CN215118860U - Die bonding swing arm - Google Patents

Abstract

The application provides a die bonding swing arm which comprises a swing arm and a suction nozzle arranged on the swing arm; the plane on which the swing arm rotates is a rotating plane, a plurality of through holes are arranged on the swing arm at intervals, and the central axis of each through hole is not vertical to the rotating plane; the swing arm is provided with a windward side and a leeward side opposite to the windward side, one end of each through hole is positioned on the windward side, and the other end of each through hole is positioned on the leeward side. This application is through seting up a plurality of through-holes at the interval on the swing arm, and the axis of each through-hole is not perpendicular to the swing arm and rotates the rotation plane at place. The swing arm is at pivoted in-process, and the wind that is located swing arm the place ahead and is parallel with the rotation plane passes a plurality of through-holes on the windward side, and a plurality of through-holes can be with just weakening the windage to the swing arm to the windage that makes the swing arm receive reduces, and the swing arm gives the amount of wind of blue membrane and reduces, thereby can avoid blue membrane to cause the position of wafer to take place the skew because of the windage is too big, and then can improve subsequent crystalline grain precision of getting and solid brilliant precision.

Description

Die bonding swing arm

Technical Field

The application belongs to the technical field of die bonding, and particularly relates to a die bonding swing arm.

Background

At present, after a chip on a blue film is ejected by a thimble assembly, the chip is sucked and transferred to a die bonding position by a suction nozzle on a die bonding swing arm for die bonding. However, in the process of rotation of the existing die bonding swing arm, the die bonding swing arm is affected by the size and the rotation amplitude of the die bonding swing arm, the wind resistance of the die bonding swing arm is large, wind is easily driven to blow towards the blue film during rotation, the blue film is greatly shaken by the wind, and the position of a wafer ejected by the ejector pin assembly on the blue film is easily deviated, so that subsequent die taking precision and die bonding precision are affected.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the present application is to provide a die bonding swing arm, in order to solve the existence in the correlation technique: the wind resistance of the die bonding swing arm is large when the die bonding swing arm rotates, the blue film is blown by wind to shake greatly, and the position of a wafer ejected by the ejector pin component on the blue film is easy to deviate, so that the subsequent die taking precision and die bonding precision are affected.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

the die bonding swing arm comprises a swing arm and a suction nozzle installed on the swing arm, wherein the rotating plane of the swing arm is a rotating plane, a plurality of through holes are formed in the swing arm at intervals, and the central axis of each through hole is not perpendicular to the rotating plane; the swing arm is provided with a windward surface and a leeward surface opposite to the windward surface, one end of each through hole is located on the windward surface, and the other end of each through hole is located on the leeward surface.

This structure, this application is through offering a plurality of through-holes at the interval on the swing arm, and the axis of each through-hole is not perpendicular to the swing arm and rotates the rotation plane at place. The swing arm is at pivoted in-process, and the wind that is located swing arm the place ahead and is parallel with the rotation plane passes a plurality of through-holes on the windward side, and a plurality of through-holes can be with just weakening the windage to the swing arm to the windage that makes the swing arm receive reduces, and the swing arm gives the amount of wind of blue membrane and reduces, thereby can avoid blue membrane to cause the position of wafer to take place the skew because of the windage is too big, and then can improve subsequent crystalline grain precision of getting and solid brilliant precision.

In one embodiment, the central axis of each through hole is parallel to the rotation plane, and the central axes of two adjacent through holes are parallel.

This structure can guarantee that the wind that is located swing arm the place ahead and is on a parallel with the swing arm can be weakened by a plurality of through-holes to can reduce the amount of wind of swing arm to blue membrane. The central axes of the through holes are arranged in parallel at intervals, so that the ventilation consistency of the swing arm at each position can be ensured, and the rotating reliability of the swing arm is improved.

In one embodiment, the windward side and the leeward side are each inclined to the rotation plane.

With the structure, the windward side and the leeward side which are obliquely arranged can further reduce the wind resistance on the swing arm.

In one embodiment, the swing arm comprises a supporting seat and a swing arm body with one end connected with the supporting seat, and the other end of the swing arm body is provided with the suction nozzle; the swing arm body is provided with a plurality of through holes at intervals.

This structure can be connected the connecting piece on swing arm body and the solid brilliant machine through the supporting seat and fix, is convenient for to the dismouting of swing arm.

In one embodiment, the supporting seat is provided with a first mounting hole, and the swing arm body is correspondingly provided with a second mounting hole; the swing arm further includes a lock member passing through the second mounting hole and locked in the first mounting hole.

This structure is through adjusting the length of retaining member locking in first mounting hole to the pressure size of Z axle direction is followed to adjustable swing arm body, avoids the suction nozzle to cause the damage to the wafer because of pressure is too big.

In one embodiment, the support seat is provided with an adjusting rod, and the swing arm body is correspondingly provided with a positioning guide rod; the side surface of the adjusting rod facing the positioning guide rod is a first plane, and the side surface of the positioning guide rod facing the adjusting rod is a second plane which is aligned and attached to the first plane.

This structure, through adjusting the length of this regulating lever, when first plane and second plane counterpoint laminating, can make the swing arm body be in the horizontal plane, can prevent that the swing arm body from controlling the slope.

In one embodiment, the supporting seat is provided with a plurality of openings at intervals, and the central axis of each opening is parallel to the central axis of each through hole.

By the structure, the wind resistance on the swing arm can be further reduced through the matching of the plurality of openings and the plurality of through holes.

In one embodiment, the swing arm further comprises an elastic member connecting the support base and the swing arm body.

According to the structure, the elastic piece can play a certain buffering protection role on the swinging of the swing arm body, and the situation that the suction nozzle is damaged on the wafer due to the overlarge stroke of the swing arm body is avoided.

In one embodiment, the swing arm further comprises a first pressing plate for cooperating with the supporting seat to clamp one end of the elastic member and a second pressing plate for cooperating with the swing arm body to clamp the other end of the elastic member; the first pressing plate is connected with the supporting seat, and the second pressing plate is connected with the swing arm body.

This structure, can be fixed in supporting seat and swing arm body with the both ends locking respectively of elastic component through first clamp plate and second clamp plate on, help the dismouting to the elastic component.

In one embodiment, the first pressure plate is spaced apart from the second pressure plate.

According to the structure, the gap between the first pressing plate and the second pressing plate can play a certain buffering and resetting role on the swinging of the swing arm body so as to prevent the suction nozzle from damaging the wafer.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a die bonding swing arm provided in an embodiment of the present application;

FIG. 2 is an exploded view of FIG. 1;

fig. 3 is a first schematic structural diagram of a swing arm body according to an embodiment of the present application;

fig. 4 is a second schematic structural view of the swing arm body according to the embodiment of the present application;

fig. 5 is a first schematic structural view of a support base according to an embodiment of the present disclosure;

fig. 6 is a second schematic structural view of the support seat according to the embodiment of the present application;

FIG. 7 is a schematic structural diagram of an elastic member according to an embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram of a first platen according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a second pressing plate according to an embodiment of the present application.

Wherein, in the drawings, the reference numerals are mainly as follows:

1. a swing arm; 10. a through hole; 11. a supporting seat; 110. an accommodating cavity; 111. a base; 1110. opening a hole; 112. a base; 1120. a first mounting hole; 113. adjusting a rod; 114. a first fixing hole; 115. a first step portion; 12. a swing arm body; 120. a second mounting hole; 121. positioning the guide rod; 1211. a second plane; 123. a first positioning hole; 124. a second step portion; 13. a locking member; 14. an elastic member; 140. a second fixing hole; 141. a second positioning hole; 15. a first platen; 150. a third fixing hole; 16. a second platen; 160. a third positioning hole;

2. a suction nozzle.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", "third" may explicitly or implicitly include one or more of the features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present application, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

For convenience of description, three coordinate axes which are mutually vertical in space are defined as an X axis, a Y axis and a Z axis respectively, and meanwhile, the direction along the X axis is longitudinal, the direction along the Y axis is transverse, and the direction along the Z axis is vertical; the X axis and the Y axis are two coordinate axes which are vertical to each other on the same horizontal plane, and the Z axis is a coordinate axis in the vertical direction; the X axis, the Y axis and the Z axis are positioned in space and are mutually vertical, and three planes are respectively an XY plane, a YZ plane and an XZ plane, wherein the XY plane is a horizontal plane, the XZ plane and the YZ plane are vertical planes, and the XZ plane is vertical to the YZ plane. Three axes in space are an X axis, a Y axis and a Z axis, and the three-axis movement in space refers to the movement along three axes which are vertical to each other in space, in particular to the movement along the X axis, the Y axis and the Z axis in space; the planar motion is a motion in the XY plane.

Referring to fig. 1 and fig. 2, a die bonding swing arm according to an embodiment of the present application will now be described. The die bonding swing arm comprises a swing arm 1 and a suction nozzle 2 installed on the swing arm 1. The swing arm 1 is substantially long, one end of the swing arm 1 can be fixed on the die bonder, and the suction nozzle 2 is detachably mounted at the other end of the swing arm 1. When the swing arm 1 is driven by the die bonder to rotate, a plane where the swing arm 1 rotates is a rotation plane (XY plane in fig. 1), a plurality of through holes 10 are formed in the swing arm 1 at intervals, the through holes 10 can be sequentially arranged along the length direction (X axis direction in fig. 1) of the swing arm 1, and a central axis of each through hole 10 is not perpendicular to the rotation plane. The swing arm 1 has a windward side and a leeward side opposite to the windward side, one end of each through hole 10 is located on the windward side, and the other end of each through hole 10 is located on the leeward side. According to the structure, the swing arm 1 is provided with the through holes 10 at intervals, and the central axis of each through hole 10 is not perpendicular to the rotation plane where the swing arm 1 rotates. Swing arm 1 is at pivoted in-process, and the wind that is located swing arm 1 the place ahead and is parallel with the rotation plane passes a plurality of through-holes 10 on the windward side, and a plurality of through-holes 10 can be just to the windage weakening of swing arm 1 to the windage that makes swing arm 1 receive reduces, and swing arm 1 gives the amount of wind of blue membrane and reduces, thereby can avoid blue membrane to cause the position of wafer to take place the skew because of the windage is too big, and then can improve subsequent crystalline grain precision and solid crystal precision of getting.

In an embodiment, please refer to fig. 3, as a specific implementation manner of the die bonding swing arm provided in the embodiment of the present application, the central axis of each through hole 10 is parallel to the rotation plane, and the central axes of two adjacent through holes 10 are parallel to each other. With this structure, it is ensured that the wind in front of the swing arm 1 and parallel to the swing arm 1 can be weakened by the plurality of through holes 10, so that the wind volume of the swing arm 1 to the blue film can be reduced. The central axes of the through holes 10 are arranged in parallel at intervals, so that the ventilation consistency of the swing arm 1 at each position can be ensured, and the rotation reliability of the swing arm 1 is improved.

In one embodiment, referring to fig. 3, the central axis of each through hole 10 may be disposed in parallel and at an interval along the width direction (Y-axis direction in fig. 3) of the swing arm 1, so as to ensure the maximum ventilation rate and reduce the air rate of the swing arm 1 to the blue film to the maximum.

In an embodiment, please refer to fig. 3, as a specific implementation of the die bonding swing arm provided in the embodiment of the present application, a windward side and a leeward side are respectively inclined to the rotation plane. With this structure, when the swing arm 1 is rotated in the forward direction, the wind in front of the swing arm 1 can be weakened by the obliquely disposed windward side, thereby reducing the wind resistance to the swing arm 1. When the oscillating arm 1 is rotated reversely, the wind in front of the oscillating arm 1 can be weakened by the leeward side provided obliquely, thereby reducing the wind resistance received by the oscillating arm 1.

In an embodiment, please refer to fig. 2 and fig. 5, as a specific implementation manner of the die bonding swing arm provided in the embodiment of the present application, the swing arm 1 includes a supporting base 11 and a swing arm body 12 having one end connected to the supporting base 11, and a suction nozzle 2 is installed at the other end of the swing arm body 12; the swing arm body 12 is provided with a plurality of through holes 10 at intervals. Specifically, the supporting seat 11 is provided with an accommodating cavity 110 into which one end of the swing arm body 12 far away from the suction nozzle 2 extends, so as to support the swing arm body 12. This structure can be connected swing arm body 12 and the connecting piece on the solid brilliant machine through supporting seat 11 and fixed, is convenient for to the dismouting of swing arm 1.

In an embodiment, referring to fig. 2, fig. 3 and fig. 5, as a specific implementation manner of the die bonding swing arm provided in the embodiment of the present application, a first mounting hole 1120 is formed on the supporting base 11, and a second mounting hole 120 is correspondingly formed on the swing arm body 12; the swing arm 1 further includes a locker 13 passing through the second mounting hole 120 and locked in the first mounting hole 1120. Specifically, the supporting base 11 may include a base 111 and a base 112 detachably mounted on the base 111, and the base 112 is provided with a first mounting hole 1120. According to the structure, the length of the locking piece 13 locked in the first mounting hole 1120 is adjusted, so that the pressure of the swing arm body 12 in the Z-axis direction can be adjusted, and the suction nozzle 2 is prevented from damaging a wafer due to overlarge pressure. The locking member 13 may be a screw, and the first mounting hole 1120 may be a screw hole.

In an embodiment, please refer to fig. 2 and fig. 3, as a specific implementation manner of the die bonding swing arm provided in the embodiment of the present application, an adjusting rod 113 is installed on the supporting seat 11, and a positioning guide rod 121 is correspondingly installed on the swing arm body 12; the side of the adjustment rod 113 facing the adjustment rod 121 is a first plane (not shown), and the side of the adjustment rod 121 facing the adjustment rod 113 is a second plane 1211 for aligning and attaching to the first plane. Specifically, the central axis of the adjusting rod 113 is collinear with the central axis of the positioning guide rod 121, and the central axis of the adjusting rod 113 is arranged along the Z-axis direction; the adjustment lever 113 may be mounted on the base 112. With this structure, by adjusting the length of the adjustment lever 113, the swing arm body 12 can be positioned in the horizontal plane (i.e., XY plane) when the first plane is aligned and bonded to the second plane 1211, thereby preventing the swing arm body 12 from tilting left and right.

In an embodiment, referring to fig. 2 and fig. 5, as a specific implementation of the die bonding swing arm provided in the embodiment of the present application, a plurality of openings 1110 are spaced apart from each other on the support base 11, and a central axis of each opening 1110 is parallel to a central axis of each through hole 10. Specifically, the plurality of holes 1110 may be disposed on the base 111 at intervals along the X-axis direction, and the central axis of each hole 1110 is disposed along the Y-axis direction. With this structure, the matching of the holes 1110 and the through holes 10 can further reduce the wind resistance on the swing arm 1, and prevent the wafer on the blue film from being displaced due to the excessive wind amount.

In an embodiment, referring to fig. 2, as a specific implementation of the die bonding swing arm provided in the embodiment of the present application, the swing arm 1 further includes an elastic member 14 connecting the support base 11 and the swing arm body 12. According to the structure, the middle part of the swing arm body 12 can be carried on the supporting seat 11, the swing arm body 12 can swing around the supporting seat 11 along the Z-axis direction, the elastic piece 14 can play a certain buffering protection role on the swing of the swing arm body 12, and the situation that the suction nozzle 2 is damaged on a wafer due to the fact that the stroke of the swing arm body 12 is too large is avoided. The elastic member 14 may be a spring.

In some embodiments, the middle position of the swing arm body 12 can also be hinged to the support base 11 through a hinge shaft, a torsion spring can be sleeved on the hinge shaft, one end of the torsion spring is abutted to the support base 11, and the other end of the torsion spring is abutted to the swing arm body 12. With the structure, the articulated shaft can improve the swinging effect of the swinging arm body 12; the torsion spring can play the same role as the elastic piece 14, and the buffer protection effect on the swing arm body 12 is realized.

In an embodiment, please refer to fig. 2, as a specific implementation manner of the die bonding swing arm provided in the embodiment of the present application, the swing arm 1 further includes a first pressing plate 15 for cooperating with the supporting base 11 to clamp one end of the elastic element 14, and a second pressing plate 16 for cooperating with the swing arm body 12 to clamp the other end of the elastic element 14; the first pressing plate 15 is connected with the supporting base 11, and the second pressing plate 16 is connected with the swing arm body 12. With the structure, the two ends of the elastic element 14 can be respectively locked and fixed on the supporting seat 11 and the swing arm body 12 through the first pressing plate 15 and the second pressing plate 16, which is beneficial to the assembly and disassembly of the elastic element 14.

In an embodiment, referring to fig. 5, 7 and 8, the supporting base 11 is formed with a plurality of first fixing holes 114, one end of the elastic element 14 is correspondingly formed with a plurality of second fixing holes 140, the first pressing plate 15 is correspondingly formed with a plurality of third fixing holes 150, and each of the first fixing holes 114, the corresponding second fixing holes 140 and the corresponding third fixing holes 150 are aligned and matched and are connected and fixed under the action of fasteners such as screws. Referring to fig. 4, 7 and 9, the swing arm body 12 is formed with a plurality of first positioning holes 123, the other end of the elastic member 14 is correspondingly formed with a plurality of second positioning holes 141, the second pressing plate 16 is correspondingly formed with a plurality of third positioning holes 160, and each first positioning hole 123, the corresponding second positioning hole 141 and the corresponding third positioning hole 160 are aligned and matched and are connected and fixed under the action of fasteners such as screws.

In an embodiment, referring to fig. 6, the supporting seat 11 is provided with a first step portion 115 for extending the end of the elastic element 14 and the first pressing plate 15, and the first step portion 115 can limit the elastic element 14 and the first pressing plate 15, which is helpful for improving the alignment installation efficiency of the elastic element 14 and the first pressing plate 15. Referring to fig. 4, the swing arm body 12 is provided with a second step portion 124 into which the other end of the elastic element 14 and the second pressing plate 16 extend, and the second step portion 124 can limit the elastic element 14 and the second pressing plate 16, which is helpful for improving the alignment installation efficiency of the elastic element 14 and the second pressing plate 16.

In an embodiment, referring to fig. 2, as a specific implementation of the die bonding swing arm provided in the embodiment of the present application, the first pressing plate 15 and the second pressing plate 16 are disposed at an interval. With the structure, the gap between the first pressure plate 15 and the second pressure plate 16 can play a certain role in buffering and resetting the swing of the swing arm body 12 so as to prevent the suction nozzle 2 from damaging the wafer.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. The utility model provides a solid brilliant swing arm, includes swing arm (1) and install in suction nozzle (2) on swing arm (1), its characterized in that: the plane on which the swing arm (1) rotates is a rotating plane, a plurality of through holes (10) are formed in the swing arm (1) at intervals, and the central axis of each through hole (10) is not perpendicular to the rotating plane; the swing arm (1) is provided with a windward surface and a leeward surface opposite to the windward surface, one end of each through hole (10) is located on the windward surface, and the other end of each through hole (10) is located on the leeward surface.

2. A die bonding swing arm according to claim 1, wherein: the axle wire of each through hole (10) is parallel to the rotating plane, and the axle wires of two adjacent through holes (10) are arranged in parallel.

3. A die bonding swing arm according to claim 1, wherein: the windward side and the leeward side are respectively inclined to the rotating plane.

4. A die bonding swing arm according to claim 1, wherein: the swing arm (1) comprises a supporting seat (11) and a swing arm body (12) with one end connected with the supporting seat (11), and the other end of the swing arm body (12) is provided with the suction nozzle (2); the swing arm body (12) is provided with a plurality of through holes (10) at intervals.

5. The die bonding swing arm of claim 4, wherein: a first mounting hole (1120) is formed in the supporting seat (11), and a second mounting hole (120) is correspondingly formed in the swing arm body (12); the swing arm (1) further comprises a locking member (13) passing through the second mounting hole (120) and locked in the first mounting hole (1120).

6. The die bonding swing arm of claim 4, wherein: an adjusting rod (113) is installed on the supporting seat (11), and a positioning guide rod (121) is correspondingly installed on the swing arm body (12); the side surface of the adjusting rod (113) facing the positioning guide rod (121) is a first plane, and the side surface of the positioning guide rod (121) facing the adjusting rod (113) is a second plane (1211) which is aligned with the first plane.

7. The die bonding swing arm of claim 4, wherein: a plurality of openings (1110) are arranged on the supporting seat (11) at intervals, and the central axis of each opening (1110) is parallel to the central axis of each through hole (10).

8. The die bonding swing arm of claim 4, wherein: the swing arm (1) further comprises an elastic piece (14) which is connected with the supporting seat (11) and the swing arm body (12).

9. A die bonding swing arm according to claim 8, wherein: the swing arm (1) further comprises a first pressing plate (15) and a second pressing plate (16), the first pressing plate is used for being matched with the supporting seat (11) to clamp one end of the elastic piece (14), and the second pressing plate is used for being matched with the swing arm body (12) to clamp the other end of the elastic piece (14); the first pressing plate (15) is connected with the supporting seat (11), and the second pressing plate (16) is connected with the swing arm body (12).

10. A die bonding swing arm according to claim 9, wherein: the first pressing plate (15) and the second pressing plate (16) are arranged at intervals.

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