CN215118872U

CN215118872U - Wafer clamp

Info

Publication number: CN215118872U
Application number: CN202121491953.4U
Authority: CN
Inventors: 曾逸; 杨林
Original assignee: Shenzhen Zhuoxing Semiconductor Technology Co ltd
Current assignee: Shenzhen Zhuoxing Semiconductor Technology Co ltd
Priority date: 2021-07-01
Filing date: 2021-07-01
Publication date: 2021-12-10
Anticipated expiration: 2031-07-01

Abstract

The application relates to the technical field of clamps and discloses a wafer clamp. The wafer chuck includes an actuator; the pushing part is connected with the actuator and can move controllably under the action of the actuator; the clamping part is provided with a fixed end and a free end, and a clamping position for clamping the wafer is formed between the two free ends; wherein, the pushing part is connected between the fixed end and the free end, or the pushing part is connected with the free end, and the connecting position of the clamping part and the pushing part can be deformed. The utility model provides a clamping part has deformable characteristics with the hookup location of connecting portion, therefore can make this hookup location warp through the promotion portion under the effect of actuator and make the centre gripping space of the centre gripping position between two clamping parts produce small change, correspond the very thin thickness of wafer to utilize the deformable characteristics of hookup location, can realize the fine setting in the centre gripping space of centre gripping position, thereby realize the stable centre gripping to the wafer.

Description

Wafer clamp

Technical Field

The application relates to the technical field of clamps, in particular to a wafer clamp.

Background

Chip On Board (COB) technology is an emerging LED packaging technology, which is a flip-chip technology, unlike traditional Surface Mount Device (SMD) front packaging technology, which directly solder light emitting chips to PCBs. As the size of the LED wafer is reduced, the number of the lamp beads in the same PCB area is increased, and the die bonding is completed as soon as possible after the solder paste is brushed. The COB technique improves screen resolution, reliability, and high color rendition.

In the die bonding process, the position of the wafer on the substrate is inaccurate, i.e., the wafers are not aligned with each other. Therefore, the position of the wafer needs to be adjusted. However, the solder paste is adhered to the lower surface of the wafer, and it is difficult to adjust the position of the wafer.

The related art discloses a wafer chuck using an actuator (particularly, a pneumatic cylinder) to move and rotate rapidly, however, according to the wafer chuck disclosed in the related art, since the thickness of each wafer is different and the thickness of the wafer is thin, fine adjustment is difficult during chucking, and thus, the wafer chuck may be unstable during chucking, resulting in chip slip.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem of unstable wafer clamping, the application provides a wafer clamp.

The embodiment of the application provides a wafer clamp, include: an actuator; the pushing part is connected with the actuator, and can move controllably under the action of the actuator; the clamping part is provided with a fixed end and a free end, and a clamping position for clamping the wafer is formed between the two free ends; wherein the pushing part is connected between the fixed end and the free end, or the pushing part is connected to the free end, and a connection position of the clamping part and the pushing part is deformable.

In an embodiment of the present application, the connection position of the clamping portion is made of an elastic material.

In one embodiment of the present application, the clamping portion and the pushing portion are an integral structure.

In one embodiment of the present application, along the stiff end orientation the direction of free end, two interval between the clamping part is the convergent.

In one embodiment of the present application, the pushing portion includes: a first connection end connected with the actuator; the second connecting end is connected with one clamping part; the third connecting end is connected with the other clamping part; the second connecting end and the third connecting end are symmetrically arranged relative to the first connecting end, and the distance between the second connecting end and the third connecting end is expanded along the direction from the fixed end to the free end.

In an embodiment of the present application, a fixed end of the clamping portion is fixedly connected to the frame body, the actuator is fixedly mounted to the frame body, and the pushing portion is slidably connected to the frame body.

In one embodiment of the present application, the number of the actuators is n, where n is an even number.

In one embodiment of the present application, the number of the stopper is two.

In one embodiment of the present application, the actuator is a micro-control motor.

In one embodiment of the present application, the apparatus further comprises a control assembly, the control assembly comprising: the sensor is electrically connected with each actuator respectively and used for detecting the output power of each actuator; and the controller is respectively connected with the sensor and each actuator and is used for receiving the signal output by the sensor and adjusting the output power of each actuator to be consistent.

Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:

the wafer anchor clamps that the embodiment of the application provided, the clamping part has stiff end and free end, connecting portion and two clamping parts are connected respectively, and hookup location is located the non-stiff end department of clamping part, because this hookup location has deformable characteristics, therefore can be under the effect of actuator, thereby it produces small change to make the centre gripping space of the centre gripping position between two clamping parts to make this hookup location deformation through the promotion portion, correspond very thin thickness of wafer, thereby utilize the deformable characteristics of hookup location, can realize the fine setting in the centre gripping space of centre gripping position, thereby realize the stable centre gripping to the wafer.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a perspective view of a clamping portion and a pushing portion provided in an embodiment of the present application;

fig. 2 is a front view of the clamping portion and the pushing portion provided in the embodiment of the present application;

fig. 3 is a perspective view of a first perspective view of a wafer chuck according to an embodiment of the present disclosure;

fig. 4 is a perspective view of a second perspective view of a wafer chuck according to an embodiment of the present disclosure;

FIG. 5 is a perspective view of a wafer chuck with a housing according to an embodiment of the present application;

fig. 6 is a front view of a wafer chuck with a housing according to an embodiment of the present application.

Reference numerals:

1. an actuator; 2. a clamping portion; 21. a fixed end; 22. a free end; 23. a connection location; 24. a clamping position; 3. a pushing part; 31. a first connection end; 32. a second connection end; 33. a third connection end; 34. an arc-shaped structure; 4. a housing.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the die bonding process, the position of the wafer on the substrate is inaccurate, i.e., the wafers are not aligned with each other. Therefore, the position of the wafer needs to be adjusted. However, the solder paste is adhered to the lower surface of the wafer, and it is difficult to adjust the position of the wafer. The related art discloses a wafer chuck using an actuator (particularly, a pneumatic cylinder) to move and rotate rapidly, however, according to the wafer chuck disclosed in the related art, since the thickness of each wafer is different and the thickness of the wafer is thin, fine adjustment is difficult during chucking, and thus, the wafer chuck may be unstable during chucking, resulting in chip slip.

In view of the above problems, embodiments of the present application provide a wafer chuck including an actuator; the pushing part is connected with the actuator, and can move controllably under the action of the actuator; the clamping part is provided with a fixed end and a free end, and a clamping position for clamping the wafer is formed between the two free ends; wherein the pushing part is connected between the fixed end and the free end, or the pushing part is connected to the free end, and a connection position of the clamping part and the pushing part is deformable.

Wherein, need the understanding of skilled person in the art, the clamping part in the correlation technique adopts the rotary type structure mostly, namely through the relative rotation to two clamping parts, realize the centre gripping to the wafer, what this application adopted is two fixed clamping parts, namely one end of clamping part is the stiff end, and the other end is the free end, through set up deformable hookup location in non-stiff end department, connect with it through the promotion portion to promote this hookup location through the promotion portion and produce the slight deformation, thereby make and form the centre gripping position of centre gripping wafer between two clamping parts.

For a more particular understanding of the technical idea of the present application, exemplary embodiments are described below with reference to the accompanying drawings:

fig. 1 is a perspective view of a clamping portion and a pushing portion provided in an embodiment of the present application; fig. 2 is a front view of the clamping portion and the pushing portion provided in the embodiment of the present application; fig. 3 is a perspective view of a first perspective view of a wafer chuck according to an embodiment of the present disclosure; fig. 4 is a perspective view of a second perspective view of a wafer chuck according to an embodiment of the present disclosure; FIG. 5 is a perspective view of a wafer chuck with a housing according to an embodiment of the present application; fig. 6 is a front view of a wafer chuck with a housing according to an embodiment of the present application.

As shown in fig. 1-6, embodiments of the present application provide a wafer chuck, including: an actuator 1; the pushing part 3 is connected with the actuator 1, and the pushing part 3 can move controllably under the action of the actuator 1; the two clamping parts 2 are provided with fixed ends 21 and free ends 22, and clamping positions 24 for clamping the wafer are formed between the two free ends 22; wherein the pushing part 3 is connected between the fixed end 21 and the free end 22, or the pushing part 3 is connected to the free end 22, and a connection position 23 of the clamping part 2 and the pushing part 3 is deformable.

The wafer anchor clamps that the embodiment of the application provided, clamping part 2 has stiff end 21 and free end 22, connecting portion are connected respectively with two clamping parts 2, and hookup location 23 is located clamping part 2's non-stiff end 21 department, because this hookup location 23 has deformable characteristics, therefore can be under actuator 1's effect, thereby it produces small change to make the clamping space of clamping position 24 between two clamping parts 2 to make this hookup location 23 warp through promotion portion 3, correspond very thin thickness of wafer, thereby utilize hookup location 23 deformable characteristics, can realize the fine setting in clamping space of clamping position 24, thereby realize the stable centre gripping to the wafer.

In some embodiments, the connecting portion 23 of the clamping portion 2 is made of an elastic material. Furthermore, the two clamping portions 2 may be made of an elastic material, such as an elastic sheet. The arrangement is such that the clamping parts 2 have a deformation capability at least at the connection locations 23, so that clamping locations 24 for clamping a wafer are formed between the two clamping parts 2.

In some embodiments, the clamping portion 2 and the pushing portion 3 are of a split structure, or, for convenience of processing, the clamping portion 2 and the pushing portion 3 are of an integral structure. Further, for the convenience of integral processing, the pushing portion 3 may be of a deformable structure or may be made of an elastic material.

With continued reference to fig. 1-2, regarding the shape of the clamping portions 2, the distance between the two clamping portions 2 is tapered along the direction from the fixed end 21 to the free end 22, so as to form an olecranon-type clamping head, and a clamping position 24 is formed between the two clamping heads. Specifically, two clamping parts 2 are the symmetry setting to guarantee that two clamping parts 2 atress are balanced, make the centre gripping stable.

With continued reference to fig. 1, for the pushing part 3, the pushing part 3 includes: a first connection end 31 connected to the actuator 1; a second connection end 32 connected to one of the clamping portions 2; and a third connecting end 33 connected to the other of the holding portions 2; the second connection end 32 and the third connection end 33 are symmetrically disposed about the first connection end 31, and a distance between the second connection end 32 and the third connection end 33 is expanded along a direction from the fixed end 21 to the free end 22.

When the pushing portion 3 is deformable in use, the pushing portion 3 may be provided with a movable space, preferably, the movable space may be an arc-shaped structure 34, the arc-shaped structure 34 is respectively connected with the first connecting end 31, the second connecting end 32 and the third connecting end 33, when the actuator 1 moves to press the first connecting end 31, the first connecting end 31 transmits power to the arc-shaped structure 34, the arc-shaped structure 34 deforms and causes the second connecting end 32 and the third connecting end 33 to deform, so as to drive the clamping space of the clamping position 24 between the clamping portions 2 to change, thereby clamping the wafer. Specifically, when clamping, the distance between the free ends 22 of the two clamping parts 2 is 0.001mm-0.01mm, or the distance between the two clamping parts 2 is less than 0.001 mm.

Wherein, it is understood by those skilled in the art that, along the direction from the fixed end 21 to the free end 22, the distance between the two clamping portions 2 is tapered to form an olecranon-type clamping head, and the distance between the second connecting end 32 and the third connecting end 33 is expanded, so that the two clamping portions 2 can be pushed by the second connecting end 32 and the third connecting end 33 to form the clamping position 24 for clamping the wafer.

Referring to fig. 5-6, in some embodiments, in order to fix the wafer chuck, the wafer chuck further includes a frame body, the fixed end 21 of the clamping portion 2 is fixedly connected to the frame body, the actuator 1 is fixedly mounted on the frame body, and the pushing portion 3 is slidably connected to the frame body. During the use, the output of each actuator 1 drives the relative support body of promotion portion 3 and slides, promotes two clamping part 2 and opens and shuts, and is concrete, can set up a slider and slide rail at the output of actuator 1, and the output link block of actuator 1, the slider can slide along the slide rail, and in slider embedding promotion portion 3, can drive promotion portion 3 and slide along linear direction to promote hookup location 23 deformation, can not make two clamping part 2 open and shut.

Considering that the odd number of actuators 1 cannot ensure the balanced stress of the clamping parts 2 on both sides, which may cause the stress of the clamping part 2 on one side to be large, the stress of the clamping part 2 on the other side to be small, and the clamping part 2 to be inclined, and further cause the clamped wafer to be inclined, thereby causing the problem of unstable clamping, the number of the actuators 1 is n, wherein n is an even number. The even number of actuators 1 are arranged, so that the two clamping parts 2 can be controlled by the even number of actuators 1, the even number of actuators 1 do not respectively control the two clamping parts 2, but control the two clamping parts 2 together, and the even number of actuators 1 are arranged to balance the stress of the two clamping parts 2, so that the two clamping parts 2 are balanced in stress, a wafer can be stably clamped, and the position of the wafer can be adjusted. Further, the even number of actuators 1 may be divided into two groups, and the two groups of actuators 1 may be symmetrically disposed about the first connection end 31, so that the clamping portions 2 on both sides are balanced in force. Specifically, the number of the actuators is two, and the two actuators 1 can ensure that the two clamping parts 2 are stressed in a balanced manner, so that the wafer can be transported stably.

For the type of actuator 1, said actuator 1 is a micro-controlled electric motor or a micro-controlled motor. The control motor is used as an actuating element, a detection element and an arithmetic element in the control system. From the working principle, the micro-control motor is not essentially different from a common motor, but is different in use function. The common motor has large power, emphasizes performance indexes of the motor such as starting, running and braking, and the control motor has smaller output power, emphasizes control precision, response speed and running reliability of the motor.

With continued reference to fig. 5-6, in order to ensure the structural integrity, the device further includes a housing 4, the housing 4 completely covers the frame body and the fixed end 21 of the clamping portion 2 and the sliding end of the pushing portion 3, so as to ensure that the internal structure is not damaged; in addition, the free end 22 of the clip portion 2 may also be wrapped by the housing 4 to protect the clip portion 2.

In order to further guarantee that the clamping part 2 of both sides is balanced in atress, still include control assembly, control assembly includes: sensors electrically connected to the actuators 1, respectively, for detecting output powers of the actuators 1; and the controller is respectively connected with the sensor and each actuator 1 and is used for receiving the signal output by the sensor and adjusting the output power of each actuator 1 to be consistent.

It should be understood by those skilled in the art that the sensors may respectively detect parameters of the output power of each actuator 1 and transmit the parameters to the controller, and the controller determines whether the output power of the actuators 1 on both sides is the same, and if so, controls each actuator 1 to still output power in the original manner, and if not, controls the output power of each actuator 1 to be the same, thereby maintaining the output power balance of the actuators 1 on both sides.

Example one

The embodiment of the application provides a wafer clamp, include: an actuator 1; the pushing part 3 is connected with the actuator 1, and the pushing part 3 can move controllably under the action of the actuator 1; the two clamping parts 2 are provided with fixed ends 21 and free ends 22, and clamping positions 24 for clamping the wafer are formed between the two free ends 22; wherein the pushing part 3 is connected to an arbitrary position between the fixed end 21 and the free end 22, and a connection position 23 of the clamping part 2 and the pushing part 3 is deformable.

Example two

The embodiment of the application provides a wafer clamp, include: an actuator 1; the pushing part 3 is connected with the actuator 1, and the pushing part 3 can move controllably under the action of the actuator 1; the two clamping parts 2 are provided with fixed ends 21 and free ends 22, and clamping positions 24 for clamping the wafer are formed between the two free ends 22; wherein the pushing part 3 is connected to the free end 22 and the connecting position 23 of the clamping part 2 and the pushing part 3 is deformable.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above description is only exemplary of the invention, and is intended to enable those skilled in the art to understand and implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer chuck, comprising:

an actuator (1);

the pushing part (3) is connected with the actuator (1), and the pushing part (3) can move controllably under the action of the actuator (1); and the number of the first and second groups,

two clamping parts (2), wherein the clamping parts (2) are provided with fixed ends (21) and free ends (22), and a clamping position (24) for clamping the wafer is formed between the two free ends (22);

wherein the pushing part (3) is connected between the fixed end (21) and the free end (22), or the pushing part (3) is connected to the free end (22), and a connection position (23) of the clamping part (2) and the pushing part (3) is deformable.

2. Wafer holder according to claim 1, characterized in that the attachment points (23) of the clamping parts (2) are made of an elastic material.

3. Wafer holder according to claim 1, characterized in that the clamping part (2) and the pushing part (3) are of one-piece construction.

4. Wafer holder according to claim 1, characterized in that the spacing between the two clamping portions (2) is tapered in the direction of the fixed end (21) towards the free end (22).

5. Wafer holder according to claim 1 or 4, characterized in that the pushing part (3) comprises:

a first connection end (31) connected to the actuator (1);

a second connection end (32) connected to one of the clamping portions (2); and the number of the first and second groups,

a third connecting end (33) connected to the other of the holding portions (2);

the second connecting end (32) and the third connecting end (33) are symmetrically arranged relative to the first connecting end (31), and the distance between the second connecting end (32) and the third connecting end (33) is expanded along the direction from the fixed end (21) to the free end (22).

6. The wafer holder according to claim 1, further comprising a frame body, wherein the fixed end (21) of the clamping portion (2) is fixedly connected to the frame body, the actuator (1) is fixedly mounted to the frame body, and the pushing portion (3) is slidably connected to the frame body.

7. Wafer holder according to claim 1, characterized in that the number of actuators (1) is n, wherein n is an even number.

8. The wafer holder of claim 7, wherein the number of actuators is two.

9. Wafer holder according to claim 1, characterized in that the actuator (1) is a micro-controlled motor.

10. The wafer chuck of claim 4, further comprising a control assembly, the control assembly comprising:

the sensor is electrically connected with each actuator (1) respectively and used for detecting the output power of each actuator (1); and the number of the first and second groups,

and the controller is respectively connected with the sensor and each actuator (1) and is used for receiving the signal output by the sensor and adjusting the output power of each actuator (1) to be consistent.