CN214812813U - Testing device for rotating disc type integrated circuit packaging part - Google Patents

Testing device for rotating disc type integrated circuit packaging part Download PDF

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Publication number
CN214812813U
CN214812813U CN202121279113.1U CN202121279113U CN214812813U CN 214812813 U CN214812813 U CN 214812813U CN 202121279113 U CN202121279113 U CN 202121279113U CN 214812813 U CN214812813 U CN 214812813U
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China
Prior art keywords
integrated circuit
testing
turntable
package
base
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CN202121279113.1U
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Chinese (zh)
Inventor
沈巧琳
徐春雷
丁向东
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Shenzhen Chuangxin Online Testing Service Co.,Ltd.
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Shenzhen Insell Electronic Co ltd
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Abstract

The utility model discloses a carousel formula integrated circuit packaging part's testing arrangement, include: the base is rotatably provided with a turntable, the turntable is provided with four accommodating grooves for bearing the integrated circuit packaging piece, and the four accommodating grooves are positioned on the same circumferential track coaxial with the turntable. The base is provided with a vertical charging barrel, an electrical testing mechanism, a defective product discharging mechanism and a non-defective product discharging mechanism which respectively correspond to the four accommodating grooves. The beneficial effects of the utility model reside in that: through adopting the carousel formula structure, reduced the place space resource that whole device occupy greatly, moreover, whole device need not artifical unloading one by one, and degree of automation improves greatly.

Description

Testing device for rotating disc type integrated circuit packaging part
Technical Field
The utility model relates to a technical field of integrated circuit packaging part test, in particular to carousel formula integrated circuit packaging part's testing arrangement.
Background
Integrated circuit packages refer to bridges or means for connecting integrated circuits and other components to a system-level substrate to form electronic packages, which include the soldering of integrated circuit pins. After the integrated circuit is packaged, all pins of the integrated circuit package need to be subjected to power-on testing, most of the conventional devices for the power-on testing of the pins of the integrated circuit package adopt a linear layout structure, so that the whole device occupies too much field space, and the automation degree is low because the whole device needs to be manually loaded and unloaded one by one.
SUMMERY OF THE UTILITY MODEL
To the problem that prior art exists, the utility model provides a carousel formula integrated circuit packaging part's testing arrangement.
In order to achieve the above object, the present invention provides a testing device for a turntable type integrated circuit package, including: the base is rotatably provided with a turntable, the turntable is provided with four accommodating grooves for bearing the integrated circuit packaging piece, and the four accommodating grooves are positioned on the same circumferential track coaxial with the turntable. The base is provided with a vertical charging barrel, an electrical testing mechanism, a defective product discharging mechanism and a non-defective product discharging mechanism which respectively correspond to the four accommodating grooves.
Preferably, the inner wall of the accommodating groove is vertically provided with first guide grooves which are in one-to-one correspondence with a plurality of test pins of the integrated circuit package.
Preferably, the inner wall of the vertical charging barrel is provided with a second guide groove which can be aligned with the first guide grooves one by one.
Preferably, the height of the integrated circuit package is greater than the depth of the accommodating groove, a gap is formed between the lower end face perpendicular to the upper charging barrel and the upper end face of the integrated circuit package in the accommodating groove, and the gap is smaller than the thickness of the test pin of the integrated circuit package.
Preferably, the power-up mechanism includes: test host computer, support, first cylinder and connect the electric piece. The test host is fixed on the support, and the support is fixed on the base. The first cylinder is fixed on the support, the first cylinder drives the power connection block to vertically slide on the support, and the power connection block is located on the square of the circumferential track where the accommodating groove is located. The bottom end face of the electricity connecting block is provided with a plurality of conductive blocks which are in one-to-one correspondence with the first guide grooves, the conductive blocks can be inserted into the corresponding first guide grooves, and each conductive block is electrically connected with the test host.
Preferably, defective products unloading mechanism and non-defective products unloading mechanism all include: a manipulator and a sucker. The manipulator is rotationally arranged on the base, and the manipulator is provided with a lifting arm and a second cylinder for driving the lifting arm to move up and down. The sucking disc is established in the bottom of lifing arm, is equipped with the vacuum generator who is connected with the sucking disc on the lifing arm.
Compared with the prior art, the beneficial effects of the utility model reside in that: through adopting the carousel formula structure, reduced the place space resource that whole device occupy greatly, moreover, whole device need not artifical unloading one by one, and degree of automation improves greatly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
fig. 2 is a schematic perspective view of another embodiment of the present invention;
the purpose of the present invention is to provide a novel and improved method and apparatus for operating a computer.
Detailed Description
The utility model provides a carousel formula integrated circuit packaging part's testing arrangement.
Referring to fig. 1-2, fig. 1 is a schematic perspective view of an embodiment of the present invention, and fig. 2 is a schematic perspective view of another embodiment of the present invention.
As shown in fig. 1-2, in an embodiment of the present invention, the testing apparatus for a carousel type integrated circuit package includes: the base 100 is provided with a turntable 200, and the turntable 200 is provided with four receiving grooves 300 for receiving the ic packages 400. The inner walls of the accommodating grooves 300 are vertically provided with first guide grooves 310 corresponding to the test pins 410 of the ic package 400 one by one, and the four accommodating grooves 300 are located on the same circumferential track coaxial with the turntable 200. When the integrated circuit package 400 is placed in the receiving cavity 300, the test pins 410 of the integrated circuit package 400 are placed in the first guide grooves 310, so that the test pins 410 of the integrated circuit package 400 are prevented from large position swing.
The base 100 is provided with a vertical charging barrel 500, an electrifying testing mechanism 600, a defective product discharging mechanism 700 and a good product discharging mechanism 800, which correspond to the four accommodating grooves 300, respectively.
The inner wall of the vertical upper barrel 500 is provided with second guide grooves 510 aligned with the first guide grooves 310 one by one. During loading, a plurality of ic packages 400 are manually stacked in the vertical loading barrel 500, and it is ensured that the pins 410 of each ic package 400 are placed in the corresponding second guide slots 510, and after the turntable 200 rotates to the position where the receiving groove 300 is aligned with the vertical loading barrel 500, the ic packages 400 in the vertical loading barrel 500 are dropped into the receiving groove 300 one by using the gravity, thereby realizing automatic loading. The feeding structure is simple and practical without an external mechanism, and the cost is greatly reduced.
The height of the ic package 400 is greater than the depth of the receiving groove 300, and a gap is formed between the lower end surface perpendicular to the upper barrel 500 and the upper end surface of the ic package 400 in the receiving groove 300, where the gap is smaller than the thickness of the test pin 410 of the ic package 400. Thus, after the lowest ic package 400 in the vertical upper barrel 500 falls into the receiving cavity 300, the pins 410 of the penultimate ic package 400 in the vertical upper barrel 500 are not completely exposed out of the lower end surface of the vertical upper barrel 500, and thus it is ensured that the ic packages 400 in the vertical upper barrel 500 sequentially fall into the receiving cavity 300 during the rotation of the turntable 200.
The power-on test mechanism 600 includes: the test system comprises a test host 610, a bracket 620, a first cylinder 630 and a power connection block 640. The test mainframe 610 is fixed on the support 620, and the support 620 is fixed on the base 100. The first cylinder 630 is fixed on the bracket 620, the first cylinder 630 drives the power connection block 640 to slide vertically on the bracket 620, and the power connection block 640 is located on the square of the circumferential track where the accommodation groove 300 is located. The bottom end surface of the electrical connection block 640 is provided with conductive blocks 641 corresponding to the plurality of first guide slots 310 in the accommodating slot 300, the conductive blocks 641 can be inserted into the corresponding first guide slots 310, and each conductive block 641 is electrically connected to the test host 610.
After the ic package 400 in the vertically upper barrel 500 falls into the receiving groove 300, the external machine controller controls the turntable 200 to rotate, so that the receiving groove 300 carrying the ic package 400 just rotates to the lower side of the upper electrical testing mechanism 600, at this time, the first cylinder 630 drives the power receiving block 640 to descend until the conductive blocks 641 on the bottom end surface of the power receiving block 640 compress the pins 410 of the ic package 400, so as to electrically connect the pins 410 of the ic package 400 with the testing host 610, thereby implementing the power-on test.
Defective products unloading mechanism 700 and defective products unloading mechanism 800 all include: a robot 710 and a suction cup 720. The robot 710 is rotatably disposed on the base 100, and the robot 710 is provided with a lifting arm 730 and a second cylinder 740 for driving the lifting arm 730 to move up and down. The suction cup 720 is disposed at the bottom of the elevating arm 730, and the elevating arm 730 is provided with a vacuum generator 750 connected to the suction cup 720.
After the power-on test of the ic package 400 is completed, the test host 610 determines whether the ic package 400 to be tested is good or bad, and sends the determination result to an external machine controller, and after the receiving groove 300 carrying the ic package 400 rotates to a position below the bad product unloading mechanism 700 or the good product unloading mechanism 800, the machine controller controls the second cylinder 740 and the suction cup 720 of the bad product unloading mechanism 700 or the good product unloading mechanism 800 to operate, so as to adsorb the ic package 400, and controls the manipulator 710 to rotate to a position above a material box of the ic package 400, and then controls the vacuum generator 750 to stop operating, so that the ic package 400 is automatically unloaded to the material box under the action of gravity.
Compared with the prior art, the beneficial effects of the utility model reside in that: through adopting carousel 200 formula structure, reduced the place space resource that whole device occupy greatly, moreover, whole device need not the manual work and goes up unloading one by one, and degree of automation improves greatly.
The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims (6)

1. A carousel type integrated circuit package testing apparatus, comprising: the base is rotatably provided with a turntable, the turntable is provided with four accommodating grooves for bearing an integrated circuit package, and the four accommodating grooves are positioned on the same circumferential track coaxial with the turntable; the base is provided with a vertical charging barrel, an electrical testing mechanism, a defective product discharging mechanism and a non-defective product discharging mechanism which respectively correspond to the four accommodating grooves.
2. The device for testing the rotating disk type integrated circuit package according to claim 1, wherein the inner wall of the receiving groove is vertically provided with first guide grooves corresponding to the plurality of test pins of the integrated circuit package one to one.
3. The apparatus for testing carousel-type integrated circuit packages as claimed in claim 2, wherein the inner wall of the vertical upper barrel is provided with second guide grooves which are aligned with the first guide grooves one by one.
4. The apparatus of claim 3, wherein the height of the ic package is greater than the depth of the receiving cavity, and a gap is formed between the lower end surface of the vertical upper barrel and the upper end surface of the ic package in the receiving cavity, wherein the gap is smaller than the thickness of the test pins of the ic package.
5. The carousel integrated circuit package testing apparatus of claim 3, wherein the power-up testing mechanism comprises: the test device comprises a test host, a support, a first air cylinder and an electricity connection block; the test host is fixed on the bracket, and the bracket is fixed on the base; the first cylinder is fixed on the support and drives the power connection block to vertically slide on the support, and the power connection block is located on the square of the circumferential track where the accommodating groove is located; the bottom end face of the electricity-connecting block is provided with a plurality of conducting blocks which correspond to the first guide grooves one to one, the conducting blocks can be inserted into the first guide grooves corresponding to the conducting blocks, and each conducting block is electrically connected with the test host.
6. The apparatus for testing a rotating disk type integrated circuit package according to claim 1, wherein the defective product unloading mechanism and the non-defective product unloading mechanism each comprise: a manipulator and a sucker; the manipulator is rotatably arranged on the base, and is provided with a lifting arm and a second cylinder for driving the lifting arm to move up and down; the sucking disc is established the bottom of lifing arm, be equipped with on the lifing arm with the vacuum generator that the sucking disc is connected.
CN202121279113.1U 2021-06-08 2021-06-08 Testing device for rotating disc type integrated circuit packaging part Active CN214812813U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121279113.1U CN214812813U (en) 2021-06-08 2021-06-08 Testing device for rotating disc type integrated circuit packaging part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121279113.1U CN214812813U (en) 2021-06-08 2021-06-08 Testing device for rotating disc type integrated circuit packaging part

Publications (1)

Publication Number Publication Date
CN214812813U true CN214812813U (en) 2021-11-23

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Application Number Title Priority Date Filing Date
CN202121279113.1U Active CN214812813U (en) 2021-06-08 2021-06-08 Testing device for rotating disc type integrated circuit packaging part

Country Status (1)

Country Link
CN (1) CN214812813U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116727259A (en) * 2023-08-15 2023-09-12 弘润半导体(苏州)有限公司 Integrated circuit test equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116727259A (en) * 2023-08-15 2023-09-12 弘润半导体(苏州)有限公司 Integrated circuit test equipment
CN116727259B (en) * 2023-08-15 2023-10-24 弘润半导体(苏州)有限公司 Integrated circuit test equipment

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Address after: Building A, Building 201, Yingdafeng Industrial Park, No. 393 Jihua Road, Shuijing Community, Jihua Street, Longgang District, Shenzhen City, Guangdong Province, 518100

Patentee after: Shenzhen Chuangxin Online Testing Service Co.,Ltd.

Address before: 518000 401, building a, yingdafeng Industrial Park, No. 393, Jihua Road, Jihua street, Longgang District, Shenzhen, Guangdong Province

Patentee before: Shenzhen insell Electronic Co.,Ltd.

CP03 Change of name, title or address