CN214218634U - Process protective film for electronic product - Google Patents
Process protective film for electronic product Download PDFInfo
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- CN214218634U CN214218634U CN202023219777.7U CN202023219777U CN214218634U CN 214218634 U CN214218634 U CN 214218634U CN 202023219777 U CN202023219777 U CN 202023219777U CN 214218634 U CN214218634 U CN 214218634U
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Abstract
The utility model discloses a processing procedure protection film for electronic product, include: the protective film comprises a release film, a micro-mucous membrane and a plurality of protective film monomers positioned between the release film and the micro-mucous membrane, wherein the protective film monomers are arranged on the release film at intervals, the micro-mucous membrane comprises a soft base material layer and a weak adhesive layer, the weak adhesive layer is coated on the surface of the soft base material layer contacted with the protective film monomers, the hard base material monomer layer is bonded with the release film through the strong adhesive layer, and the soft base material layer is bonded with the upper surface of the hard base material monomer layer through the weak adhesive layer; the hard base material monomer layer has a tab portion at one end, and the joint of the tab portion and the hard base material monomer layer has a score line. The utility model discloses the processing procedure protection film for the electronic product has avoided the protection film monomer not enough transferring or using to drop easily, prevents to draw the ear from type membrane upwarping to convenient packing, transfer and use.
Description
Technical Field
The utility model relates to a processing procedure protection film for electronic product belongs to consumer electronics processing technology field.
Background
The protective film is widely applied to the production process and use of mobile phones, panels and electronic components, the electronic components are generally small and exquisite parts, the produced electronic components need to be packaged and then conveyed to other production lines for assembly, the electronic components are fragile, if the electronic components are not packaged well, damage is easily caused in the transportation process, a large amount of waste is caused, the production cost is increased, and therefore the general electronic components need to be attached to the protective film before leaving a factory. When electronic components are used for assembly, the protective adhesive film needs to be removed, so that the protective adhesive film is required to be quickly adhered and conveniently removed.
Disclosure of Invention
The utility model aims at providing a processing procedure protection film for electronic product, this processing procedure protection film for electronic product have avoided the protection film monomer not enough transferring or using to drop easily, prevent to draw ear portion from the perk on the release film to convenient packing, transfer and use.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a process protection film for electronic products comprises: the protective film comprises a release film, a micro-mucous membrane and a plurality of protective film monomers positioned between the release film and the micro-mucous membrane, wherein the protective film monomers are arranged on the release film at intervals, each protective film monomer comprises a hard base material monomer layer and a strong adhesive layer covering the edge of the lower surface of the hard base material monomer layer, and the central area of the strong adhesive layer is a hollow area;
the micro-adhesive film comprises a soft base material layer and a weak adhesive layer, the weak adhesive layer is coated on the surface of the soft base material layer contacted with the protective film monomer, the hard base material monomer layer is bonded with the release film through the strong adhesive layer, and the soft base material layer is bonded with the upper surface of the hard base material monomer layer through the weak adhesive layer;
the hard base material monomer layer is provided with a pulling lug part at one end, the joint of the pulling lug part and the hard base material monomer layer is provided with a cutting line, and the pulling lug part is folded outwards along the cutting line and is positioned between the hard base material monomer layer and the micro mucous membrane.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the hard substrate layer of the protective film monomer is a PET substrate layer or a PVC substrate layer.
2. In the above scheme, the soft substrate layer of the micro-mucosa is a PE substrate layer or a PP substrate layer.
3. In the above scheme, the release film is an organic silicon release film or a non-silicon release film.
4. In the above scheme, the shape of the protection film monomer is rectangular.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses processing procedure protection film for electronic product, its a plurality of protection film monomer set up in same from the type membrane, and a plurality of protection film monomer are located the micro-mucous membrane and from between the type membrane at interval, and the micro-mucous membrane is by soft substrate layer and weak gluing layer, and this weak gluing layer coats in the surface that soft substrate layer and protection film monomer contacted, stereoplasm substrate monomer layer bonds through strong gluing layer with from the type membrane, soft substrate layer bonds through weak gluing layer with stereoplasm substrate monomer layer upper surface, has both avoided the protection film monomer less, leads to a large amount of protection film monomers to be difficult to deposit and shift, has also avoided the protection film monomer to shift or use the easy not enough that drops, thereby conveniently shifts and uses; in addition, its stereoplasm base material monomer layer one end has one and draws ear, and this draws ear and stereoplasm base material monomer layer junction to have a score line, draw ear to turn over along the score line to the outside and lie in stereoplasm base material monomer layer and between the little mucous membrane, prevent to draw ear to upwarp and avoided droing on the release film, also the person of facilitating the use gets and puts the protection film monomer to work efficiency has been improved.
Drawings
FIG. 1 is a schematic structural view of the process protection film for electronic products of the present invention;
FIG. 2 is a schematic sectional view taken along line A-A of FIG. 1.
In the above drawings: 1. a release film; 2. a micro-mucosa; 21. a soft substrate layer; 22. a weak adhesive layer; 3. a protective film monomer; 31. a hard base material monomer layer; 32. a strong adhesive layer; 4. a hollow-out area; 5. pulling the lug part; 6. a score line.
Detailed Description
Example 1: a process protection film for electronic products comprises: the release film comprises a release film 1, a micro-mucous membrane 2 and a plurality of protective film monomers 3 positioned between the release film 1 and the micro-mucous membrane 2, wherein the protective film monomers 3 are arranged on the release film 1 at intervals, the protective film monomers 3 comprise a hard base material monomer layer 31 and a strong adhesive layer 32 covering the edge of the lower surface of the hard base material monomer layer 31, and the central area of the strong adhesive layer 32 is a hollow area 4;
the micro-mucosa 2 is composed of a soft substrate layer 21 and a weak adhesive layer 22, the weak adhesive layer 22 is coated on the surface of the soft substrate layer 21 contacted with the protective film monomer 3, the hard substrate monomer layer 31 is bonded with the release film 1 through a strong adhesive layer 32, and the upper surfaces of the soft substrate layer 21 and the hard substrate monomer layer 31 are bonded through the weak adhesive layer 22;
the hard base material monomer layer 31 has a tab portion 5 at one end, the connection between the tab portion 5 and the hard base material monomer layer 31 has a cut line 6, and the tab portion 5 is folded outwards along the cut line 6 and is located between the hard base material monomer layer 31 and the micro adhesive film 2.
The hard base material monomer layer 31 of the protective film monomer 3 is a PET base material layer.
The soft substrate layer 21 of the micro-mucosa 2 is a PP substrate layer.
The release film 1 is an organic silicon release film, and the protective film monomer 3 is rectangular.
Example 2: a process protection film for electronic products comprises: the release film comprises a release film 1, a micro-mucous membrane 2 and a plurality of protective film monomers 3 positioned between the release film 1 and the micro-mucous membrane 2, wherein the protective film monomers 3 are arranged on the release film 1 at intervals, the protective film monomers 3 comprise a hard base material monomer layer 31 and a strong adhesive layer 32 covering the edge of the lower surface of the hard base material monomer layer 31, and the central area of the strong adhesive layer 32 is a hollow area 4;
the micro-mucosa 2 is composed of a soft substrate layer 21 and a weak adhesive layer 22, the weak adhesive layer 22 is coated on the surface of the soft substrate layer 21 contacted with the protective film monomer 3, the hard substrate monomer layer 31 is bonded with the release film 1 through a strong adhesive layer 32, and the upper surfaces of the soft substrate layer 21 and the hard substrate monomer layer 31 are bonded through the weak adhesive layer 22;
the hard base material monomer layer 31 has a tab portion 5 at one end, the connection between the tab portion 5 and the hard base material monomer layer 31 has a cut line 6, and the tab portion 5 is folded outwards along the cut line 6 and is located between the hard base material monomer layer 31 and the micro adhesive film 2.
The hard base material monomer layer 31 of the protective film monomer 3 is a PVC base material layer.
The soft substrate layer 21 of the micro-adhesive film 2 is a PE substrate layer.
The release film 1 is a non-silicon release film.
When the process protective film for the electronic product is adopted, the defects that a large number of protective film monomers are difficult to store and transfer due to small protective film monomers and the protective film monomers are easy to drop during transfer or use are avoided, so that the transfer and the use are convenient; in addition, its stereoplasm base material monomer layer one end has one and draws ear, and this draws ear and stereoplasm base material monomer layer junction to have a score line, draw ear to turn over along the score line to the outside and lie in stereoplasm base material monomer layer and between the little mucous membrane, prevent to draw ear to upwarp and avoided droing on the release film, also the person of facilitating the use gets and puts the protection film monomer to work efficiency has been improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. A process protection film for electronic products is characterized in that: the method comprises the following steps: the protective film comprises a release film (1), a micro-mucous membrane (2) and a plurality of protective film monomers (3) positioned between the release film (1) and the micro-mucous membrane (2), wherein the protective film monomers (3) are arranged on the release film (1) at intervals, the protective film monomers (3) comprise a hard base material monomer layer (31) and a strong adhesive layer (32) covering the edge of the lower surface of the hard base material monomer layer (31), and the central area of the strong adhesive layer (32) is a hollow area (4);
the micro-mucosa (2) is composed of a soft base material layer (21) and a weak adhesive layer (22), the weak adhesive layer (22) is coated on the surface of the soft base material layer (21) contacted with the protective film monomer (3), the hard base material monomer layer (31) is bonded with the release film (1) through a strong adhesive layer (32), and the soft base material layer (21) is bonded with the upper surface of the hard base material monomer layer (31) through the weak adhesive layer (22);
the hard base material monomer layer (31) is provided with a pulling lug part (5) at one end, the joint of the pulling lug part (5) and the hard base material monomer layer (31) is provided with a cutting line (6), and the pulling lug part (5) is folded outwards along the cutting line (6) and is positioned between the hard base material monomer layer (31) and the micro mucous membrane (2).
2. The process protection film for electronic products of claim 1, wherein: and the hard base material monomer layer (31) of the protective film monomer (3) is a PET base material layer or a PVC base material layer.
3. The process protection film for electronic products of claim 1, wherein: the soft substrate layer (21) of the micro-mucous membrane (2) is a PE substrate layer or a PP substrate layer.
4. The process protection film for electronic products of claim 1, wherein: the release film (1) is an organic silicon release film or a non-silicon release film.
5. The process protection film for electronic products of claim 1, wherein: the shape of the protective film monomer (3) is rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023219777.7U CN214218634U (en) | 2020-12-28 | 2020-12-28 | Process protective film for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023219777.7U CN214218634U (en) | 2020-12-28 | 2020-12-28 | Process protective film for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214218634U true CN214218634U (en) | 2021-09-17 |
Family
ID=77707702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023219777.7U Active CN214218634U (en) | 2020-12-28 | 2020-12-28 | Process protective film for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214218634U (en) |
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2020
- 2020-12-28 CN CN202023219777.7U patent/CN214218634U/en active Active
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