CN214898388U - Parallel seam welded cover plate with embedded heat sink structure for electronic packaging shell - Google Patents
Parallel seam welded cover plate with embedded heat sink structure for electronic packaging shell Download PDFInfo
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- CN214898388U CN214898388U CN202120563268.1U CN202120563268U CN214898388U CN 214898388 U CN214898388 U CN 214898388U CN 202120563268 U CN202120563268 U CN 202120563268U CN 214898388 U CN214898388 U CN 214898388U
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Abstract
The utility model discloses a parallel seam welded cover plate that is used for embedded heat sink structure of having of electronic packaging shell. Including parallel welding seam apron body and heat sink structure, heat sink structure fixed connection the parallel welding seam apron body, parallel welding seam apron body fixed connection electronic packaging shell the heat sink structure is provided with the embedded heat conduction post that is used for heat conduction, embedded heat conduction post is followed one side of heat sink structure extends to continuously the another side of heat sink structure, and is a plurality of embedded heat conduction post interval sets up the inside of cavity. The utility model discloses can solve the not enough problem of thermal diffusivity of current packaging shell's parallel seam welded cover plate.
Description
Technical Field
The utility model relates to an electronic packaging technical field, concretely relates to parallel seam welded cover plate that is used for electronic packaging shell to have embedded heat sink structure.
Background
The parallel seam welding process is a common process for metal package shells/ceramic package shells, and is used for carrying out airtight sealing protection on electronic components (such as chips, semiconductors and the like) assembled in the shells, and a cavity of the shells is filled with nitrogen or vacuum and then is hermetically sealed, so that the cavity is completely isolated from the outside. The parallel seam welding process has the advantages of excellent sealing performance, low process cost, simplicity and convenience in operation, high efficiency and capability of being repaired. Therefore, the method is widely applied to electronic components with outstanding reliability requirements.
Along with the development of electronic components and devices, highly integrated devices, especially SIP package devices, have higher and higher integration level of package structures, more and more chips and devices are integrated into a shell, and the chips and the devices are integrated on a cover plate besides being fixedly integrated on a base, so that the cover plate faces the reliability risk, and the improvement of the heat dissipation performance of the parallel seam welding cover plate of the package shell is urgently needed.
Disclosure of Invention
The utility model discloses a be not enough to prior art, the utility model discloses a parallel seam welding apron that has embedded heat sink structure for electronic packaging shell can solve the not enough problem of thermal diffusivity of the parallel seam welding apron of current packaging shell.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:
a parallel seam welded cover plate that is used for having of electronic packaging shell embedded heat sink structure, including parallel welding seam apron body and heat sink structure, heat sink structure fixed connection parallel welding seam apron body, parallel welding seam apron body fixed connection electronic packaging shell the heat sink structure is provided with the embedded heat conduction post that is used for heat conduction, embedded heat conduction post is followed one side of heat sink structure extends to continuously the another side of heat sink structure is a plurality of embedded heat conduction post interval sets up the inside at the cavity.
In an embodiment, the heat sink structure has a cavity, one end surface of the embedded heat conducting pillar is fixedly connected to an inner side surface of the cavity, and the other end surface of the embedded heat conducting pillar is fixedly connected to another inner side surface of the cavity.
According to the preferable technical scheme, along the thickness direction of the heat sink structure, the axes of the embedded heat conduction columns extend along the linear direction, and the axes of the embedded heat conduction columns are arranged in parallel.
According to the preferable technical scheme, the embedded heat conduction columns are uniformly distributed along the length direction of the heat sink structure, and the embedded heat conduction columns are uniformly distributed along the width direction of the heat sink structure.
According to the preferable technical scheme, the parallel welding seam cover plate body is provided with a mounting groove used for positioning the heat sink structure, and the outer side face of the heat sink structure is fixedly connected with the inner side face of the mounting groove.
According to the preferable technical scheme, the parallel welding seam cover plate body is provided with a parallel welding seam key edge used for positioning the electronic packaging shell, and the parallel welding seam key edge is fixedly connected with the electronic packaging shell.
The utility model discloses a parallel seam welded cover plate that is used for electronic packaging shell to have embedded heat sink structure has following advantage:
in this application embodiment, can promote heat sink structure's heat exchange capacity through the embedded heat conduction post that sets up, because the heat sink structure of parallel welding seam apron is inside and outside level and smooth bright and clean, heat sink structure's outer plane can connect outside radiator, and the interior plane of parallel welding seam apron can closely laminate through the heat conduction material (heat conduction glue, liquid metal indium etc.) of soft state with the last plane of chip to take the heat out to outside radiator from the chip.
In this application embodiment, reach embedded heat conduction post in the inside multiposition distribution of heat sink structure through the quantity that increases embedded heat conduction post, because a plurality of embedded heat conduction posts of multiposition distribution make heat sink structure's heat exchange capacity obtain promoting by a wide margin to improve and take out the ability of outside radiator with the heat from the chip.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a perspective view of an embodiment of the present invention;
fig. 2 is a perspective view of an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are some, but not all embodiments of the present invention.
Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 and fig. 2, the embodiment of the utility model provides a parallel seam welding apron that has embedded heat sink structure 2 for electronic packaging shell, including parallel seam welding apron body 1 and heat sink structure 2, heat sink structure 2 fixed connection parallel seam welding apron body 1, parallel seam welding apron body 1 fixed connection electronic packaging shell heat sink structure 2 is provided with the embedded heat conduction post 21 that is used for heat conduction, embedded heat conduction post 21 follows a side of heat sink structure 2 extends to in succession heat sink structure 2's another side, and is a plurality of embedded heat conduction post 21 interval sets up the inside of cavity 20.
In this application embodiment, can promote heat exchange capacity of heat sink structure 2 through embedded heat conduction post 21 that sets up, because the heat sink structure 2 of parallel welding seam apron is inside and outside level and smooth bright and clean, heat sink structure 2's outer plane can connect outside radiator, and the interior plane of parallel welding seam apron can closely laminate through the heat conduction material (heat conduction glue, liquid metal indium etc.) of soft attitude with the last plane of chip to take the heat out to outside radiator from the chip.
In the embodiment of the present application, the number of embedded heat conduction pillars 21 is increased to achieve multi-position distribution of the embedded heat conduction pillars 21 inside the heat sink structure 2, and the heat exchange capability of the heat sink structure 2 is greatly improved due to the multiple embedded heat conduction pillars 21 distributed at multiple positions, so that the capability of bringing heat out of the chip to an external heat spreader is improved.
In order to maintain the sealing performance of the heat sink structure 2 and provide the installation space of the embedded heat conduction pillar 21, a cavity 20 is formed in the heat sink structure 2, one end surface of the embedded heat conduction pillar 21 is fixedly connected with one inner side surface of the cavity 20, and the other end surface of the embedded heat conduction pillar 21 is fixedly connected with the other inner side surface of the cavity 20.
In order to reduce the size of the embedded heat conduction column 21 in the thickness direction of the heat sink structure 2 to increase the heat conduction speed of the embedded heat conduction column 21, the axis of the embedded heat conduction column 21 extends in a straight line direction along the thickness direction of the heat sink structure 2, and the axis directions of the embedded heat conduction columns 21 are arranged in parallel.
In order to improve the heat conduction capability and the uniformity of heat conduction of the embedded heat conduction pillars 21, a plurality of embedded heat conduction pillars 21 are uniformly distributed along the length direction of the heat sink structure 2, and a plurality of embedded heat conduction pillars 21 are uniformly distributed along the width direction of the heat sink structure 2.
In order to facilitate the heat exchange capacity of fixedly mounting the heat sink structure 2 on the parallel weld joint cover plate body 1 and improving the heat sink structure 2 on the parallel weld joint cover plate body 1, the parallel weld joint cover plate body 1 is provided with a mounting groove 10 for positioning the heat sink structure 2, and the outer side surface of the heat sink structure 2 is fixedly connected with the inner side surface of the mounting groove 10.
The parallel seam welding body cover plate body 1 and the heat sink structure 2 are combined into a whole through welding and other process means, the edge of the cover plate is assembled and positioned and meets the assembly requirements of the parallel seam welding process, the edge of the heat sink structure 2 is fixed on a fixing hole/surface mechanism of a base (packaging shell) through a proper mounting surface, the two are independent, and the parallel seam welding sealing surface does not need to bear extra mechanical stress brought by the weight of the heat sink structure 2. The fixing method can refer to the Chinese patent with patent number CN202011209346.4 named as a parallel seam welding packaging shell.
It is easy to understand that the material of the parallel-welded joint cover plate body 1 is usually kovar alloy (4J29 alloy), 4J42 alloy or other similar metal materials that can be subjected to the parallel-welded joint welding process, and the heat sink structure 2 made of high heat dissipation material, such as oxygen-free copper, tungsten copper, molybdenum copper, copper-molybdenum copper-copper or copper-molybdenum-copper composite material, is embedded in the center of the parallel-welded joint cover plate body 1 by welding.
In order to facilitate the connection of the parallel weld joint cover plate body 1 with the electronic packaging shell, the parallel weld joint cover plate body 1 is provided with a parallel weld joint key edge 11 for positioning the electronic packaging shell, and the parallel weld joint key edge 11 is fixedly connected with the electronic packaging shell.
It is easy to understand that, the parallel weld seam cover plate body 1 is fixed on the electronic packaging shell by a mechanical fixing method, and after parallel seam welding, the sealing surface of the parallel weld seam cover plate body 1 is protected, and can not be torn and leaked due to mechanical impact or vibration.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (6)
1. A parallel seam welded cover plate that is used for having of electronic packaging shell embedded heat sink structure, including parallel seam welded cover plate body and heat sink structure, heat sink structure fixed connection parallel seam welded cover plate body, parallel seam welded cover plate body fixed connection electronic packaging shell, its characterized in that: the heat sink structure is provided with embedded heat conduction columns for heat conduction, the embedded heat conduction columns continuously extend from one side face of the heat sink structure to the other side face of the heat sink structure, and the embedded heat conduction columns are arranged in the cavity at intervals.
2. The parallel seam welded cover plate with embedded heat sink structure for electronic package housing of claim 1, wherein: the heat sink structure is provided with a cavity, one end face of the embedded heat conduction column is fixedly connected with one inner side face of the cavity, and the other end face of the embedded heat conduction column is fixedly connected with the other inner side face of the cavity.
3. The parallel seam welded cover plate with embedded heat sink structure for electronic package housing of claim 1, wherein: along the thickness direction of the heat sink structure, the axes of the embedded heat conduction columns extend along the linear direction, and the axes of the embedded heat conduction columns are arranged in parallel.
4. The parallel seam welded cover plate with embedded heat sink structure for electronic package housing of claim 1, wherein: the embedded heat conduction columns are uniformly distributed along the length direction of the heat sink structure, and the embedded heat conduction columns are uniformly distributed along the width direction of the heat sink structure.
5. The parallel seam welded cover plate with embedded heat sink structure for electronic package housing of claim 1, wherein: the parallel welding seam cover plate body is provided with a mounting groove for positioning the heat sink structure, and the outer side surface of the heat sink structure is fixedly connected with the inner side surface of the mounting groove.
6. The parallel seam welded cover plate with embedded heat sink structure for electronic package housing of claim 1, wherein: the parallel welding seam cover plate body is provided with a parallel welding seam key edge used for positioning the electronic packaging shell, and the parallel welding seam key edge is fixedly connected with the electronic packaging shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120563268.1U CN214898388U (en) | 2021-03-19 | 2021-03-19 | Parallel seam welded cover plate with embedded heat sink structure for electronic packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120563268.1U CN214898388U (en) | 2021-03-19 | 2021-03-19 | Parallel seam welded cover plate with embedded heat sink structure for electronic packaging shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214898388U true CN214898388U (en) | 2021-11-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120563268.1U Active CN214898388U (en) | 2021-03-19 | 2021-03-19 | Parallel seam welded cover plate with embedded heat sink structure for electronic packaging shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214898388U (en) |
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2021
- 2021-03-19 CN CN202120563268.1U patent/CN214898388U/en active Active
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