CN214746569U - Camera heat abstractor based on semiconductor refrigeration mode - Google Patents
Camera heat abstractor based on semiconductor refrigeration mode Download PDFInfo
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- CN214746569U CN214746569U CN202120334715.6U CN202120334715U CN214746569U CN 214746569 U CN214746569 U CN 214746569U CN 202120334715 U CN202120334715 U CN 202120334715U CN 214746569 U CN214746569 U CN 214746569U
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Abstract
The utility model relates to a camera heat abstractor, concretely relates to camera heat abstractor based on semiconductor refrigeration mode has solved the heat abstractor structure complicacy to and the not stable problem of imaging quality inadequately. The camera comprises a camera imaging unit and a semiconductor heat dissipation unit. The camera imaging unit comprises a camera shell, a camera back plate, a camera front plate, a lens flange, a detector circuit board, a detector, a first circuit board and a second circuit board. The camera front plate, the camera shell and the camera back plate are fixedly connected with each other to form a cavity. The semiconductor heat dissipation unit is arranged in the cavity and comprises a semiconductor refrigeration block, a heat dissipation block, a heat insulation gasket and two fans. The cold end of the semiconductor refrigerating block is attached to the back of the detector at the opening of the detector circuit board through heat-conducting silicone grease, and the hot end of the semiconductor refrigerating block is attached to the heat dissipation block through heat-conducting silicone grease. The detector is provided with a temperature sensor, and the operation modes of the semiconductor refrigeration block and the fan are adjusted through the controller according to the measured temperature.
Description
Technical Field
The utility model relates to a camera heat abstractor, concretely relates to camera heat abstractor based on semiconductor refrigeration mode.
Background
At present, common heat dissipation modes of common cameras include water cooling, air cooling, semiconductor refrigeration and the like. The water-cooling heat dissipation occupies too large volume and weight; in air cooling heat dissipation, the air duct has great influence on heat dissipation efficiency, and the air duct is blocked or is turned at a right angle to generate vortex, so that the air cooling heat dissipation effect is easily reduced; compared with an air cooling or water cooling mode, the semiconductor refrigeration can increase the temperature potential difference between the cold end and the hot end through the voltage applied to the two ends of the semiconductor, so that the temperature of the cold end is greatly reduced, and the hot end is cooled by matching with air cooling/water cooling, so that a good heat dissipation effect can be realized. Compared with a single air cooling or water cooling mode, the refrigerating surface of the semiconductor refrigeration is not limited by the ambient temperature or the water temperature, and the temperature control of the surface to be cooled can be ensured. Although the semiconductor refrigeration effect is better, compared with other common modes, the structure of the semiconductor refrigeration device is more complex. And if the hot end heat dissipation mode design is not ideal, cold end frosting can be caused, the detector is affected with the problems of moisture and the like, and the imaging quality of the camera detector is affected.
Disclosure of the invention
The utility model aims at solving the problem that the camera heat abstractor structure that utilizes the semiconductor refrigeration mode is complicated to and the imaging quality is not stable enough, and provide a camera heat abstractor based on the semiconductor refrigeration mode.
In order to achieve the above purpose, the utility model provides a technical scheme as follows:
a camera heat abstractor based on semiconductor refrigeration mode which characterized in that: the camera imaging unit comprises a camera shell, a camera rear plate, a camera front plate, a lens flange, a detector circuit board, a detector, a first circuit board and a second circuit board; the camera front plate, the camera shell and the camera rear plate are fixedly connected with each other to form a cavity which is used as a support of the whole device;
the lens and the detector are sequentially arranged along the propagation direction of a light path, the lens is fixed outside the front camera plate through a lens flange, and a trimming pad is arranged between the lens flange and the front camera plate; the detector circuit board is arranged in the camera shell, a detector is arranged on the detector circuit board, and a contact area of the detector circuit board and the detector is provided with an opening; the first circuit board and the second circuit board are inserted at two ends of the detector circuit board;
the semiconductor heat dissipation unit is arranged in the cavity and comprises a semiconductor refrigeration block, a heat dissipation block and two fans; the semiconductor refrigeration block is arranged in the camera shell, the cold end of the semiconductor refrigeration block is attached to the back of the detector at the opening through heat-conducting silicone grease, and the hot end of the semiconductor refrigeration block is attached to the heat dissipation block through heat-conducting silicone grease; the two fans are arranged on the camera shell, the inside and the outside of the camera shell are communicated and are vertical to the first circuit board and the second circuit board, and the heat dissipation block is arranged in an area formed by the two fans, the first circuit board and the second circuit board; the heat dissipation block is provided with a comb-shaped channel along the wind direction;
and a temperature sensor is arranged on the detector, and the operation modes of the semiconductor refrigeration block and the fan are adjusted through a controller according to the measured temperature.
Furthermore, the heat dissipation block is provided with a mounting hole and is mounted on a bracket in the camera shell through a fastening screw, and a heat insulation gasket is arranged between the heat dissipation block and the camera shell; the semiconductor refrigerating block is fixed between the radiating block and the detector circuit board.
Furthermore, the two fans have the same air supply direction, air enters from one side and exits from the other side, the two fans penetrate through the comb-shaped channel of the heat dissipation block, an air field is formed inside the camera, the two fans are controlled by the same controller, and the operation modes are kept consistent.
Furthermore, the upper half part of the radiating block along the cross section of the wind direction is of a semicircular structure, the lower half part of the radiating block is of a square structure, and the comb-tooth-shaped channel of the radiating block forms a circular profile, and the diameter of the channel is the same as that of the fan.
Furthermore, wind shields are arranged between the heat dissipation block and the first circuit board and between the heat dissipation block and the second circuit board, and the wind shields are fixed on two sides of the camera rear plate.
Furthermore, the middle of the wind shields at the two sides is provided with an arch bridge-shaped rear cover which is higher than the heat dissipation block.
Furthermore, the first circuit board and the second circuit board are fixed on the camera shell through copper columns.
The utility model has the advantages that:
1. the structure is compact and simple, space is reserved for heat dissipation, and the heat dissipation effect is good. The detector circuit board is provided with holes in a contact area with the back of the detector, so that the semiconductor refrigeration block is ensured to be in full contact with the back of the detector, and the heat generated by the detector is led out to the maximum extent. The semiconductor refrigeration of the heat dissipation device is matched with air cooling to cool the hot end of the semiconductor refrigeration block, so that a good heat dissipation effect is realized. In addition, the first circuit board and the second circuit board are inserted at two ends of the detector circuit board and are perpendicular to the two fans, and space is reserved for the semiconductor heat dissipation unit while necessary functions are achieved.
2. The imaging quality is good. The heat dissipation device is provided with a temperature sensor on the detector, and the operation modes of the semiconductor refrigeration block and the fan are adjusted through the controller according to the measured temperature, so that the detector works in a relatively stable temperature environment, and the imaging signal-to-noise ratio is improved.
3. The air channel is optimized, and the function of the fan is exerted to the maximum extent. The heat dissipation device is provided with two independent fans, the two independent fans are installed on the camera shell and are communicated with the inside and the outside of the camera shell, the effect of air outlet on one side of air supply is achieved, the two fans adopt the same controller, and the purpose of controlling the air speed and the air quantity is achieved by controlling the power of the fans. In addition, according to the air supply range of the fan, the radiating block is uniquely designed, the upper half part of the radiating block along the cross section of the wind direction is of a semicircular structure, the lower half part of the radiating block is of a square structure, and the radiating block is provided with a comb-tooth-shaped channel along the wind direction, so that the effect of air cooling is ensured. In addition, the upside in wind channel also adopts the arch bridge design, and the left and right sides is equipped with the deep bead respectively, prevents that hot-blast from blowing on first circuit board and the second circuit board, increases its circuit heat. Whole wind channel is from the air inlet to the air-out, except the bellied scale of radiating block, does not have unnecessary hindrance.
Drawings
Fig. 1 is a structural diagram of an embodiment of a camera heat dissipation device based on a semiconductor refrigeration method according to the present invention;
fig. 2 is a partial internal structure diagram of an embodiment of a camera heat dissipation device based on a semiconductor refrigeration method according to the present invention;
the reference numbers are as follows:
1-lens flange, 2-detector circuit board, 3-semiconductor refrigeration block, 4-heat insulation gasket, 5-first circuit board, 6-camera shell, 7-fan, 8-camera back plate, 9-second circuit board, 10-heat dissipation block, 11-detector, 12-camera front plate, 13-lens, 14-trimming pad, 15-wind shield and 16-rear cover.
Detailed Description
The technical solution of the present invention will be clearly and completely described with reference to the accompanying drawings.
As shown in fig. 1 and 2, a camera heat dissipation device based on a semiconductor cooling method includes a camera imaging unit and a semiconductor heat dissipation unit. The semiconductor heat dissipation unit is located inside the camera imaging unit and controls the temperature of the imaging detector 11.
The camera imaging unit comprises a camera housing 6, a camera back plate 8, a camera front plate 12, a lens 13, a lens flange 1, a detector circuit board 2, a detector 11, a first circuit board 5 and a second circuit board 9. The camera front plate 12, the camera housing 6 and the camera back plate 8 are fixed to each other by screws to form a cavity as a support of the whole device.
The lens 13 and the detector 11 are sequentially arranged according to the propagation direction of a light path, the lens 13 is fixed outside the camera front plate 12 through the lens flange 1, the trimming pad 14 is arranged between the lens flange 1 and the camera front plate 12, and the relative distance between the lens 13 and the detector 11 is adjusted by changing the thickness of the trimming pad 14.
The detector circuit board 2 and the detector 11 are installed in the cavity, the detector circuit board 2 is installed on the camera shell 6 through fastening screws, and the detector 11 is welded on the detector circuit board 2. In order to facilitate heat dissipation, the contact area between the detector circuit board 2 and the detector 11 is provided with an opening. The first circuit board 5 and the second circuit board 9 are vertically inserted into the pins at two ends of the detector circuit board 2, so that a space is reserved for heat dissipation while necessary functions are realized. The first circuit board 5 and the second circuit board 9 are fixed to the camera housing 6 by 4 copper cylinders for circuit board stabilization.
The semiconductor heat dissipation unit is arranged in the cavity and comprises a semiconductor refrigeration block 3, a heat dissipation block 10 and two fans 7. The semiconductor refrigeration block 3 is installed in the camera shell 6, the cold end of the semiconductor refrigeration block is attached to the back of the detector 11 through the opening of the heat-conducting silicone grease on the detector circuit board 2, and the hot end of the semiconductor refrigeration block 3 is attached to the heat dissipation block 10 through the heat-conducting silicone grease. Because the contact area of the detector circuit board 2 and the detector 11 is provided with the open pore, the cold end of the semiconductor refrigeration block 3 is ensured to be fully contacted with the back of the detector 11, the heat generated by the detector 11 is led out to the maximum extent, and the semiconductor refrigeration block 3 is convenient to install. Two fans 7 are mounted on the camera housing 6 and are perpendicular to the first and second circuit boards 5, 9. The heat dissipation block 10 is placed in the area formed by the two fans 7 and the first and second circuit boards 5 and 9. The heat dissipation block 10 is provided with a comb-shaped channel along the wind direction. The semiconductor refrigeration block 3 does not have an installation position, the semiconductor refrigeration block 3 is fixed through the positions of the heat dissipation block 10 and the detector circuit board 2, an installation hole is formed in the heat dissipation block 10, the heat dissipation block is installed on a support in the camera shell 6 through fastening screws, and a heat insulation gasket 4 is arranged between the heat dissipation block 10 and the camera shell 6 to prevent heat of the heat dissipation block from being transmitted to the camera shell. In order to ensure the uniform distribution of the heat-conducting silicone grease, when the heat dissipation block 10 is installed, each installation hole is required to be stressed uniformly, in the fixing process, the force applied to the fastening screw on the heat dissipation block 10 is appropriately grasped, the thickness of the heat-conducting silicone grease is ensured, and the heat dissipation is not facilitated when the heat-conducting silicone grease is too thick or too thin.
The detector 11 is provided with a temperature sensor, and the operation modes of the semiconductor refrigeration block 3 and the fan 7 are adjusted through the controller according to the measured temperature so as to obtain the effect of adjusting the stable temperature. Two fans 7 air supply direction is the same, and one side air inlet, one side air outlet form a wind field in camera inside, and two fans 7 adopt same controller, and the operational mode keeps unanimous.
In order to ensure the heat dissipation effect of the air duct, the air duct is specially designed, flow field analysis is carried out on the air duct by using fluent software according to the size and the rotating speed of the selected fan 7, the intensity and the range of air disturbance generated by the fan 7 at each rotating speed are determined, and the heat dissipation block 10 and the air duct are designed on the basis. The upper half part of the radiating block 10 is of a semicircular structure, the lower half part of the radiating block 10 is of a square structure, comb-tooth-shaped channels of the radiating block 10 form a circular profile, the diameter of the channels is the same as that of the fan 7, the fan 7 is guaranteed to generate wind with the highest intensity, and the wind passes through the multiple channels on the radiating block 10, no redundant space exists, and the reduction of the radiating effect in the wind blowing direction cannot be caused. And then the air channel is designed in a closed way, the principle is to ensure that air enters from the fan 7 on one side and blows out from the fan 7 on the other side as much as possible, and the two sides of the heat dissipation block 10 are designed in a closed way to ensure that heated air cannot escape to the first circuit board 5 and the second circuit board 9. Wind shields 15 are arranged between the heat dissipation block 10 and the first circuit board 5 and between the heat dissipation block and the second circuit board 9, the wind shields 15 are fixed on two sides of the camera rear plate 8, an arch bridge-shaped rear cover 16 is arranged between the wind shields 15 on two sides, the rear cover 16 is higher than the heat dissipation block 10, and the wind shields 15 on two sides and the rear cover 16 form a closed heat dissipation wind guide groove. The rear cover 16 is designed in an arch shape, so that the air energy loss caused by the vortex at the right-angle turning position is reduced. Meanwhile, the design of the fan 7 with air inlet at one side and air outlet at the other side is adopted, so that the air convection is enhanced, and the temperature control effect is improved.
The specific temperature control process is as follows:
(1) the heat of the probe 11 is transmitted to the heat radiation block 10. The contact area of the detector circuit board 2 and the detector 11 is provided with an opening, so that the cold end of the semiconductor refrigerating block 3 is fully contacted with the back of the detector 11, the heat generated by the detector 11 is led out to the maximum extent, and the hot end of the semiconductor refrigerating block 3 is contacted with the radiating block 10 through heat-conducting silicone grease, so that the heat on the detector 11 is led to the radiating block 10.
(2) The heat dissipation block 10 dissipates heat. The heat dissipation device is specially designed for an air channel, and is provided with two independent fans 7 which are respectively arranged on two sides of a camera shell 6 to achieve the effect of air outlet on one side of air supply, wherein the fans 7 are controlled by the same controller, and the purpose of controlling the air speed and the air quantity is achieved by controlling the operation mode of the fans 7. Secondly, according to the air supply range of the fan 7, the heat dissipation block 10 is uniquely designed, the upper half part of the heat dissipation block 10 is of a semicircular structure, the lower half part of the heat dissipation block 10 is of a square structure, a plurality of comb-tooth-shaped channels are arranged in the middle of the heat dissipation block 10, the channels form a circular profile, the diameter of the channels is the same as that of the fan 7, and the air cooling effect is guaranteed. Meanwhile, the air duct is optimally designed, wind shields 15 are arranged between the heat dissipation block 10 and the first circuit board 5 and between the heat dissipation block and the second circuit board 9, hot air is prevented from blowing to the circuit boards on two sides, the heat of the circuit is increased, and an arch bridge-shaped rear cover 16 is arranged between the wind shields 15 on two sides. The whole air channel has no redundant obstruction except the fins raised by the radiating block 10 from air inlet to air outlet, and the air channel is optimized, so that the function of the fan 7 is exerted to the maximum extent, and the phenomena of vortex, air leakage and the like are prevented.
(3) And (6) measuring and controlling temperature. According to the refrigeration principle of the semiconductor refrigeration block, when the hot end temperature of the semiconductor refrigeration block is higher, the cold end temperature of the semiconductor refrigeration block is also higher, and the temperature is gradually increased along with the increase of the hot end temperature; when the temperature of the hot end of the semiconductor refrigerating block is lower, the temperature of the cold end is very low and even lower than 0 ℃, so that the problems of frost condensation and the like are caused. Therefore, in order to ensure the heat dissipation effect without frost condensation, the heat dissipation block 10 needs to be designed to be temperature-controlled to operate the detector 11 in a relatively stable temperature environment. The detector 11 is provided with a temperature sensor, the principle of temperature control is to control the power output to the fan 7 according to the actually measured temperature, for example, the surface temperature of the detector 11 is set to be 20 +/-3 ℃, when the temperature of the detector 11 is not higher than 23 ℃, the semiconductor refrigerating block 3 does not need to be electrified, the temperature gradually exceeds the preset temperature along with the increase of the temperature of the detector 11, the semiconductor refrigerating block 3 is electrified at the moment, when the temperature continues to rise and the heat at the hot end of the semiconductor refrigerating block 3 needs to be dissipated, the power is supplied to the fan 7, the heat dissipation efficiency can be controlled by adjusting the power of the fan 7, in order to reduce the burden of a program, the surface temperature of the detector 11 is collected at intervals, and then adjustment is carried out until the temperature is stable.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a camera heat abstractor based on semiconductor refrigeration mode which characterized in that: the camera comprises a camera imaging unit and a semiconductor heat dissipation unit;
the camera imaging unit comprises a camera shell (6), a camera rear plate (8), a camera front plate (12), a lens (13), a lens flange (1), a detector circuit board (2), a detector (11), a first circuit board (5) and a second circuit board (9); the camera front plate (12), the camera shell (6) and the camera rear plate (8) are fixedly connected with each other to form a cavity which is used as a support of the whole device;
a lens (13) and a detector (11) are sequentially arranged along the propagation direction of a light path, the lens (13) is fixed outside a camera front plate (12) through a lens flange (1), and a trimming pad (14) is arranged between the lens flange (1) and the camera front plate (12); the detector circuit board (2) is arranged in the camera shell (6), a detector (11) is arranged on the detector circuit board, and an opening is formed in the contact area of the detector circuit board and the detector; the first circuit board (5) and the second circuit board (9) are inserted at two ends of the detector circuit board (2);
the semiconductor heat dissipation unit is arranged in the cavity and comprises a semiconductor refrigeration block (3), a heat dissipation block (10) and two fans (7); the semiconductor refrigerating block (3) is arranged in the camera shell (6), the cold end of the semiconductor refrigerating block is attached to the back of the detector (11) at the position of the opening through heat-conducting silicone grease, and the hot end of the semiconductor refrigerating block (3) is attached to the heat radiating block (10) through heat-conducting silicone grease; the two fans (7) are arranged on the camera shell (6), the inside and the outside of the camera shell (6) are communicated and are vertical to the first circuit board (5) and the second circuit board (9), and the radiating block (10) is arranged in an area formed by the two fans (7), the first circuit board (5) and the second circuit board (9); the heat dissipation block (10) is provided with a comb-shaped channel along the wind direction;
and a temperature sensor is arranged on the detector (11), and the operation modes of the semiconductor refrigeration block (3) and the fan (7) are adjusted through a controller according to the measured temperature.
2. The camera heat dissipation device based on the semiconductor refrigeration mode as claimed in claim 1, wherein: the heat dissipation block (10) is provided with a mounting hole and is mounted on a bracket in the camera shell (6) through a fastening screw, and a heat insulation gasket (4) is arranged between the heat dissipation block (10) and the camera shell (6); the semiconductor refrigeration block (3) is fixed between the heat dissipation block (10) and the detector circuit board (2).
3. The camera heat dissipation device based on the semiconductor refrigeration mode as claimed in claim 2, wherein: the two fans (7) have the same air supply direction, air enters from one side and exits from the other side, the air passes through the comb-shaped channel of the heat dissipation block (10), an air field is formed inside the camera, the two fans (7) are controlled by the same controller, and the operation modes are kept consistent.
4. The camera heat dissipation device based on the semiconductor refrigeration mode as claimed in claim 3, wherein: the upper half part of the radiating block (10) along the cross section of the wind direction is of a semicircular structure, the lower half part of the radiating block is of a square structure, and the comb-tooth-shaped channel of the radiating block (10) forms a circular profile, and the diameter of the comb-tooth-shaped channel is the same as that of the fan (7).
5. The camera heat dissipation device based on the semiconductor refrigeration mode as claimed in any one of claims 1 to 4, wherein: and wind shields (15) are arranged between the radiating block (10) and the first circuit board (5) and between the radiating block and the second circuit board (9), and the wind shields (15) are fixed on two sides of the camera rear plate (8).
6. The camera heat dissipation device based on the semiconductor refrigeration mode as claimed in claim 5, wherein: the middle of the wind shields (15) at two sides is provided with an arch bridge-shaped rear cover (16), and the rear cover (16) is higher than the radiating block (10).
7. The camera heat dissipation device based on the semiconductor refrigeration mode as claimed in claim 6, wherein: the first circuit board (5) and the second circuit board (9) are fixed on the camera shell (6) through copper columns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120334715.6U CN214746569U (en) | 2021-02-05 | 2021-02-05 | Camera heat abstractor based on semiconductor refrigeration mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120334715.6U CN214746569U (en) | 2021-02-05 | 2021-02-05 | Camera heat abstractor based on semiconductor refrigeration mode |
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| Publication Number | Publication Date |
|---|---|
| CN214746569U true CN214746569U (en) | 2021-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120334715.6U Active CN214746569U (en) | 2021-02-05 | 2021-02-05 | Camera heat abstractor based on semiconductor refrigeration mode |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116507076A (en) * | 2022-11-29 | 2023-07-28 | 赛诺威盛科技(北京)股份有限公司 | Detector CT guide rail structure and CT scanning equipment |
-
2021
- 2021-02-05 CN CN202120334715.6U patent/CN214746569U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116507076A (en) * | 2022-11-29 | 2023-07-28 | 赛诺威盛科技(北京)股份有限公司 | Detector CT guide rail structure and CT scanning equipment |
| CN116507076B (en) * | 2022-11-29 | 2024-01-05 | 赛诺威盛科技(北京)股份有限公司 | Detector CT guide rail structure and CT scanning equipment |
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