CN215118114U

CN215118114U - Display module and display

Info

Publication number: CN215118114U
Application number: CN202120938186.0U
Authority: CN
Inventors: 贺建文
Original assignee: Jiangxi Lianchuang Wannian Electronic Co ltd
Current assignee: Jiangxi Lianchuang Wannian Electronic Co ltd
Priority date: 2021-04-30
Filing date: 2021-04-30
Publication date: 2021-12-10
Anticipated expiration: 2031-04-30

Abstract

The utility model provides a display module and a display, which comprises a CF substrate, a TFT substrate and a conductive structure for connecting the CF substrate and the TFT substrate, wherein the conductive structure comprises a conductive connecting part and a conductive medium, the conductive connecting part is arranged on the TFT substrate, is symmetrical relative to an IC module and is spaced from the IC module; the conductive medium comprises a first vertical part arranged on the conductive connecting part and a first horizontal part extending from the first vertical part, the conductive medium is spaced from the IC module and the flexible circuit board, and the CF substrate is bonded on the TFT substrate through the conductive medium. The bonding area of the TFT substrate and the CF substrate is increased through the first vertical part and the first horizontal part of the conductive medium, so that the conductive effect of the silver paste is improved, further, the conductive medium is spaced from the IC module, the situation that the silver paste is close to the IC module to influence the display effect is avoided, and the problems that the experimental effect of a display is poor and the phenomenon is different in the prior art are solved.

Description

Display module and display

Technical Field

The utility model relates to a display technical field, in particular to display module assembly and display.

Background

With the development of social economy and the rapid improvement of the living standard of people, the display is generally applied in the fields of mobile phones, computers and the like, and the silver paste process is an important process in the assembly of the display.

The display generally includes a display module, and in one of the processes of assembling the display module, the TFT substrate and the CF substrate in the display module need to be bonded together through a conductive structure, and the conductive structure discharges static electricity generated when the CF substrate is used in the display, so as to avoid static electricity damage.

In the prior art, a conductive structure of point silver paste is usually adopted to connect the TFT substrate and the CF substrate, and two silver paste points are painted on the TFT substrate to connect the CF substrate, so that the conductive area between the CF substrate and the TFT substrate is limited, and when the glass is originally poor in static electricity removing capability, the static electricity of the glass cannot be removed in a short time, which affects the customer experience effect, or even causes the phenomenon of drawing different.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model aims at providing a display module assembly for solve among the prior art display device and experience the effect poor and phenomenon draw different technical problem.

The application provides a display module assembly on one hand, which comprises a CF substrate, a TFT substrate and a conductive structure for connecting the CF substrate and the TFT substrate, wherein the TFT substrate is electrically connected with an IC module and a flexible circuit board;

the conductive medium comprises a first vertical part and a first horizontal part, the first vertical part is arranged on the conductive connecting part and extends out of the first horizontal part, the conductive medium is spaced from the IC module and the flexible circuit board, and the CF substrate is bonded on the TFT substrate through the conductive connecting part and the conductive medium.

Above-mentioned display module assembly, through scribble the conducting medium that relative IC module symmetry and spaced each other on the electrically conductive connecting portion of TFT base plate, conducting medium includes first vertical portion and first level and becomes, through first vertical portion and first horizontal portion have increased the bonding area of TFT base plate and CF base plate, have improved conducting medium's electrically conductive effect to make static on the display can discharge fast, further, the relative IC module of conducting medium is spaced each other, avoids conducting medium and IC module to be close too, disturbs the picture processing of IC module to the display, has solved the poor and phenomenon of display experience effect and has drawn different problems among the prior art.

Further, in the display module, the first horizontal portions of the conductive medium surround the back portion of the IC module, a spacing distance between the first horizontal portions is greater than a width of the flexible circuit board, and the CF substrate is bonded to the TFT substrate through the conductive connection portion in combination with the conductive medium.

Further, in the display module, the conductive connecting portion is rectangular, and the conductive medium is connected with the conductive connecting portion and disposed on the TFT substrate.

Further, in the display module, the conductive connecting portion is lower than the horizontal plane of the TFT substrate to form a groove.

Further, in the display module, a longitudinal section of the groove is any one of a trapezoid, a square or an arc.

Further, in the display module, the conductive connecting portion includes a second vertical portion and a second horizontal portion for accommodating the conductive medium, and the conductive medium is connected to the conductive connecting portion and disposed on the TFT substrate.

Further, in the display module, the conductive medium is silver paste.

This application another aspect still provides a display, including the display module assembly, the display module assembly be above-mentioned arbitrary display module assembly.

Drawings

Fig. 1 is a schematic view illustrating the assembly of a display module according to a first embodiment of the present invention;

fig. 2 is a schematic structural view of a conductive connection portion according to a first embodiment of the present invention;

FIG. 3 is a longitudinal sectional view of a conductive connecting portion according to a first embodiment of the present invention;

fig. 4 is a schematic structural view of a conductive connection portion according to a second embodiment of the present invention;

description of the main element symbols:

the following detailed description of the invention will be further described in conjunction with the above-identified drawings.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are given in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1, which is a display module according to a first embodiment of the present invention, including a CF substrate 400, a TFT substrate 300 and a conductive structure connecting the CF substrate 400 and the TFT substrate 300, wherein the TFT substrate 300 is electrically connected to an IC module 500 and a flexible circuit board 600, the conductive structure includes a conductive connecting portion 100 and a conductive medium 200, the conductive connecting portion 100 is disposed on the TFT substrate 300, and the conductive connecting portions 100 are symmetrical to the IC module 500 and spaced from each other;

in this implementation, the conductive medium 200 is made of silver paste and is connected to the CF substrate 400 and the TFT substrate 300 through the silver paste, the conductive medium 200 includes a first vertical portion 210 and a first horizontal portion 220, the first vertical portion 210 is disposed on the conductive connection portion 100 and is extended from the first vertical portion 210 to the first horizontal portion 220, the conductive medium 200 is opposite to the IC module 500 and the flexible circuit board 600, and the CF substrate 400 is bonded to the TFT substrate 300 through the conductive connection portion 100.

Further, the first horizontal portions 220 of the conductive medium 200 surround the back of the IC module 500, and the spacing distance between the first horizontal portions 220 is greater than the width of the flexible circuit board 600, and the CF substrate 400 is bonded to the TFT substrate 300 by the conductive connection portion 100 in combination with the conductive medium 200. Specifically, when bonding the CF board, IC module 500 both ends are located to the vertical portion symmetry of silver thick liquid, and be located electrically conductive connecting portion 100, the horizontal part that extends by vertical portion is located the IC module 500 back, and keep away from TFT base plate 300 lower extreme, reduce the length of TFT base plate 300 lower extreme from this, the structural design of TFT base plate 300 has been rationalized, in the bonding process has been avoided simultaneously, when CF base plate 400 extrudes TFT base plate 300, the silver thick liquid leaks from TFT base plate 300 lower extreme side, furthermore, distance between the horizontal part is greater than the width that is greater than flexible circuit board 600 when IC module 500 width, concrete distance need be according to the flexible circuit board 600 of isostructure, rationalized design, because the horizontal part of conducting medium 200 sets up at interval each other, when buckling flexible circuit board 600, flexible circuit board 600 can not cover the silver thick liquid, the silver thick liquid design has been optimized.

Referring to fig. 2, the conductive connection portion 100 is rectangular, the conductive medium 200 is dot-coated on the TFT substrate 300 from the position of the conductive connection portion 100, and the conductive surface of the conductive connection portion 100 is lower than the horizontal surface of the TFT substrate 300 to form a groove. Specifically, in the present embodiment, the depth of the groove is 1mm, but not limited thereto, the specific depth needs to be adjusted according to the TFT substrate 300 with different structures, and through the groove structure, when the conductive medium 200 is applied by dots, the vertical portion of the conductive medium 200 can be accommodated in the groove, so that the vertical portion of the conductive medium 200 is tightly attached to the conductive surface of the conductive connection portion 100, thereby avoiding an operation error, which causes the conductive medium 200 to be applied by dots to a position other than the conductive connection portion 100, resulting in a short circuit, and thus, increasing the safety of the silver paste.

Referring to fig. 3, the longitudinal section 110 of the groove is any one of a trapezoid, a square or an arc. The longitudinal section 110 of recess is trapezoidal in this embodiment, but is not limited to this, carries out the water conservancy diversion to the silver thick liquid through the slope of 4 sides of recess inner wall, the laminating degree of further reinforcing silver thick liquid and the conducting surface of conductive connection portion 100.

In this embodiment, the thickness of the conductive medium 200 is greater than 1mm of the distance between the CF substrate 400 and the TFT substrate 300, but not limited thereto, and the thickness of the silver paste is slightly greater than that of the CF substrate 400, and the silver paste is diffused onto the CF substrate 400 when the silver paste exceeding the CF substrate 400 is bonded to the CF substrate 400, so as to stabilize the installation state of the CF substrate 400 and the TFT substrate 300.

To sum up, the utility model discloses display module assembly in the middle of the above-mentioned embodiment, through scribble relative IC module symmetry and spaced conductive medium each other on the electrically conductive connecting portion of TFT base plate, conductive medium includes first vertical portion and first level one-tenth, through first vertical portion has increased the bonding area of TFT base plate and CF base plate with first horizontal portion, has improved conductive medium's electrically conductive effect to make the static on the display can discharge fast, and further, the relative IC module of conductive medium is spaced each other, avoids conductive medium and IC module to lean on too closely, disturbs the picture processing of IC module to the display, has solved the problem that the display body experiences the effect difference and the phenomenon draws the difference among the prior art.

Please refer to fig. 4, which is a display module according to the second embodiment of the present invention, the display module in this embodiment is different from the display module in the first embodiment in that: the conductive connection portion 100 includes a second vertical portion 710 and a second horizontal portion 720 for receiving the conductive medium 200, and the conductive medium 200 is connected to the conductive connection portion 100 and disposed on the TFT substrate 300. Specifically, through setting up matching and silver thick liquid assorted electrically conductive connecting portion 100, the further electrically conductive contact surface of increase TFT basic and CF base plate 400 to improve the electrically conductive effect of silver thick liquid.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A display module comprises a CF substrate, a TFT substrate and a conductive structure for connecting the CF substrate and the TFT substrate, wherein the TFT substrate is electrically connected with an IC module and a flexible circuit board;

2. The display module of claim 1, wherein the first horizontal portions of the conductive medium surround the back portion of the IC module, and the first horizontal portions are spaced apart by a distance greater than the width of the flexible circuit board, and the CF substrate is bonded to the TFT substrate through the conductive connection portion in combination with the conductive medium.

3. The display module of claim 1, wherein the conductive connection portion is rectangular, and the conductive medium is disposed on the TFT substrate and connected to the conductive connection portion.

4. The display module of claim 1, wherein the conductive connection is formed below a horizontal plane of the TFT substrate to form a recess.

5. The display module according to claim 4, wherein the longitudinal section of the groove is any one of trapezoid, square or arc.

6. The display module of claim 1, wherein the conductive connection portion comprises a second vertical portion and a second horizontal portion for receiving the conductive medium, and the conductive medium is connected to the conductive connection portion and disposed on the TFT substrate.

7. The display module of claim 1, wherein the conductive medium is silver paste.

8. A display comprising a display module according to any one of claims 1 to 7.