CN113432730A - Anti-frosting low-temperature surface source black body - Google Patents
Anti-frosting low-temperature surface source black body Download PDFInfo
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Abstract
The invention discloses an anti-frosting low-temperature surface source black body which comprises a shell, a black body plate, a semiconductor refrigerator, a temperature control assembly, a heat dissipation assembly and a power module, wherein the black body plate, the semiconductor refrigerator, the temperature control assembly, the heat dissipation assembly and the power module are arranged in the shell; the front end of the black plate is provided with an anti-frosting component arranged on the shell, and the temperature control component is suitable for being connected with an external computer and calculating according to PID parameters to adjust the power of the semiconductor refrigerator. The invention can effectively protect the low-temperature surface source black body, avoid surface frosting and simultaneously improve the temperature accuracy and stability of the low-temperature surface source black body.
Description
Technical Field
The invention relates to the technical field of optical characteristics, in particular to an anti-frosting low-temperature surface source black body.
Background
A black body is an ideal object with emissivity and absorptivity of 1, i.e. it can absorb all wavelengths of radiation at any temperature and emit radiation to the maximum. In reality there is no ideal black body, but a device black body manufactured on the same principle can be used to approximately replace the black body.
The equipment black body is widely applied to calibration of measuring equipment such as a thermal infrared imager, a spectrometer and the like. According to the test targets of the measurement equipment such as the thermal imager and the spectrometer, the temperature sections of the black body used for infrared calibration are different. Because the calibration blackbody equipment is exposed in the air for use, when a calibration experiment below zero centigrade is carried out, water vapor in the air is condensed to the surface of the blackbody due to the large temperature difference between the air and the radiation surface of the blackbody to form frosting, and the accuracy of a measurement result is questioned because the response sensitivity of the thermal imager is greatly influenced by the frosting, so that the calibration blackbody equipment cannot be used as a calibration traceability basis of the infrared equipment.
Because the follow-up temperature transmission of direct influence of the temperature accuracy of low temperature face source blackbody, in order to prevent that low temperature during operation air and face source blackbody surface from carrying out heat convection, produce the condition of frosting, and influence the check-up of instrument temperature, the scheme that commonly uses has three: the first method is to directly blow dry gas to the surface of the surface source black body, and the scheme has the advantages that the anti-frosting effect is obvious, but the surface temperature change of the surface source black body is obvious and the temperature accuracy is not high due to the difference between the nitrogen temperature and the surface source black body temperature; the second is to encapsulate the surface of the surface source black body in a box filled with dry nitrogen and seal the surface source black body by an optical window, and the scheme has the advantages that the design is simple, but because the transmittance of the optical window cannot be 1, the temperature error of the window is introduced, the measurement result needs to be corrected when being calculated, and on the other hand, the processing cost is high because the transmittance of the optical window is more than 0.99; the third is to place the surface source black body and the measured system in the cover filled with nitrogen, the scheme has the advantages that no other device introduces temperature error between the measured system and the surface source black body, but various measured systems with various volumes can appear due to various types of the measured systems, and the distance between the measured system and the surface source black body is far and near, the scheme can need to install various covers aiming at various measured systems, and the cost is high due to various types and large volume.
In addition, traditional low temperature surface source blackbody, its temperature controller adopt the mode control semiconductor cooler of pulse voltage output, because the voltage waveform on the semiconductor cooler is square pulse, and temperature control power has the sudden change, leads to temperature stability not high, and general stability is 1 ℃ moreover, because the voltage sudden change, can reduce semiconductor cooler's life-span.
Therefore, how to improve the temperature accuracy and stability of the low-temperature surface source black body becomes a considerable part of the research on the low-temperature surface source black body.
Disclosure of Invention
The invention aims to provide the anti-frosting low-temperature surface source black body aiming at the defects in the prior art, so that the low-temperature surface source black body is effectively protected, the surface frosting is avoided, and the temperature accuracy and stability of the low-temperature surface source black body can be improved.
The technical scheme for realizing the aim of the invention is as follows:
an anti-frosting low-temperature surface source black body comprises a shell, a black body plate, a semiconductor refrigerator, a temperature control assembly, a heat dissipation assembly and a power module, wherein the black body plate, the semiconductor refrigerator, the temperature control assembly, the heat dissipation assembly and the power module are arranged in the shell; the front end of the black plate is provided with an anti-frosting component arranged on the shell, and the temperature control component is suitable for being connected with an external computer and calculating according to a Proportion Integration Differentiation (PID) parameter to adjust the power of the semiconductor refrigerator.
Further, the PID parameters include proportional P (proportionality), integral i (integral), and derivative d (derivative), the P parameter can be proportional to the deviation signal of the control system in real time, and once the deviation is generated, the controller immediately generates the control action to reduce the deviation. As the offset value increases, the overshoot of the closed loop system increases, and the response speed of the system increases, but when the offset value increases to a certain extent, the system becomes unstable. The parameter I is mainly used for eliminating the static error and improving the non-difference of the system, and the larger the parameter I is, the smaller the overshoot of the closed-loop system is, and the slower the response speed of the system becomes. The parameter D can reduce overshoot, overcome oscillation, improve the stability of the system, accelerate the dynamic response speed of the system, and reduce the adjustment time, thereby improving the dynamic performance of the system. Proper adjustment P, I, D of the parameters can lead to good performance of the whole control system. PID is operated according to the function relation of proportion P, integral I and differential D according to the input deviation value, the operation result is used for controlling output, and the deviation of the controlled object can be effectively corrected through the combination of P, I, D, so that the controlled object can reach a stable state.
Further, the temperature control assembly comprises a temperature controller and a temperature sensor electrically connected with the temperature controller, the temperature sensor is provided with a plurality of temperature sensors and inserted into different positions of the black board for acquiring the temperature of the black board, the rear end of the shell is provided with a communication interface electrically connected with the temperature controller, and the temperature controller is connected with an external computer through the communication interface. The temperature controller is controlled by a computer, temperature correction is carried out on multiple temperature points, and the accuracy of the temperature is ensured; meanwhile, the temperature controller can adjust the voltage of the semiconductor refrigerator and change the relative voltage on the positive lead and the negative lead of the semiconductor refrigerator, so that the voltage direction is changed, the relative voltage value between the positive lead and the negative lead of the temperature controller can be positive or negative, the wiring direction does not need to be changed when the environmental temperature is changed by a user, and the semiconductor refrigerator is automatically controlled to realize refrigeration/heating.
Further, the temperature controller is a digital display temperature controller and controls the semiconductor refrigerator in a direct current voltage mode, and the model is TCM 1031. The digital display temperature controller is adopted, so that parameters such as voltage, temperature and the like of the temperature controller can be observed and set more conveniently; the temperature controller adopts a direct-current voltage mode, firstly calculates an output voltage, then converts the power supply voltage into the required output voltage by a voltage conversion device of the temperature controller, has small temperature control power fluctuation by adopting the mode, can realize the resolution of 0.01 ℃ and the stability of +/-0.01 ℃, simultaneously has an automatic setting function, can automatically calculate an optimized PID coefficient, simplifies the setting difficulty of the PID coefficient, and obtains the temperature control performance of high speed, small overshoot and less oscillation, thereby prolonging the service life of the semiconductor refrigerator.
Furthermore, the anti-frosting assembly comprises a protective front cover, an air curtain and a base plate which are fixedly connected in sequence, and the base plate is fixedly arranged on the shell and is positioned at the front end of the black plate; a window clapboard is movably arranged on the protective front cover; and the gas curtain is provided with a gas inlet. When the system to be tested needs to be calibrated, the window partition plate is drawn out, external air enters the air curtain through the air inlet and forms an air curtain, so that the convection heat exchange between air and the black body plate can be effectively prevented, the black body plate is effectively protected, and the surface frosting is avoided; when the measured system is calibrated, the window clapboard is inserted into the protective front cover in time, so that the temperature error caused by introducing an optical window is avoided, and the accuracy of the measuring result is ensured.
Further, one side that the backing plate is close to the air curtain is equipped with the seal groove, be equipped with sealed the pad in the seal groove, can effectively isolated air, avoid outside air to get into low temperature face source black body surface from the installation clearance between air curtain and the backing plate, improve measuring accuracy.
Furthermore, the air curtain comprises a frame and a cavity which is arranged in the frame and is connected with the air inlet, and the inner wall of the frame is provided with a plurality of small holes communicated with the cavity. The gas curtain is filled with nitrogen gas through the gas inlet, and the nitrogen gas is sprayed out from each small hole, so that an even gas curtain is formed on the surface of the surface source black body, the air and the surface of the black body plate can be effectively prevented from carrying out heat convection, the anti-frosting effect is further improved, and the defects of obvious surface temperature change and low temperature accuracy caused by directly blowing dry gas to the surface of the black body plate are overcome.
Furthermore, the heat dissipation assembly comprises a heat dissipation fin assembly, a heat dissipation fin cover plate, a heat dissipation air channel and a heat dissipation fan which are fixedly arranged at the rear end of the semiconductor refrigerator in sequence; the left side and the right side of the shell are provided with heat dissipation holes, and the heat dissipation fin assembly and the heat dissipation fin cover plate extend to the heat dissipation holes on the left side and the right side; the radiating fin cover plate is provided with a through hole, the radiating air duct is communicated with the radiating fin assembly through the through hole, and the rear end of the shell is provided with an air outlet which is opposite to the radiating air duct. Outside air flows through the radiating fin assembly from the radiating holes on the two sides of the shell under the action of the radiating fan, and is discharged from the air outlet at the rear end of the shell through the radiating air duct.
Furthermore, the power module comprises a switch power supply fixedly installed at the bottom end inside the shell, a power supply interface electrically connected with the switch power supply is arranged at the rear end of the shell, and a start-stop switch electrically connected with the power supply interface is arranged at the front end of the shell. The power supply interface supplies power to the start-stop switch, the start-stop switch supplies power to the switch power supply, and the whole system is controlled to start and stop, so that the whole power supply module is simple in design and safe to use.
Further, a heat insulation assembly is arranged between the black plate and the shell as well as between the semiconductor refrigerator and the shell; the heat insulation assembly comprises a heat insulation layer wrapped on the peripheral surfaces of the black body plate and the semiconductor refrigerator and a heat insulation plate arranged between the front end of the black body plate and the shell. Effectively insulating black board and semiconductor cooler and external air convection to and the heat transfer between black board and the casing, thereby ensure the measurement accuracy when equipment is used for infrared calibration.
Furthermore, the heat insulation plate is an FR-4 epoxy plate, has good machinability and excellent heat resistance and heat insulation performance; the heat preservation is polyurethane, has excellent heat-proof quality.
Furthermore, the black plate is made of aluminum materials, so that the heat conducting performance is good, a plurality of pyramidal protrusions are uniformly distributed on the front surface of the black plate, and the effective emissivity is high.
By adopting the technical scheme, the invention has the following beneficial effects:
(1) the semiconductor refrigerator is controlled to work by adjusting the temperature control assembly through the computer, the power of the semiconductor refrigerator is adjusted by calculating according to the PID parameters, and the temperature stability is improved; simultaneously be equipped with the subassembly that frosts that prevents who installs on the casing at the front end of blackboard board, effectively protect low temperature face source blackbody, avoid the surface to frost, can improve the temperature accuracy of low temperature face source blackbody to convenient to use.
(2) The temperature control assembly comprises a temperature controller and a plurality of temperature sensors, the temperature controller is connected with an external computer through a communication interface, the connection is convenient, the temperature controller is controlled through the computer, temperature correction is carried out on a plurality of temperature points, and the accuracy of the temperature is ensured; meanwhile, the temperature controller can adjust the voltage of the semiconductor refrigerator and change the relative voltage on the positive lead and the negative lead of the semiconductor refrigerator, so that the voltage direction is changed, the relative voltage value between the positive lead and the negative lead of the temperature controller can be positive or negative, the wiring direction does not need to be changed when the environmental temperature is changed by a user, and the semiconductor refrigerator is automatically controlled to realize refrigeration/heating.
(3) The temperature controller adopts a digital display temperature controller, so that parameters such as voltage, temperature and the like of the temperature controller can be observed and set more conveniently; the temperature controller adopts a direct-current voltage mode, firstly calculates an output voltage, then converts the power supply voltage into the required output voltage by a voltage conversion device of the temperature controller, has small temperature control power fluctuation by adopting the mode, can realize the resolution of 0.01 ℃ and the stability of +/-0.01 ℃, simultaneously has an automatic setting function, can automatically calculate an optimized PID coefficient, simplifies the setting difficulty of the PID coefficient, and obtains the temperature control performance of high speed, small overshoot and less oscillation, thereby prolonging the service life of the semiconductor refrigerator.
(4) The anti-frosting assembly comprises a protective front cover, an air curtain, a base plate and a window clapboard which are fixedly connected in sequence, when a system to be measured needs to be calibrated, the window clapboard is drawn out, external air enters the air curtain and forms an air curtain, the convection heat exchange between air and a black body plate can be effectively prevented, the black body plate is effectively protected, and the surface frosting is avoided; when the measured system is calibrated, the window clapboard is immediately inserted into the protective front cover, so that the temperature error caused by introducing an optical window in the prior art is avoided, and the accuracy of the measuring result is ensured.
(5) The sealing gasket is arranged between the backing plate and the air curtain of the anti-frosting component, so that air can be effectively isolated, external air is prevented from entering the surface of the low-temperature surface source black body from the mounting gap between the air curtain and the backing plate, and the measurement accuracy is further improved.
(6) The air curtain of the anti-frosting component comprises the cavity with the small holes, and when nitrogen is filled into the air curtain, the nitrogen is sprayed out of the small holes, so that the air curtain formed on the surface of the surface source black body is more uniform, the convective heat exchange between air and the surface of the black body plate can be effectively prevented, the anti-frosting effect is further improved, and the defects of obvious surface temperature change and low temperature accuracy caused by directly blowing dry gas to the surface of the black body plate are avoided.
(7) The radiating assembly comprises a radiating fin assembly, a radiating fin cover plate, a radiating air duct, a radiating fan, radiating holes and an air outlet. Outside air flows through the radiating fin assembly from the radiating holes on the two sides of the shell under the action of the radiating fan, and is discharged from the air outlet at the rear end of the shell through the radiating air duct.
(8) The power supply module supplies power to the start-stop switch through the power supply interface, the start-stop switch supplies power to the switch power supply, and the start-stop switch controls the start and stop of the whole system, so that the whole power supply module is simple in design and safe to use.
(9) The thermal insulation assembly is further arranged, so that convection of the black plate and the semiconductor refrigerator with the outside air and heat transfer between the black plate and the shell are effectively insulated, and the measurement accuracy of the device when the device is used for infrared calibration is ensured.
(10) The black plate is made of aluminum materials, has good heat conduction performance, is uniformly distributed with a plurality of pyramidal bulges on the front surface, and has high effective emissivity.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference is now made to the following detailed description of the present disclosure taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a control schematic of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a right side view of the present invention;
FIG. 4 is a rear view of the present invention;
FIG. 5 is a schematic view of the internal structure of the present invention;
FIG. 6 is a top view of the internal structure of the present invention;
FIG. 7 is a schematic view of an air curtain configuration of an anti-frosting assembly of the present invention;
FIG. 8 is a perspective view of a black body plate of the present invention;
FIG. 9 is a right side view of the black body plate of the present invention.
The reference numbers in the drawings are:
the system comprises a shell 1, a communication interface 1-1, heat dissipation holes 1-2, an air outlet 1-3, a power supply interface 1-4, a start-stop switch 1-5 and fuses 1-6;
a black plate 2 and a bulge 2-1;
a semiconductor refrigerator 3;
a temperature control component 4, a temperature controller 4-1 and a temperature sensor 4-2;
the cooling structure comprises a cooling component 5, a cooling fin component 5-1, a cooling fin cover plate 5-2, a cooling air duct 5-3, a cooling fan 5-4 and a fan protective cover 5-5;
a power supply module 6 and a switching power supply 6-1;
the anti-frosting module 7, the protective front cover 7-1, the air curtain 7-2, the frame 7-2-1, the cavity 7-2-2, the small hole 7-2-3, the backing plate 7-3, the window partition plate 7-4, the joint 7-5 and the sealing gasket 7-6;
a heat insulation component 8, a heat insulation layer 8-1 and a heat insulation plate 8-2.
Detailed Description
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
(example 1)
The anti-frosting low-temperature surface source blackbody shown in fig. 1 to 9 comprises a casing 1, a blackbody plate 2, a semiconductor refrigerator 3, a temperature control component 4, a heat dissipation component 5 and a power module 6, wherein the blackbody plate 2, the semiconductor refrigerator 3, the heat dissipation component 5 and the power module 6 are arranged in the casing 1, the semiconductor refrigerator 3 and the heat dissipation component 5 are sequentially arranged at the rear end of the blackbody plate 2, the temperature control component 4 is in contact with the blackbody plate 2, the semiconductor refrigerator 3 is electrically connected with the temperature control component 4, and both the temperature control component 4 and the heat dissipation component 5 are electrically connected with the power module 6; the front end of the black body plate 2 is provided with an anti-frosting component 7 arranged on the shell 1, the temperature control component 4 is connected with an external computer and calculates according to PID parameters to adjust the power of the semiconductor refrigerator 3, and therefore the temperature stability of the low-temperature surface source black body is improved; meanwhile, the anti-frosting component 7 is arranged, so that the low-temperature surface source black body is effectively protected, surface frosting is avoided, the temperature accuracy of the low-temperature surface source black body can be improved, and the use is convenient.
Specifically, the shell 1 of the present embodiment is made of a steel plate with a thickness of 3mm and a material of Q235-a, and has good overall shape strength. The temperature control assembly 4 comprises a temperature controller 4-1 and a temperature sensor 4-2 electrically connected with the temperature controller 4-1, the temperature sensor 4-2 adopts a 10k1% B =3950 NTC thermistor, a plurality of different positions which are inserted into the black plate 2 are arranged for collecting the temperature of the black plate 2, a communication interface 1-1 electrically connected with the temperature controller 4-1 is arranged at the rear end of the shell 1, the communication interface 1-1 adopts RS232, and the temperature controller 4-1 is connected with an external computer through the communication interface 1-1. The temperature controller 4-1 is controlled by a computer, temperature correction is carried out on multiple temperature points, and the accuracy of the temperature is ensured; meanwhile, the temperature controller 4-1 can not only adjust the voltage of the semiconductor refrigerator 3, but also change the relative voltage of the positive and negative leads of the semiconductor refrigerator 3, so as to change the voltage direction, therefore, the relative voltage value between the positive and negative leads of the temperature controller 4-1 can be positive or negative, the wiring direction does not need to be changed when the environmental temperature changes by a user, and the semiconductor refrigerator 3 is automatically controlled to realize refrigeration/heating.
The temperature controller 4-1 is a digital display temperature controller and controls the semiconductor refrigerator 3 by adopting a direct current voltage mode, the model is TCM1031, and a display screen of the digital display temperature controller is fixedly installed at the front end of the shell 1, so that parameters such as voltage, temperature and the like of the temperature controller can be observed and set more conveniently. The temperature controller 4-1 adopts a direct-current voltage mode, firstly calculates an output voltage, and then a voltage conversion device of the temperature controller 4-1 converts a power supply voltage into the required output voltage, the temperature control power fluctuation adopting the mode is small, the resolution ratio is 0.01 ℃, the stability is +/-0.01 ℃, and meanwhile, the automatic setting function is provided, the optimized PID coefficient can be automatically calculated, the PID coefficient setting difficulty is simplified, the temperature control performance with high speed, small overshoot and less oscillation is obtained, and the service life of the semiconductor refrigerator 3 is prolonged.
The black plate 2, the semiconductor cooler 3 and the heat dissipation assembly 5 are sequentially fixedly installed at the inner front end of the housing 1. The present embodiment is further provided with a heat insulation assembly 8, which comprises a heat insulation layer 8-1 wrapped on the outer peripheral surfaces of the black body plate 2 and the semiconductor refrigerator 3, and a heat insulation plate 8-2 arranged between the front end of the black body plate 2 and the housing 1. The heat insulation board 8-2 is an FR-4 epoxy board, and has good machinability and excellent heat resistance and heat insulation performance. The heat insulation layer 8-1 is made of polyurethane and has excellent heat insulation performance. Through setting up thermal-insulated subassembly 8 effective isolated black board 2 and semiconductor cooler 3 and external air convection to and the heat transfer between black board 2 and casing 1, thereby ensure the measurement precision when this equipment is used for infrared calibration.
The heat dissipation assembly 5 comprises a heat dissipation fin assembly 5-1, a heat dissipation fin cover plate 5-2, a heat dissipation air duct 5-3 and a heat dissipation fan 5-4 which are fixedly arranged at the rear end of the semiconductor refrigerator 3 in sequence. The left side and the right side of the shell 1 are provided with heat dissipation holes 1-2, the rear end is provided with an air outlet 1-3 which is opposite to a heat dissipation air duct 5-3, and a fan protection cover 5-5 is fixedly arranged on the air outlet 1-3. The radiating fin assembly 5-1 and the radiating fin cover plate 5-2 extend to the radiating holes 1-2 on the left side and the right side, through holes are formed in the radiating fin cover plate 5-2, and the radiating air duct 5-3 is communicated with the radiating fin assembly 5-1 through the through holes. External air flows through the radiating fin assembly 5-1 from the radiating holes 1-2 on the two sides of the shell 1 under the action of the radiating fan 5-4 and is exhausted from the air outlet 1-3 at the rear end of the shell 1 through the radiating air duct 5-3, and because the radiating fin assembly 5-1 and the radiating fin cover plate 5-2 extend to the radiating holes 1-2 on the left side and the right side, the radiating area of the radiating fin assembly 5-1 is increased, heat is exhausted from the radiating air duct 5-3 as much as possible, diffusion is avoided, and therefore the semiconductor refrigerator 3 is guaranteed to be excellent in refrigerating and heating performance, high in temperature rising and falling speed and capable of improving equipment use performance.
The power module 6 comprises a switching power supply 6-1 fixedly installed at the bottom end inside the housing 1, and the switching power supply 6-1 of the embodiment is a 100W 220V to 24V direct current power supply. The rear end of the shell 1 is provided with power supply interfaces 1-4 and fuses 1-6, the front end is provided with start-stop switches 1-5, and the power supply interfaces 1-4, the start-stop switches 1-5 and the switching power supply 6-1 are electrically connected in sequence. The power supply interface 1-4 supplies power to the start-stop switch 1-5, the start-stop switch 1-5 supplies power to the switch power supply 6-1 and controls the start and stop of the whole system, and the switch power supply 6-1 supplies power to the temperature controller 4-1 and the cooling fan 5-4, so that the whole power supply module 6 is simple in design and safe to use.
The black body plate 2 is made of aluminum material, has good heat conduction performance, a plurality of pyramidal protrusions 2-1 are uniformly distributed on the front surface, and the effective emissivity is high and reaches 0.99 +/-0.01. The semiconductor refrigerator 3 can resist high temperature of 100 ℃, the maximum refrigerating capacity of 50 ℃ is 60.7W, the maximum temperature difference is 73 ℃, the maximum current is 6.6A, the maximum voltage is 16.9V, the flowing direction of heat is further changed by changing the current direction, so that the semiconductor refrigerator can refrigerate and heat, and the test requirements of the equipment on different environmental temperatures are met. And the cold end of the semiconductor refrigerator 3 is coated with heat-conducting silicone grease and is connected with the black body plate 2, and the hot end of the semiconductor refrigerator is coated with heat-conducting silicone grease and is connected with the radiating fin component 5-1.
The frosting prevention assembly 7 comprises a protective front cover 7-1, an air curtain 7-2 and a backing plate 7-3 which are fixedly connected in sequence, wherein the backing plate 7-3 is fixedly arranged on the shell 1 and positioned at the front end of the black plate 2, and the protective front cover 7-1, the air curtain 7-2 and the backing plate 7-3 are all white photosensitive resin 3D printing parts and are fixedly connected into a whole through four screws. The protective front cover 7-1 is provided with a window clapboard 7-4 which can be drawn up and down, the window clapboard 7-4 is a transparent organic glass cover, the transparency is high, the processing performance is good, the cost is low, and the surface state of the surface source black body can be observed conveniently. The top of the air curtain 7-2 is provided with an air inlet, the air inlet is provided with a connector 7-5, the connector 7-5 is a copper nickel plating MPL6-M6 right-angle pneumatic quick connector, and can be quickly connected with a PU pipe and a nylon pipe.
The upper end surface of the protective front cover 7-1 is provided with a through groove, the inner wall of the bottom is provided with a groove, and the window clapboard 7-4 passes through the through groove and is inserted into the groove to realize drawing and fixing. The air curtain 7-2 comprises a frame 7-2-1 and a cavity 7-2-2 arranged in the frame 7-2-1 and connected with the air inlet, and a plurality of small holes 7-2-3 communicated with the cavity 7-2-2 are arranged on the inner wall 7-2-1 of the frame. A sealing groove is formed in one side, close to the air curtain 7-2, of the backing plate 7-3, a sealing gasket 7-6 is arranged in the sealing groove, air is effectively isolated, and external air is prevented from entering the surface of the low-temperature surface source black body from a mounting gap between the air curtain 7-2 and the backing plate 7-3. In order to improve the sealing effect, the sealing gasket 7-6 of the embodiment is made of silica gel, so that the rebound resilience is good, and the physical property is excellent.
When a system to be measured needs to be calibrated, the window partition plate 7-4 is drawn out, nitrogen is preferably selected from the external air source in the embodiment through the air pipe connecting joint 7-5 and the external air source, the nitrogen enters the air curtain 7-2 through the air inlet and is sprayed out from each small hole 7-2-3, so that an even air curtain is formed on the surface of the surface source black body, the air and the surface source black body surface can be effectively prevented from carrying out convective heat exchange, and meanwhile, the defects that the surface temperature change of the surface source black body is obvious and the temperature accuracy is low due to the fact that air is directly blown dry to the surface of the surface source black body are avoided, and the measurement accuracy of the surface source black body of the.
During assembly, the anti-frosting component is arranged in front of a surface source black body, the heat insulation plate 8-2, the heat insulation layer 8-1, the radiating fin component 5-1, the radiating air duct 5-3, the radiating fan 5-4, the radiating fin cover plate 5-2, the semiconductor refrigerator 3, the temperature sensor 4-2, the black body plate 2 and the start-stop switch 1-5 form a shell front component; a rear shell assembly is formed by the fan protective cover 5-5, the communication interface 1-1, the fuse 1-6 and the power supply interface 1-4; the switching power supply 6-1 and the temperature controller 4-1 form a lower assembly of the shell; subassembly, casing behind subassembly, the casing behind the subassembly of preventing frosting and the casing 1 installation back constitute whole low temperature face source blackbody of preventing frosting, whole face source blackbody simple to operate, the later maintenance and the part of being convenient for are changed.
In the embodiment, the temperature controller 4-1 is adjusted by the computer to control the semiconductor refrigerator 3 to work, and the power of the semiconductor refrigerator 3 is adjusted by calculation according to the PID parameters, so that the temperature stability is improved; meanwhile, the anti-frosting component 7 arranged on the shell 1 is arranged at the front end of the black body plate 2, so that the low-temperature surface source black body is effectively protected, surface frosting is avoided, the temperature accuracy of the low-temperature surface source black body can be improved, the use is convenient, the temperature rise rate reaches 45 ℃/min, the temperature reduction rate reaches 11 ℃/min, and the temperature setting range is-20-70 ℃.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An anti-frosting low-temperature surface source black body is characterized in that: the temperature control device comprises a shell (1), and a black plate (2), a semiconductor refrigerator (3), a temperature control assembly (4), a heat dissipation assembly (5) and a power module (6) which are arranged in the shell (1), wherein the semiconductor refrigerator (3) and the heat dissipation assembly (5) are sequentially arranged at the rear end of the black plate (2), the temperature control assembly (4) is in contact with the black plate (2), the semiconductor refrigerator (3) is electrically connected with the temperature control assembly (4), and the temperature control assembly (4) and the heat dissipation assembly (5) are both electrically connected with the power module (6); the front end of the black plate (2) is provided with an anti-frosting component (7) arranged on the shell (1), and the temperature control component (4) is suitable for being connected with an external computer and calculating according to PID parameters to adjust the power of the semiconductor refrigerator (3).
2. The anti-frosting low-temperature surface-source black body as claimed in claim 1, wherein: the temperature control assembly (4) comprises a temperature controller (4-1) and a temperature sensor (4-2) electrically connected with the temperature controller (4-1), the temperature sensor (4-2) is provided with a plurality of plug-in boards to be inserted into different positions of the black board (2), the rear end of the shell (1) is provided with a communication interface (1-1) electrically connected with the temperature controller (4-1), and the temperature controller (4-1) is connected with an external computer through the communication interface (1-1).
3. The anti-frosting low-temperature surface-source black body as claimed in claim 2, wherein: the temperature controller (4-1) is a digital display temperature controller and controls the semiconductor refrigerator in a direct current voltage mode.
4. The anti-frosting low-temperature surface-source black body as claimed in claim 1, wherein: the anti-frosting component (7) comprises a protective front cover (7-1), an air curtain (7-2) and a backing plate (7-3) which are fixedly connected in sequence, and the backing plate (7-3) is fixedly arranged on the shell (1) and is positioned at the front end of the black plate (2); a window clapboard (7-4) is movably arranged on the protective front cover (7-1); and the air curtain (7-2) is provided with an air inlet, and external air enters the air curtain (7-2) through the air inlet to form an air curtain.
5. The anti-frosting low-temperature surface-source black body as claimed in claim 4, wherein: one side of the base plate (7-3) close to the air curtain (7-2) is provided with a sealing groove, and a sealing gasket (7-6) is arranged in the sealing groove.
6. The anti-frosting low-temperature surface-source black body as claimed in claim 4, wherein: the air curtain (7-2) comprises a frame (7-2-1) and a cavity (7-2-2) arranged in the frame (7-2-1) and connected with the air inlet, and the inner wall of the frame (7-2-1) is provided with a plurality of small holes (7-2-3) communicated with the cavity (7-2-2).
7. The anti-frosting low-temperature surface-source black body as claimed in claim 1, wherein: the heat dissipation assembly (5) comprises a heat dissipation fin assembly (5-1), a heat dissipation fin cover plate (5-2), a heat dissipation air channel (5-3) and a heat dissipation fan (5-4) which are fixedly arranged at the rear end of the semiconductor refrigerator (3) in sequence; the left side and the right side of the shell (1) are respectively provided with a heat dissipation hole (1-2), and the heat dissipation fin assembly (5-1) and the heat dissipation fin cover plate (5-2) extend to the heat dissipation holes (1-2) on the left side and the right side; the radiating fin cover plate (5-2) is provided with a through hole, the radiating air duct (5-3) is communicated with the radiating fin assembly (5-1) through the through hole, and the rear end of the shell (1) is provided with an air outlet (1-3) which is opposite to the radiating air duct (5-3).
8. The anti-frosting low-temperature surface-source black body as claimed in claim 1, wherein: the power module (6) comprises a switch power supply (6-1) fixedly mounted at the bottom end inside the shell (1), a power supply interface (1-4) electrically connected with the switch power supply (6-1) is arranged at the rear end of the shell (1), and a start-stop switch (1-5) electrically connected with the power supply interface (1-4) is arranged at the front end of the shell (1).
9. The anti-frosting low-temperature surface-source black body as claimed in claim 1, wherein: a heat insulation assembly (8) is arranged between the black plate (2) and the semiconductor refrigerator (3) and the shell (1); the heat insulation assembly (8) comprises a heat insulation layer (8-1) wrapped on the outer peripheral surfaces of the black body plate (2) and the semiconductor refrigerator (3) and a heat insulation plate (8-2) arranged between the front end of the black body plate (2) and the shell (1).
10. The anti-frosting low-temperature surface-source black body as claimed in claim 1, wherein: the black plate (2) is made of aluminum materials, and a plurality of pyramidal bulges (2-1) are uniformly distributed on the front surface of the black plate.
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| CN202110978290.7A CN113432730A (en) | 2021-08-25 | 2021-08-25 | Anti-frosting low-temperature surface source black body |
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| CN202110978290.7A CN113432730A (en) | 2021-08-25 | 2021-08-25 | Anti-frosting low-temperature surface source black body |
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