CN214756345U - Satellite VDES receiving load signal machine - Google Patents

Satellite VDES receiving load signal machine Download PDF

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Publication number
CN214756345U
CN214756345U CN202120588401.9U CN202120588401U CN214756345U CN 214756345 U CN214756345 U CN 214756345U CN 202120588401 U CN202120588401 U CN 202120588401U CN 214756345 U CN214756345 U CN 214756345U
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module
cavity
radio frequency
baseband
power module
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CN202120588401.9U
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Chinese (zh)
Inventor
赵全
孔凡伟
王宇
张敏
钱婧怡
钱亚娜
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Shanghai Scientific Instrument Factory Co ltd
Shanghai Aerospace Electronics Co ltd
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Shanghai Scientific Instrument Factory Co ltd
Shanghai Aerospace Electronics Co ltd
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Abstract

The utility model discloses a satellite VDES receiving load letter machine includes baseband module, radio frequency module and power module, radio frequency module the baseband module with power module stacks in proper order, all adopts the cooperation of inlaying and ends the connected form of detaining the interlock between each module, and interconnect becomes a complete box. The utility model discloses a satellite VDES receiving load letter machine compact structure, occupation space is little.

Description

Satellite VDES receiving load signal machine
Technical Field
The utility model relates to a satellite load mechanical structure, concretely relates to satellite VDES receiving load letter machine.
Background
The VDES (very high frequency Data Exchange System) is an enhancement and upgrade of an existing marine navigation aid System AIS (Automatic Identification System), and in order to solve the problem of high link load caused by the increase of AIS users and the expansion of applications thereof, the VDES adds functions of ASM (Application Specific Messages) and VDE (very high frequency Data Exchange) on the basis of integrating the existing AIS services.
The VDES receiving load signal machine is an important component for realizing integrated communication of the ship shore's heaven', 'ground' and 'sea', and supports AIS, ASM and VDE uplink functions. During ship-satellite communication, after receiving a ship terminal signal, the VDES receiving load signal machine reports the demodulated AIS message, ASM message and VDE message to the whole satellite, and the demodulated AIS message, ASM message and VDE message are transmitted to the ground data center through the whole satellite number transmission subsystem, so that the uplink function and performance verification of the satellite-borne VDES system are completed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a satellite VDES receiving load letter machine, compact structure, occupation space is little.
In order to achieve the aim, the utility model provides a satellite VDES receiving load letter machine, including baseband module, radio frequency module and power module, radio frequency module the baseband module with power module stacks in proper order, all adopts the cooperation of inlaying and only detains the connection form of interlock between each module, and interconnect becomes a complete box.
The satellite VDES receiving load signal machine comprises a radio frequency module frame, a radio frequency module upper cavity, a radio frequency module upper cover plate, a radio frequency module lower cover plate and a radio frequency module printed board, wherein the radio frequency module comprises a radio frequency module frame body; a carrier frame is arranged in the radio frequency module frame body, and the radio frequency module printed board is placed on the carrier frame and connected with a frame of the radio frequency module frame body; the upper cavity of the radio frequency module is placed on the printed board of the radio frequency module and is connected with the frame of the frame body of the radio frequency module and the carrier frame; the radio frequency module upper cover plate and the radio frequency module lower cover plate are respectively connected to two ends of the radio frequency module frame body; and the radio frequency module frame body is provided with a connector SMA-F and a connector SMA.
The satellite VDES receiver comprises a satellite signal receiver, wherein the upper cover plate of the radio frequency module and/or the lower cover plate of the radio frequency module are/is provided with through holes.
The satellite VDES receiver load signal machine is characterized in that black anodic oxidation thermal control coatings are arranged on the surfaces of the radio frequency module frame body, the radio frequency module upper cover plate and the radio frequency module lower cover plate; the radio frequency module printed board and the radio frequency module frame body are fixed through screws, spring gaskets and flat gaskets, the contact area of each fixing position is larger than 6mm multiplied by 4mm, a copper layer covers the radio frequency module frame body of each fixing position, and finally the radio frequency module printed board and the radio frequency module frame body are fixedly sealed through silicon rubber.
The satellite VDES receiver comprises a load signal machine, wherein the baseband module comprises a baseband module cavity, a baseband module upper cover plate and a baseband module printed board; the baseband module cavity is of a rectangular cavity structure with an opening at one end and a closed end, and the upper cover plate of the baseband module is connected with the opening end of the baseband module cavity; a carrier component is arranged in the baseband module cavity, a baseband module printed board is placed on the carrier component, and the baseband module printed board is connected with the baseband module cavity and the carrier component; and a connector J30J-21ZKW, a connector J30J-9ZKW and a connector SMA are arranged on the frame of the cavity of the baseband module.
The satellite VDES receiving load signal machine is characterized in that the upper cover plate of the baseband module is provided with a through hole.
The satellite VDES receiver load signal machine is characterized in that the surfaces of the cavity of the baseband module and the upper cover plate of the baseband module are provided with black anodic oxidation thermal control coatings; the baseband module printed board and the baseband module cavity are fixed by screws, spring gaskets and flat gaskets, the contact area of each fixing position is larger than 6mm multiplied by 4mm, the baseband module cavity of each fixing position is covered with a copper layer, and finally the fixing and sealing are carried out by silicon rubber.
The satellite VDES receiving load signal machine comprises a power module cavity, a power module upper cover plate, a power module upper cavity, a power module small cavity and a power module printed board, wherein the power module comprises a power module cavity, a power module upper cover plate, a power module upper cavity, a power module small cavity and a power module printed board; the power module cavity is of a rectangular cavity structure with one open end and one closed end, and the upper cover plate of the power module is connected with the open end of the power module cavity; the power module printed board is placed in the power module cavity and connected with the frame of the power module cavity; the power module upper cavity is placed on the power module printed board and is connected with the frame and the closed end face of the power module cavity; the DCDC is arranged in the small cavity of the power supply module, and the small cavity of the power supply module is also arranged in the cavity of the power supply module; the frame of the power module cavity is provided with a connector J63A-222 and 009-TH and a connector J30JHTI5ZKD0ND 1.
The satellite VDES receiving load signal machine is characterized in that a through hole is formed in an upper cover plate of the power supply module; and black anodic oxidation thermal control coatings are arranged on the surfaces of the power module cavity and the power module upper cover plate.
In the satellite VDES receiving load signal machine, besides the surface of the power module cavity facing to the outside, the surfaces of the power module cavity and the power module upper cover plate are provided with black anodic oxidation thermal control coatings; the power module printed board and the power module cavity are fixed through screws, spring gaskets and flat gaskets, the contact area of each fixing position is larger than 6mm multiplied by 4mm, the power module cavity of each fixing position is covered with a copper layer, and finally the fixing and sealing are performed through silicon rubber.
Compared with the prior art, the utility model has the advantages that:
the satellite VDES receiving load signal machine of the utility model has the advantages that the radio frequency module, the baseband module and the power module are stacked in sequence, and all modules adopt the connection modes of embedding fit and snap-in of the stop buckle to be connected with each other to form a complete box body, so that the structure is compact and the occupied space is small;
the satellite VDES receiving load signal machine of the utility model adopts the screws, the spring gaskets and the flat gaskets to fix between the printed board and the casing, the contact area of each fixing part is larger than (6mm multiplied by 4mm), each fixing part is coated with a copper layer on the surface of the casing, and finally, the heat conduction is further enhanced by using the silicon rubber to seal;
the utility model discloses a satellite VDES receiving load letter machine, except that installation face (being the surface of power module cavity towards the outside), the product surface thermal control coating be black anodic oxidation, and its radiance is not less than 0.85, and this method has improved the radiance on product surface, is favorable to the heat to be discharged.
Drawings
The satellite VDES receiver load signal machine of the present invention is provided by the following embodiments and accompanying drawings.
Fig. 1 is a schematic structural diagram of a satellite VDES receiving load transceiver according to a preferred embodiment of the present invention.
Fig. 2 is an exploded view of the three-dimensional structure of the rf module according to the preferred embodiment of the present invention.
Fig. 3 is an exploded view of the three-dimensional structure of the baseband module according to the preferred embodiment of the present invention.
Fig. 4 is an exploded view of the three-dimensional structure of the power module according to the preferred embodiment of the present invention.
Detailed Description
The satellite VDES receiver load signal transmitter of the present invention will be described in further detail with reference to fig. 1 to 4.
Fig. 1 is a schematic structural diagram of a satellite VDES receiving load transceiver according to a preferred embodiment of the present invention.
Referring to fig. 1, the satellite VDES receiving load signal transmitter of this embodiment includes a baseband module 2, a radio frequency module 1 and a power module 3, the radio frequency module 1, the baseband module 2 and the power module 3 are stacked in sequence, and the modules are connected to each other in an embedded fit and snap-in connection manner, so as to form a complete box, which is compact in structure and occupies a small space. In this embodiment, the satellite VDES receiving load signal machine body has the following dimensions: 120mm × 120mm × 60mm, and the maximum outer envelope ruler is 150mm × 149.9mm × 64.6 mm.
Fig. 2 is an exploded view of the three-dimensional structure of the rf module according to the preferred embodiment of the present invention; fig. 3 is an exploded view of the three-dimensional structure of the baseband module according to the preferred embodiment of the present invention; fig. 4 is an exploded view of the three-dimensional structure of the power module according to the preferred embodiment of the present invention.
Referring to fig. 2 and fig. 1, the radio frequency module 1 includes a radio frequency module frame 13, a radio frequency module upper cavity 14, a radio frequency module upper cover plate 15, a radio frequency module lower cover plate 16, and a radio frequency module printed board (not shown in fig. 2);
the radio frequency module frame body 13 is used for bearing a radio frequency module printed board; the radio frequency module frame body 13 is a rectangular frame body structure, and comprises a rectangular frame 131 and a carrier frame 132; four corners of the rectangular frame 131 are respectively provided with an outer boss 133, and the outer bosses are provided with mounting holes; the carrier frame 132 is arranged in the rectangular frame 131 and connected with the rectangular frame 131; the radio frequency module printed board is placed on the carrier frame 132, and the edge of the radio frequency module printed board is connected with the rectangular frame 131; the upper cavity 14 of the radio frequency module is placed on the printed board of the radio frequency module, and the upper cavity 14 of the radio frequency module is connected with the carrier frame 132 and the rectangular frame 131; the structure of the carrier frame 132 and the structure of the upper cavity 14 of the radio frequency module are designed according to the circuit layout on the printed board of the radio frequency module, the carrier frame 132 and the upper cavity 14 of the radio frequency module clamp the printed board of the radio frequency module, and ensure that the printed board of the radio frequency module is stably installed in the rectangular frame 131, and the structure of the carrier frame 132 and the structure of the upper cavity 14 of the radio frequency module do not affect the circuit layout on the printed board of the radio frequency module (namely the structure of the carrier frame 132 and the structure of the upper cavity 14 of the radio frequency module do not collide with the circuit on the printed board of the radio frequency module), in addition, the structure of the carrier frame 132 and the structure of the upper cavity 14 of the radio frequency module can play an electric isolation role on different circuits on the printed board of the radio frequency module;
the rectangular frame 131 is provided with a connector SMA-F11 and a connector SMA 12, and the connection between the radio frequency module 1 and external equipment and the connection between the radio frequency module 1 and other modules of a satellite VDES load receiving signal machine are realized through the connector SMA-F11 and the connector SMA 12;
the radio frequency module upper cover plate 15 and the radio frequency module lower cover plate 16 are respectively connected to two ends of the radio frequency module frame body 13, and the radio frequency module upper cover plate 15, the radio frequency module lower cover plate 16 and the radio frequency module frame body 13 jointly form a closed cavity; according to the requirement, both the upper cover plate 15 and the lower cover plate 16 of the rf module can be provided with through holes (such as the through hole 161 in fig. 2), and the connectors on the printed board of the rf module are exposed through the through holes, so that the connection between the rf module 1 and other modules of the satellite VDES receiving transceiver can be conveniently realized.
Referring to fig. 3 and fig. 1, the baseband module 2 includes a baseband module cavity 24, a baseband module upper cover plate 25, and a baseband module printed board (not shown in fig. 3), the baseband module upper cover plate 25 is connected to an open end of the baseband module cavity 24, and the baseband module upper cover plate 25 and the baseband module cavity 24 together form a closed cavity;
the baseband module cavity 24 is a rectangular cavity structure with an open end and a closed end, and the baseband module upper cover plate 25 is connected with the open end of the baseband module cavity 24; four corners of the frame of the baseband module cavity 24 are respectively provided with an outer boss 242, and the outer bosses 242 are provided with mounting holes; a carrier member 241 is arranged in the baseband module cavity 24, a baseband module printed board is placed on the carrier member 241, the edge of the baseband module printed board is connected with the baseband module cavity 24, and the carrier member 241 is used for bearing the baseband module printed board; a connector J30J-21ZKW 21, a connector J30J-9ZKW 22 and a connector SMA 23 are arranged on the frame of the baseband module cavity 24, and the connection of the baseband module cavity 24 and external equipment and the connection of the baseband module cavity 24 and other modules of a satellite VDES receiving load signal machine are realized through the connectors J30J-21ZKW 21, the connectors J30J-9ZKW 22 and the connector SMA 23; the structure of the carrier member 241 is designed according to the circuit layout on the baseband module printed board;
the upper cover plate 25 of the baseband module may be provided with a through hole (e.g., the through hole 251 in fig. 3, the through hole 251 being opposite to the through hole 161 in fig. 2), so as to facilitate the connection between the baseband module 2 and other modules of the satellite VDES receiver.
Referring to fig. 4 and fig. 1, the power module 3 includes a power module cavity 34, a power module upper cover plate 35, a power module upper cavity 36, a power module small cavity 37, and a power module printed board (not shown in fig. 4);
the power module cavity 34 is a rectangular cavity structure with an opening at one end and a closed end, protrusions 341 are arranged on the inner surfaces of the frame and the closed end surface of the power module cavity 34, and mounting holes are arranged on the protrusions 341; the power module printed board is placed in the power module cavity 34 and is connected with the frame of the power module cavity 34 through screws and mounting holes on the frame protrusions; the power module upper cavity 36 is placed on the power module printed board, and the power module upper cavity 36 is connected with the frame and the closed end face of the power module cavity 34 through screws and mounting holes; the DCDC is arranged in the small power module cavity 37, and the small power module cavity 37 is arranged in the power module cavity 34; the power module upper cover plate 35 is connected with the open end of the power module cavity 34, and the power module upper cover plate 35 and the power module cavity 34 jointly form a closed cavity;
the frame of the power module cavity 34 is provided with connectors J63A-222 and 009 plus 261-TH 31 and a connector J30JHTI5ZKD0ND 132, and the power module 3 is connected with external equipment through the connectors J63A-222 and 009 plus 261-TH 31 and the connector J30JHTI5ZKD0ND 132.
Four corners of the frame of the power module cavity 34 are respectively provided with an outer boss 342, and the outer bosses 342 are provided with mounting holes; the frame of the power module cavity 34 is also provided with two outer bulges 33, and the outer bulges 33 are provided with mounting holes;
the upper cover plate 35 of the power module may be provided with a through hole (e.g., the through hole 351 in fig. 4), which facilitates the connection between the power module 3 and other modules of the satellite VDES receiving load signal machine.
Referring to fig. 1 to 4, the modules are stacked and connected through the mounting hole on the outer boss 133 of the radio frequency module frame 13, the mounting hole on the outer boss 242 of the baseband module cavity 24, the mounting hole on the outer boss 342 of the power module cavity 34, the screw 5, and the hexagon nut 6.
In the radio frequency module 1, the connector SMA 12 and the connector SMA-F11 are respectively arranged at two sides of the rectangular frame 131; in the baseband module 2, the connector J30J-21ZKW 21, the connector J30J-9ZKW 22 and the connector SMA 23 are respectively arranged at two sides of the frame of the baseband module cavity 24; after the modules are stacked and connected, the connectors SMA 12 and SMA 23 are positioned on the same side, and the connectors SMA-F11, J30J-21ZKW 21, J30J-9ZKW 22, J63A-222 and 009 261-TH 31 and J30JHTI5ZKD0ND 132 are positioned on the same side; the connector SMA 12 is connected with the connector SMA 23 through a connecting wire 41 and a two-way connector 42.
Thermal design measures
(1) Measure for enhancing heat conduction coupling of product shell and printed board
The whole structure of the product is mainly formed by stacking and combining three modules. Each module is divided into small boxes by milling thick aluminum alloy plates for placing printed boards, the edges of the printed boards are tightly connected with a product shell, the printed boards are fixed with the shell by 2mm screws, spring gaskets and flat gaskets, the contact area of each fixing part is larger than (6mm multiplied by 4mm), (the copper layer of each fixing part is covered on the surface of the shell), and finally, the heat conduction is further enhanced by fixedly sealing with silicon rubber.
(2) Thermal design of product structures
The bottom surface of the case (i.e. the surface of the power module cavity 34 facing outward) is a mounting surface and a heat conducting surface for connecting the product with the satellite structure, and needs to have sufficient contact area and certain roughness and flatness requirements to ensure good surface contact between the product and the satellite structure.
In order to facilitate heat dissipation, the thermal control coating on the surface of the product except the mounting surface is black anodized, the emissivity of the thermal control coating is not less than 0.85, and the method improves the emissivity of the surface of the product and is beneficial to heat dissipation.

Claims (10)

1. The satellite VDES receiving load signal machine is characterized by comprising a baseband module, a radio frequency module and a power supply module, wherein the radio frequency module, the baseband module and the power supply module are stacked in sequence, and all the modules are connected with each other in an embedded matching and fastening and snap-in connection mode to form a complete box body.
2. The satellite VDES rx payload transceiver of claim 1, wherein said rf module comprises an rf module frame, an rf module upper cavity, an rf module upper cover plate, an rf module lower cover plate, and an rf module printed board; a carrier frame is arranged in the radio frequency module frame body, and the radio frequency module printed board is placed on the carrier frame and connected with a frame of the radio frequency module frame body; the upper cavity of the radio frequency module is placed on the printed board of the radio frequency module and is connected with the frame of the frame body of the radio frequency module and the carrier frame; the radio frequency module upper cover plate and the radio frequency module lower cover plate are respectively connected to two ends of the radio frequency module frame body; and the radio frequency module frame body is provided with a connector SMA-F and a connector SMA.
3. The satellite VDES rx beacon of claim 2, wherein a through hole is provided in said rf module top cover and/or said rf module bottom cover.
4. The satellite VDES receiver loader of claim 2, wherein the rf module frame, the rf module upper cover plate, and the rf module lower cover plate have black anodized thermal control coatings on their surfaces; the radio frequency module printed board and the radio frequency module frame body are fixed through screws, spring gaskets and flat gaskets, the contact area of each fixing position is larger than 6mm multiplied by 4mm, a copper layer covers the radio frequency module frame body of each fixing position, and finally the radio frequency module printed board and the radio frequency module frame body are fixedly sealed through silicon rubber.
5. The satellite VDES rx payload transceiver of claim 1, wherein said baseband module comprises a baseband module cavity, a baseband module upper cover plate, and a baseband module printed board; the baseband module cavity is of a rectangular cavity structure with an opening at one end and a closed end, and the upper cover plate of the baseband module is connected with the opening end of the baseband module cavity; a carrier component is arranged in the baseband module cavity, a baseband module printed board is placed on the carrier component, and the baseband module printed board is connected with the baseband module cavity and the carrier component; and a connector J30J-21ZKW, a connector J30J-9ZKW and a connector SMA are arranged on the frame of the cavity of the baseband module.
6. The satellite VDES rx payload transceiver of claim 5, wherein said baseband module upper cover plate has through holes.
7. The satellite VDES receiver loader signal machine of claim 5, wherein the baseband module cavity and the baseband module upper cover plate surface are provided with a black anodized thermal control coating; the baseband module printed board and the baseband module cavity are fixed by screws, spring gaskets and flat gaskets, the contact area of each fixing position is larger than 6mm multiplied by 4mm, the baseband module cavity of each fixing position is covered with a copper layer, and finally the fixing and sealing are carried out by silicon rubber.
8. The satellite VDES payload transceiver of claim 1, wherein the power module comprises a power module cavity, a power module upper cover plate, a power module upper cavity, a power module small cavity, and a power module printed board; the power module cavity is of a rectangular cavity structure with one open end and one closed end, and the upper cover plate of the power module is connected with the open end of the power module cavity; the power module printed board is placed in the power module cavity and connected with the frame of the power module cavity; the power module upper cavity is placed on the power module printed board and is connected with the frame and the closed end face of the power module cavity; the DCDC is arranged in the small cavity of the power supply module, and the small cavity of the power supply module is also arranged in the cavity of the power supply module; the frame of the power module cavity is provided with a connector J63A-222 and 009-TH and a connector J30JHTI5ZKD0ND 1.
9. The satellite VDES payload transceiver of claim 8, wherein a through hole is provided in the power module upper cover plate; and black anodic oxidation thermal control coatings are arranged on the surfaces of the power module cavity and the power module upper cover plate.
10. The satellite VDES receiver loader signal machine of claim 8, wherein the surfaces of the power module cavity and the power module upper cover plate are provided with a black anodized thermal control coating in addition to the outwardly facing surface of the power module cavity; the power module printed board and the power module cavity are fixed through screws, spring gaskets and flat gaskets, the contact area of each fixing position is larger than 6mm multiplied by 4mm, the power module cavity of each fixing position is covered with a copper layer, and finally the fixing and sealing are performed through silicon rubber.
CN202120588401.9U 2021-03-23 2021-03-23 Satellite VDES receiving load signal machine Active CN214756345U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120588401.9U CN214756345U (en) 2021-03-23 2021-03-23 Satellite VDES receiving load signal machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120588401.9U CN214756345U (en) 2021-03-23 2021-03-23 Satellite VDES receiving load signal machine

Publications (1)

Publication Number Publication Date
CN214756345U true CN214756345U (en) 2021-11-16

Family

ID=78596372

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120588401.9U Active CN214756345U (en) 2021-03-23 2021-03-23 Satellite VDES receiving load signal machine

Country Status (1)

Country Link
CN (1) CN214756345U (en)

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