CN214898369U - Lifting control device for wafer edge protection structure and semiconductor machine - Google Patents
Lifting control device for wafer edge protection structure and semiconductor machine Download PDFInfo
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- CN214898369U CN214898369U CN202121481520.0U CN202121481520U CN214898369U CN 214898369 U CN214898369 U CN 214898369U CN 202121481520 U CN202121481520 U CN 202121481520U CN 214898369 U CN214898369 U CN 214898369U
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Abstract
The utility model provides a wafer edge protection architecture lift control device and semiconductor board, wafer edge protection architecture lift control device includes lift unit, stroke amplification unit and horizontal migration unit, the lift unit is used for driving basement edge protection architecture and goes up and down, stroke amplification unit is used for driving lift unit and goes up and down and remove with n times magnification drive horizontal migration unit, and carries on spacingly and measure through the stroke of horizontal migration unit to lift unit. The utility model discloses utilize stroke amplification unit output to enlarge n times's stroke, and utilize this stroke of enlarging n times to carry on spacing to the stroke of lifting unit carries on spacing, is favorable to improving spacing precision, prevents to hit and damages basement or device; the distance between the substrate edge protection structure and the substrate can be measured conveniently by utilizing the stroke amplified by n times, so that the distance can be more accurately controlled, and the protection effect can be improved.
Description
Technical Field
The utility model relates to the field of semiconductor technology, in particular to wafer edge protection structure lift control device and semiconductor board.
Background
With the continuous development of miniaturization and integration of integrated circuit technology, higher requirements are put forward on the fine control in the corresponding integrated circuit manufacturing field. For example, annealing processes are continuously changed from a method of heating the entire wafer to a Rapid Thermal Processing (RTP), a pulse annealing (pulsing annealing), and a laser scanning annealing (lsam). Wherein the laser scanning annealing effect is optimal.
In the laser scanning annealing process, because the energy density of the laser spot is high, in order to prevent the wafer fragments caused by the laser spot hitting the edge of the wafer, a wafer edge protection structure is arranged at the edge of the wafer for partial shielding, and the distance between the wafer edge protection structure and the upper surface of the wafer also needs to be correspondingly adjusted according to different annealing process conditions. Meanwhile, during annealing, in order to reduce the influence of oxygen on the surface of the wafer, the wafer is placed in the closed cavity so as to control the oxygen concentration to a certain index range. Therefore, the distance from the wafer edge protection structure arranged in the cavity of the annealing device to the upper surface of the wafer is required to be controlled within a certain distance (for example, 0.1-1.5 mm) and adjustable, but the distance is too small, so that the electrical limit and mechanical limit design difficulty of the stroke mechanism is very high, the wafer or the wafer edge protection structure cannot be effectively protected, and the stroke of the wafer edge protection structure is difficult to measure because the wafer edge protection structure is located in the narrow closed cavity.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer edge protection architecture lift control device and semiconductor board to protection basement and basement edge protection architecture are convenient for measure basement edge protection architecture's stroke.
Another object of the present invention is to facilitate measuring the stroke of the substrate edge protection structure.
In order to solve the technical problem, the utility model provides a stroke stop gear for the instruction and the protection of stroke, wafer edge protection structure lift control device includes lift unit, stroke amplification unit and horizontal migration unit, the lift unit is used for the drive basement edge protection structure goes up and down, the stroke amplification unit is used for the drive the lift unit goes up and down and drives with n times magnification horizontal migration unit removal.
Optionally, the stroke amplifying unit includes a screw shaft, a screw nut, a gear and a rack; one end of the screw shaft is connected with a driving unit, the driving unit is used for driving the screw shaft to rotate, the screw nut and the screw shaft form a screw pair, the screw nut is connected with the lifting unit to drive the lifting unit to lift, the other end of the screw shaft is fixedly connected with the gear, and the rack is meshed with the gear and is connected with the horizontal moving unit and used for amplifying the stroke of the screw nut by n times.
Optionally, n is pi × d/h, and pi × d > h, where d is a pitch circle diameter of the gear, and h is a lead of the screw shaft.
Optionally, the horizontal moving unit includes a first guide rail, a slider, a limiting part, a pointer and a scale; the sliding block is fixedly connected with the rack, the sliding block is arranged on the first guide rail in a sliding mode, the limiting parts are arranged on two sides of the first guide rail, and the pointer is connected with the sliding block and corresponds to the scale.
Optionally, the limiting component comprises a mechanical limiting component and/or an electrical limiting component; the mechanical limiting parts are mechanical limiting blocks, and the mechanical limiting blocks are arranged at two ends of the first guide rail and used for mechanically limiting the sliding block; the electrical limiting component comprises an electrical limiting sensor arranged on the first guide rail and an electrical limiting sensor blocking piece arranged on the sliding block and is used for electrically limiting the sliding block.
Optionally, the driving unit includes a motor unit, a transmission unit and a braking component, the transmission unit is connected to the motor unit and the screw shaft in a transmission manner, and the braking component is connected to the motor assembly and is used for braking the motor unit.
Optionally, the transmission unit includes a first synchronous pulley connected to the motor unit, a second synchronous pulley connected to the screw shaft, and a synchronous belt connected to the first synchronous pulley and the second synchronous pulley.
Optionally, the pitch circle diameter of the first synchronous pulley is smaller than the pitch circle diameter of the second synchronous pulley.
Optionally, the lifting unit includes a second guide rail, a connecting plate and a lifting connecting frame, the second guide rail is parallel to the screw shaft, the connecting plate is fixedly connected with the screw nut, the connecting plate runs through the second guide rail and the screw shaft, one end of the lifting connecting frame is fixedly connected with the connecting plate, and the other end of the lifting connecting frame is connected with the substrate edge protection structure.
Based on the utility model discloses a further aspect, the utility model discloses still provide a semiconductor board, the semiconductor board includes like foretell wafer edge protection structure lift control device, the semiconductor board is laser annealing equipment or bonding equipment.
To sum up, the utility model provides a wafer edge protection structure lift control device and semiconductor board have following beneficial effect:
1) the stroke amplifying unit is used for outputting the stroke amplified by n times, and the stroke amplified by n times is used for limiting, so that the stroke of the lifting unit is limited, the limiting precision is improved, and the substrate or the device is prevented from being damaged;
2) the distance between the substrate edge protection structure and the substrate can be monitored and adjusted conveniently by utilizing the stroke amplified by n times to measure, so that more accurate distance control is realized, and the protection effect is improved.
Drawings
It will be appreciated by those skilled in the art that the drawings are provided for a better understanding of the invention and do not constitute any limitation to the scope of the invention. Wherein:
fig. 1 is a schematic structural diagram of a lifting control device of a wafer edge protection structure according to an embodiment of the present disclosure.
In the drawings:
10-a stroke amplification unit; 11-a screw shaft; 12-a lead screw nut; 13-a gear; 14-a rack;
20-a horizontal movement unit; 21-a rack connection; 22-a slide block; 23-a first guide rail; 24-a mechanical stop feature; 25-an electrical limiting member; 25 a-electrical limit sensor; 25 b-an electrical limit paddle; 26-a pointer; 27-scale bar;
30-a lifting unit; 31-a second guide rail; 32-lead screw nut connection plate; 33-lifting connecting frame;
40-a drive unit; 41-a motor unit; 42-a braking component; 43-a transmission unit; 43 a-a first synchronous pulley; 43 b-a second synchronous pulley; 43 c-synchronous belt;
51-a substrate; 52-a cavity; 53-substrate edge protection structure; 54-carrying plate.
Detailed Description
To make the objects, advantages and features of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be noted that the drawings are in simplified form and are not to scale, but rather are provided for the purpose of facilitating and distinctly claiming the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.
As used in this application, the singular forms "a", "an" and "the" include plural referents, the term "or" is generally employed in a sense including "and/or," the terms "a", "an" and "the" are generally employed in a sense including "at least one", the terms "at least two" and "two or more" are generally employed in a sense including "two or more", and moreover, the terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or imply that there is a number of technical features being indicated. Thus, features defined as "first," "second," and "third" may explicitly or implicitly include one or at least two of the features unless the content clearly dictates otherwise.
The utility model provides a wafer edge protection architecture lift control device and semiconductor board utilizes the n times's of output amplification stroke in the time of the enlarged unit output stroke of stroke to it is spacing to utilize the n times's of this enlargement stroke, so that carry on spacingly to the stroke of lift unit, is favorable to improving spacing precision, prevents to hit bad basement or device. Furthermore, the distance between the substrate edge protection structure and the substrate can be monitored and adjusted conveniently by utilizing the stroke amplified by n times to measure, so that more accurate distance control is realized, and the protection effect is improved.
Fig. 1 is a schematic structural diagram of a lifting control device of a wafer edge protection structure according to an embodiment of the present disclosure.
As shown in fig. 1, the lifting control device for wafer edge protection structure provided in this embodiment is used to drive the substrate edge protection structure 53 to lift. The lifting control device for the wafer edge protection structure comprises a lifting unit 30, a stroke amplification unit 10 and a horizontal movement unit 20, wherein the lifting unit 30 is used for driving the substrate edge protection structure 53 to lift, the stroke amplification unit 10 is used for driving the lifting unit 30 to lift and driving the horizontal movement unit 20 to move with n times of magnification, and the stroke of the lifting unit 30 is limited and measured through the horizontal movement unit 20.
In the present embodiment, a substrate edge protection structure 53 is disposed in the cavity 52 for protecting the edge of the substrate 51 when performing related process. The material of the substrate 51 may be any suitable material, such as silicon, glass, sapphire, or ceramic, and the surface of the substrate 51 may further have a corresponding microstructure. In the present embodiment, the substrate 51 is a silicon wafer (also referred to as a wafer).
Referring to fig. 1, in the present embodiment, the stroke amplifying unit 10 is configured to output the stroke input by the driving unit 40 to the lifting unit 30, so that the lifting unit 30 performs a lifting operation on the substrate edge protection structure 53, and simultaneously amplifies the stroke input by the driving unit 40 by n times and outputs the amplified stroke to the horizontal moving unit 20.
Specifically, the stroke amplification unit 10 includes a screw shaft 11, a screw nut 12, a gear 13, and a rack 14. The screw nut 12 and the screw shaft 11 form a screw pair, one end (for example, the upper end) of the screw shaft 11 is in transmission connection with the driving unit 40, and the driving unit 40 is used for driving the screw shaft 11 to rotate so as to provide an input stroke; the screw nut 12 is sleeved on the screw shaft 11, and is used for converting an input stroke of the driving unit 40, namely, rotation of the screw shaft 11, into lifting of the screw nut 12, so as to output a lifting stroke, namely, a stroke of the lifting unit 30. The gear 13 is fixedly connected to the other end of the screw shaft 11 opposite to the driving unit 40, and is connected, for example, by a key, so that the gear 13 and the screw shaft 11 rotate synchronously, and the rack 14 is horizontally arranged at the lower end of the screw shaft 11 and completely meshed with the gear 13, and is used for converting the rotation of the gear 13 into the horizontal movement of the rack 14, thereby realizing the purpose of amplifying the stroke input by the driving unit 40 by n times.
In the above-described n-fold magnification, n ═ pi × d/h, d is the pitch circle diameter of the gear 13, and h is the lead of the threaded shaft 11. Preferably,. pi.times.d > h. It is understood that if the output stroke (stroke of the lifting unit 30) achieved by the lead screw nut 12 is s, the stroke correspondingly converted to the output of the rack 14 is pi × d × s/h, that is, the stroke output by the rack 14 is pi × d/h times the stroke output by the lead screw nut 12, when the input stroke of the driving unit 40 is s. When the stroke of the rack 14 is n times greater than that of the lead screw nut 12, the corresponding stroke limiting or measuring is performed on the enlarged stroke, which is not only beneficial to improving the convenience and the accuracy of the operation of the wafer edge protection structure lifting control device, but also beneficial to debugging and controlling the wafer edge protection structure lifting control device.
In one embodiment, the pitch diameter d of the gear 13 is 15mm, the lead h of the screw shaft 11 is 2mm, and if the screw nut 12 realizes a stroke of 0.1mm (up-down), the rack 14 realizes a stroke of 2.355mm (horizontal movement), and the stroke of the rack 14 enlarges 23.55 times the stroke of the screw nut 12.
Referring to fig. 1, the horizontal moving unit 20 is fixedly connected to the rack 14 of the stroke amplifying unit 10 by a rack connecting plate 21 to output the amplified stroke of the stroke amplifying unit 10. The horizontal movement unit 20 includes a first guide rail 23, a slider 22, a stopper, a pointer 26, and a scale 27. The first guide rail 23 is disposed parallel to the rack 14, and is disposed horizontally in this embodiment, a sliding block 22 is slidably disposed on the first guide rail 23, and the sliding block 22 is fixedly connected to the rack 14 by a rack connecting plate 21 and realizes synchronous horizontal movement with the rack 14. The limiting parts are arranged on two sides of the first guide rail 23, the stroke of the lifting unit 30 is limited by utilizing the limit of the horizontal stroke, the corresponding limit is carried out by utilizing the amplified stroke, the difficulty of the design of the limiting structure is reduced, so that the stroke of the lifting unit is limited, the limiting precision is improved, and the substrate or the device is prevented from being damaged. The pointer 26 is disposed on the slider 22, moves horizontally in synchronization with the slider 22, and corresponds to the scale 27 disposed under the first guide rail 23, so as to indicate and measure the stroke of the lifting unit 30.
The scale 27 may be provided with corresponding scales, and the specific scale may be set in combination with the stroke magnification n and the maximum allowable lifting stroke, and perform corresponding calibration based on the same set starting point, that is, the lifting stroke or the remaining stroke of the lifting unit 30 may be directly read by using the indication of the pointer 26 and the scales of the scale 27. In the present embodiment, the remaining stroke may be a distance between the substrate edge protection structure 53 and the substrate 51.
Further, in this embodiment, the position limiting component may include a mechanical position limiting component 24 and/or an electrical position limiting component 25. Preferably, the mechanical limiting part 24 and the electrical limiting part 25 can be arranged at the same time, the mechanical limiting part 24 can be used as hard protection and can be arranged at the outer side of the electrical limiting part 25, and the electrical limiting part 25 can be used as soft protection, so that early warning or limiting of the stroke approaching the overrun can be realized.
Specifically, the mechanical limiting part 24 may include two mechanical limiting blocks, the two mechanical limiting blocks are disposed on two sides of the first guide rail 23 and located at the maximum safe stroke of the slider 22, so as to mechanically limit the slider 22, and further realize stroke limitation of the lifting unit 30. The electrical limiting part 25 comprises an electrical limiting shifting piece 25b arranged on the sliding block 22 and two electrical limiting sensors 25a arranged on two sides of the first guide rail 23, wherein the electrical limiting shifting piece 25b is matched with the electrical limiting sensors 25a and used for achieving electrical limiting, for example, corresponding braking or alarming is immediately carried out if the electrical limiting shifting piece is over-limited.
Referring to fig. 1, in the present embodiment, the driving unit 40 is used for inputting and maintaining a stroke, and includes a motor unit 41, a transmission unit 43 and a braking component 42. The transmission unit 43 is drivingly connected to the motor unit 41 and the screw shaft 11, and the brake member 42 is connected to the motor unit 41 for performing braking or stroke holding on the motor unit 41.
The transmission unit 43 includes a first synchronous pulley 43a connected to the motor unit 41, a second synchronous pulley 43b connected to the screw shaft 11, and a synchronous belt 43c, and the synchronous belt 43c drivingly connects the first synchronous pulley 43a and the second synchronous pulley 43 b. Preferably, the pitch circle diameter of the first synchronous pulley 43a is smaller than the pitch circle diameter of the second synchronous pulley 43b, and the second synchronous pulley 43b is used for driving and connecting the first synchronous pulley 43a, so that the speed reduction output of the motor unit 41 is realized, and the overall stroke control precision is improved.
The motor unit 41 includes a motor and an encoder, and the encoder is matched with the motor and configured to control output of the motor. The braking component 42 is connected with the motor unit 41 through a shaft, is arranged at the other end of the motor opposite to the first synchronous belt pulley 43a, and is used for realizing stroke keeping or power-off keeping of the wafer edge protection structure lifting control device. Preferably, the electrical limit sensor 25a of the electrical limit component 25 is also electrically connected to the encoder to effect braking or deceleration of travel when the electrical limit is triggered to protect the substrate 51 and the device.
Referring to fig. 1, the lifting unit 30 is used for outputting a lifting stroke to the substrate edge protection structure 53, and the lifting unit 30 includes a second guide rail 31, a screw nut connection plate 32, and a lifting connection frame 33. The second guide rail 31 is parallel to the screw shaft 11, the screw nut connecting plate 32 is fixedly connected to the screw nut 12, the screw nut connecting plate 32 penetrates through the second guide rail 31 and the screw shaft 11, one end of the lifting connecting frame 33 is fixedly connected to the screw nut connecting plate 32, and the other end of the lifting connecting frame 33 is connected to the base edge protection structure 53. In this embodiment, the number of the second guide rails 31 is two, and the second guide rails 31 are both vertically disposed, and the screw nut connecting plate 32 and the two second guide rails 31 form a sliding connection.
In the embodiment, the substrate edge protection structure 53 is located in the cavity 52, and the shape of the substrate edge protection structure is matched with the shape of the edge of the substrate 51, for example, the substrate 51 is a wafer, and the substrate edge protection structure 53 is a ring shape and is used for protecting the edge of the substrate 51 in a stroke (lifting) adjustable manner in a narrow space (for example, the height is 0.1 to 1.5 mm). The substrate 51 may be placed on a carrier plate 54 in the cavity 52, and the lifting frame 33 passes through the bottom of the cavity 52 and connects to the substrate edge protection structure 53. Preferably, the lifting link 33 connects both sides of the base edge protection structure 53 to facilitate the stroke output.
The embodiment further provides a semiconductor machine, which comprises the above-mentioned wafer edge protection structure lifting control device for driving the substrate edge protection structure 53 to lift.
In some embodiments, the semiconductor machine is a laser annealing apparatus for performing lift control on the substrate edge protection structure 53 during a laser annealing process. In other embodiments, the semiconductor machine is a bonding apparatus for performing lift control on the substrate edge protection structure 53 during bonding.
To sum up, the utility model provides a wafer edge protection structure lift control device and semiconductor board have following beneficial effect:
1) the stroke amplifying unit is used for outputting the stroke amplified by n times, and the stroke amplified by n times is used for limiting, so that the stroke of the lifting unit is limited, the limiting precision is improved, and the substrate or the device is prevented from being damaged;
2) the distance between the substrate edge protection structure and the substrate can be monitored and adjusted conveniently by utilizing the stroke amplified by n times to measure, so that more accurate distance control is realized, and the protection effect is improved.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and any modification and modification made by those skilled in the art according to the above disclosure are all within the scope of the claims.
Claims (10)
1. The utility model provides a wafer edge protection structure lift control device for drive basement edge protection structure goes up and down, its characterized in that, wafer edge protection structure lift control device includes lift unit, stroke amplification unit and horizontal migration unit, the lift unit is used for driving basement edge protection structure goes up and down, stroke amplification unit is used for driving the lift unit goes up and down and drives with n times magnification horizontal migration unit removes.
2. The wafer edge protection structure lifting control device of claim 1, wherein the stroke amplification unit comprises a screw shaft, a screw nut, a gear and a rack; one end of the screw shaft is connected with a driving unit, the driving unit is used for driving the screw shaft to rotate, the screw nut and the screw shaft form a screw pair, the screw nut is connected with the lifting unit to drive the lifting unit to lift, the other end of the screw shaft is fixedly connected with the gear, and the rack is meshed with the gear and is connected with the horizontal moving unit and used for amplifying the stroke of the screw nut by n times.
3. The wafer edge protection structure lift control device of claim 2, wherein n ═ π × d/h, and π × d > h, where d is the pitch circle diameter of the gear and h is the lead of the screw shaft.
4. The wafer edge protection structure lifting control device of claim 3, wherein the horizontal moving unit comprises a first guide rail, a slider, a limiting part, a pointer and a scale; the sliding block is fixedly connected with the rack, the sliding block is arranged on the first guide rail in a sliding mode, the limiting parts are arranged on two sides of the first guide rail, and the pointer is connected with the sliding block and corresponds to the scale.
5. The wafer edge protection structure lifting control device of claim 4, wherein the limiting component comprises a mechanical limiting component and/or an electrical limiting component; the mechanical limiting parts are mechanical limiting blocks, and the mechanical limiting blocks are arranged at two ends of the first guide rail and used for mechanically limiting the sliding block; the electrical limiting component comprises an electrical limiting sensor arranged on the first guide rail and an electrical limiting sensor blocking piece arranged on the sliding block and is used for electrically limiting the sliding block.
6. The wafer edge protection structure lifting control device of claim 2, wherein the driving unit comprises a motor unit, a transmission unit and a braking component, the transmission unit is in transmission connection with the motor unit and the screw shaft, and the braking component is connected with the motor unit and is used for braking the motor unit.
7. The wafer edge protection structure lifting control device of claim 6, wherein the transmission unit comprises a first synchronous pulley connected with the motor unit, a second synchronous pulley connected with the lead screw shaft, and a synchronous belt connected with the first synchronous pulley and the second synchronous pulley.
8. The wafer edge protection structure lift control device of claim 7, wherein a pitch diameter of the first synchronous pulley is smaller than a pitch diameter of the second synchronous pulley.
9. The wafer edge protection structure lifting control device of claim 2, wherein the lifting unit comprises a second guide rail, a connecting plate and a lifting connecting frame, the second guide rail is parallel to the screw shaft, the connecting plate is fixedly connected with the screw nut, the connecting plate penetrates through the second guide rail and the screw shaft, one end of the lifting connecting frame is fixedly connected with the connecting plate, and the other end of the lifting connecting frame is connected with the substrate edge protection structure.
10. A semiconductor machine comprising the wafer edge protection structure lift control apparatus of any one of claims 1 to 9, wherein the semiconductor machine is a laser annealing apparatus or a bonding apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121481520.0U CN214898369U (en) | 2021-06-30 | 2021-06-30 | Lifting control device for wafer edge protection structure and semiconductor machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121481520.0U CN214898369U (en) | 2021-06-30 | 2021-06-30 | Lifting control device for wafer edge protection structure and semiconductor machine |
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| CN214898369U true CN214898369U (en) | 2021-11-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024002219A1 (en) * | 2022-07-01 | 2024-01-04 | 北京北方华创微电子装备有限公司 | Wafer bearing device, and semiconductor process apparatus |
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2021
- 2021-06-30 CN CN202121481520.0U patent/CN214898369U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024002219A1 (en) * | 2022-07-01 | 2024-01-04 | 北京北方华创微电子装备有限公司 | Wafer bearing device, and semiconductor process apparatus |
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