CN214797393U - Microwave module heat radiation structure - Google Patents
Microwave module heat radiation structure Download PDFInfo
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- CN214797393U CN214797393U CN202121459281.9U CN202121459281U CN214797393U CN 214797393 U CN214797393 U CN 214797393U CN 202121459281 U CN202121459281 U CN 202121459281U CN 214797393 U CN214797393 U CN 214797393U
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Abstract
The utility model relates to a heat radiation structure, concretely relates to microwave module heat radiation structure, including the installation apron, installation apron top is equipped with the external heating panel, installation apron bottom is equipped with inside heat conduction piece, the external heating panel tip is equipped with the water conservancy diversion piece that is used for guiding the distinguished and admirable entering gap between the adjacent external heating panel, inside is equipped with the heat conduction copper pipe of conducting heat, the installation apron is through first spring coupling heat conduction clamp plate, be equipped with the elastic heat conduction layer between heat conduction clamp plate and the installation apron, the last relatively fixed mounting piece that has of heat conduction copper pipe, set up on the inside heat conduction piece with the mounting piece sliding fit's mounting groove, be equipped with on the installation apron and be used for carrying out spacing stop gear to the mounting piece; the utility model provides a technical scheme can effectively overcome the relatively poor, inconvenient defect of changing the heat conduction copper pipe of radiating effect that prior art exists.
Description
Technical Field
The utility model relates to a heat radiation structure, concretely relates to microwave module heat radiation structure.
Background
For the existing microwave module, in order to reduce crosstalk, a design scheme that a signal transmission module and a power supply module are mutually independent and closed in space is mostly adopted, and in a closed space, the problem of heat dissipation is particularly important to solve. When the temperature is too high, the performance of the whole system is affected, for example, the frequency accuracy is high, and the power level changes with the temperature. Because the cavity structure of microwave signal transmission is designed through simulation optimization, it is inconvenient to change the structure in the aspect of heat dissipation, and therefore, the heat dissipation of the power module becomes more important in order to reduce the temperature.
The heat generated by the power module mainly comes from various chips, and because the normal working temperature of the chips can reach very high, most of the chips are not subjected to heat dissipation treatment, but the electrical property of the chips is changed when the chips work at high temperature. Similarly, too high temperature may also affect the performance of devices around the chip, and may possibly cause deformation and damage of the printed board due to uneven heating.
In addition, a heat conduction copper pipe is often adopted as a heat conduction device of the chip in the conventional power module for heat dissipation, but the position of the chip is also changed along with the continuous improvement and optimization of the internal structure of the power module, and the shape of the heat conduction copper pipe needs to be redesigned according to the position of the chip at the moment. However, the existing heat dissipation structure cannot effectively replace the heat conduction copper pipe, and great inconvenience exists in use.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
To the above-mentioned shortcoming that prior art exists, the utility model provides a microwave module heat radiation structure can effectively overcome the relatively poor, inconvenient defect of changing heat conduction copper pipe of radiating effect that prior art exists.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:
a microwave module heat radiation structure comprises an installation cover plate, wherein an external heat radiation plate is arranged at the top of the installation cover plate, an internal heat conduction block is arranged at the bottom of the installation cover plate, and a flow guide block for guiding wind flow to enter a gap between adjacent external heat radiation plates is arranged at the end part of the external heat radiation plate;
the mounting structure is characterized in that a heat conduction copper pipe is arranged inside the internal heat conduction block, the mounting cover plate is connected with the heat conduction pressing plate through a first spring, an elastic heat conduction layer is arranged between the heat conduction pressing plate and the mounting cover plate, the mounting block is relatively fixed on the heat conduction copper pipe, a mounting groove in sliding fit with the mounting block is formed in the internal heat conduction block, and a limiting mechanism used for limiting the mounting block is arranged on the mounting cover plate.
Preferably, the flow guide block is provided with a sliding part and an engagement surface, the end part of the external heat dissipation plate is respectively provided with a sliding groove and a fitting surface which are matched with the sliding part and the engagement surface, and the engagement surface is provided with a solder layer.
Preferably, the side surface of the flow guide block is provided with a flow guide surface and a flow guide surface which are connected.
Preferably, stop gear includes the slide rail of relatively fixed in installation apron bottom, with slide rail sliding connection's slider, connects the second spring between slider and inside heat conduction piece to and run through inside heat conduction piece lateral wall and with inside heat conduction piece sliding connection's limiting plate, inside heat conduction piece lateral wall seted up with limiting plate complex through-hole.
Preferably, the one end that is close to inside heat conduction piece on the slider is closed form, the other end of slider is open form, when the blind end contact slide rail of slider, the tip of limiting plate is located inside the through-hole.
Preferably, the heat conduction copper pipe is arranged in an S shape, and a first insulation heat conduction silicone grease layer and a second insulation heat conduction silicone grease layer are respectively stuck to the bottoms of the heat conduction copper pipe and the inner heat conduction block.
Preferably, the mounting cover plate, the external heat dissipation plate and the internal heat conduction block are of an integrated structure, and the external heat dissipation plate is uniformly arranged at intervals in the width direction of the mounting cover plate.
Preferably, the edge of the mounting cover plate is provided with a mounting screw hole.
(III) advantageous effects
Compared with the prior art, the heat-conducting copper pipe covered with the insulating heat-conducting silicone grease layer or the internal heat-conducting block can be directly contacted with a part with more generated heat, the heat conduction is more efficient, the temperature of the chip rises slowly, the external heat-radiating plate is fully contacted with air, the air flow generated by an external air source can be guided to enter a gap between adjacent external heat-radiating plates by virtue of the flow guide block, and the heat-radiating speed is effectively improved; utilize stop gear not only can prevent that heat conduction copper pipe and inside heat conduction piece from breaking away from, still be convenient for simultaneously install, dismantle heat conduction copper pipe to can in time change the heat conduction copper pipe of different shapes, make heat conduction copper pipe conduct the heat that the chip produced better, improve the radiating efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic side view of the present invention shown in FIG. 1;
fig. 3 is an enlarged schematic structural view of an end portion of the external heat dissipating plate in fig. 1 according to the present invention;
fig. 4 is a schematic top enlarged view of the end of the external heat sink in fig. 1 according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
A microwave module heat radiation structure, as shown in figure 1 and figure 2, comprises an installation cover plate 2, an external heat radiation plate 1 is arranged at the top of the installation cover plate 2, and an internal heat conduction block 3 is arranged at the bottom of the installation cover plate 2.
The edge of the mounting cover plate 2 is provided with a mounting screw hole 6, and the heat dissipation structure can be fixedly mounted at the top of the cavity structure storing the power supply module through the mounting screw hole 6.
In this application technical scheme, inside heat conduction piece 3's area is great, has guaranteed that its contact area's heat distributes evenly, has rationally protected the peripheral relevant components and parts of the position that generate heat. Furthermore, if there are more heat sources in this area, it means that heat dissipation processing can be performed on a plurality of heat sources at the same time.
Inside heat conduction copper pipe 5 that is equipped with of inside heat conduction piece 3, installation apron 2 connects heat conduction clamp plate 9 through first spring 8, is equipped with the elastic heat conduction layer between heat conduction clamp plate 9 and the installation apron 2, is relatively fixed with installation piece 10 on the heat conduction copper pipe 5, set up on the inside heat conduction piece 3 with installation piece 10 sliding fit's mounting groove 7, be equipped with on the installation apron 2 and be used for carrying out spacing stop gear to installation piece 10.
The heat conduction copper pipe 5 is arranged in an S shape, and a first insulation heat conduction silicone grease layer 4 and a second insulation heat conduction silicone grease layer 11 are respectively pasted at the bottoms of the heat conduction copper pipe 5 and the inner heat conduction block 3.
Among this application technical scheme, heat conduction copper pipe 5's appearance is mellow and smooth, and inside cavity to need be according to the suitable shape of position design that generates heat, so that heat conduction copper pipe 5 better with the position laminating that generates heat, heat conduction. In addition, the heat conduction copper pipes 5 can be distributed on the surface of the printed board, so that the whole printed board is heated uniformly, and the printed board is prevented from generating cracks due to nonuniform heating.
The inside heat conduction block 3 is provided with a mounting groove 7 of the heat conduction copper pipe 5, and the inside of the mounting groove 7 is provided with enough space to adapt to the height change of the heat conduction copper pipe 5. The heat conduction copper pipe 5 or the internal heat conduction block 3 which is covered with the insulating heat conduction silicone grease layer is directly contacted with the position with more heat generation, the heat conduction is more efficient, and the heat conduction silicone grease layer is of a soft structure, so that the circuit board and the device cannot be damaged, and the heat conduction copper pipe or the internal heat conduction block can also be fully contacted with the heating position for heat dissipation.
The height of the inner heat conducting block 3 is fixed, but it is possible to fully accommodate PCBs and chips of different package heights by means of the first spring 8. Due to the action of the elastic force of the spring, the heat conduction copper pipe 5 can be tightly attached to the heating part, the hardness of the heat conduction copper pipe 5 is low, and the circuit board in the cavity can be effectively prevented from being crushed.
An elastic heat conduction layer is arranged between the heat conduction pressing plate 9 and the mounting cover plate 2, and on one hand, the elastic heat conduction layer is arranged to increase the heat dissipation area between the heat conduction pressing plate 9 and the mounting cover plate 2, so that heat on the heat conduction copper pipe 5 is quickly transferred to the mounting cover plate 2 through the heat conduction pressing plate 9; on the other hand, the heat conducting copper pipe 5 is not prevented from moving upward inside the inner heat conducting block 3.
Stop gear is including being fixed in the slide rail 12 of 2 bottoms of installation apron relatively, with slide rail 12 sliding connection's slider 13, connect the second spring 14 between slider 13 and inside heat conduction piece 3 to and run through inside heat conduction piece 3 lateral walls and with inside heat conduction piece 3 sliding connection's limiting plate 15, inside heat conduction piece 3 lateral walls seted up with limiting plate 15 complex through-hole.
One end of the sliding block 13 close to the internal heat conducting block 3 is closed, the other end of the sliding block 13 is open, and when the closed end of the sliding block 13 contacts the sliding rail 12, the end part of the limiting plate 15 is located inside the through hole.
When the heat conducting copper pipe 5 needs to be replaced, the sliding block 13 is pulled outwards along the sliding rail 12 against the elastic force of the second spring 14. When the closed end of the sliding block 13 contacts the sliding rail 12, the end of the limiting plate 15 is located inside the through hole, and at this time, the mounting block 10 can be moved out from the bottom of the mounting groove 7, so that the heat conducting copper pipe 5 is separated from the inner heat conducting block 3.
The mounting block 10 is aligned to the mounting groove 7, a new heat conduction copper pipe 5 is placed into the internal heat conduction block 3, after the sliding block 13 is loosened, the limiting plate 15 returns to the original position under the elastic action of the second spring 14, and the limiting plate 15 blocks the mounting block 10.
As shown in fig. 3 and 4, the end of the external heat dissipation plate 1 is provided with a deflector 16 for guiding the wind flow into the gap between the adjacent external heat dissipation plates 1.
The deflector block 16 is provided with a sliding part 17 and an engagement surface 19, the end of the external heat sink 1 is provided with a sliding groove 18 and an engagement surface 20 which are respectively matched with the sliding part 17 and the engagement surface 19, and the engagement surface 19 is provided with a solder layer. The lateral surface of the guide block 16 is provided with a guide surface 21 and a guide surface 22 which are connected.
When the current guiding block 16 is mounted, the sliding part 17 is aligned with the sliding groove 18, the current guiding block 16 is moved to a proper position, so that the tangent plane of the end of the current guiding surface 22 and the side surface of the external heat dissipation plate 1 are in the same plane, and then the soldering work is performed by using the solder layer on the connecting surface 19.
The multi-sheet structure of the external heat dissipation plate 1 has a good heat dissipation effect in flowing air. To the microwave product, in being used for some quick-witted casees more, the quick-witted case outside all is provided with radiator fan, and the distinguished and admirable back that the radiator fan produced gets into the clearance between the adjacent external heating panel 1 through water conservancy diversion face 21, drainage face 22 to can take away the heat on the external heating panel 1 fast, further promote the radiating efficiency.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (8)
1. A microwave module heat radiation structure is characterized in that: the heat dissipation structure comprises a mounting cover plate (2), wherein an external heat dissipation plate (1) is arranged at the top of the mounting cover plate (2), an internal heat conduction block (3) is arranged at the bottom of the mounting cover plate (2), and a flow guide block (16) for guiding wind flow to enter a gap between adjacent external heat dissipation plates (1) is arranged at the end part of each external heat dissipation plate (1);
inside heat conduction copper pipe (5) of being equipped with of inside heat conduction piece (3), heat conduction clamp plate (9) is connected through first spring (8) in installation apron (2), be equipped with the elasticity heat-conducting layer between heat conduction clamp plate (9) and installation apron (2), be relatively fixed with installation piece (10) on heat conduction copper pipe (5), set up on inside heat conduction piece (3) with installation piece (10) sliding fit's mounting groove (7), be equipped with on installation apron (2) and be used for carrying out spacing stop gear to installation piece (10).
2. A microwave module heat dissipation structure as defined in claim 1, wherein: the heat dissipation plate is characterized in that a sliding part (17) and an engagement surface (19) are arranged on the flow guide block (16), a sliding groove (18) and a fit surface (20) which are matched with the sliding part (17) and the engagement surface (19) are respectively arranged at the end part of the external heat dissipation plate (1), and a solder layer is arranged on the engagement surface (19).
3. A microwave module heat dissipation structure as defined in claim 2, wherein: the side surface of the flow guide block (16) is provided with a flow guide surface (21) and a flow guide surface (22) which are connected.
4. A microwave module heat dissipation structure as defined in claim 1, wherein: stop gear is including being fixed in slide rail (12) of installation apron (2) bottom relatively, with slide rail (12) sliding connection's slider (13), connect second spring (14) between slider (13) and inside heat conduction piece (3) to and run through inside heat conduction piece (3) lateral wall and with inside heat conduction piece (3) sliding connection's limiting plate (15), inside heat conduction piece (3) lateral wall seted up with limiting plate (15) complex through-hole.
5. The microwave module heat dissipation structure of claim 4, wherein: the one end that is close to inside heat conduction piece (3) on slider (13) is closed form, the other end of slider (13) is open form, when the blind end contact slide rail (12) of slider (13), the tip of limiting plate (15) is located inside the through-hole.
6. A microwave module heat dissipation structure as defined in claim 1, wherein: the heat conduction copper pipe (5) is arranged in an S shape, and a first insulation heat conduction silicone grease layer (4) and a second insulation heat conduction silicone grease layer (11) are respectively pasted at the bottoms of the heat conduction copper pipe (5) and the inner heat conduction block (3).
7. A microwave module heat dissipation structure as defined in claim 1, wherein: the heat-radiating plate is characterized in that the mounting cover plate (2), the external heat-radiating plate (1) and the internal heat-conducting block (3) are of an integrated structure, and the external heat-radiating plate (1) is arranged at even intervals in the width direction of the mounting cover plate (2).
8. A microwave module heat dissipation structure as defined in claim 7, wherein: and the edge of the mounting cover plate (2) is provided with a mounting screw hole (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121459281.9U CN214797393U (en) | 2021-06-29 | 2021-06-29 | Microwave module heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121459281.9U CN214797393U (en) | 2021-06-29 | 2021-06-29 | Microwave module heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214797393U true CN214797393U (en) | 2021-11-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121459281.9U Active CN214797393U (en) | 2021-06-29 | 2021-06-29 | Microwave module heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214797393U (en) |
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2021
- 2021-06-29 CN CN202121459281.9U patent/CN214797393U/en active Active
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