CN214753653U - Quick packaging hardware of power chip - Google Patents
Quick packaging hardware of power chip Download PDFInfo
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- CN214753653U CN214753653U CN202121003466.9U CN202121003466U CN214753653U CN 214753653 U CN214753653 U CN 214753653U CN 202121003466 U CN202121003466 U CN 202121003466U CN 214753653 U CN214753653 U CN 214753653U
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Abstract
The utility model discloses a quick packaging hardware of power chip, including workstation and encapsulation subassembly, the top of workstation is installed the chip and is put the box, puts the chip that needs the encapsulation through the chip and puts the box, the both sides at workstation top all are provided with the vertical support, and two sets of the top of vertical support is provided with horizontal extension board, the below of horizontal extension board is provided with the encapsulation subassembly, the encapsulation subassembly includes encapsulation piece, telescopic cylinder, sealed gluey box, sealed gluey shower nozzle and storage box, the bottom of horizontal extension board is provided with the encapsulation piece, the top of encapsulation piece is provided with telescopic cylinder; the utility model discloses a mutually supporting between encapsulation piece, telescopic cylinder, sealed gluey box, sealed gluey shower nozzle and the storage box uses, can encapsulate fast power chip, for the handheld encapsulation on the market, the human cost has been practiced thrift to the efficiency of great improvement work, and need not artifical adjustment chip position, has improved stability.
Description
Technical Field
The utility model relates to a packaging hardware technical field especially relates to a power chip's quick packaging hardware.
Background
A chip generally refers to a carrier for an integrated circuit, and is the result of the integrated circuit after design, fabrication, packaging, and testing, and is usually a stand-alone entity that can be used immediately. The two terms "chip" and "integrated circuit" are often used together, for example, in the commonly discussed topic, the integrated circuit design and the chip design are said to have one meaning, and the chip industry and the IC industry are also said to have one meaning. In fact, there is a link between these two words and a distinction is made. Integrated circuit entities are often present in the form of chips;
the chip need encapsulate at the in-process of preparation, but current encapsulation equipment when encapsulating the chip, need place the chip on the iron core that the fixed plate corresponds, then seal the glue fixedly, need the position of artifical adjustment chip, work efficiency is lower, and the position that the chip was placed appears very easily is inaccurate, and then leads to sealing the glue failure, the extravagant cost, consequently, the utility model provides a power chip's quick packaging hardware is in order to solve the problem that exists among the prior art.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, an object of the present invention is to provide a power chip's quick packaging hardware, this power chip's quick packaging hardware uses through mutually supporting between encapsulation piece, telescopic cylinder, sealed gluey box, sealed gluey shower nozzle and the storage box, can carry out quick encapsulation to power chip, for the handheld encapsulation on the market, the efficiency of great improvement work.
For realizing the purpose of the utility model, the utility model discloses a following technical scheme realizes: a fast packaging device for a power supply chip comprises a workbench and a packaging assembly, wherein a chip placing box is installed at the top of the workbench, a chip to be packaged is placed through the chip placing box, vertical supporting columns are arranged on two sides of the top of the workbench, transverse supporting plates are arranged above two groups of the vertical supporting columns, the packaging assembly is arranged below the transverse supporting plates and comprises a packaging block, a telescopic cylinder, a sealing rubber box, a sealing rubber sprayer and a storage box, a packaging block is arranged at the bottom of the transverse supporting plate, the telescopic cylinder is arranged above the packaging block and arranged on the transverse supporting plates, the output end of the telescopic cylinder is connected with the top of the packaging block, the packaging block is driven to descend by the telescopic cylinder, the sealing rubber box is installed inside the packaging block, the sealing rubber sprayer is arranged at the bottom of the sealing rubber box and is arranged at the bottom of the packaging block, the inside of encapsulation piece is provided with the storage box, the sealed gluey box is all being connected to the both sides of storage box, puts the top coincidence of box through the encapsulation piece that descends and chip, utilizes sealed gluey shower nozzle to seal the encapsulation around the chip.
The further improvement lies in that: the heating cabinet has been seted up to the inside of workstation, the both sides of heating cabinet all are provided with the heating piece, and are two sets of be connected with the heating otter board between the heating piece, the heating otter board sets up around the heating cabinet, in heating the leading-in heating cabinet of heat through the heating piece, makes sealed glue in the heating cabinet seal fast, and sealed effect is better.
The further improvement lies in that: the bottom of heating block is connected with the lead wire, the bottom of lead wire is provided with the controller, carries out effectual control to the temperature through controller control heating block.
The further improvement lies in that: the both sides that the box was put to the chip are provided with the buffer board, the bottom of buffer board is provided with buffer spring, the inside that the box was put to the chip is provided with places the box, places the box through the transform and can carry out quick encapsulation to the chip of variation in size.
The further improvement lies in that: sliding sleeves are arranged on two sides of the packaging block, a sliding rod is arranged between the transverse support plate and the workbench, the sliding sleeves are sleeved on the sliding rod, and the sliding sleeves and the sliding rod are matched with each other for use.
The utility model has the advantages that: the utility model discloses an encapsulation piece, telescopic cylinder, sealed gluey box, mutually support between sealed gluey shower nozzle and the storage box and use, can encapsulate fast power chip, for handheld encapsulation on the market, the efficiency of great improvement work, the human cost has been practiced thrift, and need not artifical adjustment chip position, the stability has been improved, through the heating cabinet, the heating piece, the heating otter board, the mutually support between lead wire and the controller uses, can be to solidifying with higher speed at the fashioned sealed glue, great improvement sealed speed, also make the sealed effect of chip better.
Drawings
Fig. 1 is a front sectional view of the present invention;
FIG. 2 is a top view of the chip placing box of the present invention;
fig. 3 is a front schematic view of the present invention.
Wherein: 1. a work table; 2. a chip placing box; 3. a vertical support; 4. a transverse support plate; 5. packaging the block; 6. a telescopic cylinder; 7. a sealant box; 8. a sealant sprayer; 9. a storage box; 10. a heating box; 11. a heating block; 12. heating the screen plate; 13. a lead wire; 14. a controller; 15. a buffer plate; 16. a buffer spring; 17. placing the box; 18. a sliding sleeve; 19. a slide bar; 20. repairing the door; 21. a handle.
Detailed Description
In order to deepen the understanding of the present invention, the following embodiments will be combined to make the present invention do further details, and the present embodiment is only used for explaining the present invention, and does not constitute the limitation of the protection scope of the present invention.
Referring to fig. 1, 2 and 3, the embodiment provides a fast packaging device for a power chip, which includes a workbench 1 and a packaging assembly, wherein a chip placing box 2 is installed on the top of the workbench 1, a chip to be packaged is placed through the chip placing box 2, vertical pillars 3 are respectively arranged on both sides of the top of the workbench 1, two groups of vertical pillars 3 are provided with a horizontal support plate 4 above the vertical pillars 3, the packaging assembly is arranged below the horizontal support plate 4, the packaging assembly includes a packaging block 5, a telescopic cylinder 6, a sealant box 7, a sealant nozzle 8 and a storage box 9, a packaging block 5 is arranged at the bottom of the horizontal support plate 4, a telescopic cylinder 6 is arranged above the packaging block 5, the telescopic cylinder 6 is arranged on the horizontal support plate 4, and the output end of the telescopic cylinder 6 is connected to the top of the packaging block 5, the packaging block 5 is driven to descend by the telescopic cylinder 6, the internally mounted of encapsulation piece 5 has sealed gluey box 7, the bottom of sealed gluey box 7 is provided with sealed gluey shower nozzle 8, and sealed gluey shower nozzle 8 sets up in the bottom of encapsulation piece 5, the inside of encapsulation piece 5 is provided with storage box 9, sealed gluey box 7 is all being connected to the both sides of storage box 9, puts the top coincidence of box 2 through encapsulation piece 5 and the chip that descends, utilizes sealed gluey shower nozzle 8 to carry out sealed package around the chip.
The bottom of heating block 11 is connected with lead wire 13, the bottom of lead wire 13 is provided with controller 14, carries out effectual control to the temperature through controller 14 control heating block 11.
The both sides that box 2 was put to the chip are provided with buffer board 15, the bottom of buffer board 15 is provided with buffer spring 16, the inside that box 2 was put to the chip is provided with places box 17, places box 17 through the transform and can encapsulate the chip of variation in size fast.
The front of encapsulation piece 5 is provided with maintenance door 20, the front of maintenance door 20 is provided with handle 21, opens maintenance door 20 through handle 21 and loads to inside storage case 9.
When this power chip's quick packaging hardware used, put box 2 through the chip and place the chip that needs the encapsulation, drive encapsulation piece 5 through telescopic cylinder 6 and descend, put the top coincidence of box 2 through encapsulation piece 5 and the chip that descends, utilize sealed gluey shower nozzle 8 to seal the encapsulation around the chip, through heating block 11 heating with the leading-in heating cabinet 10 of heat, make sealed glue quick seal in the heating cabinet 10, sealed effect is better, carry out effectual control to the temperature through 14 control heating block 11 of controller, it can carry out quick encapsulation to the chip of variation in size to place box 17 through the transform.
The utility model discloses a encapsulation piece 5, telescopic cylinder 6, sealed gluey box 7, mutually support between sealed gluey shower nozzle 8 and the storage box 9 and use, can encapsulate fast power chip, for handheld encapsulation on the market, the efficiency of great improvement work, the human cost has been practiced thrift, and need not artifical adjustment chip position, the stability has been improved, through heating cabinet 10, heating block 11, heating otter board 12, mutually support between lead wire 13 and the controller 14 uses, can solidify with higher speed sealed glue at the shaping, great improvement sealed speed, also make the sealed effect of chip better.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides a quick packaging hardware of power chip, includes workstation (1) and encapsulation subassembly, its characterized in that: the packaging device is characterized in that a chip placing box (2) is installed at the top of the workbench (1), chips to be packaged are placed through the chip placing box (2), vertical support columns (3) are arranged on two sides of the top of the workbench (1), transverse support plates (4) are arranged above two groups of vertical support columns (3), a packaging assembly is arranged below each transverse support plate (4) and comprises a packaging block (5), a telescopic cylinder (6), a sealing glue box (7), a sealing glue sprayer (8) and a storage box (9), a packaging block (5) is arranged at the bottom of each transverse support plate (4), a telescopic cylinder (6) is arranged above each packaging block (5), the telescopic cylinder (6) is arranged on each transverse support plate (4), the output end of each telescopic cylinder (6) is connected with the top of each packaging block (5), and each packaging block (5) is driven to descend through each telescopic cylinder (6), the internally mounted of encapsulation piece (5) has sealed gluey box (7), the bottom of sealed gluey box (7) is provided with sealed gluey shower nozzle (8), and sealed gluey shower nozzle (8) set up the bottom in encapsulation piece (5), the inside of encapsulation piece (5) is provided with storage box (9), sealed gluey box (7) are all being connected to the both sides of storage box (9), and the top coincidence of putting box (2) through encapsulation piece (5) and the chip that descend utilizes sealed gluey shower nozzle (8) to carry out sealed package around the chip.
2. The fast packaging device of the power chip as claimed in claim 1, wherein: heating cabinet (10) have been seted up to the inside of workstation (1), the both sides of heating cabinet (10) all are provided with heating block (11), and are two sets of be connected with between heating block (11) and heat otter board (12), heating otter board (12) set up around heating cabinet (10), through heating block (11) heating with heat leading-in heating cabinet (10), make sealed glue in heating cabinet (10) seal fast, sealed effect is better.
3. The fast packaging device of the power chip as claimed in claim 2, wherein: the bottom of heating piece (11) is connected with lead wire (13), the bottom of lead wire (13) is provided with controller (14), carries out effectual control to the temperature through controller (14) control heating piece (11).
4. The fast packaging device of the power chip as claimed in claim 1, wherein: the both sides that box (2) were put to the chip are provided with buffer board (15), the bottom of buffer board (15) is provided with buffer spring (16), the inside that box (2) were put to the chip is provided with places box (17), places box (17) through the transform and can encapsulate the chip of variation in size fast.
5. The fast packaging device of the power chip as claimed in claim 1, wherein: sliding sleeves (18) are arranged on two sides of the packaging block (5), a sliding rod (19) is arranged between the transverse support plate (4) and the workbench (1), the sliding sleeves (18) are sleeved on the sliding rod (19), and the sliding sleeves (18) and the sliding rod (19) are matched with each other for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121003466.9U CN214753653U (en) | 2021-05-09 | 2021-05-09 | Quick packaging hardware of power chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121003466.9U CN214753653U (en) | 2021-05-09 | 2021-05-09 | Quick packaging hardware of power chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214753653U true CN214753653U (en) | 2021-11-16 |
Family
ID=78620816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121003466.9U Active CN214753653U (en) | 2021-05-09 | 2021-05-09 | Quick packaging hardware of power chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214753653U (en) |
-
2021
- 2021-05-09 CN CN202121003466.9U patent/CN214753653U/en active Active
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