CN214937766U - Evaporation source - Google Patents

Abstract

The application provides an evaporation source is provided with first board and curved second board in the inside of container for it is even from nozzle spun coating by vaporization material, thereby makes the coating by vaporization material thickness of coating by vaporization to the substrate even, has guaranteed the quality of coating by vaporization product.

Description

Evaporation source

[ technical field ] A method for producing a semiconductor device

The application relates to the technical field of evaporation, especially, relate to an evaporation source.

[ background of the invention ]

In the process of fabricating an Organic electroluminescent Display (OLED) panel, an evaporation process is a key process. In the coating by vaporization process, adopt the coating by vaporization mask version to shelter from the substrate, coating by vaporization material from coating by vaporization mask version opening coating by vaporization to the substrate position that corresponds, but current evaporation source is at the in-process of coating by vaporization, can lead to the organic material thickness of coating by vaporization on the substrate inhomogeneous to reduce the panel quality of production, cause the yield to reduce even.

[ Utility model ] content

In view of the above, embodiments of the present disclosure provide an evaporation source to solve the technical problem in the prior art that, in the evaporation process of the conventional evaporation source, the thickness of the organic material deposited on the substrate is not uniform, so that the quality of the produced panel is reduced, and even the yield is reduced.

In a first aspect, embodiments of the present application provide an evaporation source, including a nozzle plate and a container; the nozzle plate is fixed on the top of the container and covers the container, the container is used for containing evaporation materials, and the evaporation materials are sublimated to the nozzle plate from the container along a sublimation direction; the container is provided with a first cavity, a second cavity and a third cavity, and the first cavity, the second cavity and the third cavity are communicated and connected in sequence along the sublimation direction; the first cavity and the second cavity are connected through a first plate, the second cavity and the third cavity are connected through a second plate, the first plate covers the first cavity, the second plate covers the second cavity, and the nozzle plate covers the third cavity; the first plate is provided with a plurality of first channels, the second plate is provided with a plurality of second channels, the first channels are communicated with the first cavity and the second cavity, and the second channels are communicated with the second cavity and the third cavity.

Through the scheme that this embodiment provided, be used for sublimating back coating by vaporization material entering second cavity through setting up the first board, the solid material who is mingled with in the vapour of coating by vaporization material has been avoided simultaneously enters into the second cavity, then enters into the coating by vaporization material of second cavity, through setting up second board and second passageway, further filters the vapour of the coating by vaporization material from first cavity for the vapour that reaches the nozzle does not contain impurity.

Optionally, the first plate is a flat plate, the second plate is an arc-shaped plate, and a distance between the second plate and the first plate gradually decreases from a center of the second plate to an edge of the second plate.

Through the scheme that this embodiment provided, set up the second plate into the arc for the even unanimity of velocity of flow that the coating by vaporization material that flows out from the first passageway of first plate reaches nozzle import department, thereby improves the homogeneity of the coating by vaporization material from the nozzle, has guaranteed that the coating by vaporization material thickness of substrate is unanimous.

Optionally, the diameter of the first channel is larger than the diameter of the second channel.

Through the scheme that this embodiment provided, improve the velocity of flow of the vapour of coating by vaporization material in the second passageway department of second board, can improve the utilization ratio of coating by vaporization material, avoid leading to some vapour to be unable to reach the nozzle and cause the waste because of the vapour velocity is not enough.

Optionally, the first channels are uniformly distributed on the first plate, and the second channels are uniformly distributed on the second plate.

Through the scheme that this embodiment provided for the vapor distribution of the evaporation material that gets into second cavity and third cavity is more even, and the vapour volume that reaches every nozzle department keeps the same basically, and then guarantees that the evaporation material's of substrate thickness is unanimous.

Optionally, the nozzle plate extends along an extension direction perpendicular to the sublimation direction, the nozzle plate comprising a carrier plate and a plurality of first nozzles, a plurality of second nozzles and a plurality of third nozzles arranged on the carrier plate, the first nozzles having first orifices, the second nozzles having a plurality of second orifices, the third nozzles having third orifices; the opening orientation of the first nozzle is a first direction, the opening orientation of the third nozzle is a second direction, the opening orientations of the second nozzles are respectively the first direction and the second direction, and the first direction is opposite to the second direction.

Through the scheme that this embodiment provided, the spout direction, the spout shape and the spout size of first nozzle, second nozzle and third nozzle all differ, make the vapour of coating by vaporization material can be more even spout to cover on the coating by vaporization mask plate on the substrate.

Optionally, the carrier plate has a first nozzle area, a second nozzle area, and a third nozzle area, where the first nozzle area, the second nozzle area, and the third nozzle area are sequentially distributed from a center of the carrier plate to an edge of the carrier plate, the center of the carrier plate is located in the first nozzle area, and two ends of the carrier plate along the extending direction are connected to the third nozzle area; the first nozzle area is internally provided with a plurality of first nozzles, the second nozzle area is internally provided with a plurality of second nozzles, and the third nozzle area is internally provided with a plurality of third nozzles; the first direction is a direction toward the center of the carrier plate.

Through the scheme that this embodiment provided, can guarantee on the coating by vaporization mask plate that each department can both be sprayed evaporation material and can avoid the coating by vaporization material to spray repeatedly in certain region and cause the waste, guarantee the quality of coating by vaporization product.

Optionally, the first nozzle area, the second nozzle area and the third nozzle area are sequentially arranged from a central axis passing through the center of the carrier plate to an end of the carrier plate in the extending direction, and the plurality of first nozzles, the plurality of second nozzles and the plurality of third nozzles are linearly arranged in rows in the extending direction.

Through the scheme provided by the embodiment, the first nozzle, the second nozzle and the third nozzle are linearly arranged from the center to the end of the carrier plate according to the first nozzle area, the second nozzle area and the third nozzle area where the first nozzle, the second nozzle and the third nozzle are respectively located, so that the overlapping part between the spraying areas of each nozzle can be minimized, the waste of evaporation materials is further reduced, and the problem of uneven spraying is avoided.

Optionally, in a width direction perpendicular to both the sublimation direction and the extension direction, projections of two adjacent first nozzles, projections of the second nozzles, and projections of the third nozzles do not overlap, respectively.

Through the scheme that this embodiment provided, avoided the evaporation material interact of adjacent nozzle blowout on the width direction effectively, guaranteed evaporation material's on the substrate homogeneity.

Optionally, a plurality of fixing plates are fixed on the carrier plate, and the fixing plates extend along the extending direction; in the extending direction, the plurality of first nozzles, the plurality of second nozzles, and the plurality of third nozzles are arranged in this order on each of the fixing plates.

Through the scheme that this embodiment provided, a plurality of nozzles on the support plate are fixed on the support plate in a row through the fixed plate of rectangular shape for the user can more conveniently change a row of nozzle, has improved the change and the cleaning efficiency of nozzle plate, reduces cost of maintenance.

Optionally, a plurality of fixing grooves are provided on the nozzle plate, the fixing grooves extending in the extending direction, and the fixing plate is fixed in the fixing grooves.

Through the scheme that this embodiment provided for the fixed plate can be spacing when installing on the support plate, and operating environment is more stable when spraying vapor deposition material to the nozzle.

Optionally, a pair of limiting protrusions are respectively arranged at two ends of the fixing groove on the carrier plate along the extending direction; and in the width direction perpendicular to both the sublimation direction and the extension direction, the distance between the pair of limiting protrusions is greater than or equal to the width of the fixing plate.

Through the scheme that this embodiment provided for the fixed plate can be restricted in the fixed slot, can not rock so that influence the spraying of nozzle.

Optionally, the first direction is collinear with the direction of extension.

Optionally, the first spout has a first arcuate cutout, the second spout has a second arcuate cutout, and the third spout has a third arcuate cutout; in the sublimation direction, the highest points of the first arc-shaped notch, the second arc-shaped notch and the third arc-shaped notch are located at the same height, and the lowest point of the second arc-shaped notch is higher than the lowest point of the first arc-shaped notch and the lowest point of the third arc-shaped notch.

Through the scheme that this embodiment provided, improved the thickness uniformity of coating by vaporization material on the substrate, guaranteed the quality of display screen.

Optionally, be equipped with a plurality of division boards in the first cavity, the container has the heating groove, a plurality of division boards are followed the sublimation direction extends and will first cavity is in a plurality of subchambers that do not communicate each other are separated into to the extending direction, the heating groove certainly the bottom of container to the sublimation direction indent, and follow the extending direction extends, the tank bottom of heating groove is in the extending direction passes in proper order a plurality of division boards end in the both ends of container.

Through the scheme that this embodiment provided, can improve the heating homogeneity of coating by vaporization material in the container to improve the coating by vaporization homogeneity of coating by vaporization material

The disclosed evaporation source of this application embodiment is provided with first board and curved second board in the inside of container for from nozzle spun coating by vaporization material even, thereby make the coating by vaporization material thickness of coating by vaporization to the substrate even, guaranteed the quality of coating by vaporization product.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic end view of an evaporation source disclosed in an embodiment of the present application in a width direction;

fig. 2 is a schematic side view of an evaporation source disclosed in an embodiment of the present application in an extending direction;

fig. 3 is a schematic view of the internal structure of a container in the width direction in an evaporation source disclosed in an embodiment of the present application;

fig. 4 is a schematic view of the internal structure of a container in the extending direction in an evaporation source disclosed in an embodiment of the present application;

fig. 5 is a schematic top view of the carrier plate in the sublimation direction when the first direction and the second direction are two directions having a certain included angle with the extending direction in the evaporation source disclosed in the embodiment of the present application;

fig. 6 is a schematic top view of the carrier plate in the sublimation direction when the first direction is toward a reference point on the carrier plate in the evaporation source disclosed in the embodiment of the present application;

fig. 7 is a schematic top view of the carrier plate in the sublimation direction when the first direction is toward a central axis perpendicular to the extending direction on the carrier plate in the evaporation source disclosed in the embodiment of the present application;

fig. 8 is a schematic top view of the carrier plate in the sublimation direction when the first direction and the second direction are two directions having an angle with the extending direction and the nozzles are respectively arranged in the three nozzle areas in the evaporation source disclosed in the embodiment of the present application;

fig. 9 is a schematic top view of the carrier plate in the sublimation direction when the first direction is a direction toward a certain reference point on the carrier plate and the nozzles are respectively arranged in three nozzle areas in the evaporation source disclosed in the embodiment of the present application;

fig. 10 is a schematic top view of the carrier plate in the sublimation direction when the first direction is a direction toward a central axis perpendicular to the extending direction on the carrier plate and the nozzles are respectively arranged in three nozzle areas in the evaporation source disclosed in the embodiment of the present application;

fig. 11 is a schematic top view of a carrier plate in a sublimation direction when nozzles are arranged on a fixed plate in an evaporation source disclosed in an embodiment of the present application;

fig. 12 is a schematic diagram illustrating the arrangement of nozzles when the nozzle opening of the nozzle is designed as an arc-shaped cut in the evaporation source disclosed in the embodiment of the present application;

reference numerals:

1-a nozzle plate; 11-a carrier plate; 111-a fixation groove; 12-a first nozzle; 121-a first nozzle; 122-a first nozzle zone; 13-a second nozzle; 131-a second jet; 132-a second nozzle region; 14-a third nozzle; 142-a third nozzle zone; 141-third nozzle; 15-a reference point; 16-central axis; 17-center; 18-a fixed plate; 19-a limit bump; 2-a container; 21-a first cavity; 211-a separation plate; 212-subcavities; 22-a second cavity; 23-a third cavity; 24-a first plate; 25-a second plate; 26-a first channel; 27-a second channel; 28-a heating tank; 3-evaporation material; 4-a substrate; 5-evaporating a mask plate; d1-sublimation direction; d2-direction of extension; d3-width direction; o1-first direction; o2 — second direction; Δ S-predetermined spacing.

[ detailed description ] embodiments

For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.

It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be understood that although the terms first, second, third, etc. may be used in the embodiments of the present application to describe components such as nozzles, spouts, etc., these components should not be limited to these terms. These terms are only used to distinguish one element from another. For example, a first nozzle may also be referred to as a second nozzle, and similarly, a second nozzle may also be referred to as a first nozzle, without departing from the scope of embodiments of the present application.

It should be understood that the directions indicated by the first direction, the second direction and the third direction in the drawings shown herein are the directions indicated by the arrows in the paper, wherein the direction indicated by "x" is the direction perpendicular to the paper toward the exit from the main visual line, and the direction indicated by "·" is the direction perpendicular to the paper toward the entrance directly opposite to the main visual line.

Referring to fig. 1 to 3, the present embodiment discloses an evaporation source which is a planar evaporation source, i.e. the vapor emitted from the evaporation source can cover a plane. The evaporation source comprises a nozzle plate 1 and a container 2, wherein the nozzle plate 1 is fixed on the top of the container 2 and covers the container 2, the container 2 is used for containing evaporation materials 3, the evaporation materials 3 are sublimated from the container 2 to the nozzle plate 1 along a sublimation direction D1, and finally the evaporation materials are sprayed onto an evaporation mask plate 5 covered on a substrate 4 through the nozzle plate 1. The nozzle plate 1 is engaged with the upper side of the container 2 to close the container 2, the container 2 is a crucible, and the evaporation material 3 is an organic material.

Referring to fig. 3, in the evaporation source of the present embodiment, the container 2 has a first cavity 21, a second cavity 22 and a third cavity 23, and the first cavity 21, the second cavity 22 and the third cavity 23 are sequentially communicated and connected along a sublimation direction D1; the first cavity 21 and the second cavity 22 are connected by a first plate 24, the second cavity 22 and the third cavity 23 are connected by a second plate 25, the first plate 24 covers the first cavity 21, the second plate 25 covers the second cavity 22, and the nozzle plate 1 covers the third cavity 23; the first plate 24 has a plurality of first passages 26, the second plate 25 has a plurality of second passages 27, the first passages 26 communicate the first cavity 21 with the second cavity 22, and the second passages 27 communicate the second cavity 22 with the third cavity 23. Specifically, the container 2 is a rectangular parallelepiped, the first chamber 21 is an evaporation chamber for evaporating the evaporation material 3, the second chamber 22 is a mixing chamber for mixing the vapor flowing out from each first passage 26, and the third chamber 23 is an outlet chamber for allowing the user to disperse the vapor flowing out from the second passage 27 to each nozzle. During the sublimation process of the evaporation material 3 after evaporation in the first cavity 21, the evaporation material firstly enters the second cavity 22 through the first passage 26, and then enters the third cavity 23 through the second passage 27. Through setting up first board 24 and being used for sublimating back coating by vaporization material 3 and getting into second cavity 22, the solid material who is mingled with in the vapour of coating by vaporization material 3 has been avoided simultaneously and has entered into second cavity 22, then enters into the coating by vaporization material 3 of second cavity 22, through setting up second board 25 and second passageway 27, further filters the vapour of coating by vaporization material 3 from first cavity 21 for the vapour that reaches the nozzle does not contain impurity.

Further, the first plate 24 is a flat plate, the second plate 25 is an arc-shaped plate, and the distance between the second plate 25 and the first plate 24 gradually decreases from the center of the second plate 25 to the edge of the second plate 25. Set up second plate 25 as the arc for the velocity of flow that reaches nozzle inlet department from the coating by vaporization material 3 that second passageway 27 of second plate 25 flows out is even unanimous, thereby improves the homogeneity of coating by vaporization material 3 from the nozzle, has guaranteed that the coating by vaporization material 3 thickness of substrate 5 is unanimous.

Further, the diameter of the first passages 26 is larger than the diameter of the second passages 27, and the flow rate of the vapor deposition material 3 is increased at the second passages 27 of the second plate 25, so that the utilization rate of the vapor deposition material 3 can be increased, and waste caused by the fact that part of the vapor cannot reach the nozzles due to insufficient vapor flow rate can be avoided.

Further, the first passages 26 are uniformly distributed on the first plate 24, and the second passages 27 are uniformly distributed on the second plate 25, so that the vapor distribution of the evaporation material 3 entering the second cavity 22 and the third cavity 23 is more uniform, and the amount of vapor reaching each nozzle is substantially the same, thereby ensuring that the thickness of the evaporation material 3 of the substrate 5 is uniform.

Referring to fig. 4, a plurality of partition plates 211 are disposed in the first cavity 21, the container 2 has a heating slot 28, the partition plates 211 extend along the sublimation direction D1 and partition the first cavity 21 into a plurality of sub-cavities 212 which are not communicated with each other in the extension direction D2, the heating slot 28 is recessed from the bottom of the container 2 to the sublimation direction D1 and extends along the extension direction D2, and the slot bottom of the heating slot 28 sequentially penetrates through the partition plates 211 in the extension direction D2 and ends at two ends of the container 2. The partition plate 211 is inserted in the bottom of the heating tank 28 in the first cavity 21, the volume of each sub-cavity 212 is the same, and the heating tank 28 is used for heating the evaporation material 3 in the sub-cavity 212, so that the heating uniformity of the evaporation material 3 in the container 2 can be improved, and the evaporation uniformity of the evaporation material 3 can be improved.

Referring to fig. 5 to 8, in the evaporation source of the present embodiment, the nozzle plate 1 extends in an extension direction D2 perpendicular to the sublimation direction D1, the nozzle plate 1 includes a carrier plate 11 and a plurality of first nozzles 12, a plurality of second nozzles 13, and a plurality of third nozzles 14 arranged on the carrier plate 11, the first nozzles 12, the second nozzles 13, and the third nozzles 14 are arranged in an arrangement in the extension direction D2 and a width direction D3 perpendicular to both the sublimation direction D1 and the extension direction D2. The first nozzle 12, the second nozzle 13, and the third nozzle 14 have different nozzle directions, nozzle shapes, and nozzle sizes, and thus the vapor of the vapor deposition material 3 can be more uniformly sprayed onto the vapor deposition mask 5 covering the substrate 4. The first nozzle 12 has a first nozzle orifice 121, the second nozzle 13 has a plurality of second nozzle orifices 131, the third nozzle 14 has a third nozzle orifice 141, the first nozzle orifice 121 opens in a first direction O1, the third nozzle orifice 141 opens in a second direction O2, the plurality of second nozzle orifices 131 open in first and second directions O1 and O2, respectively, and the first direction O1 is opposite to the second direction O2. On the carrier plate 11, a first nozzle 12, a second nozzle 13 and a third nozzle 14 spray the evaporation material 3 in different directions. The first direction O1 and the second direction O2 may be any pair of opposite directions.

In fig. 5, the first direction O1 and the second direction O2 are two directions having a certain angle with the extending direction D2, and at this time, the first nozzle 121 and a part of the second nozzle 131 spray steam along the first direction O1 between the extending direction D2 and the width direction D3, the third nozzle 141 and a part of the second nozzle 131 spray steam along the second direction O2 opposite to the first nozzle 121, and the steam sprayed from each of the first nozzle 12, the second nozzle 13, and the third nozzle 14 is distributed in the first direction O1 and the second direction O2, so that the evaporation material 3 sprayed on the evaporation mask 5 can be uniformly distributed.

In fig. 6, the first direction O1 and the second direction O2 are different from the directions shown in fig. 5, the first direction O1 is a direction toward a certain reference point 15 on the carrier plate 11, the second direction O2 is a direction away from the reference point 15 (i.e. a direction toward the edge of the carrier plate 11), when the first nozzle 121 and a part of the second nozzle 131 spray vapor toward the reference point 15 toward the inside of the carrier plate 11 along the first direction O1, the third nozzle 141 and a part of the second nozzle 131 spray vapor toward the edge of the carrier plate 11 along the second direction O2, the vapor sprayed by the first nozzle 12 and the second nozzle 13 near the reference point 15 will spray more vapor to the area where the vapor deposition mask 5 is close to the reference point 15, and the vapor sprayed by the second nozzle 13 and the third nozzle 14 near the edge of the carrier plate 11 will spray more vapor to the area where the vapor deposition mask 5 is close to the edge of the carrier plate 11, and the reference point 15 and the first nozzle 12 at a certain distance from the edge of the carrier plate 11, The steam sprayed by the second nozzle 13 and the third nozzle 14 can well compensate the problem that the regions of the evaporation mask plate 5 far away from the reference point 15 and the edge of the support plate 11 are not enough to receive the spraying, so that the evaporation materials 3 sprayed on the evaporation mask plate 5 can be uniformly distributed. When the reference point 15 in fig. 6 is the center 17 of the whole carrier plate 11, the effect of uniformly distributing the evaporation material 3 everywhere on the evaporation mask plate 5 can be better achieved.

In fig. 7, the first direction O1 and the second direction O2 are different from those shown in fig. 5 and 6, the first direction O1 is a direction toward the central axis 16 of the carrier plate 11 perpendicular to the extending direction D2, the second direction O2 is a direction away from the central axis 16 (i.e. a direction toward both ends of the carrier plate 11 along the extending direction D2), i.e. the first direction O1 and the second direction O2 are all in the same line with the extending direction D2, when the first nozzle 12, the second nozzle 13 and the third nozzle 14 are respectively arranged on both sides of the central axis 16, the first nozzle 121 and a part of the second nozzle 131 spray vapor toward the center of the central axis 16 along the first direction O1, the third nozzle 141 and a part of the second nozzle 131 spray vapor toward both ends of the carrier plate 11 along the second direction O2, vapor sprayed by the first nozzle 12 and the second nozzle 13 near the central axis 16 is sprayed to the near-evaporation region where the mask 5 is more away from the evaporation region 16, and the steam that the second nozzle 13 and the third nozzle 14 near the both ends of support plate 11 sprayed can spout the region that evaporation coating film board 5 is close to the both ends of support plate 11 more, and the well axis 16 and the both ends of support plate 11 all have the first nozzle 12, the steam that second nozzle 13 and the third nozzle 14 sprayed of certain distance can compensate evaporation coating film board 5 well and accept to spray not enough problem apart from the reference point 15 and the region that the support plate 11 edge is all far away to realize that the evaporation coating material 3 who sprays on the evaporation coating film board 5 can evenly distributed. Preferably, the first nozzles 12, the second nozzles 13, and the third nozzles 14 are arranged in rows along the extending direction D2, and the first nozzles 12, the second nozzles 13, and the third nozzles 14 are linearly arranged from the center to the end of the carrier plate 11 according to the first nozzle area 122, the second nozzle area 132, and the third nozzle area 142 where the first nozzles 12, the second nozzles 13, and the third nozzles 14 are respectively located, so that the overlapping portion between the spraying areas of each nozzle can be minimized, the areas of each nozzle sprayed onto the evaporation mask plate 5 are uniformly distributed and do not interfere with each other, the waste of the evaporation material is further reduced, and the problem of uneven spraying is avoided.

In fig. 8, the first direction O1 and the second direction O2 are the same as those shown in fig. 5, but the first nozzle 12, the second nozzle 13, and the third nozzle 14 are arranged differently. Carrier plate 11 has first nozzle region 122, second nozzle region 132 and third nozzle region 142 thereon, and along first direction O1 and second direction O2, first nozzle region 122, second nozzle region 132 and third nozzle region 142 are arranged in sequence in a rectangular shape from center 17 of carrier plate 11 to the edge of carrier plate 11, center 17 of carrier plate 11 is located in first nozzle region 122, and the edge of carrier plate 11 is connected to third nozzle region 142; a plurality of first nozzles 12 are arranged in the first nozzle area 122, a plurality of second nozzles 13 are arranged in the second nozzle area 13, and a plurality of third nozzles 14 are arranged in the third nozzle area 142; the first direction O1 is a direction toward the center 17 of the carrier plate 11. The carrier plate 11 is divided into a first nozzle area 122, a second nozzle area 132 and a third nozzle area 142 from the center 17 to the edge of the carrier plate 11, and the first nozzles 12, the second nozzles 13 and the third nozzles 14 are correspondingly and intensively arranged in the corresponding areas, so that the spraying directions of the nozzles in one area are consistent, the first nozzles 12 and the third nozzles 14 which can only spray towards one direction are distributed in the center and the edge of the carrier plate 11, and the second nozzles 13 which can spray towards two directions are distributed between the first nozzles and the third nozzles, and the rectangular spraying formed by the arrangement can ensure that the evaporation materials 3 can be sprayed on all positions on the evaporation mask plate 5 and can avoid waste caused by repeated spraying of the evaporation materials 3 in a certain area.

In fig. 9, the first direction O1 and the second direction O2 are the same as those shown in fig. 6, but the first nozzle 12, the second nozzle 13, and the third nozzle 14 are arranged in different manners. Carrier plate 11 has first nozzle region 122, second nozzle region 132 and third nozzle region 142 thereon, along first direction O1 and second direction O2, first nozzle region 122, second nozzle region 132 and third nozzle region 142 are annularly distributed in sequence from reference point 15 on carrier plate 11 to the edge of carrier plate 11, center 17 and reference point 15 of carrier plate 11 are both located in first nozzle region 122, and both ends of carrier plate 11 in extension direction D2 are located in third nozzle region 142; a plurality of first nozzles 12 are arranged in the first nozzle area 122, a plurality of second nozzles 13 are arranged in the second nozzle area 13, and a plurality of third nozzles 14 are arranged in the third nozzle area 142; the first direction O1 is a direction towards a reference point 15 of the carrier plate 11, preferably the reference point 15 and the centre 17 coincide. The carrier plate 11 is divided into a first nozzle area 122, a second nozzle area 132 and a third nozzle area 142 from the center 17 to the edge of the carrier plate 11, and the first nozzles 12, the second nozzles 13 and the third nozzles 14 are correspondingly and intensively arranged in the corresponding areas, the spraying directions of the nozzles in one area are all located on a straight line passing through the reference point 15, the first nozzles 12 only spraying towards the reference point 15 are distributed in the center of the carrier plate 11, the third nozzles 14 only spraying towards the two ends of the carrier plate 11 are distributed at the edge of the carrier plate 11, and the second nozzles 13 spraying towards the two directions are distributed between the two nozzles.

In fig. 10, the first direction O1 and the second direction O2 are the same as those shown in fig. 7, but the first nozzle 12, the second nozzle 13, and the third nozzle 14 are arranged in different manners. Carrier plate 11 has first nozzle region 122, second nozzle region 132 and third nozzle region 142 thereon, and along first direction O1 and second direction O2, first nozzle region 122, second nozzle region 132 and third nozzle region 142 are sequentially arranged in a rectangular shape from central axis 16 passing through center 17 of carrier plate 11 to the end of carrier plate 11 along extension direction D2, central axis 16 of carrier plate 11 is located in first nozzle region 122, and both ends of carrier plate 11 along extension direction D2 are located in third nozzle region 142; a plurality of first nozzles 12 are arranged in the first nozzle area 122, a plurality of second nozzles 13 are arranged in the second nozzle area 13, and a plurality of third nozzles 14 are arranged in the third nozzle area 142; the first direction O1 is a direction toward the central axis 16 of the carrier plate 11. The plurality of first nozzles 12, the plurality of second nozzles 13, and the plurality of third nozzles 14 are arranged in a row in a linear manner in the extending direction D2. The carrier plate 11 is divided into a first nozzle area 122, a second nozzle area 132 and a third nozzle area 142 from the central axis 16 to two ends of the carrier plate 11, and the first nozzles 12, the second nozzles 13 and the third nozzles 14 are correspondingly and intensively arranged in the corresponding areas, the spraying directions of the nozzles in one area are consistent, the first nozzles 12 only spraying towards the central axis 16 are distributed in the center of the carrier plate 11, the third nozzles 14 only spraying towards the two ends of the carrier plate 11 are distributed at the two ends of the carrier plate 11, and the second nozzles 13 spraying towards two directions are distributed between the two nozzles.

Referring to fig. 10, in the evaporation source of the present embodiment, in the width direction D3 perpendicular to both the sublimation direction D1 and the extension direction D2, projections of adjacent two first nozzles 12, projections of second nozzles 13, and projections of third nozzles 14 do not overlap, respectively. That is, two adjacent first nozzles 12, two adjacent second nozzles 13, and two adjacent third nozzles 14 are arranged in a staggered manner in the width direction D3, and a predetermined distance Δ S is provided between two adjacent first nozzles 12, two adjacent second nozzles 13, and two adjacent third nozzles 14 in the width direction D3 in the extending direction D2, so that the influence of the vapor deposition materials 3 discharged from the adjacent nozzles in the width direction D3 on each other is effectively avoided, and the uniformity of the vapor deposition materials 3 on the base material 4 is ensured.

Referring to fig. 11, in the evaporation source of the present embodiment, in order to facilitate the user to maintain and assemble the nozzle, a plurality of fixing plates 18 are fixed on the carrier plate 11, and the fixing plates 18 extend in an extending direction D2; in the extending direction D2, a plurality of first nozzles 12, a plurality of second nozzles 13, and a plurality of third nozzles 14 are arranged in this order on each fixing plate 18. A plurality of nozzles on the carrier plate 11 are fixed on the carrier plate 11 in rows through the strip-shaped fixing plates 18, so that a user can replace one row of nozzles more conveniently, the replacement and cleaning efficiency of the nozzle plate 1 is improved, and the maintenance cost is reduced. Further, the nozzle plate 1 is provided with a plurality of fixing grooves 111, the fixing grooves 111 extend in the extending direction D2, and the fixing plate 18 is fixed in the fixing grooves 111, so that the fixing plate 18 can be limited when being mounted on the carrier plate 11, and the working environment of the nozzle is more stable when the evaporation material 3 is sprayed. Further, a pair of limiting protrusions 19 are respectively disposed on the carrier plate 11 at two ends of the fixing groove 111 along the extending direction D2; in the width direction D3 perpendicular to both the sublimation direction D1 and the extension direction D2, the distance between the pair of stopper protrusions 19 is greater than or equal to the width of the fixing plate 18, so that the fixing plate 18 can be confined in the fixing groove 111 without shaking to affect the spraying of the nozzle.

Referring to fig. 12, in the evaporation source of the present embodiment, the first nozzle opening 121 has a first arc-shaped cutout, the second nozzle opening 131 has a second arc-shaped cutout, and the third nozzle opening 141 has a third arc-shaped cutout, and by providing the first arc-shaped cutout, the second arc-shaped cutout, and the third arc-shaped cutout, the unevenness of the evaporation material 3 evaporated onto the base material 4 is reduced; in sublimation direction D1, the peak of first arc incision, second arc incision and third arc incision is located the same height, and the minimum point of second arc incision is higher than the minimum point of first arc incision and the minimum point of third arc incision to the thickness uniformity of coating by vaporization material 3 has been improved on substrate 4, the quality of assurance display screen.

The disclosed evaporation source of this application embodiment is provided with first board and curved second board in the inside of container for from nozzle spun coating by vaporization material even, thereby make the coating by vaporization material thickness of coating by vaporization to the substrate even, guaranteed the quality of coating by vaporization product.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims (14)

1. An evaporation source, comprising a nozzle plate and a container; the nozzle plate is fixed on the top of the container and covers the container, the container is used for containing evaporation materials, and the evaporation materials are sublimated to the nozzle plate from the container along a sublimation direction;

the container is provided with a first cavity, a second cavity and a third cavity, and the first cavity, the second cavity and the third cavity are communicated and connected in sequence along the sublimation direction;

the first cavity and the second cavity are connected through a first plate, the second cavity and the third cavity are connected through a second plate, the first plate covers the first cavity, the second plate covers the second cavity, and the nozzle plate covers the third cavity;

the first plate is provided with a plurality of first channels, the second plate is provided with a plurality of second channels, the first channels are communicated with the first cavity and the second cavity, and the second channels are communicated with the second cavity and the third cavity.

2. The evaporation source according to claim 1, wherein the first plate is a flat plate, the second plate is an arc-shaped plate, and the distance between the second plate and the first plate is gradually reduced from the center of the second plate to the edge of the second plate.

3. The evaporation source according to claim 1, wherein the diameter of the first channel is larger than the diameter of the second channel.

4. The evaporation source according to claim 1, wherein the first channels are uniformly distributed on the first plate and the second channels are uniformly distributed on the second plate.

5. The evaporation source according to claim 1, wherein the nozzle plate extends in an extension direction perpendicular to the sublimation direction, the nozzle plate comprising a carrier plate and a plurality of first nozzles, a plurality of second nozzles and a plurality of third nozzles arranged on the carrier plate, the first nozzles having first spouts, the second nozzles having a plurality of second spouts, the third nozzles having third spouts;

the opening orientation of the first nozzle is a first direction, the opening orientation of the third nozzle is a second direction, the opening orientations of the second nozzles are respectively the first direction and the second direction, and the first direction is opposite to the second direction.

6. The evaporation source according to claim 5, wherein the carrier plate has a first nozzle area, a second nozzle area and a third nozzle area, the first nozzle area, the second nozzle area and the third nozzle area are distributed from the center of the carrier plate to the edge of the carrier plate in sequence, the center of the carrier plate is located in the first nozzle area, and two ends of the carrier plate along the extending direction are connected with the third nozzle area;

the first nozzle area is internally provided with a plurality of first nozzles, the second nozzle area is internally provided with a plurality of second nozzles, and the third nozzle area is internally provided with a plurality of third nozzles;

the first direction is a direction toward the center of the carrier plate.

7. The evaporation source according to claim 6, wherein the first nozzle region, the second nozzle region and the third nozzle region are arranged in sequence from a central axis passing through a center of the carrier plate to an end of the carrier plate in the extension direction, and the plurality of first nozzles, the plurality of second nozzles and the plurality of third nozzles are arranged in a row in a linear manner in the extension direction.

8. The evaporation source according to claim 7, wherein projections of two adjacent first nozzles, projections of the second nozzles, and projections of the third nozzles do not overlap in a width direction perpendicular to both the sublimation direction and the extension direction, respectively.

9. The evaporation source according to claim 8, wherein a plurality of fixing plates are fixed on the carrier plate, and the fixing plates extend along the extending direction;

in the extending direction, the plurality of first nozzles, the plurality of second nozzles, and the plurality of third nozzles are arranged in this order on each of the fixing plates.

10. The evaporation source according to claim 9, wherein a plurality of fixing grooves are provided on the nozzle plate, the fixing grooves extending in the extending direction, the fixing plates being fixed in the fixing grooves.

11. The evaporation source according to claim 10, wherein a pair of limiting protrusions are respectively disposed on the carrier plate at two ends of the fixing groove along the extending direction;

and in the width direction perpendicular to both the sublimation direction and the extension direction, the distance between the pair of limiting protrusions is greater than or equal to the width of the fixing plate.

12. The evaporation source according to any of claims 5 to 11, wherein the first direction is collinear with the extension direction.

13. The evaporation source according to claim 5, wherein the first nozzle orifice has a first arc-shaped cutout, the second nozzle orifice has a second arc-shaped cutout, and the third nozzle orifice has a third arc-shaped cutout;

in the sublimation direction, the highest points of the first arc-shaped notch, the second arc-shaped notch and the third arc-shaped notch are located at the same height, and the lowest point of the second arc-shaped notch is higher than the lowest point of the first arc-shaped notch and the lowest point of the third arc-shaped notch.

14. The evaporation source according to claim 1, wherein a plurality of partition plates are disposed in the first cavity, the container has a heating slot, the partition plates extend along the sublimation direction and partition the first cavity into a plurality of sub-cavities that are not communicated with each other in an extending direction perpendicular to the sublimation direction, the heating slot is recessed from the bottom of the container toward the sublimation direction and extends along the extending direction, and a slot bottom of the heating slot sequentially penetrates through the partition plates in the extending direction and ends at two ends of the container.

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