CN214826613U

CN214826613U - Chip blanking and returning device of automatic ceramic dielectric chip arraying machine

Info

Publication number: CN214826613U
Application number: CN202120644560.6U
Authority: CN
Inventors: 江奕群; 彭亚乔; 李晓丹; 陈衍泽; 申建峰; 张竹平; 李雄洲; 黄义鹏; 李光钦; 董鑫
Original assignee: Shantou Free Trade Zone Songtian Electronic Technology Co ltd
Current assignee: Shantou Free Trade Zone Songtian Electronic Technology Co ltd
Priority date: 2021-03-30
Filing date: 2021-03-30
Publication date: 2021-11-23
Anticipated expiration: 2031-03-30

Abstract

The utility model discloses a chip unloading and loopback device of automatic permutation machine of ceramic dielectric chip, its characterized in that: the automatic feeding device comprises a rack, a discharging mechanism, a vibrating material conveying mechanism and a returning mechanism, wherein the discharging mechanism, the vibrating material conveying mechanism and the returning mechanism are respectively arranged on the rack, the discharging end of the vibrating material conveying mechanism corresponds to the material receiving end of the returning mechanism in position, and the discharging end of the returning mechanism corresponds to the feeding end of the discharging mechanism. The chip blanking and returning device can automatically add ceramic dielectric chips to the material containing plate arranged on the vibration material arranging device, and collect and recycle redundant ceramic dielectric chips after the vibration material arranging device finishes vibration material arranging.

Description

Chip blanking and returning device of automatic ceramic dielectric chip arraying machine

Technical Field

The utility model relates to a ceramic dielectric production facility, in particular to chip unloading and loopback device of automatic permutation machine of ceramic dielectric chip.

Background

After the ceramic dielectric chip is sintered, the silver-coated electrode needs to be processed. The ceramic dielectric chip is usually held by a special holding plate, a plurality of grooves which are used for holding the ceramic dielectric chip and have the same specification are arranged on the holding plate, and the ceramic dielectric chip is placed in the grooves and then coated with silver, so that the uniformity of the thickness of a silver layer of the ceramic dielectric chip and the regular consistency of the periphery of the silver layer are ensured. However, at present, in the process of placing the ceramic dielectric chip in the groove, a worker is generally required to hold the material containing plate and continuously shake the material containing plate, so that the ceramic dielectric chip falls into the groove, and the material arranging mode is inconvenient and laborious to operate, requires more manpower investment, and is low in working efficiency. Therefore, the applicant carries out research and development on an automatic ceramic dielectric chip arraying machine capable of automatically completing the work, the automatic ceramic dielectric chip arraying machine comprises a vibration material arranging device, after a material containing plate is placed on the vibration material arranging device, ceramic dielectric chips need to be added onto the material containing plate, and then the material containing plate is driven to vibrate to enable the ceramic dielectric chips to enter each groove in the material containing plate. In order to make the ceramic dielectric chips more easily filled in the grooves on the material containing plate, more ceramic dielectric chips are usually added on the material containing plate, and after finishing vibrating material arrangement, the redundant ceramic dielectric chips on the material containing plate need to be recovered.

Disclosure of Invention

The utility model aims to solve the technical problem that a chip unloading and loopback device of automatic permutation machine of ceramic dielectric chip is provided, this kind of chip unloading and loopback device can add ceramic dielectric chip on arranging the flourishing flitch on the vibration reason material device in automatically to will vibrate reason material device and accomplish the vibration and manage unnecessary ceramic dielectric chip after expecting and collect and retrieve.

In order to solve the technical problems, the technical scheme is as follows:

the utility model provides a chip unloading and loopback device of automatic permutation machine of ceramic dielectric chip which characterized in that: the automatic feeding device comprises a rack, a discharging mechanism, a vibrating material conveying mechanism and a returning mechanism, wherein the discharging mechanism, the vibrating material conveying mechanism and the returning mechanism are respectively arranged on the rack, the discharging end of the vibrating material conveying mechanism corresponds to the material receiving end of the returning mechanism in position, and the discharging end of the returning mechanism corresponds to the feeding end of the discharging mechanism.

In the chip blanking and returning device, the blanking mechanism is used for conveying the ceramic dielectric chips to a vibration material arranging device of the automatic ceramic dielectric chip arranging machine for arranging the ceramic dielectric chips; the material receiving end of the vibration material conveying mechanism corresponds to the material discharging end of the vibration material arranging device, and when the vibration material arranging device completes one-time arrangement, the vibration material arranging device conveys the residual ceramic medium chips to the vibration material conveying mechanism; then, the residual ceramic medium chips are conveyed to a returning mechanism through the vibration of a vibrating material conveying mechanism; after all the residual ceramic dielectric chips are conveyed to the returning mechanism, the returning mechanism returns the ceramic dielectric chips to the blanking mechanism again, and the ceramic dielectric chips are circulated. The chip blanking and returning device automatically adds ceramic dielectric chips to the material containing plate on the vibration material arranging device through the blanking mechanism, collects the residual ceramic dielectric chips when the ceramic dielectric chips are arranged by the automatic ceramic dielectric chip arranging machine every time, and returns the ceramic dielectric chips to the blanking mechanism again, so that the automatic ceramic dielectric chip feeding and returning device is high in automation degree, does not need to manually recover the ceramic dielectric chips, can effectively reduce production cost and improve production efficiency.

In the preferred scheme, the blanking mechanism comprises a blanking hopper, a receiving groove and a receiving groove turnover device capable of driving the receiving groove to turn over, the blanking hopper and the receiving groove turnover device are respectively arranged on the rack, and the receiving groove is in transmission connection with the power output end of the receiving groove turnover device; the bottom of the blanking hopper is provided with a blanking channel, and the receiving groove is positioned below the tail end of the blanking channel. Usually, the discharge hole of the material receiving groove corresponds to the position of the vibration material arranging device. The blanking hopper is used for storing the ceramic dielectric chips, and the stacked ceramic dielectric chips are conveyed to the material receiving groove under the action of gravity. When ceramic dielectric chips need to be conveyed to the vibration material arranging device, the material receiving groove overturning device drives the material receiving groove to overturn and incline, and the ceramic dielectric chips in the material receiving groove are poured into the vibration material arranging device.

In addition, a switch structure for controlling the on-off of the blanking channel can be arranged on the blanking hopper, the blanking channel is conducted when ceramic dielectric chips need to be supplied to the receiving groove, and the blanking channel is not cut off when the ceramic dielectric chips do not need to be supplied to the receiving groove. For example, the switch structure comprises a switch baffle plate and a switch baffle plate position switching cylinder, wherein a cylinder body of the switch baffle plate position switching cylinder is fixedly arranged on the side wall of the blanking hopper, the switch baffle plate is connected with a piston rod of the switch baffle plate position switching cylinder, the switch baffle plate corresponds to the inlet end of the blanking material channel in position, the switch baffle plate position switching cylinder can switch the position of the switch baffle plate, the switch baffle plate blocks the inlet end of the blanking material channel in one position, and the switch baffle plate moves to one side of the inlet end of the blanking material channel in the other position.

In a further preferred scheme, the receiving trough overturning device comprises a receiving trough overturning driving cylinder, two receiving trough rotating shafts and two receiving trough supports, the two receiving trough supports are mounted on the rack, guide holes are respectively formed in the two receiving trough supports, the positions of the two guide holes correspond to each other, each guide hole comprises a first guide hole in the front-back direction and a second guide hole inclined from back to front, the first guide hole is communicated with the second guide hole, and the second guide hole is located in the middle of the first guide hole; the two material receiving groove rotating shafts are respectively and fixedly connected with the front side and the rear side of the lower end of the material receiving groove, and the two ends of the two material receiving groove rotating shafts are respectively positioned in the guide holes; connect the silo upset to drive the lower extreme of actuating cylinder and articulated with the frame, connect the silo upset to drive actuating cylinder and be in two and connect between the silo support, connect the piston rod that the silo upset drove actuating cylinder and be in and connect the silo pivot of connecing of silo lower extreme rear side articulated to connect the silo upset to drive actuating cylinder slope setting forward from the back. Because the ceramic dielectric chip reason the in-process of material, need go on special flourishing flitch to reason the material back, still need carry out the change of flourishing flitch, consequently, still need set up and connect silo translation drive arrangement, make and connect the silo to carry out the translation of fore-and-aft direction, in order to avoid influencing the change of flourishing flitch. When ceramic dielectric chip need be poured into vibration reason material device in, connect the silo upset to drive the piston rod of actuating cylinder and release, connect the silo pivot under the spacing of first guiding hole, drive earlier and connect the silo to move forward from back, when being in the hookup location that connects silo pivot removal of silo lower extreme rear side to first guiding hole and second guiding hole, under the promotion of the piston rod that connects the silo upset to drive the actuating cylinder, be in and connect silo pivot of silo lower extreme rear side to move along the slope forward behind the second guiding hole, thereby the messenger connects the rear end of silo to lift, make ceramic dielectric chip pour from connecing the silo.

In another specific scheme, the receiving trough overturning device also comprises a receiving trough translation driving device, a receiving trough overturning driving device, a receiving trough rotating shaft and two receiving trough brackets, wherein the receiving trough translation driving device and the two receiving trough brackets are respectively arranged on the frame, the two receiving trough brackets are respectively provided with guide holes moving forwards and backwards, and the positions of the two guide holes are corresponding to each other; the lower end of the receiving groove overturning driving device is hinged with the rack, the receiving groove overturning driving device is positioned between the two receiving groove supports, and the upper end of the receiving groove overturning driving device is in transmission connection with the power output end of the receiving groove translation driving device; the front side of the lower end of the material receiving groove is fixedly connected with a material receiving groove rotating shaft, two ends of the material receiving groove rotating shaft are respectively positioned in the two guide holes, and the rear end of the bottom wall of the material receiving groove is in transmission connection with a power output end of a material receiving groove overturning driving device. The receiving groove translation driving device can adopt a receiving groove translation driving cylinder, and a piston rod of the receiving groove translation driving cylinder faces the front; connect silo upset drive arrangement to adopt and connect the silo upset to drive actuating cylinder, connect the piston rod orientation of silo upset drive actuating cylinder to go up the place ahead. Because the ceramic dielectric chip reason the in-process of material, need go on special flourishing flitch to reason the material back, still need carry out the change of flourishing flitch, consequently, still need set up and connect silo translation drive arrangement, make and connect the silo to carry out the translation of fore-and-aft direction, in order to avoid influencing the change of flourishing flitch. When need pour ceramic dielectric chip into vibration reason material device in, connect silo translation drive arrangement to connect silo upset drive arrangement translation through the drive earlier to the drive connects the silo to remove along the guiding hole, connects silo upset drive arrangement to lift up through the rear end that the promotion connects the silo afterwards, makes ceramic dielectric chip pour from connecing the silo.

In a further preferred scheme, the material receiving groove comprises a bottom wall plate, a left wall plate, a right wall plate, a rear wall plate, a baffle plate and a baffle plate rotating shaft; the bottom wall plate is in transmission connection with the power output end of the material receiving groove turning device, and the lower edges of the left wall plate, the right wall plate and the rear wall plate are respectively fixedly connected with the left edge, the right edge and the rear edge of the bottom wall plate to form a material receiving groove body with a material outlet at the front end; the front ends of the left wall plate and the right wall plate are respectively provided with a rotating shaft hole, the baffle rotating shaft penetrates through the two rotating shaft holes, and the upper edge of the baffle is fixedly connected with the baffle rotating shaft. When the material receiving groove is in a horizontal state, the baffle shields the discharge hole of the material receiving groove body; when the material receiving groove is inclined, the ceramic dielectric chip in the material receiving groove is poured into the vibration material arranging device through the material outlet at the front end of the material receiving groove (at the moment, the baffle rotates around the rotating shaft of the baffle under the action of self gravity, and a gap for the ceramic dielectric chip to pass through is formed between the lower edge of the baffle and the bottom wall plate). With this arrangement, the ceramic dielectric chip is more easily poured out.

The front and back directions are determined according to the position of the ceramic dielectric chip poured out by the receiving groove, and the position of the ceramic dielectric chip poured out by the receiving groove is front.

In a preferable scheme, the material vibrating and conveying mechanism comprises a material conveying channel and a material conveying channel vibration driving device, and the discharge end of the material conveying channel corresponds to the material receiving end of the returning mechanism; the conveying channel vibration driving device is installed on the rack, and the conveying channel is in transmission connection with the power output end of the conveying channel vibration driving device.

In a further preferred scheme, the conveying channel comprises a first strip-shaped conveying channel and a second strip-shaped conveying channel, the discharge end of the first strip-shaped conveying channel corresponds to the receiving end of the second strip-shaped conveying channel, and the discharge end of the second strip-shaped conveying channel corresponds to the receiving end of the returning mechanism; the conveying material channel vibration driving device comprises a first strip conveying channel line vibration machine and a second strip conveying channel line vibration machine, wherein the first strip conveying channel line vibration machine and the second strip conveying channel line vibration machine are respectively installed on the rack, the first strip conveying channel is in transmission connection with a power output end of the first strip conveying channel line vibration machine, and the second strip conveying channel is in transmission connection with a power output end of the second strip conveying channel line vibration machine. According to the distance and the position of the blanking mechanism and the returning mechanism, the conveying channel can also be selected to be composed of more strip-shaped conveying channels. Generally, each strip-shaped conveying channel is formed by a strip-shaped groove, a discharge port is formed in the discharge end of the strip-shaped conveying channel, in this case, the first strip-shaped conveying channel is located below the discharge end of the vibration material arranging device, the second strip-shaped conveying channel is located below the discharge port of the first strip-shaped conveying channel, when the vibration material conveying mechanism works, the first strip-shaped conveying channel receives ceramic medium chips left after arrangement, then, the first strip-shaped conveying channel is driven by a first strip-shaped conveying channel line vibrator to vibrate, so that the ceramic medium chips are conveyed to the second strip-shaped conveying channel along the first strip-shaped conveying channel, and then the second strip-shaped conveying channel line vibrator drives the second strip-shaped conveying channel to vibrate until the ceramic medium chips fall into the returning mechanism.

In a preferred scheme, the loopback mechanism comprises a loopback trough, a loopback trough lifting driving device, a lifting seat and a loopback trough overturning driving device, the loopback trough lifting driving device is installed on the rack, the lifting seat is in transmission connection with a power output end of the loopback trough lifting driving device, the loopback trough overturning driving device is installed on the lifting seat, and the loopback trough is rotatably installed on the lifting seat and is in transmission connection with a power output end of the loopback trough overturning driving device. In more preferred scheme, above-mentioned loopback silo lift drive arrangement includes no pole cylinder, and the cylinder body fixed mounting of no pole cylinder moves towards from top to bottom in the frame, and the lift seat is connected with the slider of no pole cylinder. The returning trough lifting driving device can also adopt a structure that a servo motor, a synchronous wheel and a synchronous belt are matched, and the synchronous belt is used as a power output end; the loopback silo lifting driving device can also adopt a lifting cylinder, a piston rod of the lifting cylinder faces upwards, and a lifting seat is fixedly connected to the piston rod of the lifting cylinder; the returning trough lifting driving device can also adopt a structure that a servo motor, a chain wheel and a chain are matched.

In a further preferred scheme, the returning trough overturning driving device comprises a returning trough rotating shaft, a gear, a rack and a rack translation driving device, the returning trough rotating shaft is rotatably mounted on the lifting seat, one side of the lower end of the returning trough, which is close to the discharging mechanism, is connected with the returning trough rotating shaft, the gear is fixedly connected with the returning trough rotating shaft, the rack is meshed with the gear, and the rack is in transmission connection with a power output end of the rack translation driving device. The rack translation driving device can adopt a rack translation driving cylinder which is fixedly arranged on the lifting seat, and the rack translation driving cylinder is fixedly connected to a piston rod of the rack translation driving cylinder. After all the residual ceramic dielectric chips are conveyed into the returning trough, the returning trough lifting driving device drives the returning trough to ascend through the lifting seat until the returning trough moves to the upper side of the discharging mechanism, then the rack translation driving device drives the rack to translate, the gear is driven by the rack to rotate at the moment, the rotating shaft of the returning trough rotates along with the rack, and therefore the returning trough rotates around the rotating shaft of the returning trough, and the ceramic dielectric chips in the returning trough are poured into the discharging mechanism.

The beneficial effects of the utility model reside in that: the chip blanking and returning device collects the residual ceramic dielectric chips during each arraying of the automatic ceramic dielectric chip arraying machine, recycles the ceramic dielectric chips again, is used for conveying the ceramic dielectric chips during later arraying, has high automation degree, does not need to manually recycle the ceramic dielectric chips, can effectively reduce the production cost and improve the production efficiency.

Drawings

Fig. 1 is a schematic structural view of a chip blanking and loopback device in an embodiment of the present invention;

fig. 2 is a side view of the receiving chute turnover device in the embodiment of the present invention before forward pushing;

fig. 3 is a side view of the receiving trough turnover device in the embodiment of the present invention when pushing forward;

fig. 4 is a side view of the feeding back trough, the lifting seat and the feeding back trough turnover driving device in the embodiment of the present invention.

Detailed Description

The invention will be further described with reference to the following drawings and specific embodiments:

the chip blanking and returning device of the automatic ceramic dielectric chip arraying machine shown in fig. 1-4 comprises a frame 1, a blanking mechanism 2, a material vibrating conveying mechanism 3 and a returning mechanism 4, wherein the blanking mechanism 2, the material vibrating conveying mechanism 3 and the returning mechanism 4 are respectively installed on the frame 1, the discharging end of the material vibrating conveying mechanism 3 corresponds to the position of the material receiving end of the returning mechanism 4, and the discharging end of the returning mechanism 4 corresponds to the position of the material feeding end of the blanking mechanism 2.

In the chip blanking and returning device, the blanking mechanism 2 is used for conveying ceramic dielectric chips to a vibration material arranging device of an automatic ceramic dielectric chip arranging machine for arranging the ceramic dielectric chips; the material receiving end of the vibration material conveying mechanism 3 corresponds to the material discharging end of the vibration material arranging device, and when the vibration material arranging device completes one-time arrangement, the vibration material arranging device conveys the rest ceramic medium chips to the vibration material conveying mechanism 3; then, the residual ceramic medium chips are conveyed to the returning mechanism 4 by the vibration of the vibrating material conveying mechanism 3; after all the remaining ceramic dielectric chips are transferred to the returning mechanism 4, the returning mechanism 4 returns the ceramic dielectric chips to the blanking mechanism 2 again, and the ceramic dielectric chips are recycled. The chip blanking and returning device automatically adds ceramic dielectric chips to the material containing plate on the vibration material arranging device through the blanking mechanism 2, collects the residual ceramic dielectric chips when the ceramic dielectric chips are arranged in the automatic ceramic dielectric chip arranging machine every time, and returns the ceramic dielectric chips to the blanking mechanism 2 again, so that the automation degree is high, the ceramic dielectric chips do not need to be manually recycled, the production cost can be effectively reduced, and the production efficiency is improved.

The blanking mechanism 2 comprises a blanking hopper 201, a receiving groove 202 and a receiving groove turning device 203 capable of driving the receiving groove 202 to turn over, the blanking hopper 201 and the receiving groove turning device 203 are respectively arranged on the frame 1, and the receiving groove 202 is in transmission connection with the power output end of the receiving groove turning device 203; the bottom of the blanking hopper 201 is provided with a blanking channel 2011, and the receiving groove 202 is positioned below the tail end of the blanking channel 2011. The discharge hole of the material receiving groove 202 corresponds to the position of the vibration material arranging device. The blanking hopper 201 is used for storing ceramic dielectric chips, and the stacked ceramic dielectric chips are conveyed to the material receiving groove 202 under the action of gravity. When ceramic dielectric chips need to be conveyed to the vibration material arranging device, the material receiving groove overturning device 203 drives the material receiving groove 202 to overturn and incline, and the ceramic dielectric chips in the material receiving groove 202 are poured into the vibration material arranging device.

The material receiving groove turning device 203 comprises a material receiving groove turning driving cylinder 2031, two material receiving groove rotating shafts 2032 and two material receiving groove brackets 2033, wherein the two material receiving groove brackets 2033 are mounted on the frame 1, the two material receiving groove brackets 2033 are respectively provided with guide holes, the positions of the two guide holes correspond to each other, the guide holes comprise a first guide hole 20331 which is in the front-back direction and a second guide hole 20332 which is inclined from back to front, the first guide hole 20331 is communicated with the second guide hole 20332, and the second guide hole 20332 is positioned in the middle of the first guide hole 20331; the two receiving trough rotating shafts 2032 are fixedly connected with the front side and the rear side of the lower end of the receiving trough 202 respectively, and two ends of the two receiving trough rotating shafts 2032 are positioned in the guide holes respectively; connect the lower extreme that silo upset drove actuating cylinder 2031 to articulate with frame 1, connect silo upset to drive actuating cylinder 2031 and be in two and connect between silo support 2033, connect the piston rod that silo upset drove actuating cylinder 2031 and be in and connect silo pivot 2032 of connecing of silo 202 lower extreme rear side articulated to connect silo upset to drive actuating cylinder 2031 and slope the setting forward from the back. Because the ceramic dielectric chip is required to be arranged on a special containing plate in the material arranging process, and the containing plate is required to be replaced after the material is arranged, a translation driving device of the material receiving groove 202 is required to be arranged, so that the material receiving groove 202 can translate in the front-back direction, and the material receiving plate is prevented from being replaced. When ceramic dielectric chips need to be poured into the vibration material arranging device, the piston rod of the material receiving groove overturning driving cylinder 2031 is pushed out, the material receiving groove rotating shaft 2032 is limited by the first guide hole 20331, the material receiving groove 202 is driven to move forwards from the back, when the material receiving groove rotating shaft 2032 on the rear side of the lower end of the material receiving groove 202 moves to the connecting position of the first guide hole 20331 and the second guide hole 20332, the material receiving groove rotating shaft 2032 on the rear side of the lower end of the material receiving groove 202 tilts forwards from the back along the second guide hole 20332 under the pushing of the piston rod of the material receiving groove overturning driving cylinder 2031, so that the rear end of the material receiving groove 202 is lifted, and the ceramic dielectric chips are poured out from the material receiving groove 202.

The receiving groove 202 comprises a bottom wall plate 2021, a left wall plate 2022, a right wall plate 2023, a rear wall plate 2024, a baffle 2025 and a baffle rotating shaft 2026; the bottom wall plate 2021 is in transmission connection with a power output end of the receiving groove turning device 203, and the lower edges of the left wall plate 2022, the right wall plate 2023 and the rear wall plate 2024 are respectively and fixedly connected with the left edge, the right edge and the rear edge of the bottom wall plate 2021 to form a receiving groove body with a discharge hole at the front end; the front ends of the left wall plate 2022 and the right wall plate 2023 are respectively provided with a shaft hole of a rotating shaft, the baffle rotating shaft 2026 passes through the two shaft holes of the rotating shaft, and the upper edge of the baffle 2025 is fixedly connected with the baffle rotating shaft 2026. When the material receiving groove 202 is in a horizontal state, the baffle 2025 shields the discharge hole of the material receiving groove body; when the material receiving groove 202 is inclined, the ceramic dielectric chip in the material receiving groove 202 is poured into the vibration material arranging device through the material outlet at the front end of the material receiving groove 202 (at this time, the baffle 2025 rotates around the baffle rotating shaft 2026 under the action of self gravity, and a gap through which the ceramic dielectric chip can pass is formed between the lower edge of the baffle 2025 and the bottom wall plate 2021). With this arrangement, the ceramic dielectric chip is more easily poured out.

The front-back direction is determined by the position of the receiving groove 202 from which the ceramic dielectric chip is poured, and the position of the receiving groove 202 from which the ceramic dielectric chip is poured is the front position.

The material vibrating conveying mechanism 3 comprises a conveying material channel 301 and a conveying material channel vibration driving device 302, and the discharge end of the conveying material channel 301 corresponds to the material receiving end of the returning mechanism 4; the conveying material channel vibration driving device 302 is installed on the rack 1, and the conveying material channel 301 is in transmission connection with the power output end of the conveying material channel vibration driving device 302.

The material conveying channel 301 comprises a first strip-shaped conveying channel 3011 and a second strip-shaped conveying channel 3012, the discharge end of the first strip-shaped conveying channel 3011 corresponds to the material receiving end of the second strip-shaped conveying channel 3012, and the discharge end of the second strip-shaped conveying channel 3012 corresponds to the material receiving end of the returning mechanism 4; the material conveying channel vibration driving device 302 comprises a first strip-shaped conveying channel line vibration machine 3021 and a second strip-shaped conveying channel line vibration machine 3022, the first strip-shaped conveying channel line vibration machine 3021 and the second strip-shaped conveying channel line vibration machine 3022 are respectively installed on the rack 1, the first strip-shaped conveying channel 3011 is in transmission connection with the power output end of the first strip-shaped conveying channel line vibration machine 3021, and the second strip-shaped conveying channel 3012 is in transmission connection with the power output end of the second strip-shaped conveying channel line vibration machine 3022. The first strip-shaped conveying channel 3011 is located below a discharge end of the vibration material arranging device, the second strip-shaped conveying channel 3012 is located below a discharge port of the first strip-shaped conveying channel 3011, when the vibration material conveying mechanism 3 works, the first strip-shaped conveying channel 3011 receives ceramic medium chips left after arrangement, then the first strip-shaped conveying channel line vibration machine 3021 drives the first strip-shaped conveying channel 3011 to vibrate, so that the ceramic medium chips are conveyed to the second strip-shaped conveying channel 3012 along the first strip-shaped conveying channel 3011, and then the second strip-shaped conveying channel line vibration machine 3022 drives the second strip-shaped conveying channel 3012 to vibrate until the ceramic medium chips fall into the returning mechanism 4.

The loopback mechanism 4 comprises a loopback trough 401, a loopback trough lifting driving device 402, a lifting seat 403 and a loopback trough overturning driving device 404, wherein the loopback trough lifting driving device 402 is installed on the frame 1, the lifting seat 403 is in transmission connection with the power output end of the loopback trough lifting driving device 402, the loopback trough overturning driving device 404 is installed on the lifting seat 403, and the loopback trough 401 is rotatably installed on the lifting seat 403 and is in transmission connection with the power output end of the loopback trough overturning driving device 404. The back feeding trough lifting driving device 402 adopts a rodless cylinder.

The returning trough overturning driving device 404 comprises a returning trough rotating shaft 4041, a gear 4042, a rack 4043 and a rack translation driving device 4044, the returning trough rotating shaft 4041 is rotatably installed on the lifting seat 403, one side of the lower end of the returning trough 401, which is close to the blanking mechanism 2, is connected with the returning trough rotating shaft 4041, the gear 4042 is fixedly connected with the returning trough rotating shaft 4041, the rack 4043 is meshed with the gear 4042, and the rack 4043 is in transmission connection with the power output end of the rack translation driving device 4044. The rack translation driving device 4044 adopts a rack 4043 to translate and drive the cylinder, the rack 4043 translates and drives the cylinder to be fixedly mounted on the lifting seat 403, and the rack 4043 is fixedly connected to a piston rod of the rack 4043 translating and driving cylinder. After all the remaining ceramic dielectric chips are conveyed into the returning trough 401, the returning trough lifting driving device 402 drives the returning trough 401 to ascend through the lifting seat 403 until the returning trough 401 moves to the upper side of the blanking mechanism 2, then the rack translation driving device 4044 drives the rack 4043 to translate, at this time, the gear 4042 is driven by the rack 4043 to rotate, the returning trough rotating shaft 4041 rotates accordingly, the returning trough 401 rotates around the returning trough rotating shaft 4041, and the ceramic dielectric chips in the returning trough 401 are poured into the blanking mechanism 2.

Claims

1. The utility model provides a chip unloading and loopback device of automatic permutation machine of ceramic dielectric chip which characterized in that: the automatic feeding device comprises a rack, a discharging mechanism, a vibrating material conveying mechanism and a returning mechanism, wherein the discharging mechanism, the vibrating material conveying mechanism and the returning mechanism are respectively arranged on the rack, the discharging end of the vibrating material conveying mechanism corresponds to the material receiving end of the returning mechanism in position, and the discharging end of the returning mechanism corresponds to the feeding end of the discharging mechanism.

2. The chip blanking and returning device of the ceramic dielectric chip automatic arraying machine according to claim 1, characterized in that: the blanking mechanism comprises a blanking hopper, a receiving groove and a receiving groove turnover device capable of driving the receiving groove to turn over, the blanking hopper and the receiving groove turnover device are respectively arranged on the rack, and the receiving groove is in transmission connection with the power output end of the receiving groove turnover device; the bottom of the blanking hopper is provided with a blanking channel, and the receiving groove is positioned below the tail end of the blanking channel.

3. The chip blanking and returning device of the ceramic dielectric chip automatic arraying machine according to claim 2, wherein: the receiving groove overturning device comprises a receiving groove overturning driving cylinder, two receiving groove rotating shafts and two receiving groove supports, the two receiving groove supports are mounted on the rack, guide holes are formed in the two receiving groove supports respectively, the positions of the two guide holes correspond to each other, each guide hole comprises a first guide hole in the front-back direction and a second guide hole inclined forwards from back, the first guide hole is communicated with the second guide hole, and the second guide hole is located in the middle of the first guide hole; the two material receiving groove rotating shafts are respectively and fixedly connected with the front side and the rear side of the lower end of the material receiving groove, and the two ends of the two material receiving groove rotating shafts are respectively positioned in the guide holes; connect the silo upset to drive the lower extreme of actuating cylinder and articulated with the frame, connect the silo upset to drive actuating cylinder and be in two and connect between the silo support, connect the piston rod that the silo upset drove actuating cylinder and be in and connect the silo pivot of connecing of silo lower extreme rear side articulated to connect the silo upset to drive actuating cylinder slope setting forward from the back.

4. The chip blanking and returning device of the ceramic dielectric chip automatic arraying machine according to claim 2, wherein: the receiving trough comprises a bottom wall plate, a left wall plate, a right wall plate, a rear wall plate, a baffle and a baffle rotating shaft; the bottom wall plate is in transmission connection with the power output end of the material receiving groove turning device, and the lower edges of the left wall plate, the right wall plate and the rear wall plate are respectively fixedly connected with the left edge, the right edge and the rear edge of the bottom wall plate to form a material receiving groove body with a material outlet at the front end; the front ends of the left wall plate and the right wall plate are respectively provided with a rotating shaft hole, the baffle rotating shaft penetrates through the two rotating shaft holes, and the upper edge of the baffle is fixedly connected with the baffle rotating shaft.

5. The chip blanking and returning device of the ceramic dielectric chip automatic arraying machine according to claim 1, characterized in that: the material vibrating and conveying mechanism comprises a material conveying channel and a material conveying channel vibration driving device, and the discharge end of the material conveying channel corresponds to the material receiving end of the returning mechanism in position; the conveying channel vibration driving device is installed on the rack, and the conveying channel is in transmission connection with the power output end of the conveying channel vibration driving device.

6. The chip blanking and returning device of the ceramic dielectric chip automatic arraying machine according to claim 5, wherein: the conveying channel comprises a first strip-shaped conveying channel and a second strip-shaped conveying channel, the discharge end of the first strip-shaped conveying channel corresponds to the receiving end of the second strip-shaped conveying channel in position, and the discharge end of the second strip-shaped conveying channel corresponds to the receiving end of the loopback mechanism in position; the conveying material channel vibration driving device comprises a first strip conveying channel line vibration machine and a second strip conveying channel line vibration machine, wherein the first strip conveying channel line vibration machine and the second strip conveying channel line vibration machine are respectively installed on the rack, the first strip conveying channel is in transmission connection with a power output end of the first strip conveying channel line vibration machine, and the second strip conveying channel is in transmission connection with a power output end of the second strip conveying channel line vibration machine.

7. The chip blanking and returning device of the ceramic dielectric chip automatic arraying machine according to claim 1, characterized in that: the loopback mechanism comprises a loopback trough, a loopback trough lifting driving device, a lifting seat and a loopback trough overturning driving device, the loopback trough lifting driving device is installed on the rack, the lifting seat is in transmission connection with the power output end of the loopback trough lifting driving device, the loopback trough overturning driving device is installed on the lifting seat, and the loopback trough is rotatably installed on the lifting seat and is in transmission connection with the power output end of the loopback trough overturning driving device.

8. The chip blanking and returning device of the ceramic dielectric chip automatic arraying machine according to claim 7, wherein: the loopback trough overturning driving device comprises a loopback trough rotating shaft, a gear, a rack and a rack translation driving device, the loopback trough rotating shaft is rotatably installed on the lifting seat, one side, close to the discharging mechanism, of the lower end of the loopback trough is connected with the loopback trough rotating shaft, the gear is fixedly connected with the loopback trough rotating shaft, the rack is meshed with the gear, and the rack is in transmission connection with the power output end of the rack translation driving device.