CN215088506U - Quick adhesive deposite device of chip - Google Patents
Quick adhesive deposite device of chip Download PDFInfo
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- CN215088506U CN215088506U CN202121686452.1U CN202121686452U CN215088506U CN 215088506 U CN215088506 U CN 215088506U CN 202121686452 U CN202121686452 U CN 202121686452U CN 215088506 U CN215088506 U CN 215088506U
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- glue
- chip
- heating
- dispensing
- glue storage
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Abstract
The utility model discloses a quick adhesive deposite device of chip relates to chip processing technology field. The method comprises the following steps: device shell, link, storage glue case, point are glued rifle, chip and are placed board, heating agitator tank, motor. Has the advantages that: glue in the heating and stirring tank is continuously stirred by the stirring paddle under the heating action of the heating pipe, so that the glue is not easy to solidify at a high temperature and is uniformly stirred, finally the glue is extracted by the motor and extruded from the bottom end of the glue dispensing gun to dispense chips, a large number of chips can be dispensed by each dispensing, the glue dispensing efficiency is improved, and the glue dispensing gun is prevented from being blocked by the solidification of the glue to prevent the continuous process of the glue dispensing gun; the chip placing plate capable of moving on the top end of the sliding rail in a directional mode is arranged, chips in the chip placing grooves are placed on the plate after glue dispensing is completed, the chip placing plate continues to slide on the sliding rail, the chip placing plate is conveyed out, new chips can be placed on the sliding rail continuously, production efficiency is improved, and the purpose of quick glue dispensing is achieved.
Description
Technical Field
The utility model relates to a chip processing technology field particularly, relates to a quick adhesive deposite device of chip.
Background
Along with the development of the technology, the chip is applied more and more widely in daily life, the chip dispensing technology is a common procedure in the chip processing process, and the chip can be well fixed on a fixed plate through chip dispensing, so that the chip of the whole electronic product cannot collide with other parts to generate vibration to damage the chip when the chip is vibrated.
The existing chip glue dispensing device has a complex structure, but the glue dispensing efficiency is not high, and a large amount of time is often occupied in the glue dispensing process flow, so that the production efficiency is reduced.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
To the problem among the correlation technique, the utility model provides a quick adhesive deposite device of chip to overcome the above-mentioned technical problem that current correlation technique exists.
The technical scheme of the utility model is realized like this:
a quick adhesive deposite device of chip includes: the device comprises a device shell, a connecting frame, a glue storage box, a chip placing plate, a heating and stirring tank and a motor, wherein an observation window is arranged at the top end of the front surface of the device shell, a slide rail is arranged in the device shell, a supporting plate is arranged at the bottom end of the device shell, the connecting frame is arranged at the top end of the inner part of the device shell, supporting columns are arranged at four corners of the connecting frame, the glue storage box is arranged at the bottom end of the supporting column, a glue storage cavity is arranged in the glue storage box, a heat insulation plate is arranged at the top end of the glue storage box, a connecting pipe is arranged at one end of the glue storage box, a fixed plate is arranged at the bottom end of the glue storage box, a plurality of glue dispensing guns are arranged on the fixed plate, a connecting port is arranged at the top ends of the glue dispensing guns, a chip placing plate is arranged above the slide rail, a plurality of chip placing grooves are arranged at the top end of the chip placing plate, a slide groove is arranged at the bottom end of the chip placing plate, and the heating and stirring tank is arranged above the supporting plate, the inside central authorities of heating agitator tank are provided with the stirring rake, the inside heating pipe that is provided with of heating agitator tank, heating agitator tank one end is provided with the motor, the one end that the heating agitator tank was kept away from to the motor is provided with the rubber outlet pipe.
Further, glue in the motor extraction heating agitator tank is sent into inside the device shell through going out the glue pipe, then sends into inside the glue storage chamber through the connecting pipe.
Further, the glue storage cavity is communicated with the glue dispensing gun through a connecting port.
Further, the glue dispensing gun corresponds to the chip placing grooves formed in the top end of the chip placing plate one by one.
Further, the sliding groove moves in a single direction under the limitation of the sliding rail, and the sliding groove drives the chip placing plate to move in a single direction on the sliding rail.
The utility model has the advantages that whether each mechanism of the detection device operates normally or not is detected, chips to be glued are respectively placed in the chip placing grooves arranged at the top end of the chip placing plate, the chip placing plate slides to the right below the connecting frame under the limitation of the slide rail through the slide grooves arranged at the bottom end of the chip placing plate, so that the glue dispensing gun and the chip placing grooves arranged at the top end of the chip placing plate correspond to each other one by one, the glue in the heating and stirring tank is continuously stirred by the stirring paddle under the heating action of the heating pipe, the glue is uniformly stirred at the higher temperature while being not easy to solidify, the glue in the heating and stirring tank is extracted by the motor and is sent into the shell of the device through the glue outlet pipe, then the glue is sent into the glue storage cavity through the connecting pipe, the glue after being stirred and uniformly mixed is sent into the glue storage cavity through the motor, the glue storage cavity is communicated with the glue dispensing gun through the connecting port, and then will store up glue intracavity glue and extrude from the gluey rifle bottom of point through the connector and carry out the point glue to the chip, the chip is placed the board and is continued unidirectional movement on the slide rail after the point glue is accomplished, and then makes the chip that the point glue was accomplished send out whole device, and the above-mentioned operation of circulation reaches the purpose of circulation to production. According to the quick chip glue dispensing device, the heating stirring tank is arranged, glue in the heating stirring tank is continuously stirred by the stirring paddle under the heating action of the heating pipe, so that the glue is not easy to solidify at a high temperature and is uniformly stirred, the glue is finally extracted by the motor and extruded from the bottom end of the glue dispensing gun to dispense the chips, a large number of chips can be dispensed by each dispensing, the whole glue dispensing time is saved, the glue dispensing efficiency is improved, and the situation that the glue dispensing gun is blocked by the solidification of the glue to block the continuous process is avoided; this quick adhesive deposite device of chip places the board through setting up the chip that can orientate and remove on the slide rail top, and the chip in the chip standing groove is placed the board and is continued to slide on the slide rail and place the board and see off the chip after the point is glued to the chip to can constantly place new chip on the slide rail and place the board and reach the purpose of circulation production, improve production efficiency and reach the purpose of quick point gluing.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
fig. 2 is a schematic diagram of an overall explosion according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view according to an embodiment of the present invention.
In the figure:
1. a device housing; 11. an observation window; 12. a slide rail; 13. a support plate; 2. a connecting frame; 21. a support pillar; 3. a glue storage box; 31. a glue storage cavity; 32. a thermal insulation board; 33. a connecting pipe; 4. a fixing plate; 41. dispensing a glue gun; 42. a connecting port; 5. a chip placement board; 51. a chip placing groove; 52. a chute; 6. heating the stirring tank; 61. a stirring paddle; 62. heating a tube; 7. a motor; 71. and (4) a rubber outlet pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art all belong to the protection scope of the present invention.
According to the utility model discloses an embodiment provides a quick adhesive deposite device of chip.
As shown in fig. 1-3, according to the utility model discloses a quick adhesive deposite device of chip, include: the device comprises a device shell 1, a connecting frame 2, a glue storage box 3, a chip placing plate 5, a heating and stirring tank 6 and a motor 7, wherein an observation window 11 is arranged at the top end of the front surface of the device shell 1, a slide rail 12 is arranged in the device shell 1, a supporting plate 13 is arranged at the bottom end of the device shell 1, the connecting frame 2 is arranged at the top end of the device shell 1, supporting columns 21 are arranged at four corners of the connecting frame 2, the glue storage box 3 is arranged at the bottom end of the supporting column 21, a glue storage cavity 31 is arranged in the glue storage box 3, a heat insulation plate 32 is arranged at the top end of the glue storage box 3, a connecting pipe 33 is arranged at one end of the glue storage box 3, a fixing plate 4 is arranged at the bottom end of the glue storage box 3, a plurality of glue dispensing guns 41 are arranged on the fixing plate 4, a plurality of glue dispensing guns 42 are arranged at the top end of the glue dispensing gun 41, the chip placing plate 5 is arranged above the slide rail 12, a plurality of chip placing grooves 51 are arranged at the top end of the chip placing plate 5, the bottom end of the chip placing plate 5 is provided with a sliding groove 52, a heating stirring tank 6 is arranged above the supporting plate 13, a stirring paddle 61 is arranged in the center of the inside of the heating stirring tank 6, a heating pipe 62 is arranged in the heating stirring tank 6, a motor 7 is arranged at one end of the heating stirring tank 6, and a rubber outlet pipe 71 is arranged at one end, away from the heating stirring tank 6, of the motor 7.
In one embodiment, the glue extracted by the motor 7 and heated in the stirring tank 6 is fed into the device shell 1 through the glue outlet pipe 71, and then is fed into the glue storage cavity 31 through the connecting pipe 33, so that the uniformly mixed glue is fed into the glue storage cavity 31 through the motor 7.
In one embodiment, the glue storage cavity 31 is communicated with the glue dispensing gun 41 through a connecting port 42, and the glue in the glue storage cavity 31 is extruded from the bottom end of the glue dispensing gun 41 through the connecting port 42.
In one embodiment, the dispensing guns 41 correspond to the chip placement grooves 51 formed at the top of the chip placement plate 5 one by one, so that the chips in each chip placement groove 51 can be dispensed by the independent dispensing gun 41.
In one embodiment, for the above-mentioned slide groove 52 moving in one direction under the limitation of the slide rail 12, the slide groove 52 drives the chip placing plate 5 to move in one direction on the slide rail 12, so that the dispensed chip is sent out of the whole device.
In conclusion, with the above technical solution of the present invention, firstly, whether each mechanism of the detecting device operates normally is detected, chips to be glued are respectively placed in the chip placing groove 51 formed at the top end of the chip placing plate 5, the chip placing plate 5 slides to the position under the connecting frame 2 under the limitation of the slide rail 12 through the slide groove 52 formed at the bottom end of the chip placing plate 5, so that the glue dispensing gun 41 and the chip placing groove 51 formed at the top end of the chip placing plate 5 correspond to each other one by one, and the glue in the heating and stirring tank 6 is continuously stirred by the stirring paddle 61 under the heating action of the heating pipe 62, so that the glue is uniformly stirred while being not easily solidified at a higher temperature, and then the glue in the heating and stirring tank 6 is extracted by the motor 7 and is sent into the device housing 1 through the glue outlet pipe 71, and then is sent into the glue storage cavity 31 through the connecting pipe 33, and then the stirred glue is sent into the glue storage cavity 31 through the motor 7, store up gluey chamber 31 and pass through connector 42 and glue the rifle 41 intercommunication with some, and then will store up gluey glue in the chamber 31 and extrude from some glue rifle 41 bottom through connector 42 and carry out some glue to the chip, the chip is placed board 5 and is continued unidirectional movement on slide rail 12 after the point is glued and is accomplished, and then makes the chip that the point was glued and accomplish send out whole device, and the above-mentioned operation of circulation reaches the purpose of circulation to production.
Has the advantages that: 1. this quick adhesive deposite device of chip, through setting up heating agitator tank 6, glue wherein constantly stirs through stirring rake 61 under the heating effect of heating pipe 62, make glue be by the stirring when difficult solidification under the higher temperature, finally extrude the chip from gluing rifle 41 bottom through motor extraction glue and carry out some glue, the homoenergetic is glued to the chip of more quantity at every turn point, whole some glue time has been practiced thrift, the efficiency is glued to the improvement point, the continuation that rifle 41 hinders the process is glued to the jam point that has prevented the solidification of glue simultaneously.
2. This quick adhesive deposite device of chip places board 5 through setting up the chip that can orientate and remove on slide rail 12 top, and the chip in chip standing groove 51 is placed board 5 and is continued to slide and place board 5 and see off the chip on slide rail 12 after the point is glued and is accomplished to the chip to can constantly place new chip on slide rail 12 and place board 5 and reach the purpose of circulation production, improve production efficiency and reach the purpose of quick point gluing.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A quick adhesive deposite device of chip includes: the device comprises a device shell (1), a connecting frame (2), a glue storage box (3), a chip placing plate (5), a heating stirring tank (6) and a motor (7), and is characterized in that an observation window (11) is arranged at the front top end of the device shell (1), a slide rail (12) is arranged in the device shell (1), a supporting plate (13) is arranged at the bottom end of the device shell (1), the connecting frame (2) is arranged at the top end of the device shell (1), supporting columns (21) are arranged at four corners of the connecting frame (2), the glue storage box (3) is arranged at the bottom end of the supporting column (21), a glue storage cavity (31) is arranged in the glue storage box (3), a heat insulation plate (32) is arranged at the top end of the glue storage box (3), a connecting pipe (33) is arranged at one end of the glue storage box (3), and a fixing plate (4) is arranged at the bottom end of the glue storage box (3), be provided with a plurality of glue dispensing guns (41) on fixed plate (4), glue dispensing gun (41) top is provided with connector (42), slide rail (12) top is provided with the chip and places board (5), the chip is placed board (5) top and is provided with a plurality of chip standing grooves (51), the chip is placed board (5) bottom and has been seted up spout (52), backup pad (13) top is provided with heating agitator tank (6), the inside central authorities of heating agitator tank (6) are provided with stirring rake (61), the inside heating pipe (62) that is provided with of heating agitator tank (6), heating agitator tank (6) one end is provided with motor (7), the one end that heating agitator tank (6) were kept away from in motor (7) is provided with rubber outlet pipe (71).
2. The quick chip glue dispensing device according to claim 1, characterized in that the motor (7) extracts glue from the heating and stirring tank (6), and the glue is fed into the device shell (1) through the glue outlet pipe (71), and then is fed into the glue storage cavity (31) through the connecting pipe (33).
3. The quick chip glue dispensing device according to claim 1, wherein the glue storage cavity (31) is communicated with the glue dispensing gun (41) through a connecting port (42).
4. The quick chip dispensing device according to claim 1, wherein the dispensing guns (41) are in one-to-one correspondence with the chip placement grooves (51) formed at the top ends of the chip placement plates (5).
5. The quick chip dispensing device according to claim 1, wherein the sliding groove (52) is restricted by the sliding rail (12) to move in a single direction, and the sliding groove (52) drives the chip placing plate (5) to move in a single direction on the sliding rail (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121686452.1U CN215088506U (en) | 2021-07-23 | 2021-07-23 | Quick adhesive deposite device of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121686452.1U CN215088506U (en) | 2021-07-23 | 2021-07-23 | Quick adhesive deposite device of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215088506U true CN215088506U (en) | 2021-12-10 |
Family
ID=79318403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121686452.1U Active CN215088506U (en) | 2021-07-23 | 2021-07-23 | Quick adhesive deposite device of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215088506U (en) |
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2021
- 2021-07-23 CN CN202121686452.1U patent/CN215088506U/en active Active
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