CN215058820U - Vacuum adsorption device - Google Patents

Abstract

The utility model relates to a vacuum adsorption device, which comprises a carrying platform for adsorbing a product to be processed, a base plate positioned below the carrying platform and a vacuum air source for vacuumizing; the carrying platform and the base plate are arranged in a surrounding mode to form a first vacuum area and a second vacuum area surrounding the first vacuum area; the carrying platform is provided with a first adsorption hole communicated with the first vacuum area and a second adsorption hole communicated with the second vacuum area; the vacuum air source comprises a first vacuum air source forming a passage with the first vacuum area and the first adsorption hole and a second vacuum air source forming a passage with the second vacuum area and the second adsorption hole, the first vacuum air source and the second vacuum air source are independently controlled to vacuumize, each vacuum area corresponds to the corresponding adsorption hole and the corresponding vacuum assembly, the corresponding vacuum assembly can be started according to the size of a product to be processed, and therefore vacuum adsorption of the product to be processed in different sizes can be achieved.

Description

Vacuum adsorption device

Technical Field

The utility model relates to a semiconductor field especially relates to a vacuum adsorption device.

Background

Semiconductor chips need to be fixed in the semiconductor packaging process, and a vacuum adsorption device is generally adopted to fix the semiconductor chips in the prior art. The vacuum adsorption device is provided with a carrying platform for placing a semiconductor chip, a plurality of vacuum adsorption holes are formed in the surface of the carrying platform, and the vacuum adsorption range of the carrying platform is formed by the areas formed by the vacuum adsorption holes. The vacuum adsorption device is also provided with a vacuum air source for controlling vacuumizing, after the semiconductor chip is placed on the carrying platform, the vacuum air source controls vacuumizing to be started, and the semiconductor chip is adsorbed on the carrying platform through the vacuum adsorption hole to complete the fixation of the semiconductor chip.

However, the vacuum suction range of the carrier in the prior art is generally fixed, if the vacuum suction range is smaller than the size of the semiconductor chip, the vacuum suction range cannot uniformly cover the product, the suction is not tight, and if the suction range is too small, the product is easily sucked and deformed, and the product is damaged during processing. In order to solve the problem, a proper carrier is usually required to be replaced in time, which reduces the efficiency of semiconductor chip packaging, and carriers of various specifications are required, which results in high production cost.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the weak point among the prior art, providing a vacuum adsorption device, the concrete scheme is as follows:

a vacuum adsorption device is characterized by comprising a carrier for adsorbing a product to be processed, a base plate positioned below the carrier and a vacuum air source for vacuumizing;

the carrying table and the base plate are arranged in an enclosing mode to form a first vacuum area and a second vacuum area surrounding the first vacuum area;

the carrying platform is provided with a first adsorption hole communicated with the first vacuum area and a second adsorption hole communicated with the second vacuum area;

the vacuum gas source comprises a first vacuum gas source communicated with the first vacuum area and the first adsorption hole forming passage and a second vacuum gas source communicated with the second vacuum area and the second adsorption hole forming passage, and the first vacuum gas source and the second vacuum gas source are independently controlled to be vacuumized.

Further, a first vacuum cavity with an open bottom and a second vacuum cavity with an open bottom surrounding the first vacuum cavity are arranged in the carrier, the first vacuum cavity, the second vacuum cavity and the backing plate form the first vacuum area and the second vacuum area, and the first suction hole and the second suction hole are respectively located on the upper walls of the first vacuum cavity and the second vacuum cavity.

Further, grooves which longitudinally extend from the upper surface of the carrier to the second vacuum cavity and transversely extend from the second vacuum cavity to the edge of the carrier are distributed on the carrier at intervals;

the second adsorption hole is positioned between the two grooves;

the upper wall of the second vacuum cavity is provided with a first inner surface provided with a second adsorption hole and a second inner surface corresponding to the bottom surface of the groove, and the distance between the first inner surface and the second inner surface is smaller than the depth of the second vacuum cavity.

Furthermore, a flange is arranged around the carrier, and the upper surface of the flange and the bottom surface of the groove are in the same plane;

the flange is provided with first gap portions at intervals, and the positions of the first gap portions correspond to the opening of the groove.

Further, a sealing member for sealing the first vacuum chamber and the second vacuum chamber is provided on a lower surface of the stage.

Further, the stage further comprises a third vacuum cavity surrounding the second vacuum cavity, the first vacuum cavity is circular, and the second vacuum cavity and the third vacuum cavity are in the shape of a ring concentric with the first vacuum cavity;

the first adsorption holes are distributed in a circular area which is concentric with the first vacuum cavity and has a radius smaller than that of the first vacuum cavity;

the second adsorption holes and the third adsorption holes corresponding to the third vacuum cavities are respectively arranged along the circumference concentric with the circular area.

Further, the second vacuum container has a first sidewall at a position corresponding to the groove side surface, the third vacuum container has a second sidewall at a position corresponding to the groove side surface, and the thickness of the second sidewall is greater than that of the first sidewall.

Further, a first inner wall is arranged between the second vacuum cavity and the third vacuum cavity, and a first positioning hole for positioning the carrier on the base plate is arranged at the position of the first inner wall corresponding to the groove.

Further, the microscope carrier also comprises an outer wall and a second inner wall located between the second vacuum cavity and the first vacuum cavity, sealing grooves are formed in the bottom surfaces of the first inner wall, the second inner wall and the outer wall, and a sealing ring is arranged between the sealing groove and the base plate.

Further, the first vacuum air source comprises a first solenoid valve positioned outside the backing plate, and the second vacuum air source comprises a second solenoid valve positioned outside the backing plate;

the liner plate is internally provided with a first vacuum hole communicated with the first vacuum area and a first vacuum channel for connecting the first electromagnetic valve and the first vacuum hole;

and a second vacuum hole communicated with the second vacuum area and a second vacuum channel connected with a second electromagnetic valve and the second vacuum hole are further formed in the base plate.

The utility model discloses in, microscope carrier and backing plate enclose and establish the vacuum area who forms the difference, including first vacuum area and encircle the second vacuum area of first vacuum area, each vacuum area is corresponding to corresponding absorption hole and corresponding vacuum air supply, can be according to the size of treating the processing product, open corresponding vacuum air supply, for example to the less product of size, can open first vacuum air supply, open first vacuum air supply and second vacuum air supply simultaneously to the great product of size, thereby can realize treating the vacuum adsorption of processing product to different sizes, vacuum suction evenly covers the product, avoid gas leakage and damage product, the adsorption efficiency and the adsorption quality of product have not only been improved, also avoid changing the microscope carrier of multiple specification simultaneously, and the production cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a vacuum adsorption apparatus in one embodiment;

FIG. 2 is a perspective view of a stage in one embodiment;

FIG. 3 is a bottom view of a stage in one embodiment;

FIG. 4 is a cross-sectional view of a stage in one embodiment;

FIG. 5 is a top view of a stage in one embodiment;

FIG. 6 is a seal ring in one embodiment;

FIG. 7 is a front view of a shim according to one embodiment;

FIG. 8 is a perspective view of a shim plate according to one embodiment;

fig. 9 is a left side view of a shim plate according to one embodiment.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The technical solution of the present invention will be further explained by the following embodiments with reference to the accompanying drawings.

The utility model provides a vacuum adsorption device, which comprises a carrying platform for adsorbing a product to be processed, a base plate positioned below the carrying platform and a vacuum air source for vacuumizing;

the carrying platform and the base plate are arranged in a surrounding mode to form a first vacuum area and a second vacuum area surrounding the first vacuum area;

the carrying platform is provided with a first adsorption hole communicated with the first vacuum area and a second adsorption hole communicated with the second vacuum area;

the vacuum air source comprises a first vacuum air source forming a passage with the first vacuum area and the first adsorption hole and a second vacuum air source forming a passage with the second vacuum area and the second adsorption hole, and the first vacuum air source and the second vacuum air source are independently controlled to vacuumize.

The utility model discloses in, microscope carrier and backing plate enclose and establish the vacuum area who forms the difference, including first vacuum area and encircle first vacuum area's at least one second vacuum area, each vacuum area is corresponding to corresponding absorption hole and vacuum air source, can be according to the size of treating the processing product, open corresponding vacuum air source, for example to the less product of size, can open first vacuum air source, open first vacuum air source and second vacuum air source simultaneously to the great product of size, thereby can realize treating the vacuum adsorption of processing product to different sizes, vacuum suction evenly covers the product, avoid gas leakage and damage product, the adsorption efficiency and the adsorption quality of product have not only been improved, also avoid changing the microscope carrier of multiple specification simultaneously, and the production cost is reduced.

The utility model discloses in, the vacuum area who is used for forming vacuum suction among the vacuum adsorption equipment is enclosed to establish by microscope carrier and backing plate and forms, surround first vacuum area's second vacuum area including the position, first vacuum area and second vacuum area's formation includes multiple implementation mode, in an implementation mode, first vacuum cavity and second vacuum cavity are located the inside of microscope carrier, have the open first vacuum cavity in bottom and encircle the open second vacuum cavity in bottom of first vacuum cavity in the microscope carrier, place the microscope carrier on the backing plate after, first vacuum cavity and second vacuum cavity and backing plate constitute first vacuum area and second vacuum area; in another embodiment, the first vacuum chamber and the second vacuum chamber are located on the backing plate, and have a first vacuum chamber with an open top and a second vacuum chamber with an open top surrounding the first vacuum chamber, and the first vacuum chamber and the second vacuum chamber and the carrier constitute a first vacuum area and a second vacuum area after the carrier is placed on the backing plate; in another embodiment, the first vacuum chamber and the second vacuum chamber are both partially located on the stage and partially located on the pad, and after the stage is placed on the pad, the first vacuum chamber, the second vacuum chamber, and the stage form a first vacuum region and a second vacuum region. Further, the first vacuum region and the second vacuum region may be located at a central position of the carrier and/or the pad, or may be located at other positions, preferably, at a central position of the carrier and/or the pad.

In order to further improve vacuum adsorption device's application scope, the utility model provides a how much of vacuum area can set up according to actual conditions, for example, except that the second vacuum area is outside, can also set up the third vacuum area as required, the fourth vacuum area, then, the third vacuum area encircles the second vacuum area, the fourth vacuum area encircles the third vacuum area, analogize with this, can design a plurality of second vacuum areas, be provided with corresponding third adsorption hole on the microscope carrier simultaneously, the fourth adsorption hole, vacuum source still includes third vacuum air supply and fourth vacuum air supply, each vacuum air supply all can independently control the evacuation, that is, first adsorption hole, first vacuum area and corresponding first vacuum air supply form first passageway, the second adsorption hole, second vacuum area and corresponding second vacuum air supply form the second passageway, third adsorption hole, the third adsorption hole is opened to vacuum area, the second vacuum area is opened to vacuum area, the vacuum area is opened to the vacuum area, the second vacuum source is opened to the second passageway, the second vacuum source is opened to the third adsorption hole, The third vacuum area and the corresponding third vacuum air source form a third passage, and the fourth adsorption hole, the fourth vacuum area and the corresponding fourth vacuum air source form a fourth passage, so that when the size of the product is smaller, the first vacuum air source is started to adsorb the product through the first adsorption hole, when the size of the product is medium, the first vacuum air source and the second vacuum air source are both started to adsorb the product through the first adsorption hole and the second adsorption hole, therefore, when the product is larger, the first vacuum air source, the second vacuum air source, the third vacuum air source and the fourth vacuum air source are all started to adsorb the product through the first adsorption hole, the second adsorption hole, the third adsorption hole and the fourth adsorption hole, the central area of the product has vacuum suction, the edge of the product also has vacuum suction, product damage caused by non-uniform vacuum suction is avoided, and vacuum adsorption of products to be processed with different sizes can be realized, realizing vacuum uniform adsorption.

In a preferred embodiment, the carrier has a first vacuum chamber with an open bottom and a second vacuum chamber with an open bottom surrounding the first vacuum chamber, the second vacuum chamber and the backing plate form a first vacuum region and a second vacuum region, and the first suction hole and the second suction hole are respectively located on the upper walls of the first vacuum chamber and the second vacuum chamber.

As shown in fig. 1, the vacuum suction apparatus includes a carrier 10, a pad 20, and a vacuum source 30, the carrier 10 is located on the pad 20, as shown in fig. 2, the carrier 10 includes a first vacuum chamber 111 with an open top and a second vacuum chamber 112 surrounding the first vacuum chamber 111, the second vacuum chamber 112, and the pad 20 form a first vacuum area and a second vacuum area, and the first vacuum chamber 111 and the second vacuum chamber 112 are both disposed on the carrier. In addition to the first and second vacuum chambers 111, 112, other vacuum chambers may be present, as shown in fig. 2-3, and the carrier may further comprise a third vacuum chamber 113.

The shape of the first vacuum chamber 111 and the shape of the second vacuum chamber 112 can be set according to requirements, as shown in fig. 2, the first vacuum chamber 111 is circular, the second vacuum chamber 112 is annular, the first vacuum chamber 111 can also be square, and the second vacuum chamber 112 can be "return" shaped, of course, the first vacuum chamber 111 and the second vacuum chamber 112 can also be other shapes, which are not listed here.

As shown in FIG. 3, the first suction hole 121 is located at the first upper wall 1111 of the first vacuum container 111, the second suction hole 122 is located at the second upper wall 1121 of the second vacuum container 112, and the third suction hole 123 is located at the upper wall 1131 of the third vacuum container 113.

In a preferred embodiment, the carrier is spaced apart by grooves extending longitudinally from the upper surface of the carrier to the second vacuum chamber and laterally from the second vacuum chamber to the edge of the carrier;

the second adsorption hole is positioned between the two grooves;

the upper wall of the second vacuum container is provided with a first inner surface provided with a second adsorption hole and a second inner surface corresponding to the bottom surface of the groove, and the distance between the first inner surface and the second inner surface is smaller than the depth of the second vacuum container.

As shown in fig. 4 and 5, in order to facilitate placing and taking out of the product, grooves 131 are distributed at intervals on the surface of the carrier 10, and the grooves 131 extend longitudinally from the upper surface of the carrier to the second vacuum chamber 112 and laterally from the second vacuum chamber 112 to the edge of the carrier, for the case where there are a plurality of second vacuum chambers, for example, the carrier shown in fig. 3, the vacuum suction device includes the second vacuum chamber 112 and the third vacuum chamber 113, the grooves 131 extend laterally from the second vacuum chamber 112 to the third vacuum chamber 113 and extend to the edge of the carrier 10, and the widths of the grooves 131 in the second vacuum chamber 112 and the third vacuum chamber 113 may be the same or different between the two grooves 131, as shown in fig. 4, for the convenience of processing the carrier, the widths of the grooves in the second vacuum chamber 112 and the third vacuum chamber 113 are the same.

The surface area of the carrier 10 located in the middle of the grooves 131 plays a role of carrying a product, so the second suction hole is located between two grooves 131, and with reference to fig. 4, the second suction hole 122 and the third suction hole 123 are located between two grooves 131.

With continued reference to fig. 4, the lower portion of the second vacuum chamber 112 is open and the upper portion is closed, such that the second upper wall 1121 of the second vacuum chamber 112 has a first inner surface 11211, and since the recess 131 sinks into the second vacuum chamber 112, the second vacuum chamber 112 has a second inner surface 11212 at a position corresponding to the bottom surface of the recess 131, and further, in order to ensure uniformity of the vacuum suction, the second vacuum chamber 112 is connected, such that, in order to ensure that the chambers of the second vacuum chamber 112 on both sides of the recess 131 are connected, the distance between the first inner surface 11211 and the second inner surface 11212 is smaller than the depth of the second vacuum chamber 112, i.e., after the stage has been placed on the backing plate 20, the second vacuum chamber 112 has a gap between the first inner surface and the backing plate 11211, such that the second vacuum chamber 112 is entirely connected.

When more than two vacuum chambers exist, each vacuum chamber is not communicated with each other, but the inside of each vacuum chamber needs to be communicated, so that the vacuum suction force of the vacuum chamber is ensured to be uniform, as shown in fig. 5, the carrying platform comprises a second vacuum chamber 112 and a third vacuum chamber 113, the upper wall 1131 of the third vacuum chamber 113 is provided with a third inner surface 11311 provided with a third suction hole 123, a fourth inner surface 11312 is arranged at the position corresponding to the bottom surface of the groove 131, and the distance between the third inner surface 11311 and the fourth inner surface 11312 is smaller than the depth of the third vacuum chamber 113.

In a preferred embodiment, the periphery of the carrier is provided with a flange, and the upper surface of the flange and the bottom surface of the groove are in the same plane;

the flange is provided with first breach portion at interval, and the position of first breach portion corresponds the setting with the opening part of recess.

Referring further to fig. 2, in order to fix the carrier on the pad, a flange 114 is disposed around the carrier, the upper surface of the flange 114 and the bottom surface of the recess 131 are in the same plane, and a first notch 1141 for limiting the movement of the carrier in the horizontal direction is disposed on the flange 114 at an interval, and can move in the horizontal direction with a screw or the like. Further, for convenience of installation, the first notch portion 1141 is disposed corresponding to the opening of the groove 113.

In a preferred embodiment, the lower surface of the carrier is provided with a sealing member for sealing the first vacuum chamber and the second vacuum chamber.

In order to avoid air leakage, the lower surface of the stage 10 is provided with seals for sealing the first and second vacuum chambers 111, 112, the number of seals being set accordingly according to the number of vacuum chambers.

In a preferred embodiment, the stage further comprises a third vacuum chamber surrounding the second vacuum chamber, the first vacuum chamber is circular, and the second vacuum chamber and the third vacuum chamber are annular and concentric with the first vacuum chamber;

the first adsorption holes are distributed in a circular area which is concentric with the first vacuum cavity and has a radius smaller than that of the first vacuum cavity;

the second adsorption holes and the third adsorption holes corresponding to the third vacuum cavities are respectively arranged along the circumference concentric with the circular area.

In order to facilitate the processing of the wafer, in the present embodiment, the carrier is designed to be circular, as shown in fig. 1 to 5, in the present embodiment, the carrier further includes a third vacuum chamber 113 surrounding the second vacuum chamber 112, the first vacuum chamber 111 is circular, the second vacuum chamber 112 and the third vacuum chamber 113 are annular and concentric with the first vacuum chamber 111, the first vacuum holes 121 are distributed in a circular area concentric with the first vacuum chamber 111 and having a radius smaller than that of the first vacuum chamber 111, the second vacuum holes 122 and the third vacuum holes 123 corresponding to the third vacuum chamber 113 are respectively arranged along a circumference concentric with the circular area, as shown in fig. 3 and 4, the first vacuum holes 121 are distributed more densely and are arranged in a circular area, so that the carrier can be used for adsorbing a wafer with a smaller size or small fragments with irregular shapes, the second vacuum holes 122 and the third vacuum holes 123 are used for adsorbing edges of products, therefore, the first to third suction holes 121, 122 and 123 may be arranged along a circumference concentric with the circular region, and the number and size of the first to third suction holes 121, 122 and 123 may be set according to an actual vacuum suction condition.

In a preferred embodiment, the grooves have the same width in the second and third vacuum vessels.

For the convenience of processing the carrier, the width of the concave groove 131 in the second vacuum chamber 112 is the same as that of the third vacuum chamber 113, as shown in fig. 2, 4 concave grooves 131 are arranged on the carrier 10 when viewed from the front, the concave groove 131 is substantially rectangular, the upper surfaces of the carrier at two sides of the concave groove 131 are fan-shaped, and the second suction hole 122 and the third suction hole 123 are distributed on the fan-shaped.

In a preferred embodiment, the second vacuum chamber has a first sidewall at a position corresponding to a side of the groove, and the third vacuum chamber has a second sidewall at a position corresponding to a side of the groove, the second sidewall having a thickness greater than that of the first sidewall.

As shown in fig. 4, two first side walls 1122 are respectively arranged at positions of the second vacuum containers 112 corresponding to the side surfaces of the grooves 131, two second side walls 1132 are respectively arranged at positions of the third vacuum containers 113 corresponding to the side surfaces of the grooves 131, the thicknesses of the first side walls 1122 and the second side walls 1132 may be the same or different, in this embodiment, the thicknesses of the first side walls 1122 and the second side walls 1132 are different, the thickness of the second side walls 1132 is larger than that of the first side walls 1122, as shown in fig. 2 and 3, the second inner surfaces 11312 of the second vacuum containers 112 and the third inner surfaces 11312 of the third vacuum containers 113 are arc surfaces when viewed from the back, and the area of the third inner surfaces 11212 is larger than that of the second inner surfaces 11212.

In a preferred embodiment, the second vacuum chamber and the third vacuum chamber have a first inner wall therebetween, and the first inner wall has a first positioning hole for positioning the stage on the pad at a position corresponding to the recess.

As shown in fig. 3, the stage further comprises a first inner wall 151 located between the second vacuum chamber 112 and the third vacuum chamber 113, the first inner wall 151 having a first positioning hole 161 at a position corresponding to the recess 131, the first positioning hole 161 being used for positioning the stage 10 on the pad 30.

In a preferred embodiment, the carrier further includes an outer wall and a second inner wall located between the second vacuum chamber and the first vacuum chamber, the first inner wall, the second inner wall and the bottom surface of the outer wall are provided with sealing grooves, and a sealing ring is arranged between the sealing groove and the backing plate.

As shown in fig. 2, the stage further comprises a second inner wall 152 and an outer wall 153 located between the second vacuum chamber 112 and the first vacuum chamber 111, a first sealing groove 1511, a second sealing groove 1521 and a third sealing groove 1531 are disposed on the bottom surfaces of the first inner wall 151, the second inner wall 152 and the outer wall 153, and corresponding sealing rings are disposed between the pad and the stage corresponding to the first sealing groove 1511, the second sealing groove 1521 and the third sealing groove 1531, as shown in fig. 6.

In a preferred embodiment, the vacuum suction device further comprises a gasket positioned on and conforming to the shape of the flange and the groove.

As shown in fig. 7, in order to prevent the holder from wearing the stage, spacers are further provided on the flange 141 and the recess 131, the shape of the spacers is adapted to the shape of the flange 114 and the recess 131, a second positioning hole 411 is provided at a position corresponding to the first positioning hole 161, a second notch portion 412 is provided corresponding to the first notch portion 1141, a third positioning hole 162 is provided between the first notch portions 1141, and a fourth positioning hole 413 is provided at a position corresponding to the third positioning hole 162 on the spacer. Further, in order to fix the spacer, as shown in fig. 3, a fifth positioning hole 163 is provided at the second inner surface 11212, and a sixth positioning hole 414 is correspondingly provided on the spacer.

In a preferred embodiment, the first vacuum source comprises a first solenoid valve located outside the pad plate, and the second vacuum source comprises a second solenoid valve located outside the pad plate;

the liner plate is internally provided with a first vacuum hole communicated with the first vacuum area and a first vacuum channel for connecting the first electromagnetic valve and the first vacuum hole;

the liner plate is also internally provided with a second vacuum hole communicated with the second vacuum area and a second vacuum channel connected with a second electromagnetic valve and the second vacuum hole.

As shown in fig. 8, which is a front view of the pad, and as shown in fig. 9, which is a left view of the pad, the first vacuum source includes a first solenoid valve 311, a second solenoid valve 312, and a third solenoid valve 313 located outside the pad, the second vacuum source includes a second solenoid valve 312 located outside the pad 20, the pad 20 is further provided inside with a first vacuum hole 221 connected to the first vacuum chamber 111, and a first vacuum passage 231 connecting the first solenoid valve 311 and the first vacuum hole 221, and the first vacuum hole 221 is located at one end of the first vacuum passage 231; the inside of the backing plate 20 is further provided with a second vacuum hole 222 connected to the second vacuum chamber 112, and a second vacuum passage 232 connecting the second solenoid valve 312 and the second vacuum hole 222, wherein the second vacuum hole 222 is located at the middle position of the second vacuum passage 232; the pad plate 20 is further provided therein with a third vacuum hole 223 connected to the third vacuum chamber 113, and a third vacuum passage 233 connecting the third solenoid valve 313 and the third vacuum hole 223, the third vacuum hole 223 being located at an intermediate position of the third vacuum passage 233.

The vacuum source further comprises a vacuum pump connected to the first solenoid valve 311, the second solenoid valve 312 and the third solenoid valve 312 for forming a vacuum environment.

When the vacuum adsorption device in the present embodiment is used for adsorbing a semiconductor element, the first vacuum channel 231, the first vacuum hole 221, the first vacuum chamber 111 and the first adsorption hole 121 are vacuumized to form a first vacuum passage, the second vacuum channel 232, the second vacuum hole 222, the second vacuum chamber 112 and the second adsorption hole 122 are vacuumized to form a first vacuum passage, the third vacuum channel 233, the third vacuum hole 223, the third vacuum chamber 113 and the third adsorption hole 123 are vacuumized to form a third vacuum passage, when the vacuum adsorption device is used for adsorbing a semiconductor element, the first vacuum passage is controlled to be formed after the element with a small size and some fragments are placed on the stage, so that the semiconductor element is adsorbed at the middle position of the stage, and when the element with a medium size is placed on the stage, the first electromagnetic valve and the second electromagnetic valve can be controlled to be opened to form the first vacuum passage and the second vacuum passage, and when the element with a large size, can control first solenoid valve, second solenoid valve and third solenoid valve and open and form first vacuum access, second vacuum access and third vacuum access, the adsorption affinity size of first vacuum access, second vacuum access and third vacuum access can be adjusted through first solenoid valve, second solenoid valve and third solenoid valve, and each solenoid valve is parallel control, consequently, the utility model discloses can be applicable to the product of multiple size, for example, can adsorb 2-8 cun wafer to avoid gas leakage and damage product, when adding the microscope carrier of avoiding multiple size to the product of not unidimensional man-hour, improve production efficiency, reduction in production cost.

In a preferred embodiment, a seventh positioning hole is disposed on the cushion plate at a position corresponding to the first notch, and an eighth positioning hole is disposed at a position corresponding to the first positioning hole.

As shown in fig. 8, the base plate 20 is provided with a seventh positioning hole 211 at a position corresponding to the first notched portion 1141, an eighth positioning hole 212 at a position corresponding to the first positioning hole 161, the first notched portion 1141 and the seventh positioning hole 211 are connected by a horizontal adjustment screw, a rectangular spring, or the like for restricting displacement of the stage in the horizontal direction, and the eighth positioning hole and the first positioning hole are connected by a fixing member such as a screw for fixing the stage.

If the laser peeling device is used in the field of laser peeling, a heating rod and a temperature sensor are needed to be used on the vacuum carrying platform.

The utility model discloses microscope carrier and backing plate enclose establishes the vacuum region that forms the difference, including the first vacuum region that is located center department and encircle the second vacuum region of first vacuum region, each vacuum region is corresponding to corresponding absorption hole and vacuum air source, can be according to the size of treating the processing product, open corresponding vacuum air source, for example to the less product of size, can open first vacuum air source, open first vacuum air source and second vacuum air source simultaneously to the great product of size, thereby can realize treating the vacuum adsorption of processing product to different sizes, vacuum suction evenly covers the product, avoid gas leakage and damage product, the adsorption efficiency and the adsorption quality of product have not only been improved, also avoid changing the microscope carrier of multiple specification simultaneously, and the production cost is reduced.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Claims (10)

1. A vacuum adsorption device is characterized by comprising a carrier for adsorbing a product to be processed, a base plate positioned below the carrier and a vacuum air source for vacuumizing;

the carrying table and the base plate are arranged in an enclosing mode to form a first vacuum area and a second vacuum area surrounding the first vacuum area;

the carrying platform is provided with a first adsorption hole communicated with the first vacuum area and a second adsorption hole communicated with the second vacuum area;

the vacuum gas source comprises a first vacuum gas source communicated with the first vacuum area and the first adsorption hole forming passage and a second vacuum gas source communicated with the second vacuum area and the second adsorption hole forming passage, and the first vacuum gas source and the second vacuum gas source are independently controlled to be vacuumized.

2. The apparatus according to claim 1, wherein the carrier has a first vacuum chamber with an open bottom and a second vacuum chamber with an open bottom surrounding the first vacuum chamber, the first vacuum chamber and the second vacuum chamber and the backing plate constitute the first vacuum region and the second vacuum region, and the first suction hole and the second suction hole are respectively located on upper walls of the first vacuum chamber and the second vacuum chamber.

3. The apparatus of claim 2, wherein the carrier has spaced-apart recesses extending longitudinally from an upper surface of the carrier to the second vacuum chamber and laterally from the second vacuum chamber to an edge of the carrier;

the second adsorption hole is positioned between the two grooves;

the upper wall of the second vacuum cavity is provided with a first inner surface provided with a second adsorption hole and a second inner surface corresponding to the bottom surface of the groove, and the distance between the first inner surface and the second inner surface is smaller than the depth of the second vacuum cavity.

4. The apparatus of claim 3, wherein the carrier has a flange around it, the upper surface of the flange and the bottom surface of the recess being in the same plane;

the flange is provided with first gap portions at intervals, and the positions of the first gap portions correspond to the opening of the groove.

5. The apparatus according to any of claims 2 to 4, wherein a lower surface of the stage is provided with a sealing member for sealing the first vacuum chamber and the second vacuum chamber.

6. The apparatus of claim 1, wherein said stage further comprises a third vacuum chamber surrounding said second vacuum chamber, said first vacuum chamber being circular, said second vacuum chamber and said third vacuum chamber being said ring concentric with said first vacuum chamber;

the first adsorption holes are distributed in a circular area which is concentric with the first vacuum cavity and has a radius smaller than that of the first vacuum cavity;

the second adsorption holes and the third adsorption holes corresponding to the third vacuum cavities are respectively arranged along the circumference concentric with the circular area.

7. The apparatus according to claim 6, wherein the second vacuum chamber has a first sidewall at a position corresponding to a side of the groove, and the third vacuum chamber has a second sidewall at a position corresponding to a side of the groove, the second sidewall having a thickness greater than that of the first sidewall.

8. The apparatus according to claim 7, wherein the second vacuum chamber and the third vacuum chamber have a first inner wall therebetween, and the first inner wall has a first positioning hole for positioning the stage on the pad at a position corresponding to the recess.

9. The apparatus of claim 6 or 7, wherein the stage further comprises an outer wall and a second inner wall located between the second vacuum chamber and the first vacuum chamber, wherein sealing grooves are formed in bottom surfaces of the first inner wall, the second inner wall and the outer wall, and a sealing ring is arranged between the sealing groove and the backing plate.

10. The apparatus of claim 1, wherein the first vacuum source comprises a first solenoid valve located outside the pad, and the second vacuum source comprises a second solenoid valve located outside the pad;

the liner plate is internally provided with a first vacuum hole communicated with the first vacuum area and a first vacuum channel for connecting the first electromagnetic valve and the first vacuum hole;

and a second vacuum hole communicated with the second vacuum area and a second vacuum channel connected with a second electromagnetic valve and the second vacuum hole are further formed in the base plate.

Images