CN214896609U

CN214896609U - Heat insulation protection structure for electronic element

Info

Publication number: CN214896609U
Application number: CN202121200180.XU
Authority: CN
Inventors: 王晓红
Original assignee: Shenzhen Zhanheng Electronics Co ltd
Current assignee: Shenzhen Zhanheng Electronics Co ltd
Priority date: 2021-05-31
Filing date: 2021-05-31
Publication date: 2021-11-26
Anticipated expiration: 2031-05-31

Abstract

The utility model discloses a thermal-insulated protection architecture that electronic component used relates to electronic component technical field. Including stamping workpiece, copper billet and thermal-insulated membrane, be equipped with the installation position on the stamping workpiece, the copper billet is located the installation position and welds rather than through the tin cream, is equipped with radiating fin structure on the stamping workpiece, and the thermal-insulated membrane is attached on the copper billet, and the thermal-insulated membrane includes WSe2 film, MoS2 film and graphite alkene film, and MoS2 film is located the upper strata of WSe2 film, and graphite alkene film is located the upper strata of MoS2 film. The heat insulation protection structure for the electronic element has the advantages that the heat insulation film formed by the WSe2 thin film, the MoS2 thin film and the graphene thin film can well inhibit thermal vibration of atoms, most energy can be lost when the atoms pass through each layer, heat is dissipated among the layers, each layer plays a good heat insulation effect in the heat transfer process, and meanwhile, the heat can be quickly conducted out by matching with heat conduction of the copper block and a stamping piece, so that the heat dissipation function and the usability are enhanced.

Description

Heat insulation protection structure for electronic element

Technical Field

The utility model relates to an electronic component technical field specifically is a thermal-insulated protection architecture that electronic component used.

Background

Nowadays, the occupation ratio of smart phones, notebook computers and other electronic devices in our work and life is increasing day by day, and in the electronic industry, too high temperature of electronic components is always a troublesome problem, for example, high-speed running of a CPU of a notebook computer and concurrent running of various programs are main reasons for heating of the notebook computer.

The development trend of miniaturization of electronic equipment is focused on bringing about a small challenge to engineers about the design of heat insulation materials and even the whole heat insulation system.

SUMMERY OF THE UTILITY MODEL

The utility model provides a thermal-insulated protection architecture that electronic component used possesses the advantage that has strengthened heat dissipation function and usability, when the guarantee user used the travelling comfort, has reduced the problem that influences computer performance and life-span.

For the purpose that the realization has strengthened heat dissipation function and usability, the utility model provides a following technical scheme: a heat insulation protection structure for an electronic element comprises a stamping part, a copper block and a heat insulation film, wherein the stamping part is provided with a mounting position, the copper block is positioned in the mounting position and welded with the mounting position through solder paste, the stamping part is provided with a radiating fin structure, and the heat insulation film is attached to the copper block;

the heat insulation film comprises a WSe2 film, a MoS2 film and a graphene film, wherein the MoS2 film is located on the upper layer of the WSe2 film, and the graphene film is located on the upper layer of the MoS2 film.

As a preferred technical scheme of the utility model, the top of stamping workpiece is annex assembly face, the bottom of stamping workpiece is the component binding face.

As the utility model discloses a preferred technical scheme, the middle part of installation position is opening structure, the radiating fin structure is located the both ends of stamping workpiece.

As a preferred technical scheme of the utility model, be equipped with the mounting hole on the stamping workpiece, and the mounting hole distributes around the stamping workpiece.

As a preferred technical scheme of the utility model, the upper and lower two sides of copper billet and the upper and lower two sides parallel and level of stamping workpiece, and the copper billet is anti-oxidation technology processing.

As an optimal technical scheme of the utility model, thermal-insulated membrane bonds on the copper billet through heat-conducting glue, and thermal-insulated membrane is the layering stacked structure form.

Compared with the prior art, the utility model provides a thermal-insulated protection architecture that electronic component used possesses following beneficial effect:

the heat insulation protection structure for the electronic element has the advantages that the heat insulation film formed by the WSe2 thin film, the MoS2 thin film and the graphene thin film can well inhibit thermal vibration of atoms, most energy can be lost when the atoms pass through each layer, heat is dissipated among the layers, each layer plays a good heat insulation effect in the heat transfer process, and meanwhile, the heat can be quickly conducted out by matching with heat conduction of the copper block and a stamping piece, so that the heat dissipation function and the usability are enhanced.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is an exploded view of the present invention shown in fig. 1;

fig. 3 is a reverse view of fig. 1 of the present invention;

fig. 4 is an exploded view of fig. 3 of the present invention;

fig. 5 is a schematic view of the structure of the heat insulation film of the present invention.

In the figure: 1. stamping parts; 2. a copper block; 3. a heat insulating film; 4. an installation position; 5. a heat-dissipating fin structure; 6. a WSe2 film; 7. MoS2 film; 8. a graphene film; 9. an accessory mounting face; 10. an element attaching surface; 11. and (7) installing holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the utility model discloses a thermal-insulated protection architecture that electronic component used, including stamping workpiece 1, copper billet 2 and thermal-insulated membrane 3, be equipped with installation position 4 on the stamping workpiece 1, copper billet 2 is located installation position 4 and welds with it through the tin cream, be equipped with radiating fin structure 5 on the stamping workpiece 1, thermal-insulated membrane 3 attaches on copper billet 2, thermal-insulated membrane 3 that constitutes by WSe2 film 6, MoS2 film 7 and graphite alkene film 8 can restrain atomic thermal vibration well, when the atom passes through each layer, all can lose most energy, the heat dissipates between each layer, and each layer has played fine thermal-insulated effect in the heat transfer process, and the heat conduction of cooperation copper billet 2 and stamping workpiece 1 can be gone out very fast simultaneously to strengthen heat dissipation function and usability;

the heat insulation film 3 comprises a WSe2 thin film 6, a MoS2 thin film 7 and a graphene thin film 8, wherein the MoS2 thin film 7 is located on the upper layer of the WSe2 thin film 6, and the graphene thin film 8 is located on the upper layer of the MoS2 thin film 7.

Specifically, the top of the stamping part 1 is an accessory mounting surface 9, and the bottom of the stamping part 1 is an element attaching surface 10.

In this embodiment, the accessory mounting surface 9 can be used for mounting other electronic accessories, and the component mounting surface 10 can be used for mounting required electronic components.

Specifically, the middle part of installation position 4 is opening structure, radiating fin structure 5 is located the both ends of stamping workpiece 1.

In this embodiment, for the installation position 4 of opening structure can increase the heat exchange rate of copper billet 2 and outside air, radiating fin structure 5 plays the heat exchange rate of counterpressure piece 1 and outside air equally.

Specifically, be equipped with mounting hole 11 on stamping workpiece 1, and mounting hole 11 distributes around stamping workpiece 1.

In this embodiment, the stamping part 1 can be mounted on other electronic accessories through the mounting hole 11, and plays a role in fixing.

Specifically, the upper surface and the lower surface of the copper block 2 are flush with the upper surface and the lower surface of the stamping part 1, and the copper block 2 is subjected to anti-oxidation process treatment.

In this embodiment, the upper and lower surfaces of the copper block 2 are flush with the upper and lower surfaces of the stamping part 1 to ensure the degree of engagement with other electronic accessories or elements, and the copper block 2 is subjected to an anti-oxidation process, which helps to prolong the service life of the copper block.

Specifically, the heat insulation film 3 is bonded to the copper block 2 through a heat conductive adhesive, and the heat insulation film 3 is in a layered stacked structure.

In this embodiment, the thermal insulation film 3 composed of the WSe2 thin film 6, the MoS2 thin film 7, and the graphene thin film 8 can suppress thermal vibration of atoms well, most of energy is lost when atoms pass through each layer, heat is dissipated among the layers, and each layer has a good thermal insulation effect in a heat transfer process.

The utility model discloses a theory of operation and use flow: when the heat insulation film 3 is used, the heat insulation film 3 composed of the WSe2 film 6, the MoS2 film 7 and the graphene film 8 can well inhibit thermal vibration of atoms, most energy is lost when the atoms pass through each layer, heat is dissipated among the layers, each layer plays a good heat insulation effect in a heat transfer process, and meanwhile, the heat can be quickly conducted out by matching with heat conduction of the copper block 2 and the stamping part 1, so that the heat dissipation function and the usability are enhanced.

In summary, the thermal insulation protection structure for the electronic component, the thermal insulation film 3 composed of the WSe2 film 6, the MoS2 film 7 and the graphene film 8 can well inhibit the thermal vibration of atoms, most energy is lost when the atoms pass through each layer, heat is dissipated among the layers, each layer has a good thermal insulation effect in the heat transfer process, and the heat can be quickly conducted out by matching with the heat conduction of the copper block 2 and the stamping part 1, so that the heat dissipation function and the usability are enhanced.

It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a thermal-insulated protection architecture that electronic component used, includes stamping workpiece (1), copper billet (2) and thermal-insulated membrane (3), its characterized in that: the heat insulation film is characterized in that a mounting position (4) is arranged on the stamping part (1), the copper block (2) is located in the mounting position (4) and welded with the mounting position through solder paste, a heat dissipation fin structure (5) is arranged on the stamping part (1), and the heat insulation film (3) is attached to the copper block (2);

the heat insulation film (3) comprises a WSe2 film (6), a MoS2 film (7) and a graphene film (8), the MoS2 film (7) is located on the upper layer of the WSe2 film (6), and the graphene film (8) is located on the upper layer of the MoS2 film (7).

2. The heat insulating protective structure for an electronic component according to claim 1, wherein: the top of stamping workpiece (1) is annex assembly face (9), the bottom of stamping workpiece (1) is component binding face (10).

3. The heat insulating protective structure for an electronic component according to claim 1, wherein: the middle part of installation position (4) is opening structure, radiating fin structure (5) are located the both ends of stamping workpiece (1).

4. The heat insulating protective structure for an electronic component according to claim 1, wherein: be equipped with mounting hole (11) on stamping workpiece (1), and mounting hole (11) distribute around stamping workpiece (1).

5. The heat insulating protective structure for an electronic component according to claim 1, wherein: the upper surface and the lower surface of the copper block (2) are flush with the upper surface and the lower surface of the stamping part (1), and the copper block (2) is subjected to anti-oxidation process treatment.

6. The heat insulating protective structure for an electronic component according to claim 1, wherein: the heat insulation film (3) is bonded on the copper block (2) through heat conduction glue, and the heat insulation film (3) is in a layered stacked structure form.