CN215090391U - No-clean transistor pin shearing forming equipment - Google Patents

Abstract

The utility model discloses a washing-free transistor pin-shearing forming device, which comprises a panel and a control system, wherein a feeding mechanism for providing transistor element raw materials, a pin-shearing forming mechanism for forming and cutting transistor element welding pins and a receiving mechanism for collecting processed transistor elements are arranged on the panel, a carrying mechanism for carrying the transistor elements among the feeding mechanism, the pin-shearing forming mechanism and the receiving mechanism is arranged between the feeding mechanism, the pin-shearing forming mechanism and the receiving mechanism, the control system is used for controlling the carrying mechanism and the pin-shearing forming mechanism to work, the carrying mechanism can take the transistor elements from the feeding mechanism to the pin-shearing forming mechanism for forming and pin-shearing and then move to the receiving mechanism during the work, workers do not need to take the transistor elements to a next procedure during the work, thereby avoiding the pollution of the transistor caused by the touch of hands and the high production efficiency and simultaneously saving the cleaning and drying procedures of the transistor elements, manpower and logistics cost are saved.

Description

No-clean transistor pin shearing forming equipment

Technical Field

The utility model relates to a foot former is cut to exempt from to wash transistor.

Background

The existing operation mode of a factory is that a pin is firstly uniformly cut and formed through a manual forming die, then deionized water is used for cleaning the surface of a transistor through an ultrasonic cleaning machine, and then the transistor is dried by filtering and enters an oven for drying, so that a radiator is assembled by adhering silicone grease, the production efficiency is low, and the use cost is high. In addition, different cutters and forming dies are required to be switched for different products with different sizes, such as different products with different cutting lengths, or different products, after die change, die testing is usually required to confirm whether an electronic component formed by pin cutting meets the specification, and the die testing is usually adjusted by adjusting the cutters and the forming dies, so that the die change and die testing time is long, the efficiency is low, and the die testing is easy to cause the increase of defective products due to the fact that the burrs of the pin cutting are too large or the forming size is not in place.

The present invention is made based on such a situation.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the defects of the prior art and providing a washing-free transistor pin shearing forming device.

The utility model discloses a realize through following technical scheme:

the utility model provides a washing-free transistor cuts foot former, includes panel and control system, be equipped with the feed mechanism that is used for providing the transistor component raw materials on the panel, be used for the transistor component leg to cut out fashioned foot forming mechanism of cutting and be used for collecting the receiving agencies of the transistor component that has processed, be equipped with the transport mechanism who is used for carrying the transistor component between the three between feed mechanism, foot forming mechanism and receiving agencies, control system is used for controlling transport mechanism and the work of foot forming mechanism of cutting.

The washing-free transistor pin cutting and forming equipment comprises a pin cutting and forming mechanism for cutting and forming the transistor element pins, a first control device for controlling the pin cutting and forming mechanism to work, and a second control device capable of adjusting the position of the pin cutting and forming mechanism is arranged below the pin cutting and forming mechanism.

Like foretell transistor-free pin-shearing former, tailor shaping structure including be used for transistor element leg to tailor fashioned demountable installation's pin-shearing shaping module, be equipped with the forming bottom plate that is used for installing pin-shearing shaping module in the below of cutting pin-shearing shaping module, first controlling means including fixed connection at forming bottom plate both sides end and be used for controlling the die-cut cylinder of pin-shearing shaping module work, second controlling means including connecting the cross slip table that moves in order to control the bottom plate in a vertical plane in forming bottom plate below.

The free transistor of washing cuts foot former, transport mechanism is including being used for cliping transistor component press from both sides the mechanism and be used for controlling the third controlling means of cliping the mechanism removal, clip and press from both sides the finger that the mechanism was including being used for cliping transistor component and press from both sides the top of finger clip is equipped with and controls the finger and press from both sides the finger cylinder of cliping transistor component, third controlling means including being used for controlling the finger clip to move on X axle direction and make the finger clip can carry out the third straight line slip table module of carrying between feed mechanism, cut foot former and receiving agencies, feed mechanism, cut foot former and receiving agencies arrange along X axle direction.

The washing-free transistor pin shearing forming equipment comprises a plurality of feeding pipes which are arranged in parallel along the Y-axis direction and used for providing transistor elements, wherein a blocking structure capable of blocking the transistor elements from falling out of the feeding pipes and a track structure capable of enabling the transistor elements to move are arranged at the lower port of each feeding pipe, a fourth control device capable of enabling the feeding pipes to move in the Y-axis direction and enabling the feeding pipes to be in butt joint with the track structure is arranged below the feeding pipes, and a fifth control device capable of enabling the transistor elements in the feeding pipes to smoothly slide into the track structure is used for finely adjusting the feeding pipes according to the material bottom heights of different transistor elements.

The device for forming the transistor pin-cut free from washing comprises a feeding baffle plate arranged at the lower port of the feeding pipe and used for preventing the transistor element from falling out of the unused feeding pipe, a first cylinder capable of blocking the transistor element from sliding into the rail structure is arranged at the junction of the rail structure and the feeding pipe, a first optical fiber sensor which can sense the transistor element and further transmit signals to a control system to control the first cylinder to work is arranged beside the first cylinder, a material blocking sheet for blocking the transistor element from continuously sliding is arranged at the other end of the track structure, the second optical fiber sensor capable of sensing the transistor element and transmitting signals to the control system to control the carrying mechanism to clamp the transistor element is arranged below the material blocking piece, and a reset spring capable of enabling the material blocking piece to reset is arranged on the outer side of the material blocking piece.

According to the washing-free transistor pin-shearing forming equipment, the material receiving mechanism comprises the chute for placing the transistor element, the side, far away from the pin-shearing forming mechanism, of the chute is provided with the material receiving pipe for collecting the transistor element, and the side, close to the pin-shearing forming mechanism, of the chute is provided with the material pushing device capable of pushing the transistor element to enter the material receiving pipe.

According to the above washing-free transistor pin cutting and forming equipment, the material pushing device comprises a finished product handler capable of pushing the transistor element to enter the material receiving pipe, a second cylinder fixedly connected below the finished product handler and capable of moving the position of the finished product handler and pushing the transistor element to enter the material receiving pipe, and a third cylinder connected below the second cylinder.

According to the above washing-free transistor pin-shearing forming device, the receiving pipes are arranged side by side along the Y-axis direction, the sixth control device capable of moving the receiving pipes in the Y-axis direction to align the receiving pipes with the chute is arranged below the feeding pipes, and the seventh control device capable of finely adjusting the positions of the receiving pipes in the Z-axis direction according to the heights of the bottoms of different transistor elements to enable the transistor elements on the chute to be smoothly pushed into the receiving pipes by finished product discharging hands.

Compared with the prior art, the utility model discloses there is following advantage:

1. the utility model discloses carry out during operation transport mechanism and can get transistor element from feed mechanism presss from both sides to cut the leg forming mechanism and carry out removing receiving agencies after the shaping of tailorring of leg welding, need not the workman and go to taking the next procedure to transistor element with the hand in the course of the work, avoided the staff touch to cause the transistor to pollute and the high washing stoving process of having saved transistor element simultaneously of production efficiency, use manpower sparingly and logistics cost.

2. The utility model discloses a cut moulded die and cutting die constitution among the foot forming mechanism and cut foot shaping module, the cutting die is located the inboard of moulded die, can realize the shaping of transistor element leg and tailor, thereby need not often to go to trade the shaping that different moulds realized transistor element leg respectively and tailor and improve production efficiency.

3. The utility model discloses a cut sharp slip table module that has its removal in Y axle and Z axle direction of control among the foot forming mechanism for only need select after the retooling to correspond shaping automatic adjustment can fast production, reduce retooling and examination mould time, raise the efficiency, reduce the defective products.

4. The utility model discloses a transport mechanism is including the controlling means who is used for cliping the mechanism and is used for the control clamp to get the mechanism removal of transistor component, can be accurately get transistor component from the last process clamp and reduce the produced error of processing and avoid artificial pollution to the next process.

5. The utility model discloses be close to the end of cutting foot forming mechanism at track structure and be equipped with optical fiber sensor, optical fiber sensor senses transistor element transmission signal and controls transport mechanism for control system and come to press from both sides the transistor element and get, realizes that full-automatic processing saves the manual work, improves production efficiency.

6. When the conveying mechanism places the transistor elements in the chutes among the finished product seats, the finished product arranging handles push the transistor elements into the material receiving pipes, so that the automatic collection and pipe loading of the transistor elements are realized, and the phenomenon that the manual pipe loading possibly causes pollution to influence the performance of the transistors is avoided.

Drawings

The following detailed description of embodiments of the present invention is provided with reference to the accompanying drawings, in which:

FIG. 1 is a perspective view of the no-clean transistor pin-cutting forming device of the present invention;

fig. 2 is a perspective view of the feeding mechanism of the present invention;

FIG. 3 is an enlarged view of the structure A of FIG. 2 according to the present invention;

FIG. 4 is an enlarged view of the structure B of FIG. 2 according to the present invention;

fig. 5 is a perspective view of the carrying mechanism of the present invention;

fig. 6 is a left side view of the pin shearing forming mechanism of the present invention;

fig. 7 is an exploded view of the shear foot forming mechanism of the present invention;

fig. 8 is a perspective view of the material receiving mechanism of the present invention;

fig. 9 is an exploded view of the receiving mechanism of the present invention.

Detailed Description

The invention will be further described with reference to the accompanying drawings:

the no-clean transistor pin cutting forming equipment shown in fig. 1 to 8 comprises a panel 6 and a control system 5, wherein a feeding mechanism 1 for providing raw materials for a transistor element, a pin cutting forming mechanism 3 for forming and cutting a transistor element pin and a material receiving mechanism 4 for collecting the processed transistor element are arranged on the panel 6, a carrying mechanism 2 for carrying the transistor element among the feeding mechanism 1, the pin cutting forming mechanism 3 and the material receiving mechanism 4 is arranged among the feeding mechanism 1, the pin cutting forming mechanism 3 and the material receiving mechanism 4, and the control system 5 is used for controlling the carrying mechanism 2 and the pin cutting forming mechanism 3 to work.

The utility model provides a control system 5 can control transport mechanism 2 and will be located feeding system 1 unprocessed transistor element clamp and get on cutting foot forming mechanism 3, cut foot forming mechanism 3 and tailor the shaping back to transistor element's leg, control system 5 controls transport mechanism 2 again and will cut the fashioned transistor element of leg and transfer to receiving agencies 4, collect the tubulation by receiving agencies 4 with the transistor element that has processed, need not the workman and go to take the next procedure to the transistor element with the hand in the course of the work, avoided the staff touch to cause the transistor to pollute and the high washing stoving process of leaving out the transistor element simultaneously of production efficiency, use manpower sparingly and logistics cost.

As the embodiment shown in fig. 4, transport mechanism 2 is including being used for cliping transistor element's the mechanism of pressing from both sides and being used for controlling the third controlling means that the mechanism removed of pressing from both sides, it presss from both sides 21 including the finger that is used for cliping transistor element to press from both sides the mechanism the top of finger clip 21 is equipped with and controls finger clip 21 and carry out the finger cylinder 22 of cliping transistor element, third controlling means including being used for controlling finger clip 21 to move in the X axle direction and make finger clip 21 carry out the third straight line slip table module 23 of carrying between feed mechanism 1, cut foot forming mechanism 3 and receiving agencies 4, feed mechanism 1, cut foot forming mechanism 3 and receiving agencies 4 arrange along the X axle direction.

The third linear sliding table module 23 is an embedded screw linear sliding table module and is driven by a motor, the motor drives a screw to move the sliding table, so that the clamping mechanism moves in the X-axis direction, the third linear sliding table module 23 enables the clamping mechanism to move above the track structure 15 to clamp the transistor element and then move above the pin shearing forming mechanism to transfer the transistor element to the top of the finished product seat 41 to place the transistor element in the chute 42 after the pins of the transistor element are sheared and formed.

As shown in fig. 2 to 4, the feeding mechanism 1 includes a plurality of feeding tubes 11 arranged in parallel along the Y-axis direction and used for supplying transistor elements, a blocking structure arranged at the lower port of the feeding tube 11 and used for blocking the transistor elements from falling out of the feeding tube 11 unused and a track structure 15 used for moving the transistor elements, a fourth control device 12 arranged below the feeding tube 11 and used for moving the feeding tube 11 in the Y-axis direction and butting one of the feeding tubes 11 with the track structure 15, and a fifth control device 13 arranged below the feeding tube 11 and used for finely adjusting the feeding tube 11 according to the material bottom height of different transistor elements and used for enabling the transistor elements in the feeding tube 11 to smoothly slide into the track structure 15, wherein the blocking structure includes a feeding baffle 14 arranged at the lower port of the feeding tube 11 and used for blocking the transistor elements from falling out of the feeding tube 11, and a junction between the track structure 15 and the feeding tube 11 and used for blocking the transistor elements from sliding into the track structure 15 The device comprises a first air cylinder 16, a first optical fiber sensor 17 which is arranged beside the first air cylinder 16 and can sense a transistor element to transmit a signal to a control system 5 to control the first air cylinder 16 to work, a material blocking sheet 18 which is used for blocking the transistor element to continuously slide is arranged at the other end of a track structure 15, a second optical fiber sensor 171 which is arranged below the material blocking sheet 18 and can sense the transistor element to transmit a signal to the control system 5 to control a carrying mechanism 2 to clamp the transistor element is arranged, and a return spring 20 which can make the material blocking sheet 18 reset is arranged on the outer side of the material blocking sheet 18.

The fourth control device 12 is controlled by a cylinder, a piston rod moves in a piston manner when the cylinder enters and exits air, and then the feed pipes 11 are controlled to move in the Y-axis direction so that one of the feed pipes 11 is butted with the track structure 15, the fifth control device 13 is controlled by a screw rod, the feed pipes 11 are finely adjusted according to the material bottom heights of different transistor elements by rotating the screw rod, so that the transistor elements in the feed pipes 11 can smoothly slide into a track chute 151 of the track structure 15, a feed baffle 14 at the lower port of the feed pipes 11 can prevent the unused transistor elements in the feed pipes 11 from falling down, a first cylinder 16 is arranged at the junction of the track chute 151 and the lower port of the feed pipes 11, a first optical fiber sensor 17 aligned with the track chute 151 is arranged beside the first cylinder 16, and when the transistor elements are not sensed by the first optical fiber sensor 17 after the transistor elements exist in the feed pipes 11 in use, a signal is transmitted to the control system 5 to control the piston rod of the first cylinder 16 to move downwards and block the piston rod After the second transistor-equipped feeding tube 11 is aligned with the rail chute 151, the control system 5 controls the piston rod of the mini cylinder 16 to move upward to allow the transistor component to smoothly slide down from the feeding tube 11 to the sliding rail chute 151, so as to prevent the transistor component or the device from being damaged due to the fact that the transistor component in the feeding tube 11 slides into the rail chute 151 and the feeding tube 11 moves when the feeding tube 11 is adjusted; when the transistor element moves to the striker 18, the second optical fiber sensor 171 below the striker 18 senses the transistor element and transmits a signal to the control system 5, so as to control the carrying mechanism 2 to clamp the transistor element onto the trimming pin forming mechanism 3, when the carrying mechanism 2 clamps the transistor element, the striker 18 is flushed, and at this time, the return spring 20 outside the striker 18 can push the striker swing seat 19 to return the striker 18.

As shown in fig. 6 to 7, the trimming and forming mechanism 3 includes a trimming and forming structure for trimming and forming the solder fillet of the transistor device and a first control device for controlling the trimming and forming structure, a second control device is disposed below the trimming and forming structure and can adjust the position of the trimming and forming mechanism 3 according to the shape and size of the solder fillet of the transistor device with different specifications, the trimming and forming structure includes a detachably mounted trimming and forming module 30 for trimming and forming the solder fillet of the transistor device, a forming bottom plate 34 for mounting the trimming and forming module 30 is disposed below the trimming and forming module 30, the first control device includes punching cylinders 31 disposed at the two side ends of the forming bottom plate 34 and used for controlling the operation of the trimming and forming module 30, a first base 32 and a second base 33 for mounting the punching cylinders 31 are disposed at the two side ends of the forming bottom plate 34 in the Y-axis direction, a first photo-magnetic rod 35 of the sense transistor element is mounted on a side of an inner side surface of the first base 32 in the Y-axis direction of one end of the molded base 34 near the track structure 15, a second photo-magnetic rod 36 of the sense transistor element is mounted on the side of the inner side surface of the second base 33 at the other end of the shaped bottom plate 34 in the Y-axis direction away from the track structure 15, a waste collecting mechanism 39 for collecting waste generated by transistor pin cutting is fixedly connected with one side of the forming bottom plate 34 close to the feeding mechanism 1, the second control means comprises a cross slide connected below the profiled bottom plate 34 to control the movement of the bottom plate 34 in a vertical plane, the cross sliding table comprises a first linear sliding table module 37 and a second linear sliding table module 38, wherein the first linear sliding table module 37 can adjust the pin shearing forming mechanism 3 to a proper processing position according to the shape and size required by transistor element welding pins with different specifications, and the second linear sliding table module 38 is arranged below the first linear sliding table module 37.

The first straight sliding table module 37 and the second straight sliding table module 38 are both embedded screw rod straight sliding table modules, which are driven by a motor, the motor drives a screw rod to move the sliding tables, the first straight sliding table module 37 and the second straight sliding table module 38 are adjusted according to the specifications of transistor pin trimming, the pin trimming forming mechanism 3 is adjusted to a proper position, the pin trimming forming module 30 of the pin trimming forming mechanism 3 is ensured to perform the cutting forming of the pins according to the shape and size required by the pins of the transistor element, when the transistor element is clamped on the pin trimming forming mechanism 3 by the carrying mechanism 2, the first photo-magnetic rod 35 senses the passing of the transistor element, and transmits a signal to the control system 5 to control the punching cylinder 31 to push the pin trimming forming module 30 to form and cut the pins of the transistor element, and the punching cylinder 31 pulls the pin trimming forming module 30 to reset after the pin trimming is formed, when the transporting mechanism 2 continues to move the transistor device, when the second photo-magnetic rod 36 senses the transistor device, it will transmit a signal to the control system 5 to control the material receiving mechanism 4 to collect the transistor device, and the waste material generated by the formation and cutting of the transistor device solder fillet will fall on the inclined surface 341 inclined downward toward the waste material collecting mechanism 39 to slide into the waste material collecting mechanism 39 for collecting the waste material.

As shown in fig. 8 to 9, the material pushing device includes a finished product discharging hand 44 capable of pushing the transistor elements into the material receiving tube 43, a second cylinder 45 fixedly connected below the finished product discharging hand 44 and capable of moving the position of the finished product discharging hand 44 and pushing the transistor elements into the material receiving tube 43, and a third cylinder 46 connected below the second cylinder 45, wherein the material receiving tube 43 is arranged side by side along the Y-axis direction, a sixth control device 47 capable of moving the material receiving tube 43 in the Y-axis direction and aligning the material receiving tube 43 with the chute 42 is arranged below the material supplying tube 11, and a seventh control device 48 capable of finely adjusting the position of the material receiving tube 43 in the Z-axis direction according to the material bottom height of different transistor elements so that the transistor elements on the chute 42 can be smoothly pushed into the material receiving tube 43 by the finished product discharging hand 44.

The second cylinder 45 can control the finished product discharging hand 44 to move in the X-axis direction, the third cylinder 46 below the second cylinder 45 can control the finished product discharging hand 44 to move in the Z-axis direction, the position of the finished product discharging hand 44 is controlled by the second cylinder 45 and the third cylinder 46 together to enable a push block at the upper end of the finished product discharging hand 44 to align with a transistor element on the chute 42 and then push the transistor element into the material receiving pipe 43, the sixth control device 47 is controlled by the cylinder, a piston rod moves in a piston manner when the cylinder enters and exits air to control the material receiving pipe 43 to move in the Y-axis direction to align one of the material receiving pipes 43 with the chute 42, the seventh control device 48 is controlled by a screw rod, the position of the material receiving pipe 43 in the Z-axis direction is finely adjusted by rotating the screw rod according to the material bottom height of different transistor elements, so that the transistor element on the chute 42 can be smoothly pushed into the material receiving pipe 43 by the finished product discharging hand 44, and automatic collection and tubing of the transistor elements is realized, avoid the manual tubulation and probably cause the pollution to influence the performance of transistor.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (9)

1. The utility model provides a exempt from to wash transistor cuts foot former which characterized in that: including panel (6) and control system (5), be equipped with on panel (6) and be used for providing feeding mechanism (1) of transistor component raw materials, be used for transistor component leg to tailor fashioned leg forming mechanism (3) of cutting and be used for collecting receiving agencies (4) of the transistor component that has processed, be equipped with between feeding mechanism (1), leg forming mechanism (3) of cutting and receiving agencies (4) and be used for carrying transport transistor component's transport mechanism (2) between the three, control system (5) are used for controlling transport mechanism (2) and leg forming mechanism (3) work of cutting.

2. The no-clean transistor pin-shearing forming device as claimed in claim 1, wherein: the pin shearing forming mechanism (3) comprises a cutting forming structure used for cutting and forming the transistor element welding pins and a first control device for controlling the cutting forming structure to work, and a second control device capable of adjusting the position of the pin shearing forming mechanism (3) is arranged below the cutting forming structure.

3. The no-clean transistor pin-shearing forming device as claimed in claim 2, wherein: tailor forming structure including be used for transistor element leg to tailor fashioned demountable installation's foot shaping module (30) of cutting, be equipped with below cutting foot shaping module (30) and be used for installing shaping bottom plate (34) of cutting foot shaping module (30), first controlling means including fixed connection at shaping bottom plate (34) both sides end and be used for controlling die-cut cylinder (31) of cutting foot shaping module (30) work, second controlling means including connecting at shaping bottom plate (34) below with control bottom plate (34) the cross slip table of a vertical in-plane removal.

4. The no-clean transistor pin-shearing forming device as claimed in claim 1, wherein: transport mechanism (2) press from both sides the mechanism and be used for controlling to press from both sides the third controlling means that the mechanism removed including the finger that is used for cliping transistor element and press from both sides (21) the top that the finger pressed from both sides (21) is equipped with and controls finger clamp (21) and clip finger cylinder (22) of transistor element, third controlling means including being used for controlling finger clamp (21) to remove on X axle direction and make finger clamp (21) can carry out the third straight line slip table module (23) of carrying between feeding mechanism (1), cut foot forming mechanism (3) and receiving agencies (4), feeding mechanism (1), cut foot forming mechanism (3) and receiving agencies (4) arrange along X axle direction.

5. The no-clean transistor pin-shearing forming device as claimed in claim 4, wherein: the feeding mechanism (1) comprises a plurality of feeding pipes (11) which are arranged in parallel along the Y-axis direction and used for providing transistor elements, a blocking structure capable of blocking the transistor elements from falling out of the feeding pipes (11) and a track structure (15) capable of enabling the transistor elements to move are arranged at the lower port of the feeding pipes (11), a fourth control device (12) capable of enabling the feeding pipes (11) to move in the Y-axis direction to enable the feeding pipes (11) to be in butt joint with the track structure (15) is arranged below the feeding pipes (11), and a fifth control device (13) capable of enabling the transistor elements in the feeding pipes (11) to smoothly slide into the track structure (15) is finely adjusted according to the material bottom heights of different transistor elements.

6. The no-clean transistor pin-shearing forming device as claimed in claim 5, wherein: the blocking structure comprises a feeding baffle (14) which is arranged at the lower port of the feeding pipe (11) and can block a transistor element from falling out of the unused feeding pipe (11), a first air cylinder (16) which can block the transistor element from sliding into the rail structure (15) is arranged at the junction of the rail structure (15) and the feeding pipe (11), a first optical fiber sensor (17) which can sense the transistor element and transmit a signal to the control system (5) to control the first air cylinder (16) to work is arranged beside the first air cylinder (16), a blocking piece (18) which is used for blocking the transistor element from continuously sliding is arranged at the other end of the rail structure (15), a second optical fiber sensor (171) which can sense the transistor element and transmit a signal to the control system (5) to control the carrying mechanism (2) to clamp the transistor element is arranged below the blocking piece (18), and a return spring (20) capable of returning the material blocking piece (18) is arranged on the outer side of the material blocking piece (18).

7. The no-clean transistor pin-shearing forming device as claimed in claim 1, wherein: the receiving mechanism (4) comprises a sliding groove (42) for placing the transistor element, a receiving pipe (43) for collecting the transistor element is arranged on one side, away from the pin shearing forming mechanism (3), of the sliding groove (42), and a pushing device capable of pushing the transistor element to enter the receiving pipe (43) is arranged below one side, close to the pin shearing forming mechanism (3), of the sliding groove (42).

8. The no-clean transistor pin-shearing forming device as claimed in claim 7, wherein: the material pushing device comprises a finished product arranging hand (44) capable of pushing the transistor element to enter the material receiving pipe (43), a second air cylinder (45) fixedly connected below the finished product arranging hand (44) and capable of moving the position of the finished product arranging hand (44) and pushing the transistor element to enter the material receiving pipe (43), and a third air cylinder (46) connected below the second air cylinder (45).

9. The no-clean transistor pin-shearing forming device as claimed in claim 8, wherein: the feeding device comprises a plurality of material receiving pipes (43) which are arranged side by side along the Y-axis direction, a sixth control device (47) which can enable the material receiving pipes (43) to move in the Y-axis direction to enable the material receiving pipes (43) to be aligned with the sliding chute (42) and a seventh control device (48) which can finely adjust the positions of the material receiving pipes (43) in the Z-axis direction according to the heights of the bottoms of different transistor elements to enable the transistor elements on the sliding chute (42) to be smoothly pushed into the material receiving pipes (43) by a finished product handler (44) are arranged below the feeding pipe (11).

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