CN214756250U - Temperature compensation type crystal oscillator - Google Patents
Temperature compensation type crystal oscillator Download PDFInfo
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- CN214756250U CN214756250U CN202023271277.8U CN202023271277U CN214756250U CN 214756250 U CN214756250 U CN 214756250U CN 202023271277 U CN202023271277 U CN 202023271277U CN 214756250 U CN214756250 U CN 214756250U
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Abstract
The utility model relates to an electronic components technical field discloses a temperature compensation type crystal oscillator. Wherein, the temperature compensation type crystal oscillator includes: the ceramic base is arranged into a barrel-shaped structure with a bottom; the heat conducting metal sheet is connected with the ceramic base and is grounded through a first bonding pad on the ceramic base; the oscillating chip is attached to the surface of the heat-conducting metal sheet and can detect the temperature of the heat-conducting metal sheet; and the crystal is connected with the ceramic base and is electrically connected with the oscillation chip through a second bonding pad on the ceramic base, and the crystal is arranged above the heat-conducting metal sheet at intervals. The utility model provides a temperature compensation type crystal oscillator can make the temperature compensation who vibrates the chip synchronous with the temperature variation of crystal, and the temperature when the crystal heaies up and cools down is unanimous with the frequency curve, improves frequency stability and temperature stability.
Description
Technical Field
The utility model relates to an electronic components technical field especially relates to a temperature compensation type crystal oscillator.
Background
A temperature Compensated Crystal oscillator (also called as a temperature Compensated Crystal oscillator, abbreviated as tcxo (temperature Compensated Crystal oscillator) for short) is a Crystal oscillator that keeps the output frequency of the Crystal oscillator within a certain precision range through a certain compensation method (such as capacitance compensation, thermistor network compensation, etc.) within a certain temperature range. It has the features of good starting performance, low power consumption, high frequency-temperature stability, etc. and is used widely in various communication, navigation, radar, satellite positioning system, mobile communication, program controlled telephone exchange and electronic measuring instrument.
At present, as shown in fig. 1, the oscillation chip is generally directly disposed on the ceramic base, and the crystal 4 is mounted on the ceramic base in a suspension manner through the bonding pad, so that the speed of measuring the temperature change by the temperature sensor in the oscillation chip 5 is faster than the speed of measuring the temperature change of the crystal 4, and the temperature compensation of the oscillation chip 5 and the temperature change of the crystal have an asynchronous problem, which affects the frequency-temperature characteristic. In addition, the crystal 4 is thermally conducted by the bonding pad, so that the crystal 4 has a thermal gradient, and the temperature rise gradient and the temperature decrease gradient are just opposite to each other, so that the frequency during temperature rise and the frequency during temperature decrease are inconsistent at the same temperature, hysteresis is formed, and the frequency temperature stability is influenced.
Therefore, a temperature compensated crystal oscillator is needed to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
Based on above, an object of the utility model is to provide a temperature compensation type crystal oscillator for the temperature variation of the temperature compensation of vibrating the chip and crystal is synchronous, and the temperature when the crystal heaies up and cools down is unanimous with the frequency curve, improves frequency stability and temperature stability.
In order to achieve the purpose, the utility model adopts the following technical proposal:
provided is a temperature compensation type crystal oscillator including:
the ceramic base is arranged into a barrel-shaped structure with a bottom;
the heat conducting metal sheet is connected with the ceramic base and is grounded through a first bonding pad on the ceramic base;
the oscillating chip is attached to the surface of the heat-conducting metal sheet and can detect the temperature of the heat-conducting metal sheet; and
the crystal is connected with the ceramic base and is electrically connected with the oscillation chip through a second bonding pad on the ceramic base, and the crystal is arranged above the heat-conducting metal sheet at intervals.
As an optional scheme of the temperature compensation type crystal oscillator, the ceramic base includes a ceramic bottom plate and a ceramic side plate, the ceramic bottom plate is disposed at the bottom, the ceramic side plate is disposed around the periphery of the ceramic bottom plate, and the ceramic side plate and the ceramic bottom plate jointly form a chamber for placing the heat conducting metal sheet, the oscillation chip and the crystal.
As an alternative to the temperature compensated crystal oscillator, the ceramic base further comprises:
the first side pillar is arranged in the cavity, one end of the heat-conducting metal sheet is connected with the top of the first side pillar, and the first bonding pad is arranged at the top of the first side pillar.
As an alternative to the temperature compensated crystal oscillator, the ceramic base further comprises:
the second side strut is arranged in the cavity and opposite to the first side strut, one end of the crystal is connected with the top of the second side strut, and the second bonding pad is arranged at the top of the second side strut.
As an optional solution of the temperature compensation type crystal oscillator, the oscillation chip is disposed on the ceramic base plate, and an upper surface of the oscillation chip is attached to a lower surface of the heat conductive metal sheet.
As an alternative to the temperature compensation type crystal oscillator, the heat conductive metal sheet is provided below the crystal, and an area of the lower surface of the crystal exceeding four fifths overlaps the heat conductive metal sheet in the vertical direction.
As an optional scheme of the temperature compensation type crystal oscillator, a temperature sensor is arranged in the oscillation chip, and the temperature sensor is attached to the outer surface of the heat-conducting metal sheet.
As an optional solution of the temperature compensation type crystal oscillator, the method further includes: and the metal top shell is connected with the ceramic base in a sealing manner at the top of the ceramic base.
As an optional solution of the temperature compensation type crystal oscillator, the heat conducting metal sheet and the oscillation chip are connected through a heat conducting insulating adhesive.
The utility model has the advantages that:
the utility model provides a temperature compensation type crystal oscillator includes ceramic substrate, heat conduction sheetmetal, vibrates chip and crystal. When the ambient temperature outside the temperature compensation type crystal oscillator changes, because the heat conduction metal sheet is grounded, the temperature of the heat conduction metal sheet changes along with the ambient temperature at first, the heat conduction metal sheet is attached to the oscillation chip, because the metal heat conduction is fast, the temperature change can be quickly conducted to the oscillation chip, meanwhile, the area of the heat conduction metal sheet is large, the heat conduction metal sheet is very close to the crystal, the heat radiation effect is good, the temperature of the crystal can be effectively and uniformly and quickly changed along with the ambient temperature, the crystal and the oscillation chip can realize synchronous temperature sensing, the temperature compensation of the oscillation chip is synchronous with the temperature change of the crystal, the frequency stability is improved, meanwhile, the temperature gradient disappears, opposite gradients do not exist in temperature rising and temperature lowering, the temperature and the frequency curve in temperature rising and lowering are consistent, the hysteresis characteristic disappears, and the frequency temperature stability is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art temperature compensated crystal oscillator;
fig. 2 is a schematic structural diagram of a temperature compensated crystal oscillator according to the present invention.
In the figure:
1. a ceramic base plate; 2. a ceramic side plate; 3. a metal top shell; 4. a crystal; 5. oscillating the chip; 6. a heat conductive metal sheet; 7. a first side pillar; 8. a second side strut.
Detailed Description
In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 2, the present embodiment provides a temperature compensated crystal oscillator, which includes a ceramic base, a heat conducting metal sheet 6, an oscillating chip 5 and a crystal 4, wherein the ceramic base is configured as a barrel structure with a bottom; the heat-conducting metal sheet 6 is connected with the ceramic base and is grounded through a first bonding pad on the ceramic base; the oscillation chip 5 is attached to the surface of the heat-conducting metal sheet 6 and can detect the temperature of the heat-conducting metal sheet 6; the crystal 4 is connected with the ceramic base and is electrically connected with the oscillation chip 5 through a second bonding pad on the ceramic base, and the crystal 4 is arranged above the heat-conducting metal sheet 6 at intervals.
Particularly, when the outer ambient temperature of temperature compensation type crystal oscillator changes, because heat conduction sheetmetal 6 is ground connection, therefore its temperature changes along with ambient temperature at first, and heat conduction sheetmetal 6 is attached together with shaking chip 5, be close to with crystal 4 large tracts of land, because metal heat conduction is fast, temperature variation can conduct fast and shake chip 5, heat conduction sheetmetal 6 area is big simultaneously, it is very close to from crystal 4, the heat radiation effect is good, can effectively make crystal 4 temperature even with follow ambient temperature fast and change, make crystal 4 and shake chip 5 realize synchronous temperature sensing, the temperature compensation that makes to shake chip 5 is synchronous with crystal 4's temperature variation, frequency stability is improved. Meanwhile, when the temperature changes, the heat is mainly radiated to the crystal 4 through the heat conducting metal sheet 6, so that the temperature of each part of the crystal 4 is uniform, the temperature gradient disappears, and no opposite gradient exists in temperature rising and temperature lowering, so that the temperature and the frequency curve in temperature rising and temperature lowering are consistent, the hysteresis characteristic disappears, and the frequency temperature stability is improved.
Optionally, the ceramic base includes ceramic bottom plate 1 and ceramic curb plate 2, and ceramic bottom plate 1 locates the bottom, and ceramic curb plate 2 encloses the periphery of locating ceramic bottom plate 1, constitutes the cavity that is used for placing heat conduction sheetmetal 6, vibrates chip 5 and crystal 4 with ceramic bottom plate 1 jointly.
Optionally, the ceramic base further includes a first side pillar 7, the first side pillar 7 is disposed in the cavity, one end of the heat conducting metal sheet 6 is connected to the top of the first side pillar 7, and the first pad is disposed on the top of the first side pillar 7.
Optionally, the ceramic base further includes a second side pillar 8, the second side pillar 8 is disposed in the chamber and opposite to the first side pillar 7, one end of the crystal 4 is connected to the top of the second side pillar 8, and the second pad is disposed on the top of the second side pillar 8.
Optionally, the oscillation chip 5 is disposed on the ceramic base plate 1, and the upper surface of the oscillation chip 5 is attached to the lower surface of the heat-conducting metal sheet 6.
Optionally, the heat conducting metal sheet 6 is arranged below the crystal 4, the area of the lower surface of the crystal 4 exceeding four fifths is overlapped with the heat conducting metal sheet 6 in the vertical direction, and the heat conducting area of the crystal 4 and the heat conducting metal sheet 6 is enlarged as much as possible, so that the heat radiation efficiency between the crystal 4 and the heat conducting metal sheet 6 is improved.
Further, a temperature sensor is arranged in the oscillation chip 5 and attached to the outer surface of the heat-conducting metal sheet 6, so that the speed of detecting the temperature change by the temperature sensor is increased.
Optionally, the temperature compensated crystal oscillator further includes a metal top case 3, and the metal top case 3 and the ceramic base are hermetically connected to the top of the ceramic base to seal the chamber. Preferably, the metal top shell 3 is hermetically connected with the ceramic base under vacuum or pure nitrogen environment.
Preferably, the heat conducting metal sheet 6 is bonded to the oscillation chip 5 through a heat conducting insulating adhesive.
Preferably, the thickness of the heat-conducting metal sheet 6 does not exceed 2 mm.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (9)
1. A temperature compensated crystal oscillator, comprising:
the ceramic base is arranged into a barrel-shaped structure with a bottom;
the heat-conducting metal sheet (6) is connected with the ceramic base and is grounded through a first bonding pad on the ceramic base;
the oscillation chip (5) is attached to the surface of the heat-conducting metal sheet (6) and can detect the temperature of the heat-conducting metal sheet (6); and
the crystal (4) is connected with the ceramic base and is electrically connected with the oscillation chip (5) through a second bonding pad on the ceramic base, and the crystal (4) is arranged above the heat-conducting metal sheet (6) at intervals.
2. The temperature compensated crystal oscillator of claim 1, wherein the ceramic base comprises a ceramic bottom plate (1) and a ceramic side plate (2), the ceramic bottom plate (1) is disposed at the bottom, the ceramic side plate (2) is disposed around the periphery of the ceramic bottom plate (1), and forms a chamber for placing the heat conducting metal sheet (6), the oscillating chip (5) and the crystal (4) together with the ceramic bottom plate (1).
3. The temperature-compensated crystal oscillator of claim 2, wherein the ceramic base further comprises:
the first side supporting column (7) is arranged in the cavity, one end of the heat-conducting metal sheet (6) is connected with the top of the first side supporting column (7), and the first bonding pad is arranged at the top of the first side supporting column (7).
4. The temperature-compensated crystal oscillator of claim 3, wherein the ceramic base further comprises:
second side pillar (8), locate in the cavity, with first side pillar (7) set up relatively, the one end of crystal (4) with the top of second side pillar (8) is connected, the second pad is located the top of second side pillar (8).
5. The crystal oscillator of claim 2, wherein the oscillating chip (5) is disposed on the ceramic base plate (1), and an upper surface of the oscillating chip (5) is attached to a lower surface of the heat-conducting metal sheet (6).
6. A temperature compensated crystal oscillator according to claim 5, wherein the thermally conductive metal sheet (6) is provided below the crystal (4), and wherein an area of the lower surface of the crystal (4) exceeding four fifths overlaps the thermally conductive metal sheet (6) in the vertical direction.
7. The temperature compensated crystal oscillator of claim 1, wherein a temperature sensor is disposed in the oscillating chip (5), and the temperature sensor is attached to an outer surface of the heat-conducting metal sheet (6).
8. The temperature-compensated crystal oscillator of any one of claims 1-7, further comprising: and the metal top shell (3) is hermetically connected to the top of the ceramic base.
9. The temperature compensated crystal oscillator of any of claims 1-7, wherein the thermally conductive metal plate (6) and the oscillating chip (5) are bonded by a thermally conductive insulating adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023271277.8U CN214756250U (en) | 2020-12-30 | 2020-12-30 | Temperature compensation type crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023271277.8U CN214756250U (en) | 2020-12-30 | 2020-12-30 | Temperature compensation type crystal oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214756250U true CN214756250U (en) | 2021-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023271277.8U Active CN214756250U (en) | 2020-12-30 | 2020-12-30 | Temperature compensation type crystal oscillator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214756250U (en) |
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2020
- 2020-12-30 CN CN202023271277.8U patent/CN214756250U/en active Active
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Address after: 523000 Room 401 and 402, building 5, No. 24, industrial East Road, Songshanhu Park, Dongguan City, Guangdong Province Patentee after: Guangdong daguangxin Technology Co.,Ltd. Address before: 523808 the first, second and third floors of building 16, small and medium-sized science and technology enterprise Pioneer Park, North Industrial City, Songshanhu high tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: Guangdong Dapu Telecom Technology Co.,Ltd. |