CN214830057U - High-precision component transfer film - Google Patents
High-precision component transfer film Download PDFInfo
- Publication number
- CN214830057U CN214830057U CN202023218509.3U CN202023218509U CN214830057U CN 214830057 U CN214830057 U CN 214830057U CN 202023218509 U CN202023218509 U CN 202023218509U CN 214830057 U CN214830057 U CN 214830057U
- Authority
- CN
- China
- Prior art keywords
- layer
- base material
- film
- monomer
- hard base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a high accuracy subassembly transfer membrane, include: the protective film monomer comprises a hard base material monomer layer and a strong adhesive layer covering the edge of the lower surface of the hard base material monomer layer, wherein the central area of the strong adhesive layer is a hollow area; hard substrate monomer layer and from the bonding of type membrane through strong gluing layer, hard substrate monomer layer one end has one and draws the ear, and this draws ear and hard substrate monomer layer junction to have a score line, draw the ear to turn over to the outside along the score line. The utility model discloses high accuracy subassembly transfer membrane had both avoided the protection film monomer less, led to a large amount of protection film monomers to be difficult to deposit and shift, also the person of facilitating the use gets puts the protection film monomer to work efficiency has been improved.
Description
Technical Field
The utility model relates to a high accuracy subassembly transfer membrane belongs to consumer electronics processing technology field.
Background
The protective film is widely applied to the production process and use of mobile phones, panels and electronic components, the electronic components are generally small and exquisite parts, the produced electronic components need to be packaged and then conveyed to other production lines for assembly, the electronic components are fragile, if the electronic components are not packaged well, damage is easily caused in the transportation process, a large amount of waste is caused, the production cost is increased, and therefore the general electronic components need to be attached to the protective film before leaving a factory. When electronic components are used for assembly, the protective adhesive film needs to be removed, so that the protective adhesive film is required to be quickly adhered and conveniently removed.
Disclosure of Invention
The utility model aims at providing a high accuracy subassembly transfer membrane, this high accuracy subassembly transfer membrane had both avoided the protection film monomer less, led to a large amount of protection film monomers to be difficult to deposit and shift, and also the person of facilitating the use gets puts the protection film monomer to work efficiency has been improved.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a high precision component transfer film comprising: the protective film monomer comprises a hard base material monomer layer and a strong adhesive layer covering the edge of the lower surface of the hard base material monomer layer, wherein the central area of the strong adhesive layer is a hollow area;
hard substrate monomer layer and from the bonding of type membrane through strong gluing layer, hard substrate monomer layer one end has one and draws the ear, and this draws ear and hard substrate monomer layer junction to have a score line, draw the ear to turn over to the outside along the score line.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the hard base material monomer layer of the protective film monomer is a PET base material layer or a PVC base material layer.
2. In the above scheme, the release film is an organic silicon release film or a non-silicon release film.
3. In the above scheme, the shape of the protection film monomer is rectangular.
4. In the above aspect, the thickness of the hard base material monomer layer is 50 to 150 μm.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses high accuracy subassembly transfer membrane, its a plurality of protection film monomer set up in same from the type membrane, stereoplasm substrate monomer layer bonds through strong gluing layer with from the type membrane, has both avoided the protection film monomer less, leads to a large amount of protection film monomers to be difficult to deposit and shift to convenient transfer and use; in addition, its one end that is located the stereoplasm substrate monomer layer on the release liner has one and draws the ear, and this draws ear and stereoplasm substrate monomer layer junction to have a score line, draw the ear to turn over to the outside along the score line, the person of facilitating the use gets and puts the protection film monomer to work efficiency has been improved.
Drawings
FIG. 1 is a schematic structural view of the high-precision component transfer film of the present invention;
FIG. 2 is a schematic sectional view taken along line A-A of FIG. 1.
In the above drawings: 1. a release film; 3. a protective film monomer; 31. a hard base material monomer layer; 32. a strong adhesive layer; 4. a hollow-out area; 5. and pulling the ear part.
Detailed Description
Example 1: a high precision component transfer film comprising: the protective film comprises a release film 1 and a plurality of protective film monomers 3 positioned on the release film 1, wherein the protective film monomers 3 are arranged on the release film 1 at intervals, each protective film monomer 3 comprises a hard base material monomer layer 31 and a strong adhesive layer 32 covering the edge of the lower surface of the hard base material monomer layer 31, and the central area of the strong adhesive layer 32 is a hollow area 4;
the hard base material monomer layer 31 is bonded with the release film 1 through the strong adhesive layer 32, one end of the hard base material monomer layer 31 is provided with a tab part 5, the joint of the tab part 5 and the hard base material monomer layer 31 is provided with a score line, and the tab part 5 is folded towards the outside along the score line.
The hard base material monomer layer 31 of the protective film monomer 3 is a PET base material layer.
The release film 1 is a silicone release film, and the thickness of the hard base material monomer layer 31 is 120 μm.
Example 2: a high precision component transfer film comprising: the protective film comprises a release film 1 and a plurality of protective film monomers 3 positioned on the release film 1, wherein the protective film monomers 3 are arranged on the release film 1 at intervals, each protective film monomer 3 comprises a hard base material monomer layer 31 and a strong adhesive layer 32 covering the edge of the lower surface of the hard base material monomer layer 31, and the central area of the strong adhesive layer 32 is a hollow area 4;
the hard base material monomer layer 31 is bonded with the release film 1 through the strong adhesive layer 32, one end of the hard base material monomer layer 31 is provided with a tab part 5, the joint of the tab part 5 and the hard base material monomer layer 31 is provided with a score line, and the tab part 5 is folded towards the outside along the score line.
The hard base material monomer layer 31 of the protective film monomer 3 is a PVC base material layer.
The release film 1 is a non-silicon release film, and the protective film monomer 3 is rectangular.
The thickness of the hard base material monomer layer 31 was 80 μm.
When the high-precision assembly transfer film is adopted, a plurality of protective film monomers are arranged on the same release film, and the hard base material monomer layer is bonded with the release film through the strong adhesive layer, so that the situation that a large number of protective film monomers are difficult to store and transfer due to small protective film monomers is avoided, and the transfer and the use are convenient; in addition, its one end that is located the stereoplasm substrate monomer layer on the release film has one and draws the ear, and this draws ear and stereoplasm substrate monomer layer junction to have a score line, draw the ear to turn over to the outside along the score line, both avoided because protection film monomer size is less, lead to a large amount of protection film monomers to be difficult to deposit and shift, also the person of facilitating the use gets puts the protection film monomer to work efficiency has been improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. A high accuracy subassembly transfer film which characterized in that: the method comprises the following steps: the protective film comprises a release film (1) and a plurality of protective film monomers (3) positioned on the release film (1), wherein the protective film monomers (3) are arranged on the release film (1) at intervals, the protective film monomers (3) comprise a hard base material monomer layer (31) and a strong adhesive layer (32) covering the edge of the lower surface of the hard base material monomer layer (31), and the central area of the strong adhesive layer (32) is a hollow area (4);
the hard base material monomer layer (31) is bonded with the release film (1) through the strong adhesive layer (32), one end of the hard base material monomer layer (31) is provided with a tab part (5), the joint of the tab part (5) and the hard base material monomer layer (31) is provided with a score line, and the tab part (5) is folded towards the outer side along the score line.
2. The high precision assembly transfer film of claim 1, wherein: and the hard base material monomer layer (31) of the protective film monomer (3) is a PET base material layer or a PVC base material layer.
3. The high precision assembly transfer film of claim 1, wherein: the release film (1) is an organic silicon release film or a non-silicon release film.
4. The high precision assembly transfer film of claim 1, wherein: the shape of the protective film monomer (3) is rectangular.
5. The high precision assembly transfer film of claim 1, wherein: the thickness of the hard base material monomer layer (31) is 50 to 150 [ mu ] m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023218509.3U CN214830057U (en) | 2020-12-28 | 2020-12-28 | High-precision component transfer film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023218509.3U CN214830057U (en) | 2020-12-28 | 2020-12-28 | High-precision component transfer film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214830057U true CN214830057U (en) | 2021-11-23 |
Family
ID=78869757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023218509.3U Active CN214830057U (en) | 2020-12-28 | 2020-12-28 | High-precision component transfer film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214830057U (en) |
-
2020
- 2020-12-28 CN CN202023218509.3U patent/CN214830057U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2008129976A1 (en) | Method for manufacturing chip with adhesive | |
| EP1122776A3 (en) | Process for producing semiconductor chip | |
| CN110969945B (en) | Support film, flexible display module and preparation method thereof | |
| TW200727446A (en) | Stack type semiconductor device manufacturing method and stack type electronic component manufacturing method | |
| CN105428339A (en) | Antistatic fingerprint sensor chip packaging structure and manufacturing method | |
| CN214830057U (en) | High-precision component transfer film | |
| WO2009078203A1 (en) | Multilayered pressure-sensitive adhesive sheet and process for producing electronic part with multilayered pressure-sensitive adhesive sheet | |
| CN211088067U (en) | Wireless charging module positioning pad | |
| CN214218634U (en) | Process protective film for electronic product | |
| CN103855324A (en) | Method for taking out flexible element and method for separating substrates | |
| CN214218632U (en) | Electronic protection pad pasting | |
| CN214270746U (en) | High-efficiency component transfer film | |
| CN214218633U (en) | Protective film for electronic product | |
| CN214218640U (en) | High-reliability assembly film | |
| CN205942189U (en) | Liquid crystal module | |
| CN214218621U (en) | Double-sided foam adhesive component | |
| CN205621711U (en) | A supporting component for bearing weight of wafer | |
| CN209748922U (en) | Internal device applied to flexible circuit board | |
| CN210151014U (en) | Foam adhesive tape | |
| CN214270750U (en) | Assembly component for electronic product | |
| CN114686132A (en) | Foam gluing component for electronic product | |
| CN217061273U (en) | PET shrink label capable of being gilded | |
| CN215947175U (en) | Flexible inner anti-explosion membrane for 3D curved surface stripping | |
| CN110910763B (en) | Preparation method of flexible display device | |
| CN220569157U (en) | Capacitive touch film structure for protecting film material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |