CN214846481U - Display module and electronic equipment - Google Patents
Display module and electronic equipment Download PDFInfo
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- CN214846481U CN214846481U CN202121317675.0U CN202121317675U CN214846481U CN 214846481 U CN214846481 U CN 214846481U CN 202121317675 U CN202121317675 U CN 202121317675U CN 214846481 U CN214846481 U CN 214846481U
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Abstract
The application discloses a display module and electronic equipment, which comprise lower glass, foam, a packaging carrier and a chip; the lower glass is provided with a first surface and a second surface, and the first surface and the second surface are oppositely arranged; the foam is fixed on the first surface of the lower glass; one end of the packaging carrier is fixed on the second surface of the lower glass, and the other end of the packaging carrier is fixed on the foam; the chip is fixed on the packaging carrier, the chip is located between the packaging carrier and the foam, a groove is formed in the position, corresponding to the chip, of the foam, and the chip is embedded in the groove. The application discloses display module assembly and electronic equipment is through setting up the recess on the bubble is cotton for the chip inlays in the recess, has reduced the thickness and the volume of the display module assembly that the bubble is cotton and the chip structure occupies, thereby has reduced electronic equipment's complete machine casing to the dodging space of display module assembly, helps electronic equipment's miniaturized design.
Description
Technical Field
The application belongs to the technical field of electronic products, and particularly relates to a display module and electronic equipment.
Background
With the development of 5G, the power consumption of electronic devices such as mobile phones and tablet computers increases, and endurance becomes a pain point of the electronic devices. In order to meet the increasing demand of users for the battery capacity of electronic devices, the volume of the battery needs to be increased, and the thickness and size of the electronic devices are changed due to the increased volume of the battery. As one of the important devices of electronic equipment, a display screen is designed to be miniaturized, which is a main direction of the electronic equipment.
In the related art, the circuit board structures such as the chip of the Active-matrix organic light-emitting diode (AMOLED) or the Active-matrix organic light-emitting diode (AMOLED) display screen occupy a large volume, so that a large avoiding space needs to be reserved for the whole casing of the electronic device, thereby being not favorable for the miniaturization design of the electronic device.
SUMMERY OF THE UTILITY MODEL
The present application is directed to a display module and an electronic device, which at least solve one of the problems of the related art.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a display module, including:
a lower glass having a first surface and a second surface, the first surface and the second surface being disposed opposite one another;
the foam is fixed on the first surface of the lower glass;
one end of the packaging carrier is fixed on the second surface of the lower glass, and the other end of the packaging carrier is fixed on the foam;
the chip is fixed on the packaging carrier, the chip is located between the packaging carrier and the foam, a groove is formed in the position, corresponding to the chip, of the foam, and the chip is embedded in the groove.
In a second aspect, an embodiment of the present application provides an electronic device, including the above display module.
In the embodiment of this application, through set up the recess on the bubble is cotton for the chip inlays in the recess, has reduced the thickness and the volume of the display module assembly that the bubble is cotton and the chip structure occupies, thereby has reduced electronic equipment's complete machine casing to the dodging space of display module assembly, helps electronic equipment's miniaturized design.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a display module according to some other embodiments of the present disclosure;
fig. 3 is a plan view of fig. 2.
Reference numerals:
in the figure: 1. glass is put; 2. soaking cotton; 201. a groove; 21. first foam; 22. second foam; 3. packaging the carrier; 4. a chip; 5. a support block; 6. a circuit board; 7. glass is coated; 8. frame glue; 9. a polarizer; 10. an optical tape; 11. a cover plate; 12. and (5) hot-pressing the binding area.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
As shown in fig. 1 to 3, an embodiment of the present application provides a display module including a lower glass 1, a foam 2, a package carrier 3, and a chip 4. The display module can be applied to electronic equipment with screens, such as mobile phones, tablet computers, game machines and the like.
Specifically, the lower glass 1 has a first surface and a second surface, the first surface and the second surface being disposed oppositely; the foam is fixed on the first surface of the lower glass 1. As shown in fig. 1 and 2, the first surface refers to the lower surface of the lower glass 1, and the second surface refers to the upper surface of the lower glass 1.
The foam 2 is fixed on the first surface of the lower glass 1. Wherein, bubble cotton 2 has better cushioning effect, and it can effectively protect display module assembly, avoids display module assembly to receive the striking and damage.
More specifically, one end of the packaging carrier 3 is fixed on the second surface of the lower glass 1, and the other end is fixed on the foam 2. The packaging carrier 3 is used for fixing and packaging the chip 4, the circuit board and other structures, has a good fixing effect, and is simple in fixing mode.
The chip 4 is fixed in the packaging carrier 3, the chip 4 is located between the packaging carrier 3 and the foam 2, and the foam 2 can directly protect the chip 4, so that the safety of the display module in the using process is improved. A groove 201 is formed in the position, corresponding to the chip 4, of the foam 2, and the chip 4 is embedded in the groove 201. The chip 4 may be completely embedded in the groove 201, or partially embedded in the groove 201.
Carry out the attenuate design to the corresponding position of bubble cotton 2 and chip 4 for some structures of chip 4 can be inlayed in recess 201, not only help reducing display module's whole thickness, have realized moreover can the accurate positioning chip 4 when assembling display module, have improved the rate of accuracy of display module equipment, also help improving display module's packaging efficiency simultaneously.
The display module assembly that this application embodiment provided, structural design is reasonable, through set up recess 201 on bubble cotton 2 for chip 4 inlays in recess 201, has reduced the thickness and the volume of the display module assembly that bubble cotton 2 and chip 4 isotructures occupy, thereby has reduced electronic equipment's complete machine casing to the dodging space of display module assembly, helps electronic equipment's miniaturized design.
Optionally, the foam 2 comprises a first foam 21 and a second foam 22, and the thickness of the second foam 22 is smaller than that of the first foam 21; first bubble cotton 21 with the adjacent setting of second bubble cotton 22, recess 201 set up in second bubble cotton 21 is close to one side of chip 4. Through the adjacent setting of first bubble cotton 21 and second bubble cotton 22 to make the thickness that second bubble cotton 22 is less than the thickness of first bubble cotton 21, the processing mode is simpler, also is convenient for fix first bubble cotton 21 and second bubble cotton 22 on glass 1 down, is favorable to practicing thrift the processing cost.
Optionally, as shown in fig. 1 and 2, the display module further includes a supporting block 5.
Wherein, the supporting block 5 is arranged between the packaging carrier 3 and the second foam 22. The supporting block 5 is used for supporting, the chip 4 is made of glass and is easy to break due to impact, and the supporting block 5 supports the chip 4 by a certain safety height, so that the chip 4 is effectively prevented from being extruded, and the chip 4 is well protected.
In the embodiment of the present application, in order to reduce the thickness of the display module well, the supporting block 5 may be disposed in the groove 201, so that the supporting block 5 can support the foam 2 and the package carrier 3 for the chip 4 more stably.
In some embodiments, as shown in fig. 1, the top of the support block 5 is bonded to the second foam 22 and the bottom is bonded to the package carrier 3. The top of the supporting block 5 is bonded with the second foam 22 through double-faced adhesive tape, and the bottom is bonded with the packaging carrier 3 through double-faced adhesive tape, so that the fixing mode of the supporting block 5 is very simple, and the supporting block 5 is more stable to be fixed between the second foam 22 and the packaging carrier 3.
Alternatively, as shown in fig. 3, the supporting block 5 has a ring structure with a hollow area, and the chip 4 is located in the hollow area of the supporting block 5. The supporting block 5 with the annular structure can be firmly supported between the packaging carrier 3 and the second foam 22, the chip 4 is arranged in the hollow area, and the periphery of the chip 4 can be supported by the supporting block 5, so that the chip 4 is prevented from being extruded, and the safety of the chip 4 in the using process is improved.
Optionally, the thickness of the second foam 22 is less than half of the thickness of the first foam 21, which makes the groove 201 formed at the second foam 22 have a greater depth, so as to facilitate the chip 4 to be embedded inside the groove 201, thereby effectively reducing the thickness of the display module and facilitating the implementation of the miniaturized design of the electronic device.
Optionally, as shown in fig. 2, the display module further includes: and a wiring board 6. The circuit board 6 is fixed on one side of the package carrier 3 away from the chip 4. Because the area of circuit board 6 is bigger, then the space of the display module that circuit board 6 occupy is bigger, sets up circuit board 6 and chip 4 respectively in the both sides of encapsulation carrier 3, helps reducing circuit board 6 and chip 4 and along the planar direction of display module to the occupation of the inner space of display module, helps reducing circuit board 6 and chip 4 and occupies the area of display module to help electronic equipment's miniaturized design.
Optionally, the circuit board 6 extends from one end of the package carrier 3 fixed on the foam 2 to a direction close to the chip 4. This makes circuit board 6 can make full use of the area of the one side of keeping away from chip 4 of encapsulation carrier 3, helps chip 4 and circuit board 6 to carry out more optimized overall arrangement on encapsulation carrier 3, and the structure is more reasonable, has reduced electronic equipment's complete machine casing to the dodging space of display module assembly to help electronic equipment's miniaturized design.
Optionally, the display module further comprises an anisotropic conductive film, and the circuit board 6 is fixed to the package carrier 3 through the anisotropic conductive film by hot pressing.
The circuit board 6 is fixed on the packaging carrier 3 through the anisotropic conductive adhesive film in a hot-pressing mode, the fixing mode is simple, stable connection between the circuit board 6 and the packaging carrier 3 is facilitated, and the circuit board 6 is protected better. The area where the circuit board 6 is fixed on the package carrier 3 by hot pressing through the anisotropic conductive film is a hot-pressed binding area 12, and the hot-pressed binding area 12 enables the circuit board 6 to be firmly fixed on the package carrier 3.
In one embodiment, referring to fig. 1 and 2, the display module further includes a top glass 7 and a sealant 8. The upper glass 7 is bonded on the second surface of the lower glass 1 through the frame glue 8, and the frame glue only fixes the peripheries of the lower glass 1 and the upper glass 7, so that the central areas of the lower glass 1 and the upper glass 7 can display normally, the lower glass 1 and the upper glass 7 can be effectively fixed, and the function of the display module is not influenced.
As shown in fig. 1, the upper glass 7 is located on the upper side of the lower glass 1, and the lower glass 1 and the upper glass 7 are connected through a rubber frame, so that the fixation between the lower glass 1 and the upper glass 7 is more stable.
Optionally, the electronic device further comprises a cover plate 11, and the cover plate 11 is disposed on a side of the upper glass 7 far away from the lower glass 1. The cover plate 11 can protect the upper glass 7 well.
In an exemplary embodiment, the display module further includes a polarizer 9 and an optical adhesive tape 10, the polarizer 9 is disposed on the surface of the upper glass 7 far away from the lower glass 1, the optical adhesive tape 10 is disposed on the surface of the polarizer 9 far away from the upper glass 7, and the cover plate 11 covers the upper surface of the optical adhesive tape 10. The cover plate 11 may be a glass cover plate. This makes the display module assembly have compacter structure, helps guaranteeing the functional well of display module assembly.
In addition, an embodiment of the present application provides an electronic device, which includes the display module described above. The electronic equipment has the advantages that the internal structure design is very reasonable, the size of the display module can be further reduced, the size reduction of the electronic equipment is facilitated, and the miniaturization design of the electronic equipment is facilitated.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A display module, comprising:
a lower glass having a first surface and a second surface, the first surface and the second surface being disposed opposite one another;
the foam is fixed on the first surface of the lower glass;
one end of the packaging carrier is fixed on the second surface of the lower glass, and the other end of the packaging carrier is fixed on the foam;
the chip is fixed on the packaging carrier, the chip is located between the packaging carrier and the foam, a groove is formed in the position, corresponding to the chip, of the foam, and the chip is embedded in the groove.
2. The display module of claim 1,
the foam comprises a first foam and a second foam, and the thickness of the second foam is smaller than that of the first foam;
the first bubble is cotton with the second bubble is cotton adjacent to be set up, the recess set up in the second bubble is cotton be close to one side of chip.
3. The display module of claim 2, further comprising:
and the supporting block is arranged between the packaging carrier and the second foam.
4. The display module assembly of claim 3, wherein the supporting block is a ring structure having a hollow area, and the chip is located in the hollow area of the supporting block.
5. The display module of claim 1, further comprising:
the circuit board is fixed on one side, far away from the chip, of the packaging carrier.
6. The display module of claim 5, wherein the circuit board extends from an end of the package carrier fixed to the foam toward a direction near the chip.
7. The display module of claim 5, further comprising:
and the circuit board is fixed on the packaging carrier through the anisotropic conductive film in a hot-pressing manner.
8. The display module of claim 7, further comprising:
the upper glass is bonded to the second surface of the lower glass through the frame glue.
9. The display module of claim 8, further comprising:
the cover plate is arranged on one side, far away from the lower glass, of the upper glass in a covering mode.
10. An electronic device, comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121317675.0U CN214846481U (en) | 2021-06-11 | 2021-06-11 | Display module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121317675.0U CN214846481U (en) | 2021-06-11 | 2021-06-11 | Display module and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN214846481U true CN214846481U (en) | 2021-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121317675.0U Active CN214846481U (en) | 2021-06-11 | 2021-06-11 | Display module and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114338877A (en) * | 2021-12-30 | 2022-04-12 | 维沃移动通信有限公司 | Electronic device |
| CN114613262A (en) * | 2022-02-18 | 2022-06-10 | 维沃移动通信有限公司 | Electronic device |
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2021
- 2021-06-11 CN CN202121317675.0U patent/CN214846481U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114338877A (en) * | 2021-12-30 | 2022-04-12 | 维沃移动通信有限公司 | Electronic device |
| CN114338877B (en) * | 2021-12-30 | 2024-02-27 | 维沃移动通信有限公司 | Electronic equipment |
| CN114613262A (en) * | 2022-02-18 | 2022-06-10 | 维沃移动通信有限公司 | Electronic device |
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