CN214753710U

CN214753710U - Antistatic packaging structure for semiconductor chip

Info

Publication number: CN214753710U
Application number: CN202120820388.5U
Authority: CN
Inventors: 陈建鸿; 陈慧贞; 陈宜萱; 林圆香; 陈尹臻
Original assignee: Hefei Qiangyou Technology Co ltd
Current assignee: Hefei Qiangyou Technology Co ltd
Priority date: 2021-04-21
Filing date: 2021-04-21
Publication date: 2021-11-16
Anticipated expiration: 2031-04-21

Abstract

The utility model discloses an antistatic packaging structure for semiconductor chip, including the base plate, and the surface of base plate rises upwards and forms the standing groove that is used for placing semiconductor chip, detachable connections has the static protection casing that is used for semiconductor chip protection on the base plate, still includes fixed connection and is used for the fixed subassembly of pressing to semiconductor chip on the static protection casing, all set up on static protection casing and the base plate and carry out radiating ventilation hole to semiconductor chip, the bottom fixedly connected with of base plate increases the L type mounting panel in base plate bottom heat dissipation clearance. The utility model discloses an above-mentioned isotructure's cooperation has realized installing the semiconductor chip that can be simple quick, and the firm stability more of installation has also increased the clearance of base plate with the circuit board for the radiating effect is better, and at radiating in-process, plays dustproof effect.

Description

Antistatic packaging structure for semiconductor chip

Technical Field

The utility model relates to a semiconductor chip packaging technology field specifically is an antistatic packaging structure for semiconductor chip.

Background

The traditional semiconductor chip packaging method is generally a packaging process method of melting and injecting a packaging material which is solid at normal temperature into a mold at high temperature and high pressure and rapidly curing and molding again (5-50 seconds). In the packaging method, the packaged product needs to bear higher temperature and pressure in the processing process.

For example, chinese patent publication No. CN210092061U discloses a semiconductor chip package structure.

Because this packaging structure is comparatively loaded down with trivial details complicated to semiconductor chip's packaging process, also difficult to dismantle semiconductor chip in later stage, and this packaging structure's radiating effect is relatively poor, consequently needs to improve.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an antistatic packaging structure for semiconductor chip possesses can be simply quick and installs semiconductor chip, and the firm stability more of installation has also increased the clearance of base plate and circuit board for the radiating effect is better, and at radiating in-process, plays dustproof effect, has solved the problem of proposing among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: an antistatic packaging structure for semiconductor chips comprises a substrate, wherein a placing groove for placing the semiconductor chips is formed on the surface of the substrate in an upward protruding mode, and an electrostatic protection cover for protecting the semiconductor chips is detachably connected to the substrate.

Still include fixed connection and be used for the support pressure subassembly fixed to semiconductor chip on the electrostatic protection cover, all set up on electrostatic protection cover and the base plate and carry out radiating ventilation hole to semiconductor chip, the bottom fixedly connected with of base plate increases the L type mounting panel in base plate bottom heat dissipation clearance.

Preferably, the pressing component comprises a telescopic rod fixedly connected to the inner wall of the electrostatic protection cover, a pressing plate is fixedly connected to the bottom end of the telescopic rod, and a spring for pushing the pressing plate to fixedly press the semiconductor chip is sleeved on the telescopic rod.

Preferably, a first dust guard and a second dust guard are fixedly installed in the ventilation hole.

Preferably, the air holes in the first dust-proof plate and the second dust-proof plate are arranged in a staggered mode at intervals.

Preferably, the static protection cover, the first dust-proof plate and the second dust-proof plate can be made of PVC or PET sheets.

Preferably, the electrostatic protection cover is detachably connected to the substrate through screws.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the semiconductor chip can be simply and quickly installed and fixed, and convenience is provided for subsequent dismounting.

Second, through the setting of L type mounting panel, increased the clearance between basic and the circuit board, improved the mobility of base plate bottom air for the radiating effect is better, at radiating in-process, still plays dustproof antistatic effect.

Drawings

Fig. 1 is a front cross-sectional view of the present invention;

fig. 2 is an enlarged view of the structure of the present invention at a.

In the figure: 1. a substrate; 2. a semiconductor chip; 3. an electrostatic shield; 4. a vent hole; 5. an L-shaped mounting plate; 6. a telescopic rod; 7. pressing a plate; 8. a spring; 9. a first dust guard; 10. a second dust guard; 11. and (4) screws.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 2, the present invention provides a technical solution: an antistatic semiconductor chip packaging structure comprises a substrate 1, a placing groove for placing a semiconductor chip 2 is formed on the surface of the substrate 1 in an upward protruding mode, and an electrostatic protection cover 3 for protecting the semiconductor chip 2 is detachably connected to the substrate 1.

Still including fixed connection be used for on electrostatic protection casing 3 to semiconductor chip 2 fixed support the pressure subassembly, all set up on electrostatic protection casing 3 and the base plate 1 and carry out radiating ventilation hole 4 to semiconductor chip 2, the L type mounting panel 5 in 1 bottom heat dissipation clearance of base plate 1's bottom fixedly connected with increase base plate.

Support and press the subassembly to include fixed connection at the telescopic link 6 of 3 inner walls of electrostatic protection casing, the bottom fixedly connected with clamp plate 7 of telescopic link 6, the cover is equipped with on the telescopic link 6 and promotes clamp plate 7 and support to press fixed spring 8 to semiconductor chip 2.

When needs are installed fixedly to semiconductor chip 2, place semiconductor chip 2 in the standing groove on base plate 1 earlier, then cover electrostatic protection casing 3, the in-process of electrostatic protection casing 3 lid on semiconductor chip 2, can compression spring 8, make spring 8 can promote clamp plate 7 to support to press fixedly semiconductor chip 2 under the effect of elasticity, make semiconductor chip 2 can be stable firm be located base plate 1, screw 11 is screwed up to fix electrostatic protection casing 3 afterwards, and easy operation is convenient, it is convenient to provide subsequent dismouting.

Fixed mounting has dust guard 9 and dust guard two 10 in the ventilation hole 4, through the setting of dust guard 9 and dust guard two 10 for play dustproof effect to ventilation hole 4, avoided the dust in the air to enter into in the static protection casing 3.

The mutual interval of bleeder vent on dust guard one 9 and the dust guard two 10 is crisscross to be set up, and the interval through bleeder vent on dust guard one 9 and the dust guard two 10 is crisscross to be set up for when ventilation hole 4 is ventilating, can also play dustproof and prevent the effect of static.

The electrostatic protection cover 3, the first dust-proof plate 9 and the second dust-proof plate 10 can be made of PVC or PET thin plates, and the PVC or PET thin plates are good in antistatic effect.

The electrostatic shield 3 is detachably attached to the base plate 1 by screws 11.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An antistatic semiconductor chip packaging structure is characterized in that: the semiconductor chip protection device comprises a substrate (1), wherein a placing groove for placing a semiconductor chip (2) is formed by upwards protruding the surface of the substrate (1), and an electrostatic protection cover (3) for protecting the semiconductor chip (2) is detachably connected to the substrate (1);

still include fixed connection and be used for the support pressure subassembly fixed to semiconductor chip (2) on static protection casing (3), all set up on static protection casing (3) and base plate (1) and carry out radiating ventilation hole (4) to semiconductor chip (2), the bottom fixedly connected with of base plate (1) increases base plate (1) bottom heat dissipation clearance's L type mounting panel (5).

2. The package structure of claim 1, wherein: support and press the subassembly including fixed connection at the telescopic link (6) of static protection casing (3) inner wall, the bottom fixedly connected with clamp plate (7) of telescopic link (6), the cover is equipped with on telescopic link (6) and promotes clamp plate (7) and support to press fixed spring (8) to semiconductor chip (2).

3. The package structure of claim 1, wherein: and a first dust guard (9) and a second dust guard (10) are fixedly arranged in the ventilation hole (4).

4. The package structure of claim 3, wherein: the air holes in the first dust-proof plate (9) and the second dust-proof plate (10) are arranged in a staggered mode at intervals.

5. The package structure of claim 4, wherein: the electrostatic protection cover (3), the first dust guard (9) and the second dust guard (10) can be made of PVC or PET thin plates.

6. The package structure of claim 1, wherein: the electrostatic protection cover (3) is detachably connected to the substrate (1) through a screw (11).