CN215008274U

CN215008274U - Film packaging structure suitable for folding flexible display

Info

Publication number: CN215008274U
Application number: CN202022810099.5U
Authority: CN
Inventors: 齐竹竹; 郭秋泉
Original assignee: Jiangsu Chengrui Technology Co ltd
Current assignee: Jiangsu Chengrui Technology Co ltd
Priority date: 2020-11-29
Filing date: 2020-11-29
Publication date: 2021-12-03
Anticipated expiration: 2030-11-29

Abstract

The utility model discloses a film packaging structure suitable for folding flexible display, a serial communication port, the structure includes first inorganic layer (1), organic layer (3) and second inorganic layer (2), first inorganic layer (1) and second inorganic layer (2) are formed by diffusion barrier layer (4) and barrier layer (5) stack in turn. An overlapping structure is adopted to replace the original first inorganic layer/second inorganic layer structure,through film forming many times, reduce the internal stress of film forming rete every time, reduce the problem that rete crack, peeling appear, multilayer structure is barrier layer + diffusion inhibiting layer's integrated configuration, on satisfying the basis of encapsulation barrier performance, puts emphasis on preventing NH in the inorganic layer_x ^*Diffusion of free radicals. The overlapped packaging structure can not only prevent harmful gas in the external environment from corroding the OLED device, but also prevent the lower film in the whole structure from corroding the upper film.

Description

Film packaging structure suitable for folding flexible display

Technical Field

The utility model relates to a film packaging structure suitable for folding flexible display belongs to folding flexible AMOLED encapsulation technical field.

Background

The AMOLED device is sensitive to moisture and oxygen, and after the OLED light-emitting device is manufactured, an encapsulation protective layer is required to be added above the OLED device and used for blocking moisture and oxygen in the external environment from corroding the OLED device, so that the normal display of the OLED device is ensured, and the service life of the OLED device is prolonged.

The packaging method of the AMOLED device mainly comprises UV packaging, Frit packaging, thin film packaging and the like. For the flexible AMOLED display screen body, the UV glue packaging and the Frit packaging cannot meet the requirement of flexibility due to the existence of the glass cover plate, so that only a thin film packaging (TFE) mode can be adopted.

For the thin film package, package structures such as inorganic thin film package, organic thin film package, inorganic/organic thin film package, and the like can be used. Considering the packaging effect and the feasibility of mass production, the industry mainly uses an inorganic/organic thin film packaging structure. The inorganic layer is mainly used for blocking harmful gas substances such as water vapor and oxygen, and the organic layer is mainly used for balancing the stress of the inorganic layer.

The first technical scheme is as follows: the existing thin film packaging structure adopts a CVD1-IJP-CVD2 three-layer packaging structure. CVD1 (the first inorganic layer) adopts Plasma Enhanced Chemical Vapor Deposition (PECVD) process, the film forming type is SiNx (poly silicon nitride)/SiONx (poly silicon oxynitride)/SiOx (poly silicon oxide), and the film thickness is 0.5-1.5 um; the IJP adopts an ink-jet printing process, the film forming type is acrylic/epoxy/organic silicon generally, and the film thickness is 5-20 um; the CVD2 (second inorganic layer) adopts Plasma Enhanced Chemical Vapor Deposition (PECVD) process, the film forming type is SiNx/SiONx/SiOx, and the film thickness is 0.5-1.5 um.

The drawback of this solution is that the SiNx/sion x/SiOx thin film formed by Plasma Enhanced Chemical Vapor Deposition (PECVD) deposition process is inorganic and generally compressive. For folding flexibility, excessive internal stress is easy to generate film crack and film peeling phenomena in the bending process, so that defects are caused. Particularly, in the case of the fold-out display, when the screen is folded out, the screen is in a stretched state and is repelled by the compressive stress generated by the film formation of the film package CVD1/CVD2, and thus the abnormalities such as film crack (crack) and delamination (peeling) are more likely to occur, which causes the display failure of the screen. For the IJP process, since the ink jet printing process is adopted, in order to prevent the liquid fluidity of the film forming raw material and ensure that the position of the film forming edge is at the required position, a Dam (Dam) is generally made at the edge for stopping the flow of the film forming raw material ink, and a double Dam, i.e., an inner Dam and an outer Dam, is generally adopted. Since the height of the dam is higher than that of the non-dam region, abnormal conditions such as disconnection and excessively thin film easily occur in the climbing part of the dam in the CVD1/CVD2 film layer, and finally display failure occurs.

For the folded flexible AMOLED device, the SiX thin film used in the current CVD film layer contains ammonia (NH3) in the film forming raw material, the ammonia cannot be completely dissociated in the PECVD apparatus, and the formed radicals contain NH_x ^*. In the multiple bending process, if the CVD film has crack, NH contained in the film_x ^*The radicals diffuse and react with iodide ions in the polarizer, thereby causing failure of the polarizer.

The second prior art scheme is: a multilayer packaging structure of ALD1+ CVD1/IJP/ALD2+ CVD2 is adopted. An Atomic Layer Deposition (ALD) process is used to enhance or replace CVD thin films. The ALD film forming type is AlOx/SiOx, and the film forming thickness is 30-100 nm. The CVD and IJP processes are the same as in the prior art solution.

The disadvantage of this solution is that the Atomic Layer Deposition (ALD) film formation rate is 0.1-0.3 nm/sec, which is very slow compared to the CVD film formation rate (300 nm/sec), thus causing a large delay in the tact. In addition, the types of the atomic layer deposition films are controlled and limited by precursor materials and reaction modes, the types of the selectable films are limited, and AlO is adopted in the general thermal reaction type atomic layer deposition_xThin film, plasma enhanced atomic layer depositionAlO_xOr SiO_xA film. The remaining technical drawbacks for the folded flexible AMOLED device are consistent with one of the prior art.

Chinese patent 201610584780.8 discloses a thin film encapsulation member of an organic light emitting diode device, comprising at least one inorganic film layer and at least one organic film layer, wherein the inorganic film layer and the organic film layer are alternately stacked, and the thin film encapsulation member is characterized in that: the material of the inorganic film layer is selected from one or the combination of more of silicon nitride, silicon oxide, silicon oxynitride, silicon carbonitride, silicon oxycarbide and silicon oxycarbonitride; the material of the organic film layer is selected from any one or a combination of a plurality of acryl-based polymers, silicon-based polymers or epoxy-based polymers. The scheme can prevent NH to a certain degree_x ^*The free radicals diffuse, but the effect is still not ideal.

Disclosure of Invention

An object of the utility model is to provide a film packaging structure and production method suitable for folding flexible display can solve in the folding flexible display because the polaroid that film packaging crackle leads to is inefficacious to and it is great to solve present CVD1 CVD2 rete thick and stress, the rete crack appears easily when buckling, the peeling phenomenon, thereby lead to showing bad scheduling problem.

In order to solve the technical problem, the utility model discloses a following technical scheme: the utility model provides a film packaging structure suitable for folding flexible display, the structure includes first inorganic layer, organic layer and second inorganic layer, first inorganic layer and second inorganic layer are formed by diffusion barrier layer and barrier layer stack in turn.

The aforesaid is applicable to the film packaging structure that folding flexible showed, diffusion barrier layer adopts and does not contain ammonium ion or the inorganic film of ammonium free radical, silicon oxide, aluminium oxide or titanium oxide film, the barrier layer adopts metal oxide film or metal nitride film, aluminium oxide, silicon oxide or silicon oxynitride.

In the foregoing film encapsulation structure suitable for folding flexible display, the diffusion barrier layer and the barrier layer in the first inorganic layer and the second inorganic layer are 2 or more layers.

In the foregoing thin film encapsulation structure suitable for a foldable flexible display, the diffusion barrier layer and the barrier layer in the first inorganic layer and the second inorganic layer are 2 to 5 layers.

The thin film packaging structure suitable for folding flexible display is characterized in that the thickness of the diffusion barrier layer is 0.1-0.2 um, and a silicon oxide thin film is adopted.

The thin film packaging structure suitable for folding flexible display is characterized in that the thickness of the barrier layer is 0.1-0.2 um.

The foregoing thin film encapsulation structure suitable for a foldable flexible display, the diffusion barrier layer is above the barrier layer.

The aforesaid is applicable to folding flexible display's film packaging structure, the organic layer thickness is 2 ~ 20um, and the whole thickness on first inorganic layer is 0.3 ~ 1.5 micron, and the whole thickness on second inorganic layer is 0.3 ~ 1.5 micron.

The production method of the thin film packaging structure suitable for folding flexible display comprises the steps of packaging a first inorganic layer, an organic layer and a second inorganic layer on an AMOLED device in sequence when the AMOLED device is packaged, wherein the first inorganic layer and the second inorganic layer are formed by alternately overlapping a diffusion barrier layer and a barrier layer.

In the foregoing method for producing a thin film encapsulation structure suitable for a foldable flexible display, the diffusion barrier layer and the barrier layer are encapsulated by using a plasma enhanced chemical vapor deposition process, a high-density plasma enhanced chemical vapor deposition process, or an atomic layer deposition process.

Compared with the prior art, the utility model has the advantages of it is following:

1. the film packaging structure comprises: the overlapping structure is adopted to replace the original first inorganic layer/second inorganic layer structure, the internal stress of the film forming film layer is reduced each time through multiple film forming, the problem of film crack and peeling is reduced, the film forming process without ammonia gas reaction gas is adopted to block the film forming process with ammonia gas reaction gas, and the optimal film thickness of the first inorganic layer/second inorganic layer of the overlapping structure is obtained. The multilayer structure is a combined structure of a barrier layer and a diffusion inhibition layer, and meets the requirement of packaging barrier propertyEmphasis is placed on preventing NH in the inorganic layer_x ^*Diffusion of free radicals.

2. Film layers for film encapsulation: the film containing ammonia reaction gas mainly comprises SiNx and SiONx; the film containing no ammonia reaction gas was mainly SiOx. The overlapped packaging structure can not only prevent harmful gas in the external environment from corroding the OLED device, but also prevent the lower film in the whole structure from corroding the upper film.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a schematic structural diagram of prior art scheme 1;

fig. 3 is a schematic structural view of prior art scheme 2.

The following description is given with reference to the accompanying drawings and the detailed description, but not to limit the present invention.

Detailed Description

Embodiment 1 of the utility model:

the utility model provides a film packaging structure suitable for folding flexible display, the structure includes first inorganic layer 1, organic layer 3 and second inorganic layer 2, first inorganic layer 1 and second inorganic layer 2 are formed by diffusion barrier layer 4 and barrier layer 5 stack in turn.

Wherein, the diffusion barrier layer 4 adopts an inorganic film without ammonium ions or ammonium radicals, such as a silicon oxide, aluminum oxide or titanium oxide film, and the barrier layer 5 adopts a metal oxide film or a metal nitride film, such as aluminum oxide, silicon oxide or silicon oxynitride.

More preferably, the diffusion barrier layer 4 and the barrier layer 5 in the first inorganic layer 1 and the second inorganic layer 2 are 2 or more layers.

Preferably, the diffusion barrier layer 4 and the barrier layer 5 in the first inorganic layer 1 and the second inorganic layer 2 are 2 to 5 layers.

Preferably, the thickness of the diffusion barrier layer 4 is 0.1-0.2 um, and a silicon oxide film is adopted.

More preferably, 5 thickness of barrier layer is 0.1 ~ 0.2um, adopts the independent filming of silicon nitride or poly silicon oxynitride, or the two jointly films.

The diffusion barrier layer 4 is above the barrier layer 5.

More preferably, the thickness of the organic layer 3 is 2 to 20um, the overall thickness of the first inorganic layer 1 is 0.3 to 1.5 micron, and the overall thickness of the second inorganic layer 2 is 0.3 to 1.5 micron. By selecting the thickness and number of the diffusion barrier layer 4, the barrier layer 5, the first inorganic layer 1 and the second inorganic layer 2, NH in the inorganic layers can be prevented_x ^*The diffusion of free radicals and the corrosion resistance reduce the packaging thickness and the packaging difficulty of the film, and a good packaging effect is realized.

The production method of the thin film packaging structure suitable for folding flexible display comprises the steps of sequentially packaging a first inorganic layer 1, an organic layer 3 and a second inorganic layer 2 on an AMOLED device 6 when the AMOLED device 6 is packaged, wherein the first inorganic layer 1 and the second inorganic layer 2 are formed by alternately overlapping a diffusion barrier layer 4 and a barrier layer 5.

The diffusion barrier layer 4 and the barrier layer 5 are encapsulated using a plasma enhanced chemical vapor deposition process, a high density plasma enhanced chemical vapor deposition process, or an atomic layer deposition process.

Embodiment 2 of the utility model: the utility model provides a film packaging structure suitable for folding flexible display, the structure includes first inorganic layer 1, organic layer 3 and second inorganic layer 2, first inorganic layer 1 and second inorganic layer 2 are formed by diffusion barrier layer 4 and barrier layer 5 stack in turn.

The diffusion barrier layer 4 is a titanium oxide film, and the barrier layer 5 is silicon oxynitride.

The diffusion barrier layer 4 and the barrier layer 5 in the first inorganic layer 1 and the second inorganic layer 2 are 3 to 4 layers.

The thickness of the diffusion barrier layer 4 is 0.15 um.

More preferably, the thickness of the barrier layer 5 is 0.15um, and the film is formed by adopting the silicon nitride and the silicon oxynitride.

The diffusion barrier layer 4 is above the barrier layer 5.

The thickness of the organic layer 3 is 10um, the whole thickness of the first inorganic layer 1 is 0.8 micron, and the whole thickness of the second inorganic layer 2 is 0.8 micron.

The production method is the same as example 1.

Claims

1. The utility model provides a film packaging structure suitable for folding flexible display, its characterized in that, the structure includes first inorganic layer (1), organic layer (3) and second inorganic layer (2), first inorganic layer (1) and second inorganic layer (2) are formed by diffusion barrier layer (4) and barrier layer (5) stack in turn.

2. The thin film encapsulation structure suitable for the foldable flexible display of claim 1, wherein the diffusion barrier layer (4) is made of inorganic thin film, silicon oxide, aluminum oxide or titanium oxide film without containing ammonium ions or ammonium radicals, and the barrier layer (5) is made of metal oxide film or metal nitride film, aluminum oxide, silicon oxide or silicon oxynitride.

3. The thin film encapsulation structure suitable for a folding flexible display according to claim 1, wherein the diffusion barrier layer (4) and the barrier layer (5) in the first inorganic layer (1) and the second inorganic layer (2) are 2 layers or more.

4. A thin film encapsulation structure suitable for folding flexible displays according to claim 3, characterized in that the diffusion barrier layer (4) and the barrier layer (5) in the first inorganic layer (1) and the second inorganic layer (2) are 2-5 layers.

5. The thin film encapsulation structure suitable for the folding flexible display of claim 3, wherein the thickness of the diffusion barrier layer (4) is 0.1-0.2 um, and a silicon oxide thin film is adopted.

6. The thin film encapsulation structure suitable for the folding flexible display of claim 3, wherein the thickness of the barrier layer (5) is 0.1-0.2 um.

7. The thin film encapsulation structure suitable for folding flexible displays of claim 1, characterized in that the diffusion barrier layer (4) is above the barrier layer (5).

8. The thin film encapsulation structure suitable for the foldable flexible display of claim 1, wherein the thickness of the organic layer (3) is 2-20 um, the overall thickness of the first inorganic layer (1) is 0.3-1.5 um, and the overall thickness of the second inorganic layer (2) is 0.3-1.5 um.