CN214956770U - Blanking mechanism and automatic glue sealing equipment - Google Patents

Abstract

The utility model relates to an automation equipment field, especially an unloading mechanism and automatic glue equipment of sealing. The unloading mechanism includes: the automatic feeding device comprises a feeding Y-direction slide rail, a feeding sliding seat, a feeding Z-direction slide rail, an X-axis feeding turnover device, a feeding sliding driving mechanism and a feeding adsorption assembly; the rotary driving end of the X-axis blanking overturning driving device is vertically connected with a blanking adsorption component, so that the adsorption end of the blanking adsorption component can overturn in a vertical plane perpendicular to the X direction; the blanking mechanism can automatically indicate the blanking of the semiconductor refrigeration chip which is subjected to the dispensing operation to a designated position, and can also perform drying or stacking operation on the blanked semiconductor refrigeration chip according to the blanking requirement, so that the automation degree of the automatic glue sealing equipment is improved, and the glue sealing processing efficiency and quality of the semiconductor refrigeration chip are improved.

Description

Blanking mechanism and automatic glue sealing equipment

Technical Field

The utility model relates to an automation equipment field, especially an unloading mechanism and automatic glue equipment of sealing.

Background

In the production process of the semiconductor refrigeration chip, after the hot end substrate and the cold end substrate are attached, glue sealing operation needs to be carried out on the periphery of the semiconductor refrigeration chip, and the periphery of the semiconductor refrigeration chip is sealed by using solidified glue.

The traditional semiconductor refrigeration chip production is basically completed manually, the semiconductor chips are manually held one by one for gluing, the problems of low efficiency and high labor cost exist in manual processing, particularly, if the periphery of the semiconductor refrigeration chip is packaged by manual glue dispensing, the hands of workers are easy to shake, glue sealing at the peripheral position of the semiconductor refrigeration chip is uneven, a blade is required to be used for trimming after the glue dispensing, if bubbles are generated during the glue dispensing, the solidified semiconductor refrigeration chip becomes waste, and the production efficiency of the refrigeration chip is seriously influenced.

Along with the development of automation technology, an automatic packaging mechanism or equipment appears in the prior art, for example, the chinese utility model patent with patent publication No. CN207951883U discloses a semiconductor refrigeration chip packaging mechanism, which can adsorb and clamp a single semiconductor refrigeration chip and rotate vertically, and then automatically complete the adhesive dispensing and sealing operation of the semiconductor chip by using an adhesive dispensing device. However, the glue sealing operation of the semiconductor refrigeration chip includes a loading and clamping operation, a dispensing operation and a discharging operation, the packaging mechanism only enables the dispensing operation of the semiconductor refrigeration chip to be automated, the semiconductor chip still needs to be manually operated to be adsorbed and clamped on the adsorption workpiece, and the semiconductor refrigeration chip still needs to be manually cancelled from the adsorption workpiece after the dispensing operation is completed, so that the processing efficiency and the processing quality of the packaging mechanism in practical application can still be influenced by the manual loading or discharging operation efficiency and the operation precision, and the glue sealing processing efficiency and the processing quality of the semiconductor refrigeration chip are still difficult to be well improved.

SUMMERY OF THE UTILITY MODEL

To the above defect, the utility model aims to provide an unloading mechanism, unloading mechanism can realize the automatic accurate unloading operation of semiconductor refrigeration chip.

Another object of the utility model is to provide an automatic glue equipment of sealing, the degree of automation of automatic glue equipment of sealing is higher, and the glue machining efficiency and the quality of sealing of semiconductor refrigeration chip are higher.

To achieve the purpose, the utility model adopts the following technical proposal:

a blanking mechanism, comprising: the automatic feeding device comprises a feeding Y-direction slide rail, a feeding sliding seat, a feeding Z-direction slide rail, an X-axis feeding turnover device, a feeding sliding driving mechanism and a feeding adsorption assembly; the blanking sliding seat is arranged on the blanking Y-direction sliding rail in a sliding manner; the blanking Z-direction slide rail is arranged on the blanking slide seat, the X-axis blanking overturning driving device is slidably mounted on the blanking Z-direction slide rail, and a rotation driving end of the X-axis blanking overturning driving device is vertically connected with the blanking adsorption component, so that the adsorption end of the blanking adsorption component can be overturned in a vertical plane vertical to the X direction; the blanking sliding seat and the X-axis blanking turnover device slide along the blanking Y-direction sliding rail and the blanking Z-direction sliding rail respectively under the driving of a blanking sliding driving mechanism arranged at a corresponding position.

Preferably, the unloading adsorption component includes: a Y-direction blanking overturning driving device and a blanking adsorption end; the Y-direction blanking turnover device is characterized in that a body of the Y-direction blanking turnover device is connected with a rotation driving end of the X-axis blanking turnover driving device, and the rotation driving end of the Y-direction blanking driving device is vertically connected with a blanking adsorption end.

Preferably, the automatic feeding device is further provided with an air drying device, and a blowing opening of the air drying device faces to an active area of the feeding adsorption end.

Preferably, the feeding adsorption end is a flexible sucker, the end face of the outer end of the feeding adsorption end is an adsorption face, the adsorption face is made of soft materials and is provided with air holes, the periphery of each air hole is provided with a sealing skirt edge, and the inner end of each air hole is provided with an air flow pipeline communicated with the air holes.

Preferably, the blanking Y-direction slide rail and the blanking Z-direction slide rail are both provided with travel limit switches, and the travel limit switches are used for detecting the position information of the blanking sliding seat and the X-axis blanking overturning driving device.

More preferably, the automatic feeding device is further provided with a discharging conveying belt, and the discharging adsorption component is located right above the feeding end of the discharging conveying belt.

Preferably, the blanking end and the feeding end of the blanking conveyor belt are both provided with blanking detectors; the blanking detector is used for detecting and controlling the stop and the movement of the blanking conveyor belt.

Preferably, the blanking mechanism is further provided with a counter, and the counter is used for recording the number of the materials blanked by the blanking adsorption assembly; the unloading adsorption component is provided with a height sensor for detecting the height between the adsorption component and the top surface of the unloading conveyor belt.

Automatic glue sealing equipment, it includes: the dispensing device and the blanking mechanism are arranged; the adhesive dispensing device comprises: the glue dispensing device comprises a glue dispensing X-direction slide rail, a glue dispensing Z-direction slide rail, a glue dispensing slide base, a glue dispensing slide top seat, a glue dispensing assembly, a glue dispensing adsorption assembly, a glue dispensing overturning driving device and a glue dispensing slide driving mechanism; the glue dispensing sliding base is arranged on the glue dispensing X-direction sliding rail in a sliding manner; the dispensing Z-direction slide rail is arranged right above the dispensing X-direction slide rail; the glue dispensing sliding top seat is arranged on the glue dispensing Z-direction slide rail in a sliding manner; the dispensing component is parallel to the Z-direction slide rail and is arranged on the dispensing sliding top seat; the glue dispensing overturning driving device is arranged on the glue dispensing base; the dispensing adsorption component is arranged along the Y direction and is in transmission connection with a rotating shaft of the dispensing overturning driving device; the glue dispensing sliding base and the glue dispensing sliding top seat respectively slide along the glue dispensing X-direction slide rail and the glue dispensing Z-direction slide rail under the driving of a glue dispensing sliding driving mechanism driving device arranged at the corresponding positions; the unloading mechanism set up in dispensing device's inboard, and be close to the unloading end of X to the slide rail is glued to the point, makes unloading adsorption end when overturning to be on a parallel with Y to the direction, unloading adsorption end can with slide to X is to the unloading end of slide rail the point adsorb subassembly butt joint.

Preferably, the dispensing adsorption assembly comprises a dispensing adsorption end and a telescopic wire pushing assembly arranged on one side of the dispensing adsorption end, the dispensing adsorption end and the telescopic wire pushing assembly are arranged along the Y direction, and the telescopic wire pushing assembly comprises a wire pushing telescopic driving device and a wire pushing plate connected to the driving end of the wire pushing telescopic driving device; and a dispensing hollow window is arranged in the middle of the line pushing plate.

According to the above content, the utility model provides an unloading mechanism and automatic glue equipment of sealing, unloading mechanism not only can indicate the assigned position with the semiconductor refrigeration chip unloading of accomplishing the point operation voluntarily, can also dry or pile up the operation to the semiconductor refrigeration chip by the unloading as required according to the unloading, and then improves the degree of automation of automatic glue equipment of sealing improves the gluey machining efficiency and the quality of gluing of semiconductor refrigeration chip.

Drawings

Fig. 1 is a schematic structural view of the automatic glue sealing apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic view of the embodiment of FIG. 1 with the housing removed;

FIG. 3 is a schematic diagram of another perspective of the embodiment of FIG. 2;

fig. 4 is a schematic structural view of the feeding jig according to an embodiment of the present invention;

fig. 5 is a schematic structural view of the material taking mechanism according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of the pre-positioning feeding mechanism according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of the pre-positioning device according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of another perspective of the embodiment of FIG. 7;

fig. 9 is a schematic structural view of the dispensing device according to an embodiment of the present invention;

FIG. 10 is a schematic structural view of a part of the structure in the embodiment shown in FIG. 9;

fig. 11 is a schematic structural diagram of the blanking mechanism in an embodiment of the present invention.

Wherein: the feeding jig 100, the Z-direction bar-shaped clamping groove 110, the Z-direction bar-shaped hollowed-out portion 120, the material taking mechanism 140, the material taking X-direction slide rail 141, the material taking slide seat 142, the material taking adsorption end 143, the pre-positioning feeding mechanism 200, the pre-positioning device 210, the positioning seat 211, the slide limit 213, the positioning telescopic driving device 214, the fixing limit 215, the flip-over feeding device 220, the material feeding Y-direction slide rail 221, the material feeding slide seat 222, the material feeding Z-direction slide rail 223, the X-axis material feeding flip-over driving device 224, the material feeding swing seat 225, the buffer 226, the material feeding adsorption end 227, the glue dispensing device 300, the glue dispensing X-direction slide rail 310, the glue dispensing Z-direction slide 320, the glue dispensing slide seat 330, the glue dispensing slide top seat 340, the glue dispensing assembly 350, the glue supply device 351, the glue dispensing adsorption end 361, the wire push-out telescopic driving device 362, the wire push plate 363, the glue dispensing hollowed-out window 364, the glue dispensing flip-over driving device 370, the blanking mechanism 400, the blanking Y-direction slide rail 410, the automatic feeding device comprises a feeding sliding seat 420, a feeding Z-direction sliding rail 430, an X-axis feeding overturning device 440, a Y-direction feeding overturning driving device 451, a feeding adsorption end 452, a feeding conveying belt 460, a shell 510 and an alarm 520.

Detailed Description

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom", "X, Y, Z" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description of the present invention and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

An embodiment of the utility model, as shown in fig. 1-3, an automatic glue sealing device, it includes in proper order along the glue sealing operation process sequence of semiconductor refrigeration chip: the automatic feeding device comprises a feeding clamp 100, a material taking mechanism 140, a pre-positioning feeding mechanism 200, a glue dispensing device 300 and a discharging mechanism.

Specifically, as shown in fig. 4, the feeding fixture 100 is located at a feeding end of the automatic sealing apparatus. The feeding clamp 100 is provided with a Z-direction strip-shaped clamping groove 110, the horizontal cross section of the Z-direction strip-shaped clamping groove 110 is rectangular, Z-direction strip-shaped hollow parts 120 are arranged on two sides of a vertical side wall of the Z-direction strip-shaped clamping groove 110, and a rectangular clamping hollow opening is formed in the top of the Z-direction strip-shaped clamping groove 110.

Z can be used for stacking a plurality of semiconductor refrigeration chips along Z to the bar-shaped clamping groove 110, Z can let two of semiconductor refrigeration chips extend to Z to bar-shaped clamping groove 110's outside is placed to Z to bar-shaped clamping groove 120, guarantees the roughness that semiconductor refrigeration chip piled up, and then can improve the precision of initial material loading, also can improve the material precision of getting of feeding agencies 140.

Prepositioning feed mechanism 200 is located X of material loading anchor clamps 100 is to direction low reaches, extracting mechanism 140 set up in material loading anchor clamps 100 with the top of feed mechanism, after the semiconductor chip is piled up in material loading anchor clamps 100, extracting mechanism 140 can be completely automatic will the monolithic in proper order the accurate transportation of semiconductor refrigeration chip extremely in prepositioning feed mechanism 200.

Specifically, as shown in fig. 5, the material taking mechanism 140 includes: the material taking X-direction slide rail 141, the material taking slide seat 142, the material taking adsorption end 143 and the material taking slide driving mechanism; two ends of the material taking X-direction slide rail 141 are respectively located right above the positioning seat 211 and the feeding clamp 100; the material taking sliding seat 142 is slidably arranged on the material taking X-direction sliding rail 141, and the material taking sliding seat 142 is in transmission connection with the material taking sliding driving mechanism; get material adsorption end 143 along the Z to the direction set up in get material sliding seat 142, and get under the drive of material sliding drive mechanism, the adsorption end along get material X to slide rail 141.

As shown in fig. 6 to 8, the pre-positioning and feeding mechanism 200 includes: a pre-positioning device 210 and a turning and feeding device 220; the pre-positioning device 210 comprises: the top of the positioning seat 211 is provided with a positioning groove; the turning and feeding device 220 includes: a feeding Y-direction slide rail 221, a feeding slide seat 222, a feeding Z-direction slide rail 223, an X-axis feeding turnover driving device 224, a feeding slide driving mechanism and a feeding adsorption component; the feeding Y-direction slide rail 221 is arranged above the positioning seat 211, and the feeding slide seat 222 is slidably arranged on the feeding Y-direction slide rail 221; the feeding Z-direction slide rail 223 is arranged on the feeding slide seat 222, the X-axis feeding turnover driving device 224 is slidably mounted on the feeding Z-direction slide rail 223, and a rotation driving end of the X-axis feeding turnover driving device 224 is vertically connected with the feeding adsorption component; the feeding sliding seat 222 and the feeding overturning driving device slide along the feeding Y-direction sliding rail 221 and the feeding Z-direction sliding rail 223 respectively under the driving of a feeding sliding driving mechanism arranged at a corresponding position.

The pre-positioning feeding mechanism 200 can automatically feed the semiconductor refrigeration chips to the dispensing device 300 by using the turnover feeding device 220, and before automatic feeding, can also accurately position the semiconductor refrigeration chips placed on the positioning seats 211 by using the pre-positioning device 210, so that the clamping accuracy of the semiconductor refrigeration chips automatically fed to the dispensing device 300 is ensured, and the quality of the glue sealing operation is improved.

The material loading adsorption component comprises: a feeding swing seat 225, a buffer member 226 and a feeding adsorption end 227; one end of the feeding swing seat 225 is connected to the rotation driving end of the X-axis feeding and overturning driving device 224, and the end surface of the other end thereof is connected to the feeding adsorption end 227 through the buffer 226.

In order to ensure that the loading adsorption end 227 is fully adsorbed to the semiconductor refrigeration chip, the loading adsorption assembly must be fully pressed down, but since the semiconductor refrigeration chip is easily deformed or even damaged by external pressure, the buffer member 226 must be additionally arranged between the loading swing seat 225 and the loading adsorption end 227, so that the loading adsorption end 227 can be fully adsorbed to the semiconductor refrigeration chip without causing overvoltage damage to the semiconductor refrigeration chip.

The material loading adsorption end 227 is a rigid sucker, the end face of the outer end of the material loading adsorption end is an adsorption face, the adsorption face is made of rigid materials and is provided with a plurality of air holes, and the inner end of the material loading adsorption end is provided with an air flow pipeline communicated with the air holes.

If the flexible sucker that material loading adsorption end 227 made adopts soft materials, because the deformation of flexible sucker is difficult to control and detect, consequently can lead to the precision of prepositioning operation to be difficult to guarantee, and adopt the rigid sucker can finely eliminate the error that the flexible sucker brought, improve prepositioning operation precision.

The specific implementation of the buffer member 226 is various, and specifically, the buffer member 226 may include: the guide rod and the spring are sleeved outside the guide rod; one end of the guide rod is connected with the feeding swing seat 225, the other end of the guide rod penetrates through a limiting hole formed in the feeding adsorption end 227, and the feeding adsorption end 227 is installed at the end in a sliding limiting manner; the spring is disposed between the feeding swing seat 225 and the feeding adsorption end 227 in a pressing manner.

As shown in fig. 7 and 8, the positioning groove is a rectangular groove, and two sliding stoppers 213, two sliding windows, and two fixing stoppers 215 are disposed on the periphery of the positioning groove; the sliding window is arranged opposite to the fixed limit block 215; the two sliding windows are respectively positioned at two adjacent vertical edges of the positioning groove; the two sliding limiting blocks 213 are respectively limited and arranged in the two sliding windows; one end of each sliding limiting block 213 is connected with the driving end of a positioning telescopic driving device 214 arranged at the bottom of the positioning seat 211, the other end of each sliding limiting block 213 penetrates through the corresponding sliding window at the corresponding position and extends to the upper part of the positioning seat 211, and under the driving of the positioning telescopic driving device 214, the two sliding limiting blocks 213 are respectively just close to or just far away from the two fixed limiting blocks 215.

The semiconductor refrigeration chip is rectangular, and can be horizontally limited and placed well when placed in the rectangular groove; furthermore, when the positioning slot is fixedly arranged, the semiconductor refrigeration chip is placed in the positioning slot by the material taking mechanism 140, which is difficult to be smoothly placed in the positioning slot due to slight deviation. The positioning groove in the embodiment adopts a structure capable of freely expanding or contracting according to operation requirements, so that the semiconductor refrigeration chip can be smoothly placed into the positioning groove, and the operation precision of subsequent pre-positioning can be ensured.

The positioning groove is provided with at least two position detectors, one of which is used for detecting the bottom area of the positioning groove and the other is used for detecting the top area of the positioning groove. The semiconductor refrigeration chip pre-positioning device comprises a positioning groove, a semiconductor refrigeration chip, two position detectors, an automatic glue sealing device and a semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is arranged in the positioning groove, the semiconductor refrigeration chip can be accurately detected by the position detectors, when an error exists in the semiconductor refrigeration chip, the position detectors can timely send an alarm instruction to the automatic glue sealing device, and the automatic glue sealing device can be stopped according to the alarm instruction and send an alarm signal to an operator.

The feeding Y-direction slide rail 221 and the feeding Z-direction slide rail 223 are both provided with travel limit switches, and the travel limit switches are used for detecting position information of the feeding sliding seat 222 and the X-axis feeding overturning driving device 224. The travel limit switch is a component which can be directly detected in the existing market, and can send an alarm instruction to the automatic glue sealing equipment when the feeding sliding seat 222 and the X-axis feeding overturning driving device 224 move to a set position, and the automatic glue sealing equipment can send an operation instruction to other mechanisms according to the alarm instruction, so that the processing precision is ensured, and the automation degree of the automatic glue sealing equipment can be improved.

The glue dispensing device 300 is located outside the automatic glue sealing equipment, and is specifically located downstream of the pre-positioning feeding mechanism 200 in the Y direction; the feeding mechanism is arranged on the inner side of the dispensing device 300 and is close to the feeding end of the dispensing X-direction slide rail 310, so that when the feeding adsorption end 227 is turned over to be parallel to the Y-direction, the feeding adsorption end 227 can be in butt joint with the dispensing adsorption component which slides to the feeding end of the X-direction slide rail.

Specifically, as shown in fig. 9 and 10, the dispensing device 300 includes: the dispensing device comprises a dispensing X-direction slide rail 310, a dispensing Z-direction slide rail 320, a dispensing slide base 330, a dispensing slide top base 340, a dispensing assembly 350, a dispensing adsorption assembly, a dispensing overturning driving device 370 and a dispensing slide driving mechanism; the dispensing sliding base 330 is slidably disposed on the dispensing X-direction sliding rail 310; the dispensing Z-direction sliding 320 rail is arranged right above the dispensing X-direction sliding rail 310; the glue-dispensing sliding top seat 340 is slidably arranged on the glue-dispensing Z-direction sliding 320 rail; the dispensing assembly 350 is parallel to the Z-direction slide rail and is mounted on the dispensing sliding top seat 340; the dispensing overturning driving device 370 is installed on the dispensing base; the dispensing adsorption component is arranged along the Y direction and is in transmission connection with a rotating shaft of the dispensing overturning driving device 370; the dispensing sliding base 330 and the dispensing sliding top seat 340 slide along the dispensing X-direction sliding rail 310 and the dispensing Z-direction sliding rail 320 respectively under the driving of the dispensing sliding driving mechanism arranged at the corresponding positions. The dispensing assembly 350 is in communication with an externally disposed glue supply 351.

After the pre-positioning feeding mechanism 200 sucks the semiconductor refrigeration chip on the positioning seat 211 along the Z direction, the X-axis feeding turnover driving device 224 drives the feeding swing seat 225 to swing, so that the feeding suction end 227 sucks the semiconductor refrigeration chip to swing to the feeding area of the dispensing device 300. The glue-dispensing sliding base 330 slides to the feeding end of the X-direction glue-dispensing slide rail 310, the glue-dispensing adsorption end 361 contacts and adsorbs the semiconductor refrigeration chip, then the glue-dispensing sliding base slides to the position right below the glue-dispensing assembly 350, the glue-dispensing overturning driving device 370 enables the semiconductor refrigeration chip to vertically rotate, the glue-dispensing adsorption assembly moves along the Z-direction glue-dispensing slide rail 320, and the glue-dispensing end of the glue-dispensing assembly 350 always clings to the periphery of the semiconductor refrigeration chip to precisely complete glue-dispensing; after the semiconductor refrigeration chip finishes the dispensing operation, the dispensing sliding seat slides to the feeding end of the glue X-direction sliding rail and the unloading mechanism 400 absorbs and takes away the glue to finish unloading.

Preferably, as shown in fig. 10, the dispensing adsorption assembly includes a dispensing adsorption end 361 and a telescopic wire pushing assembly disposed on one side of the feeding adsorption end 227, and both are disposed along the Y direction, the telescopic wire pushing assembly includes a wire pushing telescopic driving device 362 and a wire pushing plate 363 connected to a driving end of the wire pushing telescopic driving device 362; the middle part of the line pushing plate 363 is provided with a dispensing hollow window 364.

Because two leads are led out from one side of the semiconductor refrigeration chip, the two leads are easy to interfere the smooth dispensing operation in the vertical rotary dispensing process of the semiconductor refrigeration chip, after the telescopic wire pushing assembly is additionally arranged, on one hand, the wire pushing plate 363 can push the two leads outwards to avoid the interference of the leads to the dispensing operation, the wire pushing plate 363 is additionally provided with a dispensing hollowed window 364, and the dispensing end of the dispensing assembly 350 can extend into the periphery of the semiconductor refrigeration chip from the dispensing hollowed window 364 to smoothly complete the dispensing operation.

The blanking mechanism 400 is also disposed inside the dispensing device 300 and close to the blanking end of the X-direction slide rail 310 for dispensing, so that when the blanking suction end 452 is turned over to be parallel to the Y-direction, the blanking suction end 452 can be in butt joint with the dispensing suction component sliding to the blanking end of the X-direction slide rail.

As shown in fig. 11, the blanking mechanism 400 includes: the automatic feeding device comprises a feeding Y-direction slide rail 410, a feeding sliding seat 420, a feeding Z-direction slide rail 430, an X-axis feeding turnover device 440, a feeding sliding driving mechanism and a feeding adsorption component; the blanking sliding seat 420 is slidably arranged on the blanking Y-direction sliding rail 410; the blanking Z-direction slide rail 430 is arranged on the blanking slide seat 420, the X-axis blanking turnover driving device is slidably mounted on the blanking Z-direction slide rail 430, and a rotation driving end of the X-axis blanking turnover driving device is vertically connected with a blanking adsorption component, so that an adsorption end of the blanking adsorption component can be turned in a vertical plane perpendicular to the X direction; the blanking sliding seat 420 and the X-axis blanking turnover device 440 slide along the blanking Y-direction sliding rail 410 and the blanking Z-direction sliding rail 430, respectively, under the driving of a blanking sliding driving mechanism disposed at a corresponding position.

After the dispensing device 300 finishes dispensing operation, the dispensing sliding seat slides to the feeding end of the dispensing X-direction slide rail 310, the unloading mechanism 400 turns over the unloading adsorption assembly by the X-axis unloading turning device 440, so that the unloading adsorption end 452 of the unloading adsorption assembly faces the semiconductor refrigeration chip at the feeding end of the dispensing X-direction slide rail 310, and the unloading sliding seat 420 slides along the unloading Y-direction slide rail 410, so that the unloading adsorption end 452 approaches to and takes away the semiconductor refrigeration chip by adsorption. The blanking mechanism 400 can automatically and accurately take away the semiconductor refrigeration chip after the dispensing is finished without manual operation.

The unloading adsorption component includes: a Y-direction feeding flip driving device 451 and a feeding suction end 452; the body of the Y-direction blanking turnover device is connected with the rotation driving end of the X-axis blanking turnover driving device 440, and the rotation driving end of the Y-direction blanking driving device is vertically connected with the blanking adsorption end 452.

The glue dispensing device 300 adopts vertical rotation glue dispensing operation, if the semiconductor refrigeration chip which just completes the glue dispensing operation is vertically placed towards a single direction, glue around the semiconductor refrigeration chip is easy to flow to the bottom in the blanking process, so that the glue sealing is not uniform; after the Y-direction overturning driving device is additionally arranged on the blanking adsorption assembly, the blanking adsorption end 452 can rotate along an X axis and a Y axis in the blanking process, so that glue of the semiconductor refrigeration chip cannot flow in a single direction in a centralized mode, and the glue sealing uniformity of the semiconductor intelligent chip after blanking can be improved.

Furthermore, as shown in fig. 3, the blanking suction assembly is further provided with an air drying device 470, and a blowing opening of the air drying device 470 faces to an active area of the blanking suction end 452.

Air drying device 470 is the device of direct purchase on the existing market, and it can blow off the air of setting for the temperature, dries to semiconductor refrigeration chip for the semiconductor refrigeration chip of just accomplishing some glue operations can accomplish the stoving operation in the multidirectional rotation of while in the unloading in-process, makes the weight of semiconductor refrigeration chip further improve.

The feeding adsorption end 452 is a flexible sucker, the end face of the outer end of the feeding adsorption end is an adsorption face, the adsorption face is made of soft materials and is provided with air holes, sealing skirt edges are arranged on the peripheries of the air holes, and an airflow pipeline communicated with the air holes is arranged at the inner end of the feeding adsorption end.

And the blanking Y-direction slide rail 410 and the blanking Z-direction slide rail 430 are both provided with travel limit switches, and the travel limit switches are used for detecting the position information of the blanking sliding seat 420 and the X-axis blanking overturning driving device.

The travel limit switch is a direct detection element in the existing market, and can send an alarm instruction to the automatic glue sealing equipment when the blanking sliding seat 420 and the X-axis blanking turnover driving device move to a set position, and the automatic glue sealing equipment can send an operation instruction to other mechanisms according to the alarm instruction, so that the processing precision is ensured, and the automation degree of the automatic glue sealing equipment can be improved.

The blanking mechanism 400 is further provided with a blanking conveyor belt 460, and the blanking adsorption component is located right above the feeding end of the blanking conveyor belt 460.

The blanking adsorption end 452 finally places the semiconductor refrigeration chip on the transmission belt in a movable manner, and the transmission belt automatically transports the semiconductor refrigeration chip subjected to the glue sealing operation to a specified position.

The blanking end and the feeding end of the blanking conveying belt 460 are both provided with blanking detectors; the blanking detector is used to detect and control the stopping and movement of the blanking conveyor belt 460.

The blanking mechanism 400 is further provided with a counter, and the counter is used for recording the number of the materials blanked by the blanking adsorption assembly; the unloading adsorption component is equipped with height sensor for detect adsorption component with the height between the unloading conveyer belt 460 top surface.

As shown in fig. 2 and 3, the blanking mechanism 400 not only can complete the one-by-one blanking operation of the semiconductor refrigeration chips, but also can horizontally stack a plurality of semiconductor refrigeration chips on the transmission belt according to the setting requirement and automatically transport the semiconductor refrigeration chips to the designated position; the number of stacked semiconductor refrigeration chips can be quickly and accurately set by utilizing the detection information of the height sensor.

It should be noted that in this embodiment, the position sensor, the height sensor, and the blanking detector are all detection elements that can be directly purchased in the market according to the functional requirements; the material taking sliding driving mechanism, the material loading sliding driving mechanism, the glue dispensing sliding driving mechanism and the material unloading sliding driving mechanism have many specific embodiments and can be a screw rod driving mechanism, a transmission belt driving mechanism or a telescopic cylinder and the like in the prior art; the X-axis feeding turnover driving device 224, the dispensing turnover driving device 370, the X-axis discharging turnover device 440, and the Y-axis discharging turnover device may be a rotary cylinder, a rotary hydraulic cylinder, or a motor in the prior art.

The automatic glue sealing equipment is provided with a shell 510, and the top of the shell 510 is provided with an alarm 520.

According to the embodiment, the utility model provides an automatic glue equipment of sealing, it is equipped with prepositioning feed mechanism not only can accomplish the point operation automatically with semiconductor refrigeration chip material loading to the adhesive deposite device in, can also carry out prepositioning operation to the semiconductor refrigeration chip by the material loading, guaranteed the precision of semiconductor refrigeration chip automatic feeding, it is equipped with unloading mechanism not only can indicate the assigned position with the semiconductor refrigeration chip unloading of accomplishing the adhesive deposite operation voluntarily, can also dry or pile up the operation to the semiconductor refrigeration chip by the unloading according to the unloading needs, and then improve automatic glue equipment's degree of automation improves the gluey machining efficiency and the quality of gluing of semiconductor refrigeration chip.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims (10)

1. The utility model provides a unloading mechanism which characterized in that includes: the automatic feeding device comprises a feeding Y-direction slide rail, a feeding sliding seat, a feeding Z-direction slide rail, an X-axis feeding turnover device, a feeding sliding driving mechanism and a feeding adsorption assembly;

the blanking sliding seat is arranged on the blanking Y-direction sliding rail in a sliding manner; the blanking Z-direction slide rail is arranged on the blanking slide seat, the X-axis blanking overturning driving device is slidably mounted on the blanking Z-direction slide rail, and a rotation driving end of the X-axis blanking overturning driving device is vertically connected with the blanking adsorption component, so that the adsorption end of the blanking adsorption component can be overturned in a vertical plane vertical to the X direction; the blanking sliding seat and the X-axis blanking turnover device slide along the blanking Y-direction sliding rail and the blanking Z-direction sliding rail respectively under the driving of a blanking sliding driving mechanism arranged at a corresponding position.

2. The blanking mechanism of claim 1, wherein the blanking suction assembly comprises: a Y-direction blanking overturning driving device and a blanking adsorption end; the Y-direction blanking turnover device is characterized in that a body of the Y-direction blanking turnover device is connected with a rotation driving end of the X-axis blanking turnover driving device, and the rotation driving end of the Y-direction blanking driving device is vertically connected with a blanking adsorption end.

3. The blanking mechanism of claim 2 further comprising an air drying device, wherein the blowing opening of the air drying device faces the active area of the blanking suction end.

4. The blanking mechanism of claim 2 wherein the blanking suction end is a flexible suction cup, the outer end surface of the blanking suction end is a suction surface, the suction surface is made of soft material and is provided with an air hole, the periphery of the air hole is provided with a sealing skirt, and the inner end of the air hole is provided with an air flow pipeline communicated with the air hole.

5. The blanking mechanism of claim 1, wherein the blanking Y-direction slide rail and the blanking Z-direction slide rail are provided with travel limit switches for detecting position information of the blanking sliding seat and the X-axis blanking turnover driving device.

6. The blanking mechanism of claim 1, further comprising a blanking conveyor belt, wherein the blanking suction assembly is located directly above a feeding end of the blanking conveyor belt.

7. The blanking mechanism of claim 6, wherein the blanking end and the feeding end of the blanking conveyor belt are provided with blanking detectors; the blanking detector is used for detecting and controlling the stop and the movement of the blanking conveyor belt.

8. The blanking mechanism according to claim 6, further comprising a counter, wherein the counter is used for recording the number of the materials blanked by the blanking adsorption component; the unloading adsorption component is provided with a height sensor for detecting the height between the adsorption component and the top surface of the unloading conveyor belt.

9. Automatic glue sealing equipment, its characterized in that, it includes: a dispensing device and a blanking mechanism according to any one of claims 1 to 8;

the adhesive dispensing device comprises: the glue dispensing device comprises a glue dispensing X-direction slide rail, a glue dispensing Z-direction slide rail, a glue dispensing slide base, a glue dispensing slide top seat, a glue dispensing assembly, a glue dispensing adsorption assembly, a glue dispensing overturning driving device and a glue dispensing slide driving mechanism;

the glue dispensing sliding base is arranged on the glue dispensing X-direction sliding rail in a sliding manner; the dispensing Z-direction slide rail is arranged right above the dispensing X-direction slide rail; the glue dispensing sliding top seat is arranged on the glue dispensing Z-direction slide rail in a sliding manner; the dispensing component is parallel to the Z-direction slide rail and is arranged on the dispensing sliding top seat; the glue dispensing overturning driving device is arranged on the glue dispensing base; the dispensing adsorption component is arranged along the Y direction and is in transmission connection with a rotating shaft of the dispensing overturning driving device; the glue dispensing sliding base and the glue dispensing sliding top seat respectively slide along the glue dispensing X-direction slide rail and the glue dispensing Z-direction slide rail under the driving of a glue dispensing sliding driving mechanism driving device arranged at the corresponding positions;

the unloading mechanism set up in dispensing device's inboard, and be close to the unloading end of X to the slide rail is glued to the point, makes unloading adsorption component's unloading adsorption end upset when being on a parallel with Y to the direction, unloading adsorption end can with slide extremely X is to the unloading end of slide rail the point adsorption component butt joint.

10. The automatic glue sealing apparatus of claim 9, wherein the glue dispensing suction assembly comprises a glue dispensing suction end and a retractable wire pushing assembly disposed at one side of the glue dispensing suction end, and both are disposed along the Y direction, the retractable wire pushing assembly comprises a wire pushing retractable driving device and a wire pushing plate connected to a driving end of the wire pushing retractable driving device; and a dispensing hollow window is arranged in the middle of the line pushing plate.

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