CN215010953U - High definition liquid crystal concatenation integrated circuit board - Google Patents
High definition liquid crystal concatenation integrated circuit board Download PDFInfo
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- CN215010953U CN215010953U CN202120523878.9U CN202120523878U CN215010953U CN 215010953 U CN215010953 U CN 215010953U CN 202120523878 U CN202120523878 U CN 202120523878U CN 215010953 U CN215010953 U CN 215010953U
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Abstract
The utility model belongs to the technical field of high-definition liquid crystal screens, in particular to a high-definition liquid crystal splicing board card, which comprises a board card body, an interface panel and a heat dissipation pipe fitting, wherein a housing is arranged outside the board card body, the inner cavity side wall of the housing is provided with a moisture barrier, the front end of the top of the board card body is provided with the interface panel, two sides of the interface panel are provided with a heat dissipation hole, the top of the board card body is provided with a signal converter, a signal encoder and a signal amplifier, the structure is reasonable, the heat dissipation pipe fitting is arranged at the bottom of the board card body, heat dissipation fins are arranged at two sides of the heat dissipation pipe fitting, two heat dissipation holes are arranged on the heat dissipation fins, one heat dissipation hole is arranged at two sides of the interface panel, the heat dissipation performance of the device is improved, the temperature is prevented from being overhigh, and the moisture barrier is arranged on the inner cavity side wall of the housing, the moisture resistance of the device is improved, and the service life of the device is prolonged.
Description
Technical Field
The utility model relates to a high definition LCD screen technical field specifically is a high definition liquid crystal concatenation integrated circuit board.
Background
The liquid crystal splicing board card is widely applied to the fields of video display, monitoring equipment and the like, and has the main functions of cutting a complete image signal into a plurality of blocks and then distributing the blocks to the corresponding liquid crystal splicing display screens for display, externally connecting a hybrid matrix device and a plurality of signal lines, such as HDMI signal lines, DVI signal lines, VGA signal lines, AV signal lines and then distributing the complete image signal into a plurality of blocks through a traditional splicing drive board and then distributing the blocks to the corresponding liquid crystal splicing display screens for display, and a plurality of common liquid crystal splicing display screens are installed and spliced into an oversized screen and display a complete picture.
The existing high-definition liquid crystal splicing plate card has some defects in the using process, for example, the heat dissipation and damp-proof effects are poor, the service life of the device is influenced, and a novel high-definition liquid crystal splicing plate card is provided for solving the problems.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.
In view of the problem that exists in the current high definition liquid crystal concatenation integrated circuit board, provided the utility model discloses.
Therefore, the utility model aims at providing a high definition liquid crystal concatenation integrated circuit board can realize the in-process that uses, has improved the heat dispersion and the humidity resistance of device, has prolonged the life of device.
For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
the utility model provides a high definition liquid crystal concatenation integrated circuit board, its includes integrated circuit board body, interface panel and heat dissipation pipe fitting, the outside of integrated circuit board body is provided with the housing, the inner chamber lateral wall of housing is provided with the dampproof course, the top front end of integrated circuit board body is provided with the interface panel, the both sides of interface panel are provided with the louvre No. one, the top of integrated circuit board body is provided with signal converter, signal encoder and signal amplifier, the bottom of integrated circuit board body is provided with the heat dissipation pipe fitting, the both sides of heat dissipation pipe fitting are provided with radiating fin, be provided with the louvre No. two on the radiating fin.
As an optimal selection scheme of high definition liquid crystal concatenation integrated circuit board, wherein: the interface panel comprises a DVI interface, an HOMI interface, a VGA interface, an RJ45 input interface, a USB interface and an RJ45 output interface.
As an optimal selection scheme of high definition liquid crystal concatenation integrated circuit board, wherein: the signal converter is electrically connected with the signal amplifier, the signal amplifier is electrically connected with the signal encoder, and the signal encoder is electrically connected with the output interface on the interface panel.
As an optimal selection scheme of high definition liquid crystal concatenation integrated circuit board, wherein: the heat dissipation pipe fitting is a heat dissipation copper pipe, and the heat dissipation pipe fitting is arranged in a semicircular shape.
As an optimal selection scheme of high definition liquid crystal concatenation integrated circuit board, wherein: the inner cavities of the first heat dissipation hole and the second heat dissipation hole are provided with dust screens.
Compared with the prior art, the beneficial effects of the utility model are that: through the setting of this high definition liquid crystal concatenation integrated circuit board, structural design is reasonable, is provided with the heat dissipation pipe fitting through the bottom at the integrated circuit board body, is provided with radiating fin in radiating pipe fitting's both sides, is provided with the louvre No. two on radiating fin, is provided with the louvre No. one in interface panel's both sides, has improved the heat dispersion of device, prevents in the use, and the high temperature is provided with the dampproof course through the inner chamber lateral wall at the housing, has improved the humidity resistance of device, has prolonged the life of device.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the heat dissipation pipe of the present invention;
fig. 3 is a schematic view of the overlooking structure of the office board body of the present invention.
In the figure; 100 integrated circuit board bodies, 110 housings, 120 moisture-proof layers, 200 interface panels, 210 heat dissipation holes, 220 signal converters, 230 signal encoders, 240 signal amplifiers, 300 heat dissipation pipes, 310 heat dissipation fins and 320 heat dissipation holes.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways than those specifically described herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the schematic drawings, and in the detailed description of the embodiments of the present invention, for convenience of explanation, the sectional view showing the device structure will not be enlarged partially according to the general scale, and the schematic drawings are only examples, and should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
The utility model provides a following technical scheme: a high-definition liquid crystal splicing board improves the heat dissipation performance and the moisture resistance of a device and prolongs the service life of the device in the using process;
referring to fig. 1 to 3, the card connector comprises a card body 100, an interface panel 200 and a heat dissipation pipe 300, wherein a housing 110 is arranged outside the card body 100, a moisture-proof layer 120 is arranged on the side wall of an inner cavity of the housing 110, the interface panel 200 is arranged at the front end of the top of the card body 100, a first heat dissipation hole 210 is arranged on each of two sides of the interface panel 200, a signal converter 220, a signal encoder 240 and a signal amplifier 230 are arranged on the top of the card body 100, the heat dissipation pipe 300 is arranged at the bottom of the card body 100, heat dissipation fins 310 are arranged on two sides of the heat dissipation pipe 300, and a second heat dissipation hole 320 is arranged on each of the heat dissipation fins 310;
specifically, the interface panel 200 includes a DVI interface, an HOMI interface, a VGA interface, an RJ45 input interface, a USB interface, and an RJ45 output interface.
Specifically, the signal converter 220 is electrically connected to the signal amplifier 230, the signal amplifier 230 is electrically connected to the signal encoder 240, and the signal encoder 240 is electrically connected to the output interface of the interface panel 200.
Specifically, the heat dissipation pipe 300 is a heat dissipation copper pipe, and the heat dissipation pipe 300 is disposed in a semicircular shape.
Specifically, the inner cavities of the first heat dissipation hole 210 and the second heat dissipation hole 320 are provided with dust screens.
The working principle is as follows: the utility model discloses an in-process, be provided with heat dissipation pipe fitting 300 through the bottom at integrated circuit board body 100, both sides at heat dissipation pipe fitting 300 are provided with radiating fin 310, be provided with No. two louvres 320 on radiating fin 310, be provided with louvre 210 No. one in interface panel 200's both sides, the heat dispersion of device has been improved, in preventing the use, the high temperature, be provided with dampproof course 120 through the inner chamber lateral wall at housing 110, the moisture resistance of device has been improved, the life of device has been prolonged.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (5)
1. The utility model provides a high definition liquid crystal concatenation integrated circuit board which characterized in that: including integrated circuit board body (100), interface panel (200) and heat dissipation pipe fitting (300), the outside of integrated circuit board body (100) is provided with housing (110), the inner chamber lateral wall of housing (110) is provided with dampproof course (120), the top front end of integrated circuit board body (100) is provided with interface panel (200), the both sides of interface panel (200) are provided with louvre (210) No. one, the top of integrated circuit board body (100) is provided with signal converter (220), signal encoder (240) and signal amplifier (230), the bottom of integrated circuit board body (100) is provided with heat dissipation pipe fitting (300), the both sides of heat dissipation pipe fitting (300) are provided with radiating fin (310), be provided with louvre No. two (320) on radiating fin (310).
2. The high-definition liquid crystal splicing board card according to claim 1, characterized in that: the interface panel (200) comprises a DVI interface, an HOMI interface, a VGA interface, an RJ45 input interface, a USB interface and an RJ45 output interface.
3. The high-definition liquid crystal splicing board card according to claim 1, characterized in that: the signal converter (220) is electrically connected with the signal amplifier (230), the signal amplifier (230) is electrically connected with the signal encoder (240), and the signal encoder (240) is electrically connected with the output interface on the interface panel (200).
4. The high-definition liquid crystal splicing board card according to claim 1, characterized in that: the heat dissipation pipe fitting (300) is a heat dissipation copper pipe, and the heat dissipation pipe fitting (300) is arranged in a semicircular shape.
5. The high-definition liquid crystal splicing board card according to claim 1, characterized in that: the inner cavities of the first heat dissipation hole (210) and the second heat dissipation hole (320) are provided with dust screens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120523878.9U CN215010953U (en) | 2021-03-12 | 2021-03-12 | High definition liquid crystal concatenation integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120523878.9U CN215010953U (en) | 2021-03-12 | 2021-03-12 | High definition liquid crystal concatenation integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215010953U true CN215010953U (en) | 2021-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120523878.9U Active CN215010953U (en) | 2021-03-12 | 2021-03-12 | High definition liquid crystal concatenation integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215010953U (en) |
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2021
- 2021-03-12 CN CN202120523878.9U patent/CN215010953U/en active Active
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