CN214843647U - Infrared induction module for remote sensing device - Google Patents
Infrared induction module for remote sensing device Download PDFInfo
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- CN214843647U CN214843647U CN202121260331.0U CN202121260331U CN214843647U CN 214843647 U CN214843647 U CN 214843647U CN 202121260331 U CN202121260331 U CN 202121260331U CN 214843647 U CN214843647 U CN 214843647U
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Abstract
The utility model relates to an infrared induction module technical field, concretely relates to infrared induction module for remote sensing device, including the device main part, the inside of device main part is provided with infrared sensor, and a plurality of louvres have been seted up to the surface of device main part, and infrared sensor's inside is provided with the fin, and the louvre is the setting of annular array form. The utility model overcomes prior art's is not enough, through setting up fin and louvre, when infrared induction module is carrying out the during operation for a long time, the accessible fin absorbs the inside heat of infrared sensor and gives off the heat to infrared sensor's the outside, a plurality of louvres have been seted up through the surface at the device main part afterwards, thereby make the heat discharge from the louvre again, effectually dispel the heat to infrared sensor, in order to avoid infrared sensor to be difficult to discharge and lead to inside temperature to rise and influence infrared sensor's performance after carrying out work for a long time the heat that produces.
Description
Technical Field
The utility model relates to an infrared induction module technical field specifically is an infrared induction module for remote sensing device.
Background
The infrared sensor is a sensor which can sense infrared rays radiated by a target, can measure by utilizing physical properties of the infrared rays, can be divided into a photon detector and a heat detector according to a detection mechanism, and has been widely applied to the fields of modern science and technology, national defense, industry and agriculture and the like.
However, in the actual use process of the existing infrared sensing module, after the infrared sensor works for a long time, internal elements such as thermoelectric elements, diodes and the like are easy to generate a large amount of heat, and the inside of the infrared sensor is in a closed state, so that the heat of the infrared sensor is difficult to dissipate after the infrared sensor works for a long time to cause the internal temperature to rise, and the use performance of the infrared sensor is easy to influence; simultaneously, current infrared induction module is at the in-service use in-process, thereby when needs are installed infrared sensor or are dismantled and overhaul, because it is more complicated to be connected between infrared sensor and the shell for need spend certain time when overhauing infrared sensor, staff's maintenance efficiency has been reduced.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects of the prior art, the utility model provides an infrared sensing module for a remote sensing device, which overcomes the defects of the prior art, has simple structural design, effectively solves the problem that the prior infrared sensing module is in the actual use process, because the infrared sensor works for a long time, the internal thermoelectric element, the diode and other elements are easy to generate a large amount of heat, and the internal part of the infrared sensor is in a closed state, the heat is difficult to dissipate after the infrared sensor works for a long time, so that the internal temperature is increased, and the service performance of the infrared sensor is easy to be influenced; simultaneously, current infrared induction module is at the in-service use in-process, thereby when needs are installed infrared sensor or are dismantled and overhaul, because it is more complicated to be connected between infrared sensor and the shell for need spend certain time when overhauing infrared sensor, reduced staff's maintenance efficiency's problem.
In order to solve the technical problem, the utility model provides a following technical scheme:
an infrared sensing module for a remote sensing device comprises a device main body, an infrared sensor is arranged in the device main body,
a plurality of heat dissipation holes are formed in the outer surface of the device main body;
a radiating fin is arranged inside the infrared sensor;
the radiating holes are arranged in an annular array shape, and the area of each radiating fin is larger than that of each radiating hole.
Preferably, the bottom of the infrared sensor is connected with a pin, a circuit element is arranged inside the infrared sensor, an FET tube is arranged on the top of the circuit element, a thermoelectric element is arranged on the top of the FET tube, a support ring is mounted on the bottom of the thermoelectric element, and an optical filter is arranged on the top of the thermoelectric element.
Preferably, the top of the infrared sensor is provided with a shell, the top of the shell is provided with a window, the inside of the shell is provided with a radiating fin, the window is positioned right above the optical filter, and the area of the window is smaller than that of the optical filter.
Preferably, a lampshade is installed at the top of the device main body and located right above the infrared sensor, and the area of the lampshade is larger than that of the window.
Preferably, the base is installed to the bottom of device main part, the inside of base is provided with the circuit board, the top of circuit board is provided with a plurality of contacts, the bottom of circuit board is connected with the electric wire, just the contact links to each other with the pin.
Preferably, openings are formed in two sides of the top of the base, an annular groove is formed in the base, and the annular groove is communicated with the openings.
Preferably, the inside of device main part is provided with the buffering cotton, the surface mounting of device main part has the slider, just the device main part passes through slider and ring channel sliding connection, slider and ring channel in close contact with.
Preferably, the buffering cotton is in contact with the outer surface of the infrared sensor, and the area of the buffering cotton is larger than that of the infrared sensor.
The embodiment of the utility model provides an infrared induction module for remote sensing device possesses following beneficial effect: through the inside at infrared sensor is provided with the fin, thereby make the fin can effectually absorb the heat that infrared sensor during operation produced, give off the heat to infrared sensor's outside afterwards, in order to avoid infrared sensor to be difficult to discharge and lead to inside temperature rising and influence infrared sensor's performance after long-time working, and cotton through setting up the buffering, in order to protect infrared sensor through the buffering cotton, make infrared sensor buffering cotton can carry out effectual shock attenuation buffering when producing vibrations or receiving the impact, infrared sensor's life has been improved, and make the heat that infrared sensor produced also can be through buffering cotton.
1. Through setting up fin and louvre, when infrared induction module is carrying out the during operation for a long time, the accessible fin absorbs the inside heat of infrared sensor and gives off the heat to infrared sensor's the outside, a plurality of louvres have been seted up through the surface at the device main part afterwards, thereby make the heat discharge from the louvre again, effectually dispel the heat to infrared sensor, in order to avoid infrared sensor to be difficult to discharge and lead to inside temperature to rise and influence infrared sensor's performance after carrying out the work for a long time the heat that produces.
2. Through setting up the opening, ring channel and slider, after being connected infrared sensor and circuit board, the staff accessible aligns the opening position department at base top with the slider of device main part surface both sides, make the slider install inside the ring channel again, rethread rotating device main part afterwards, make the device main part drive the slider at the ring channel internal rotation, and through slider and ring channel looks in close contact with, it is not hard up between with avoiding device main part and the base, thereby make very convenient when carrying out the dismouting to the device main part, and then improved the maintenance efficiency to infrared sensor.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural diagram of the infrared sensor of the present invention;
fig. 3 is a schematic view of the internal structure of the infrared sensor of the present invention;
FIG. 4 is a schematic view of the internal structure of the base of the present invention;
fig. 5 is an enlarged schematic view of a portion a in fig. 4 according to the present invention.
In the figure: 1. a device main body; 101. heat dissipation holes; 102. a slider; 2. a base; 201. an opening; 202. an annular groove; 3. a lamp shade; 4. an electric wire; 5. a housing; 501. a window; 6. an infrared sensor; 601. a pin; 602. a circuit element; 603. an FET tube; 604. a thermoelectric element; 605. an optical filter; 606. a support ring; 7. a circuit board; 701. a contact; 8. buffering cotton; 9. and a heat sink.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Example (b): as shown in fig. 1 to 5, an infrared sensing module for a remote sensing device includes a device body 1, an infrared sensor 6 is provided inside the device body 1,
a plurality of heat dissipation holes 101 are formed in the outer surface of the device body 1;
a radiating fin 9 is arranged inside the infrared sensor 6;
the heat dissipation holes 101 are arranged in an annular array, and the area of the heat dissipation fins 9 is larger than that of the heat dissipation holes 101.
The bottom of the infrared sensor 6 is connected with a pin 601, a circuit element 602 is arranged inside the infrared sensor 6, the top of the circuit element 602 is provided with an FET tube 603, the top of the FET tube 603 is provided with a thermoelectric element 604, the bottom of the thermoelectric element 604 is provided with a support ring 606, and the top of the thermoelectric element 604 is provided with a filter 605;
in this embodiment, with such a design, the heat inside the infrared sensor 6 can be absorbed by the heat sink 9 and dissipated to the outside of the infrared sensor 6, and then the heat is exhausted from the heat dissipating holes 101 by forming the heat dissipating holes 101 on the outer surface of the device body 1, and after the circuit is connected, when the infrared sensor 6 operates, the circuit signal passes through the circuit element 602, the circuit element 602 transmits the signal to the FET 603, the FET 603 transmits the signal to the heat dissipating infrared ray of the thermoelectric element 604, and the emitted light is filtered by the optical filter 605.
The top of the infrared sensor 6 is provided with a shell 5, the top of the shell 5 is provided with a window 501, a radiating fin 9 is arranged inside the shell 5, the window 501 is positioned right above the optical filter 605, and the area of the window 501 is smaller than that of the optical filter 605;
in this embodiment, the infrared sensor 6 can be protected by the housing 5, and light can be emitted through the filter 605 and the window 501 when the infrared sensor 6 operates.
The top of the device main body 1 is provided with a lampshade 3, the lampshade 3 is positioned right above the infrared sensor 6, and the area of the lampshade 3 is larger than that of the window 501;
in this embodiment, through this kind of design to protect infrared sensor 6 through lamp shade 3, and make infrared sensor 6 can pass through window 501 and lamp shade 3 at the during operation light, thereby make infrared sensor 6 respond to the detection.
The device comprises a device body 1, a base 2, a circuit board 7, a plurality of contacts 701, wires 4 and pins 601, wherein the base 2 is installed at the bottom of the device body 1, the circuit board 7 is arranged inside the base 2, the plurality of contacts 701 are arranged at the top of the circuit board 7, and the contacts 701 are connected with the pins 601;
in this embodiment, by such a design, the pin 601 at the bottom of the infrared sensor 6 is connected to the contact 701 at the top of the circuit board 7, so that the infrared sensor 6 is connected to the circuit board 7, and the infrared sensor 6 is operated after the wire 4 is connected.
Wherein, both sides of the top of the base 2 are provided with openings 201, the inside of the base 2 is provided with an annular groove 202, and the annular groove 202 is communicated with the openings;
in this embodiment, through this design, the sliding block 102 on the outer surface of the device main body 1 is aligned with the opening 201, so that the sliding block 102 is installed in the annular groove 202, and the device main body 1 and the base 2 are conveniently detached by a worker.
Wherein, the inside of device main part 1 is provided with the buffer cotton 8, and the surface mounting of device main part 1 has slider 102, and device main part 1 passes through slider 102 and ring channel 202 sliding connection, slider 102 and ring channel 202 in close contact with.
In this embodiment, by such a design, when the device main body 1 and the base 2 are connected, the device main body 1 and the base 2 can be connected by aligning the slider 102 with the annular groove 202 and rotating the slider 102 in the annular groove 202, and at the same time, the slider 102 is in close contact with the annular groove 202, which improves the stability of the device main body 1.
Wherein, the buffer cotton 8 contacts with the outer surface of the infrared sensor 6, and the area of the buffer cotton 8 is larger than that of the infrared sensor 6.
In this embodiment, through this kind of design to protect infrared sensor 6 through buffering cotton 8, make infrared sensor 6 when producing vibrations or receiving the impact buffering cotton 8 can carry out effectual shock attenuation buffering, improved infrared sensor 6's life, and make the heat that infrared sensor 6 produced also accessible buffering cotton 8.
The working principle is as follows: firstly, after the infrared sensor 6 is connected with the circuit board 7, a worker can align the sliding blocks 102 on two sides of the outer surface of the device body 1 to the position of the opening 201 on the top of the base 2, then install the sliding blocks 102 into the annular groove 202, then rotate the device body 1, drive the sliding blocks 102 to rotate in the annular groove 202 by the device body 1, and tightly contact with the annular groove 202 through the sliding blocks 102 to avoid looseness between the device body 1 and the base 2, so that the device body 1 can be assembled and disassembled conveniently, the overhaul efficiency of the infrared sensor 6 is improved, meanwhile, when the infrared sensing module works for a long time, the heat inside the infrared sensor 6 can be absorbed through the radiating fins 9 and radiated to the outer side of the infrared sensor 6, and then the outer surface of the device body 1 is provided with a plurality of radiating holes 101, therefore, heat is discharged from the heat dissipation hole 101, the infrared sensor 6 is effectively cooled, and the situation that the internal temperature is increased and the use performance of the infrared sensor 6 is affected due to the fact that the heat generated by the infrared sensor 6 after long-time work is difficult to discharge is avoided.
Finally, it should be noted that: in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides an infrared induction module for remote sensing device, includes device main part (1), the inside of device main part (1) is provided with infrared sensor (6), its characterized in that:
a plurality of heat dissipation holes (101) are formed in the outer surface of the device main body (1);
a radiating fin (9) is arranged inside the infrared sensor (6);
the radiating holes (101) are arranged in an annular array, and the area of the radiating fin (9) is larger than that of the radiating holes (101).
2. The infrared sensing module for a remote sensing device of claim 1, wherein: the bottom of the infrared sensor (6) is connected with a pin (601), a circuit element (602) is arranged inside the infrared sensor (6), an FET tube (603) is arranged on the top of the circuit element (602), a thermoelectric element (604) is arranged on the top of the FET tube (603), a support ring (606) is arranged on the bottom of the thermoelectric element (604), and a filter (605) is arranged on the top of the thermoelectric element (604).
3. The infrared sensing module for a remote sensing device of claim 1, wherein: the infrared sensor is characterized in that a shell (5) is installed at the top of the infrared sensor (6), a window (501) is arranged at the top of the shell (5), radiating fins (9) are arranged inside the shell (5), the window (501) is located right above the optical filter (605), and the area of the window (501) is smaller than that of the optical filter (605).
4. The infrared sensing module for a remote sensing device of claim 1, wherein: the lamp shade (3) is installed at the top of the device main body (1), the lamp shade (3) is located right above the infrared sensor (6), and the area of the lamp shade (3) is larger than that of the window (501).
5. The infrared sensing module for a remote sensing device of claim 1, wherein: base (2) are installed to the bottom of device main part (1), the inside of base (2) is provided with circuit board (7), the top of circuit board (7) is provided with a plurality of contacts (701), the bottom of circuit board (7) is connected with electric wire (4), just contact (701) link to each other with pin (601).
6. The infrared sensing module for a remote sensing device of claim 5, wherein: openings (201) are formed in two sides of the top of the base (2), an annular groove (202) is formed in the base (2), and the annular groove (202) is communicated with the openings.
7. The infrared sensing module for a remote sensing device of claim 1, wherein: the device is characterized in that buffering cotton (8) is arranged inside the device main body (1), a sliding block (102) is installed on the outer surface of the device main body (1), the device main body (1) is in sliding connection with the annular groove (202) through the sliding block (102), and the sliding block (102) is in close contact with the annular groove (202).
8. The infrared sensing module for a remote sensing device of claim 7, wherein: the buffer cotton (8) is in contact with the outer surface of the infrared sensor (6), and the area of the buffer cotton (8) is larger than that of the infrared sensor (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121260331.0U CN214843647U (en) | 2021-06-07 | 2021-06-07 | Infrared induction module for remote sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121260331.0U CN214843647U (en) | 2021-06-07 | 2021-06-07 | Infrared induction module for remote sensing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214843647U true CN214843647U (en) | 2021-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121260331.0U Active CN214843647U (en) | 2021-06-07 | 2021-06-07 | Infrared induction module for remote sensing device |
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| Country | Link |
|---|---|
| CN (1) | CN214843647U (en) |
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2021
- 2021-06-07 CN CN202121260331.0U patent/CN214843647U/en active Active
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