechanism 4.
The utility model provides a technical scheme in, set up bearing seat 2, weighing detection mechanism 3 and injecting glue mechanism 4 on frame 1, frame 1 has processing station and detection station, bearing seat 2 is located processing station, weighing detection mechanism 3 is located detection station, injecting glue mechanism 4 includes injecting glue head 41, injecting glue head 41 movably locates frame 1 to have the first operating condition that is located processing station and the second operating condition that is located detection station, injecting glue head 41 is in the first operating condition when normally working, at this moment injecting glue head 41 is right the work piece of waiting to bond on bearing seat 2 carries out the injecting glue, after injecting glue carries out a period, point glue bonding device 100 is right injecting glue volume of injecting glue mechanism 4 is spot check, injecting glue head 41 switches to the second operating condition, at this time, the glue injection head 41 injects glue to the weighing detection mechanism 3, so that the weighing detection mechanism 3 detects the glue injection amount of the glue injection mechanism 4, and by arranging the weighing detection mechanism 3, the intermittent glue injection amount of the glue injection head 41 is detected, so that the glue injection amount of the glue injection mechanism 4 is ensured within a preset value range, and the glue injection amount of the glue dispensing bonding device 100 can be accurately controlled.
Specifically, taking the package of the sensitive element as an example, since the glue injection amount directly affects the bonding firmness of the subsequent sensitive element, and since there are many points where the sensitive element needs to be bonded in the bonding process, there are many points where the glue is injected, the glue injection amount at each point needs to be controlled, if the glue injection amount is too large, the bonding surface of the sensitive element becomes large, and the place where the sensitive element cannot be bonded is bonded and covered, so that the normal use of the sensitive element is affected, and if the glue injection amount is too small, the sensitive element may be bonded insufficiently, so that it is particularly important to control the glue injection amount. In order to ensure that the glue injection amount of the glue injection mechanism 4 in the first working state can be always kept within a preset range, please refer to fig. 1, in this embodiment, the weighing detection mechanism 3 includes a monitoring control unit and a weighing tray 31 which are arranged on the base 1, in the second working state, the glue injection head 41 is used for injecting glue into the weighing tray 31, the weighing tray 31 is used for acquiring the glue injection amount of the glue injection mechanism 4 in the second working state, the monitoring control unit is electrically connected with the weighing tray 31 and the glue injection mechanism 4, when the glue injection amount acquired by the weighing tray 31 is within a preset range value, the monitoring control unit controls the glue injection mechanism 4 to be switched to the first working state, and normally injects glue into the workpiece to be bonded, and when the glue injection amount acquired by the weighing tray 31 is outside the preset range value, the monitoring control unit controls the glue injection mechanism 4 to adjust the glue injection amount, and performs glue injection on the weighing tray 31 again, until the glue injection amount is within a preset range value, the glue injection mechanism 4 is switched to the first working state again, and performs normal glue injection on the workpieces to be bonded, so that the glue injection mechanism 4 is switched to the second working state at intervals, and the glue injection amount is subjected to sampling inspection, so that the glue injection amount can be timely controlled.
Specifically, because the glue injection mechanism 4 is switched between the first working state and the second working state, the glue injection mechanism 4 is in a movable state, and in order to ensure that the glue injection mechanism 4 can accurately inject glue to a workpiece to be bonded, referring to fig. 2, in this embodiment, the glue injection mechanism 4 further includes a glue barrel 42, the glue barrel 42 has a containing cavity for containing glue, the glue injection head 41 is located at the lower end of the glue barrel 42 and is communicated with the containing cavity, and the glue barrel 42 is easy to shake during the moving process due to the large mass of the glue, so as to drive the glue injection head 41 to shake, and in order to prevent the position of a glue injection point from being inaccurate due to the shake, the glue injection mechanism 4 further includes a limiting plate 43 arranged on the base 1, the limiting plate 43 is located below the glue barrel 42, the limiting plate 43 is provided with a limiting groove for the glue injection head 41 to penetrate through, the limiting plate 43 is used for bearing and fixing the rubber cylinder 42, so that the rubber cylinder 42 reduces shaking.
Further, in order to fully utilize the dispensing and bonding apparatus 100, so that the dispensing and bonding apparatus 100 can have better compatibility and match with workpieces to be bonded of more types, please refer to fig. 3, in this embodiment, a plurality of fixing units 21 are disposed on the bearing seat 2, each fixing unit 21 is used to bear the workpiece to be bonded of a corresponding type, when the dispensing and bonding apparatus 100 is used, the workpiece to be bonded needing dispensing is placed into the fixing unit 21 of the corresponding type to be fixed, and when the workpiece to be bonded of another type needs to be changed, the workpiece to be bonded is correspondingly placed into another fixing unit 21.
Specifically, the fixing units 21 may be in many forms, and different fixtures may be arranged to clamp and fix the workpieces to be bonded, in this embodiment, an accommodating groove with an upward opening is formed in an upper side of each fixing unit 21, and each accommodating groove is used to accommodate the workpieces to be bonded of a corresponding type.
Further, in order to facilitate detection and comparison of the glue injection quality of the glue dispensing and bonding device 100, please refer to fig. 2, in this embodiment, the glue dispensing and bonding device 100 further includes an image collecting device 5, the image collecting device 5 is disposed on the base 1 and located above the bearing seat 2, the image collecting device 5 is configured to collect an image of the workpiece to be bonded on the bearing seat 2, and compare the collected image with a qualified glue injection workpiece, so as to detect the glue injection quality of the glue dispensing and bonding device 100.
Specifically, in order to switch the glue injection head 41 between the first working state and the second working state, referring to fig. 3, in this embodiment, the glue injection mechanism 4 further includes a driving assembly, and the driving assembly is disposed on the base 1 and is in driving connection with the glue injection head 41. The driving assembly may have various forms, but in order to ensure the accuracy of the glue injection head 41, the driving assembly needs to have higher accuracy, and specifically, in this embodiment, the driving assembly includes a first electric sliding table 401, a second electric sliding table 402, and a third electric sliding table 403; because of electronic slip table is with low costs, small, and the energy consumption is low, adopts the straight slider guide rail of high accuracy, and the motion is steady, characteristics such as compact structure make the displacement control of high accuracy can be realized to injecting glue mechanism 4 in limited space, first electronic slip table 401 is located frame 1, first electronic slip table 401 with the electronic slip table 402 drive of second is connected, is used for the drive the electronic slip table 402 of second is along controlling to the activity, the electronic slip table 402 of second with the electronic slip table 403 drive of third is connected, is used for the drive the electronic slip table 403 of third is along moving to the front and back, the electronic slip table 403 of third with injecting glue head 41 drive connection, is used for the drive injecting glue head 41 is along moving from top to bottom, sets up like this for injecting glue head 41 can upwards all can accurate control at X, Y, Z.
Further, because what adhesive deposite device 100 adopted is automatic production line, can not adopt the mode of manual monitoring constantly at the in-process of gluing in the point, when the glue solution in packing element 42 was used up, if not in time supply, can influence the injecting glue volume of waiting to bond the work piece, in this embodiment, adhesive deposite device 100 still includes monitoring devices 6, monitoring devices 6 locate frame 1, and with injecting glue head 41 interval sets up, monitoring devices 6 are used for monitoring injecting glue head 41's play glue volume, in order to monitor the surplus of the glue solution in packing element 42, of course monitoring devices 6 can be through the mode of image acquisition shooing, also can be through the mode of weighing, also can be the mode of infrared ray monitoring play glue volume and monitor, do not do the injectly in this scheme.
The utility model provides a packaging equipment, packaging equipment includes foretell point gluing bonding device 100, packaging equipment is used for right point gluing bonding device 100 injecting glue treat that the work piece that bonds encapsulates, point gluing bonding device 100's concrete structure refers to above-mentioned embodiment, because this packaging equipment has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that all technical scheme of above-mentioned all embodiments brought at least, and the repeated description is not repeated here one by one again. The packaging device may be used to package a sensitive element (e.g., a pressure chip) in the pressure sensor, or may be used to glue the housing and bond the upper cover, which is not limited herein.
The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.
Claims (10)
1. The utility model provides a point is glued and is glued device which characterized in that includes:
the device comprises a machine base, a detection device and a control device, wherein the machine base is provided with a processing station and a detection station;
the bearing seat is arranged on the machine base and positioned at the processing station, and is used for bearing a workpiece to be bonded;
the weighing detection mechanism is arranged on the base and is positioned at the detection station; and the number of the first and second groups,
injecting glue mechanism, including the injecting glue head, the injecting glue head movably locates the frame is in order to have and to be located the first operating condition of processing station and be located the second operating condition of detection station under the first operating condition, the injecting glue head is used for right bear on the seat treat that the work piece that bonds carries out the injecting glue under the second operating condition, the injecting glue head is used for right the detection mechanism that weighs carries out the injecting glue, so that the detection mechanism that weighs detects the injecting glue volume of injecting glue mechanism.
2. The dispensing and bonding apparatus according to claim 1, wherein the weighing and detecting mechanism includes a monitor and control unit and a weighing tray, the monitor and control unit is disposed on the base, the dispensing head is configured to dispense glue to the weighing tray in the second operating state, and the weighing tray is configured to obtain a dispensing amount of the dispensing mechanism in the second operating state;
the monitoring control unit is electrically connected with the weighing tray and the glue injection mechanism, and when the glue injection amount acquired by the weighing tray is within a preset range value, the monitoring control unit controls the glue injection mechanism to be switched to the first working state; and when the glue injection amount acquired by the weighing tray is out of a preset range value, the monitoring control unit controls the glue injection mechanism to adjust the glue injection amount and glue the weighing tray again.
3. The dispensing bonding apparatus according to claim 1, wherein the glue injection mechanism further comprises a glue barrel, the glue barrel has a containing cavity for containing glue solution, and the glue injection head is located at a lower end of the glue barrel and communicated with the containing cavity;
the glue injection mechanism further comprises a limiting plate arranged on the base, the limiting plate is located below the glue cylinder, and a limiting groove for the glue injection head to penetrate through is formed in the limiting plate.
4. The dispensing and bonding apparatus according to claim 1, wherein the carrier has a plurality of fixing units, each of the fixing units being configured to carry a corresponding type of the workpiece to be bonded.
5. The dispensing and bonding apparatus according to claim 4, wherein the upper side of each fixing unit is provided with a containing groove with an upward opening, and each containing groove is used for accommodating the workpieces to be bonded of corresponding types.
6. The dispensing and bonding apparatus of claim 1, further comprising an image capturing device, wherein the image capturing device is disposed on the base and located above the carrying seat, and the image capturing device is configured to capture an image of the workpiece to be bonded on the carrying seat, so as to detect the glue injecting quality of the dispensing and bonding apparatus.
7. The dispensing and bonding apparatus according to claim 1, wherein the glue injection mechanism further comprises a driving assembly, and the driving assembly is disposed on the base and is in driving connection with the glue injection head for driving the glue injection head to switch between the first operating state and the second operating state.
8. The apparatus according to claim 7, wherein the driving assembly comprises a first electric slide, a second electric slide, and a third electric slide;
the first electric sliding table is arranged on the base and is in driving connection with the second electric sliding table so as to drive the second electric sliding table to move along the left and right directions;
the second electric sliding table is in driving connection with the third electric sliding table and is used for driving the third electric sliding table to move along the front and back directions;
and the third electric sliding table is in driving connection with the glue injection head and is used for driving the glue injection head to move up and down.
9. The dispensing and bonding apparatus according to claim 3, further comprising a monitoring device, wherein the monitoring device is disposed on the base and spaced from the glue injection head, and the monitoring device is configured to monitor a glue discharge amount of the glue injection head so as to monitor a remaining amount of the glue solution in the glue cartridge.
10. A packaging apparatus, comprising the adhesive dispensing and bonding apparatus according to any one of claims 1 to 9, wherein the packaging apparatus is configured to package the workpiece to be bonded injected by the adhesive dispensing and bonding apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120944657.9U CN215141533U (en) | 2021-04-30 | 2021-04-30 | Adhesive dispensing and bonding device and packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120944657.9U CN215141533U (en) | 2021-04-30 | 2021-04-30 | Adhesive dispensing and bonding device and packaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215141533U true CN215141533U (en) | 2021-12-14 |
Family
ID=79366526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120944657.9U Active CN215141533U (en) | 2021-04-30 | 2021-04-30 | Adhesive dispensing and bonding device and packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215141533U (en) |
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2021
- 2021-04-30 CN CN202120944657.9U patent/CN215141533U/en active Active
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