CN214753725U

CN214753725U - Heat dissipation type memory chip

Info

Publication number: CN214753725U
Application number: CN202121539795.5U
Authority: CN
Inventors: 黄志雄; 李华峰; 潘承辽
Original assignee: Guangxi Georgia Industrial Co ltd
Current assignee: Guangxi Georgia Industrial Co ltd
Priority date: 2021-07-07
Filing date: 2021-07-07
Publication date: 2021-11-16
Anticipated expiration: 2031-07-07

Abstract

The utility model discloses a heat dissipation type memory chip, its structure includes memory chip main part, first heat abstractor, pin and second heat abstractor, memory chip main part top rigid coupling has first heat abstractor, memory chip main part left and right ends symmetry tin soldering has the pin, the utility model discloses have following beneficial effect, stabilize carbon fiber layer through first heat conduction glue film to provide preliminary radiating effect, the second heat conduction glue film stabilizes carbon fiber layer and magnalium alloy layer, and provides the radiating effect once more, has reached through carrying out the continuous heat extraction in the face position in order to improve the beneficial effect of heat-sinking capability; through set up second heat abstractor in the pin outside, stabilize the pin through third heat-conducting glue layer, absorb the heat to the position department of pin and memory chip main part soldering, again by the silica gel heat dissipation layer dispel the heat can to guarantee to connect the themogenesis protection of circular telegram position to different materials.

Description

Heat dissipation type memory chip

Technical Field

The utility model belongs to the technical field of the chip processing, in particular to heat dissipation type memory chip.

Background

The memory chip is a specific application of the concept of an embedded system chip in the memory industry. Therefore, no matter the system chip or the memory chip, the multifunctional and high-performance are realized by embedding software in a single chip, and the support to various protocols, various hardware and different applications is realized;

but the not good problem of radiating effect when this chip of prior art is used.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In order to overcome the defects of the prior art, the heat dissipation type storage chip is provided so as to solve the problem that the heat dissipation effect is poor when the chip is used, and the beneficial effect of continuously dissipating heat through the opposite position and the power connection position so as to improve the heat dissipation capacity is achieved.

(II) technical scheme

The utility model discloses a following technical scheme realizes: the utility model provides a heat dissipation type memory chip, including memory chip main part, first heat abstractor, pin and second heat abstractor, memory chip main part top rigid coupling has first heat abstractor, both ends symmetry soldering has the pin about the memory chip main part, the pin periphery is provided with second heat abstractor to the second heat abstractor sets up in the memory chip main part outside.

Further, first heat abstractor includes first heat-conducting glue film, fibrous layer, second heat-conducting glue film and magnalium alloy layer, first heat-conducting glue film top bonds with the fibrous layer, the fibrous layer top bonds with second heat-conducting glue film, second heat-conducting glue film top bonds and has magnalium alloy layer, first heat-conducting glue film bottom bonds with the memory chip main part.

Further, the second heat dissipation device comprises a third heat conduction adhesive layer and a silica gel heat dissipation layer, the silica gel heat dissipation layer is bonded on the outer side of the third heat conduction adhesive layer, the third heat conduction adhesive layer is arranged on the inner side of the outer surface of the pin, and the inner side of the third heat conduction adhesive layer is bonded with the storage chip main body.

(III) advantageous effects

Compared with the prior art, the utility model, following beneficial effect has:

1) through setting up first heat abstractor on storage chip main part top, stabilize carbon fiber layer through first heat-conducting glue film to provide preliminary radiating effect, second heat-conducting glue film stabilizes carbon fiber layer and magnalium alloy-layer, and provides radiating effect once more, has reached and has lasted the beneficial effect of heat extraction in order to improve the heat-sinking capability through face position.

2) Through set up second heat abstractor in the pin outside, stabilize the pin through third heat-conducting glue layer, absorb the heat to the position department of pin and memory chip main part soldering, again by the silica gel heat dissipation layer dispel the heat can to guarantee to connect the themogenesis protection of circular telegram position to different materials.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic front view of the structure of the present invention;

in the figure: the memory chip comprises a memory chip main body-1, a first heat dissipation device-2, pins-3, a second heat dissipation device-4, a first heat conduction adhesive layer-21, a carbon fiber layer-22, a second heat conduction adhesive layer-23, a magnesium aluminum alloy layer-24, a third heat conduction adhesive layer-41 and a silica gel heat dissipation layer-42.

Detailed Description

Referring to fig. 1 and 2, the present invention provides a heat dissipation type memory chip: the memory chip comprises a memory chip main body 1, a first heat dissipation device 2, pins 3 and a second heat dissipation device 4, wherein the first heat dissipation device 2 is fixedly connected to the top end of the memory chip main body 1, the pins 3 are symmetrically soldered to the left end and the right end of the memory chip main body 1, the second heat dissipation device 4 is arranged on the periphery of each pin 3, and the second heat dissipation device 4 is arranged on the outer side of the memory chip main body 1.

Wherein, first heat abstractor 2 includes first heat conduction glue film 21, carbon fiber layer 22, second heat conduction glue film 23 and magnalium alloy layer 24, first heat conduction glue film 21 top bonds with carbon fiber layer 22, carbon fiber layer 22 top bonds with second heat conduction glue film 23, second heat conduction glue film 23 top bonds and has magnalium alloy layer 24, first heat conduction glue film 21 bottom bonds with memory chip main part 1, lasts the beneficial effect of heat extraction in order to improve the heat-sinking capability through the counterpoint position according to the aforesaid.

Wherein, second heat abstractor 4 includes third heat conduction glue film 41 and silica gel heat dissipation layer 42, third heat conduction glue film 41 outside bonds and has silica gel heat dissipation layer 42, third heat conduction glue film 41 sets up in pin 3 surface inboard, third heat conduction glue film 41 is inboard to bond with memory chip main part 1, guarantees to the themogenesis protection of different material connection circular telegram positions according to the aforesaid.

The working principle is as follows: firstly, taking out the memory chip main body 1 and placing the memory chip main body at a processing position;

then, the first heat dissipation device 2 is arranged at the top end of the storage chip main body 1, the carbon fiber layer 22 is stabilized through the first heat conduction adhesive layer 21, a primary heat dissipation effect is provided, the second heat conduction adhesive layer 23 stabilizes the carbon fiber layer 22 and the magnesium-aluminum alloy layer 24, a secondary heat dissipation effect is provided, and the beneficial effect that the heat dissipation capability is improved by continuously dissipating heat to the face position is achieved;

finally, soldering the pins 3 to the left end and the right end of the memory chip main body 1, arranging a second heat dissipation device 4 outside the pins 3, stabilizing the pins 3 through a third heat conduction glue layer 41, absorbing heat at the soldering position of the pins 3 and the memory chip main body 1, and dissipating heat through a silica gel heat dissipation layer 42 to ensure heat generation protection of different material connection power-on positions.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A heat dissipation type memory chip is characterized in that: including memory chip main part (1), first heat abstractor (2), pin (3) and second heat abstractor (4), memory chip main part (1) top rigid coupling has first heat abstractor (2), both ends symmetry soldering has pin (3) about memory chip main part (1), pin (3) periphery is provided with second heat abstractor (4) to second heat abstractor (4) set up in the memory chip main part (1) outside.

2. The heat dissipating memory chip of claim 1, wherein: first heat abstractor (2) include first heat-conducting glue film (21), carbon fiber layer (22), second heat-conducting glue film (23) and magnalium alloy layer (24), first heat-conducting glue film (21) top bonds with carbon fiber layer (22), carbon fiber layer (22) top bonds with second heat-conducting glue film (23), second heat-conducting glue film (23) top bonds and has magnalium alloy layer (24), first heat-conducting glue film (21) bottom bonds with memory chip main part (1).

3. The heat dissipating memory chip of claim 1, wherein: second heat abstractor (4) include third heat conduction glue film (41) and silica gel heat dissipation layer (42), third heat conduction glue film (41) outside bonds and has silica gel heat dissipation layer (42), third heat conduction glue film (41) set up in pin (3) surface inboard, third heat conduction glue film (41) inboard bonds with memory chip main part (1).