CN214957803U

CN214957803U - Novel semiconductor laser

Info

Publication number: CN214957803U
Application number: CN202121114215.8U
Authority: CN
Inventors: 徐晓丽; 马煜栋
Original assignee: Shenzhen Lela Laser Technology Co ltd
Current assignee: Shenzhen Lela Laser Technology Co ltd
Priority date: 2021-05-24
Filing date: 2021-05-24
Publication date: 2021-11-30
Anticipated expiration: 2031-05-24

Abstract

The utility model discloses a novel semiconductor laser, including the laser main part, the upper end surface of laser main part is provided with heat dissipation installation mechanism, be provided with an installation section of thick bamboo between heat dissipation installation mechanism and the laser main part, heat dissipation installation mechanism's lower extreme outer wall is through the inside movable mounting in upper end of an installation section of thick bamboo and laser main part. A novel semiconductor laser, through the heat dissipation installation mechanism that sets up, make the installation between heat dissipation mechanism and the laser main part more convenient, during the installation, the installation cover is installed inside the upper end of laser main part through the installation screw thread, the setting of spacing guard circle plays certain limiting displacement to the installation cover, this novel semiconductor laser, through the heat dissipation mechanism that sets up, make the radiating rate of whole laser inside chip when using faster, the laser uses more smoothly, during the use, the inside at the installation draw-in groove is installed to the installation fixture block, the installation of the heating panel of being convenient for.

Description

Novel semiconductor laser

Technical Field

The utility model relates to a semiconductor laser technical field specifically is a novel semiconductor laser.

Background

Semiconductor laser, also called laser diode, is a laser using semiconductor material as working substance, the specific process of different kinds of laser is special due to the difference of substance structure, the semiconductor laser device can be divided into several kinds of homojunction, single heterojunction, double heterojunction, etc., homojunction laser and single heterojunction laser are mostly pulse devices at room temperature, and double heterojunction laser can realize continuous work at room temperature, the semiconductor diode laser is the most practical and important kind of laser, it has small volume and long service life, and can adopt simple current injection mode to pump, its working voltage and current are compatible with integrated circuit, so it can be integrated with its single chip, and can also directly carry out current modulation with frequency up to GHz to obtain high-speed modulated laser output, because of these advantages, the semiconductor diode laser can be used in laser communication, Optical storage, optical gyros, laser printing, ranging, and radar are widely used.

When the existing semiconductor laser is used, the temperature of an internal chip can be gradually increased, the temperature of the laser with the temperature increased can prevent the laser from obtaining good working performance, and therefore the novel semiconductor laser is provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a novel semiconductor laser possesses the radiating efficiency height, and advantages such as the heat dissipation mechanism installation is simple can effectively solve the problem in the background art to prior art not enough.

(II) technical scheme

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a novel semiconductor laser, includes the laser main part, the upper end surface of laser main part is provided with heat dissipation installation mechanism, be provided with an installation section of thick bamboo between heat dissipation installation mechanism and the laser main part, the inside movable mounting in upper end of a heat dissipation installation mechanism's lower extreme outer wall through an installation section of thick bamboo and laser main part, heat dissipation installation mechanism's inside movable mounting has heat dissipation mechanism.

Preferably, the front end outer fixed surface of laser main part is connected with the installed part, the front end fixedly connected with of installed part is a light section of thick bamboo, the front end inner wall of a light section of thick bamboo is provided with the light lid, the rear end inner wall demountable installation of light lid has the optical lens, be provided with the screw thread circle between light lid and the light section of thick bamboo, the rear end outer wall of light lid passes through the screw thread circle and the front end inner wall movable mounting of a light section of thick bamboo.

Preferably, the heat dissipation mounting mechanism comprises a mounting sleeve, a mounting thread, a built-in ring, a mounting clamping groove and a limiting protection ring, and the limiting protection ring is fixedly connected to the outer surface of the upper end of the mounting sleeve.

Preferably, the inner wall of the mounting sleeve is fixedly connected with a built-in ring, the outer surface of the upper end of the built-in ring is provided with a mounting clamping groove, and the outer wall of the lower end of the mounting sleeve is provided with mounting threads.

Preferably, the heat dissipation mechanism includes metal heat conduction frame, class liquid metal, graphite fin, erection column, motor post, flabellum, heating panel and installation fixture block, the outer wall fixedly connected with installation fixture block of heating panel, the lower extreme surface fixed mounting of heating panel has the motor post.

Preferably, the middle outer wall of the motor column is detachably provided with fan blades, the lower end outer surface of the motor column is fixedly connected with the mounting column, the lower end outer surface of the mounting column is fixedly connected with the metal heat conduction frame, the upper end outer surface of the metal heat conduction frame is fixedly adhered with graphite cooling fins, the graphite cooling fins are located outside the mounting column, and liquid metal is arranged inside the metal heat conduction frame.

(III) advantageous effects

Compared with the prior art, the utility model provides a novel semiconductor laser possesses following beneficial effect:

1. this novel semiconductor laser through the heat dissipation installation mechanism that sets up for installation between heat dissipation mechanism and the laser main part is more convenient, and during the installation, the installation cover is installed inside the upper end of laser main part through the installation screw thread, and certain limiting displacement is played to the installation cover in the setting of spacing guard ring, the installation of the installation cover of being convenient for, and certain dustproof guard action is played to the built-in circle of the inside setting of installation cover to spacing guard ring, and the installation of the mechanism of being convenient for dispel the heat of seting up of installation slot.

2. The novel semiconductor laser has the advantages that through the arranged heat dissipation mechanism, the heat dissipation speed of the inner chip of the whole laser is higher when the laser is used, the laser is used more smoothly, when the laser is used, the laser chip is attached to the lower end of the metal heat conduction frame, the temperature of the chip is directly transferred to the metal heat conduction frame after the temperature of the chip is raised, the inner portion of the lower end of the metal heat conduction frame is raised, liquid-like metal is further changed from solid to liquid, gaps in the metal heat conduction frame are filled, the heat transfer efficiency is improved, the heat dissipation speed is greatly improved, the heat conduction coefficient of the liquid-like metal is K =3.3, the heat transfer speed relative to air is higher and higher efficient, heat is transferred to the upper end of the metal heat conduction frame and is rapidly and uniformly dispersed through the graphite heat dissipation fins, the heat conduction coefficient of the graphite is K >100, the heat on the graphite heat dissipation fins is accelerated through the motor columns and the fan blades, and the heat transferred by the rotation of the fan blades is led out of the laser main body through the heat dissipation plates, the installation fixture block is installed in the installation clamping groove, so that the heat dissipation plate can be conveniently installed.

Drawings

Fig. 1 is the overall structure schematic diagram of the semiconductor laser of the present invention.

Fig. 2 is a schematic structural diagram of a novel heat dissipation mounting mechanism in a semiconductor laser.

Fig. 3 is a schematic structural diagram of a novel heat dissipation mechanism in a semiconductor laser of the present invention.

In the figure: 1. a laser body; 2. a mounting member; 3. a light cylinder; 4. a light cover; 5. a light mirror; 6. a heat dissipation mounting mechanism; 601. installing a sleeve; 602. installing threads; 603. a ring is arranged inside; 604. installing a clamping groove; 605. a limiting protection ring; 7. a heat dissipation mechanism; 701. a metal heat conducting frame; 702. a liquid-like metal; 703. a graphite heat sink; 704. mounting a column; 705. a motor column; 706. a fan blade; 707. a heat dissipation plate; 708. and (6) installing a clamping block.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

Detailed description of the preferred embodiment

The present embodiment is a novel semiconductor laser.

As shown in fig. 1-3, a novel semiconductor laser comprises a laser main body 1, a heat dissipation mounting mechanism 6 is arranged on the outer surface of the upper end of the laser main body 1, a mounting cylinder is arranged between the heat dissipation mounting mechanism 6 and the laser main body 1, the outer wall of the lower end of the heat dissipation mounting mechanism 6 is movably mounted in the upper end of the laser main body 1 through the mounting cylinder, and a heat dissipation mechanism 7 is movably mounted in the heat dissipation mounting mechanism 6.

The front end outer fixed surface of laser main body 1 is connected with installed part 2, the front end fixedly connected with of installed part 2 light section of thick bamboo 3, the front end inner wall of light section of thick bamboo 3 is provided with light lid 4, the rear end inner wall demountable installation of light lid 4 has optical lens 5, be provided with the screw thread circle between light lid 4 and the light section of thick bamboo 3, the rear end outer wall of light lid 4 passes through screw thread circle and the front end inner wall movable mounting of light section of thick bamboo 3, heat dissipation installation mechanism 6 includes mounting sleeve 601, installation thread 602, built-in circle 603, installation slot 604 and spacing guard ring 605, the upper end outer fixed surface of mounting sleeve 601 is connected with spacing guard ring 605, the inner wall fixedly connected with of mounting sleeve 601 embeds circle 603, installation slot 604 has been seted up to the upper end surface of built-in circle 603, installation thread 602 has been seted up to the lower extreme outer wall of mounting sleeve 601.

It should be noted that the present invention is a novel semiconductor laser, which is characterized in that the installation between the heat dissipation mechanism 7 and the laser main body 1 is more convenient by the installation mechanism 6 for heat dissipation, when installing, the installation sleeve 601 is installed inside the upper end of the laser main body 1 by the installation thread 602, the installation sleeve 601 is limited by the limit protection ring 605, the installation of the installation sleeve 601 is facilitated, and the limit protection ring 605 protects the built-in ring 603 inside the installation sleeve 601 from dust, the installation of the heat dissipation mechanism 7 is facilitated by the installation groove 604, the heat dissipation mechanism 7 is arranged, so that the heat dissipation speed of the chip inside the whole laser is faster when using, the laser is more smoothly used, when using, the laser chip is attached to the lower end 701 of the metal heat conduction frame, after the temperature of the chip rises, the temperature is directly transferred to the metal heat conduction frame 701, the lower end of the metal heat conduction frame 701 rises inside, so that the liquid-like metal 702 is changed into liquid from a solid state, the gap inside the metal heat conduction frame 701 is filled, the heat transfer efficiency is improved, the heat dissipation speed is greatly improved, the heat conduction coefficient of the liquid-like metal 702 is K =3.3, the heat transfer speed relative to air is faster and more efficient, the heat is transferred to the upper end of the metal heat conduction frame 701, the heat is rapidly and uniformly dispersed through the graphite heat dissipation fins 703, the heat conduction coefficient K is greater than 100, the heat on the graphite heat dissipation fins 703 is accelerated by the motor columns 705 and the fan blades 706, the heat transmitted by the rotation of the fan blades 706 is guided out of the laser main body 1 through the heat dissipation plate 707, the installation clamping block 708 is installed inside the installation clamping groove 604, and the installation of the heat dissipation plate 707 is facilitated.

Detailed description of the invention

The present embodiment is an embodiment of a novel heat dissipation mechanism for a semiconductor laser.

As shown in fig. 1 and 3, a novel heat dissipation mechanism for a semiconductor laser, the heat dissipation mechanism 7 includes a metal heat conduction frame 701, a liquid metal-like 702, a graphite heat dissipation fin 703, a mounting column 704, a motor column 705, a fan blade 706, a heat dissipation plate 707 and a mounting fixture 708, the outer wall of the heat dissipation plate 707 is fixedly connected with the mounting fixture 708, the outer surface of the lower end of the heat dissipation plate 707 is fixedly provided with the motor column 705, the outer wall of the middle part of the motor column 705 is detachably provided with the fan blade 706, the outer surface of the lower end of the motor column 705 is fixedly connected with the mounting column 704, the outer surface of the lower end of the mounting column 704 is fixedly connected with the metal heat conduction frame 701, the graphite heat dissipation fin 703 is fixedly adhered to the outer surface of the upper end of the metal heat conduction frame 701, the graphite heat dissipation fin 703 is located outside the mounting column 704, and the liquid metal-like 702 is arranged inside the metal heat conduction frame 701.

It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A novel semiconductor laser comprising a laser body (1), characterized in that: the outer surface of the upper end of the laser main body (1) is provided with a heat dissipation installation mechanism (6), an installation cylinder is arranged between the heat dissipation installation mechanism (6) and the laser main body (1), the outer wall of the lower end of the heat dissipation installation mechanism (6) is movably installed in the upper end of the installation cylinder and the laser main body (1), and a heat dissipation mechanism (7) is movably installed in the heat dissipation installation mechanism (6).

2. A novel semiconductor laser as claimed in claim 1 wherein: the utility model discloses a laser instrument, including laser main part (1), the front end outer fixed surface of laser main part (1) is connected with installed part (2), the front end fixedly connected with light section of thick bamboo (3) of installed part (2), the front end inner wall of light section of thick bamboo (3) is provided with light lid (4), the rear end inner wall demountable installation of light lid (4) has light mirror (5), be provided with the screw thread circle between light lid (4) and light section of thick bamboo (3), the rear end outer wall of light lid (4) passes through the screw thread circle and the front end inner wall movable mounting of light section of thick bamboo (3).

3. A novel semiconductor laser as claimed in claim 1 wherein: the heat dissipation mounting mechanism (6) comprises a mounting sleeve (601), mounting threads (602), a built-in ring (603), a mounting clamping groove (604) and a limiting protection ring (605), wherein the limiting protection ring (605) is fixedly connected to the outer surface of the upper end of the mounting sleeve (601).

4. A novel semiconductor laser as claimed in claim 3 wherein: the inner wall of the mounting sleeve (601) is fixedly connected with a built-in ring (603), the outer surface of the upper end of the built-in ring (603) is provided with a mounting clamping groove (604), and the outer wall of the lower end of the mounting sleeve (601) is provided with mounting threads (602).

5. A novel semiconductor laser as claimed in claim 1 wherein: the heat dissipation mechanism (7) comprises a metal heat conduction frame (701), liquid metal (702), graphite heat dissipation fins (703), mounting columns (704), motor columns (705), fan blades (706), a heat dissipation plate (707) and mounting fixture blocks (708), the outer wall of the heat dissipation plate (707) is fixedly connected with the mounting fixture blocks (708), and the outer surface of the lower end of the heat dissipation plate (707) is fixedly provided with the motor columns (705).

6. A novel semiconductor laser as claimed in claim 5 wherein: the fan blades (706) are detachably mounted on the outer wall of the middle of the motor column (705), the mounting column (704) is fixedly connected to the outer surface of the lower end of the motor column (705), the metal heat conduction frame (701) is fixedly connected to the outer surface of the lower end of the mounting column (704), the graphite cooling fins (703) are pasted to the outer surface of the upper end of the metal heat conduction frame (701), the graphite cooling fins (703) are located outside the mounting column (704), and liquid metal (702) is arranged inside the metal heat conduction frame (701).