CN215039706U - Injection molding system for electronic wire shell - Google Patents

Abstract

The utility model discloses an injection molding system for electron wire rod shell, include support assembly, material loading assembly, melt material assembly and mould assembly, the mould assembly is installed in support assembly upper end, installs on the support assembly and melts the material assembly, melts material assembly left side and installs the material loading assembly, and the material loading assembly comprises motor, rope sheave, hoisting rope and material frame assembly. The device is at first packed into the wire rod raw materials inside the material frame assembly when using, because material frame assembly height is lower, material loading that can be more convenient, the raw materials adds the rear starter motor of completion, the motor is curled up the hoisting rope, and then mention the material frame assembly, and add the raw materials inside the material melting assembly, the material melting assembly melts the raw materials into liquid state, and inject the raw materials through the ejector beam and carry out injection moulding to the mould assembly is inside, compare with the injection molding system of traditional wire rod shell and have the material loading convenience, and easy operation, advantages such as rapid prototyping.

Description

Injection molding system for electronic wire shell

Technical Field

The utility model relates to a technical field of moulding plastics of wire rod shell, concretely a system of moulding plastics for electron wire rod shell.

Background

Injection molding is a method for producing and molding industrial products, and the products generally adopt rubber injection molding and plastic injection molding, and the injection molding can also be divided into injection molding and die casting methods.

Most of the existing injection molding systems for electronic wire shells have the problems of difficult feeding, long cooling time, difficult demoulding and the like.

In response to the problems and challenges, we propose an injection molding system for electronic wire housings, which has the advantages of convenient material loading, simple operation, and rapid molding.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an injection molding system for electron wire rod shell, the device is at first packed into the wire rod raw materials when using inside the material frame assembly, because material frame assembly height is lower, material loading that can be more convenient, the raw materials adds the back starter motor of accomplishing, the motor is rolled up the hoisting rope, and then mention the material frame assembly, and add the raw materials to melt inside the material assembly, melt the material assembly and melt the raw materials for liquid state, and inject the inside injection moulding that carries out of mould assembly with the raw materials through the ejector pin, thereby the injection molding system who has solved traditional electron wire rod shell mostly exists at the material loading difficulty, the cooling time is long, difficult drawing of patterns scheduling problem.

In order to achieve the above purpose, the utility model provides the following technical scheme: an injection molding system for an electronic wire shell comprises a support assembly, a feeding assembly, a melting assembly and a mold assembly, wherein the mold assembly is installed at the upper end of the support assembly, the melting assembly is installed on the support assembly, the feeding assembly is installed on the left side of the melting assembly, the feeding assembly consists of a motor, a rope pulley, a lifting rope and a material frame assembly, the lifting rope is installed on the material frame assembly, the other end of the lifting rope is connected with the rope pulley, and the rope pulley is installed at the front end of the motor;

the support assembly comprises a working platform, a lifting frame, a mold mounting frame and a linear guide rail, the linear guide rail is mounted on the left side of the lifting frame, the working platform is mounted on the right side of the lifting frame, the mold mounting frame is mounted on the working platform, the mold assembly is mounted at the lower end of the mold mounting frame and consists of a feeding hole, a fixed mold and a movable mold assembly, the fixed mold is mounted at the lower end of the movable mold assembly, and the feeding hole is formed in the left side of the fixed mold.

Further, the material frame assembly comprises a material box, a buffer pad, a hinge, a door plate and a lock catch, the lock catch is installed at the lower end of the material box, the buffer pad is installed on the material box, the door plate is installed on the right side of the material box, and the hinge is installed at the upper end of the door plate.

Further, melt the material assembly and include hopper, material chamber, ejector pin and sprue, the sprue is installed in material chamber left side, and material chamber internally mounted has the ejector pin, and the hopper is installed to material chamber upper end.

Furthermore, the movable mold assembly comprises a movable mold cavity, guide rods, a cylinder, a guide sleeve and a floating joint, the floating joint is installed at the lower end of the cylinder, the guide rods are installed on two sides of the cylinder, the guide rods are installed inside the guide sleeve, and the movable mold cavity is installed at the lower end of the guide rods.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. this injection molding system for electron wire rod shell is provided with the material pushing rod that melts the material assembly through melting the material assembly with the one-step propelling movement of raw materials to injection mold, at the continuous heating to raw and other materials of propelling movement in-process simultaneously, realizes the function that material loading was melted simultaneously, and then improves the efficiency of moulding plastics.

2. This a system of moulding plastics for electron wire rod shell installs the material loading assembly in the left side of support assembly, and the operator can be in the raw materials at lower and carry out the material loading, and then reduces workman's intensity of labour.

3. This a system of moulding plastics for electron wire rod shell is provided with the door plant on the right side of material frame assembly. Hinge and hasp, when material frame assembly reachd the assigned height, only need open the hasp can be with the raw materials fill send melt material assembly inside, easy operation material loading efficiency height.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the melting assembly of the present invention;

fig. 3 is a schematic structural view of the feeding assembly of the present invention;

FIG. 4 is a schematic view of the structure of the material frame assembly of the present invention;

fig. 5 is a schematic structural diagram of the movable mold assembly of the present invention.

In the figure: 1. a bracket assembly; 11. a working platform; 12. a hoisting frame; 13. a mold mounting frame; 14. a linear guide rail; 2. a feeding assembly; 21. a motor; 22. a sheave; 23. a hoisting rope; 24. a material frame assembly; 241. a magazine; 242. a cushion pad; 243. a hinge; 244. locking; 245. a door panel; 3. a material melting assembly; 31. a hopper; 32. a material cavity; 33. a material pushing rod; 34. a material injection port; 4. a mold assembly; 41. a feeding port; 42. fixing a mold; 43. a movable mold assembly; 431. a movable die cavity; 432. a guide bar; 433. a cylinder; 434. A guide sleeve; 435. a floating joint.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, an injection molding system for electronic wire housings comprises a bracket assembly (1), a feeding assembly 2, a melting assembly 3 and a mold assembly 4, wherein the mold assembly 4 is installed at the upper end of the bracket assembly 1, the melting assembly 3 is installed on the bracket assembly 1, the feeding assembly 2 is installed at the left side of the melting assembly 3, the feeding assembly 2 is composed of a motor 21, a rope pulley 22, a lifting rope 23 and a material frame assembly 24, the lifting rope 23 is installed on the material frame assembly 24, the other end of the lifting rope 23 is connected with the rope pulley 22, the rope pulley 22 is installed at the front end of the motor 21, the bracket assembly 1 comprises a working platform 11, a lifting frame 12, a mold installation frame 13 and a linear guide rail 14, the linear guide rail 14 is installed at the left side of the lifting frame 12, the working platform 11 is installed at the right side of the lifting frame 12, the mold installation frame 13 is installed on the working platform 11, the mold assembly 4 is installed at the lower end of the mold installation frame 13, the die assembly 4 consists of a feeding port 41, a fixed die 42 and a movable die assembly 43, the fixed die 42 is installed at the lower end of the movable die assembly 43, the feeding port 41 is arranged at the left side of the fixed die 42, the material frame assembly 24 comprises a material box 241, a cushion 242, a hinge 243, a door plate 245 and a lock 244, the lock 244 is installed at the lower end of the material box 241, the cushion 242 is installed on the material box 241, the door plate 245 is installed at the right side of the material box 241, the hinge 243 is installed at the upper end of the door plate 245, the material melting assembly 3 comprises a hopper 31, a material cavity 32, a material pushing rod 33 and a material injecting port 34, the material injecting port 34 is installed at the left side of the material cavity 32, the material pushing rod 33 is installed inside the material cavity 32, the hopper 31 is installed at the upper end of the material cavity 32, the movable die assembly 43 comprises a movable die cavity 431, a guide rod 432, a cylinder 433, a guide sleeve 434 and a floating joint 435, the floating joint is installed at the lower end of the cylinder 433, guide rods 432 are installed at both sides of the cylinder 433, the guide rod 432 is installed inside the guide sleeve 434, the lower end of the guide rod 432 is provided with a movable die cavity 431.

In summary, the following steps: when the injection molding system for the electronic wire shell is used, firstly, the motor 21 is started, the lifting rope 23 is released to put down the material frame assembly 24 when the motor 21 works, and when the material frame assembly 24 falls to the bottom, an operator only needs to place raw materials of the wire shell into the material frame assembly 24;

wherein, the material pushing rod 33 begins to rotate when the raw materials are transferred to the melting assembly 3, the material pushing rod 33 pushes the raw materials of the wire rod shell to the front end when rotating, the raw materials are continuously heated in the material cavity 32 in the pushing process, the raw materials are further melted into a liquid state, and the raw materials in the liquid state are filled into the mold assembly 4 through the material injection port 34 to complete the injection molding.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. The utility model provides an injection molding system for electron wire rod shell, includes support assembly (1), material loading assembly (2), melts material assembly (3) and mould assembly (4), its characterized in that: the mold assembly (4) is installed at the upper end of the support assembly (1), the melting assembly (3) is installed on the support assembly (1), the feeding assembly (2) is installed on the left side of the melting assembly (3), the feeding assembly (2) is composed of a motor (21), a rope pulley (22), a lifting rope (23) and a material frame assembly (24), the lifting rope (23) is installed on the material frame assembly (24), the other end of the lifting rope (23) is connected with the rope pulley (22), and the rope pulley (22) is installed at the front end of the motor (21); support assembly (1) is including work platform (11), hoisting frame (12), mould mounting bracket (13) and linear guide (14), install in hoisting frame (12) left side linear guide (14), work platform (11) are installed on hoisting frame (12) right side, install mould mounting bracket (13) on work platform (11), mould assembly (4) are installed to mould mounting bracket (13) lower extreme, mould assembly (4) are by material loading mouth (41), cover half (42) and movable mould assembly (43) are constituteed, cover half (42) are installed to movable mould assembly (43) lower extreme, cover half (42) left side is provided with material loading mouth (41).

2. An injection molding system for an electronic wire enclosure as recited in claim 1, wherein: the material frame assembly (24) comprises a material box (241), a cushion pad (242), a hinge (243), a door panel (245) and a lock catch (244), wherein the lock catch (244) is installed at the lower end of the material box (241), the cushion pad (242) is installed on the material box (241), the door panel (245) is installed on the right side of the material box (241), and the hinge (243) is installed at the upper end of the door panel (245).

3. An injection molding system for an electronic wire enclosure as recited in claim 1, wherein: melt material assembly (3) and include hopper (31), material chamber (32), ejector ram (33) and sprue (34), install on material chamber (32) left side sprue (34), material chamber (32) internally mounted has ejector ram (33), and hopper (31) are installed to material chamber (32) upper end.

4. An injection molding system for an electronic wire enclosure as recited in claim 1, wherein: the movable die assembly (43) comprises a movable die cavity (431), a guide rod (432), a cylinder (433), a guide sleeve (434) and a floating joint (435), wherein the floating joint (435) is installed at the lower end of the cylinder (433), the guide rod (432) is installed on two sides of the cylinder (433), the guide rod (432) is installed inside the guide sleeve (434), and the movable die cavity (431) is installed at the lower end of the guide rod (432).

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