CN218301994U - Integrated photoelectric detector's heat radiation structure - Google Patents

Integrated photoelectric detector's heat radiation structure Download PDF

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Publication number
CN218301994U
CN218301994U CN202221417016.9U CN202221417016U CN218301994U CN 218301994 U CN218301994 U CN 218301994U CN 202221417016 U CN202221417016 U CN 202221417016U CN 218301994 U CN218301994 U CN 218301994U
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CN
China
Prior art keywords
fixedly connected
circuit board
integrated
vent
heat
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Expired - Fee Related
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CN202221417016.9U
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Chinese (zh)
Inventor
张科
李兰兰
郭大伟
王守亚
孙业国
余海军
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Huainan Normal University
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Huainan Normal University
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Priority to CN202221417016.9U priority Critical patent/CN218301994U/en
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Publication of CN218301994U publication Critical patent/CN218301994U/en
Expired - Fee Related legal-status Critical Current
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Abstract

The utility model is suitable for a photoelectric detector technical field provides an integrated form photoelectric detector's heat radiation structure, which comprises a housin, the inside detachably of casing transversely is provided with integrated circuit board, the top detachably of casing is provided with the closing cap, the bottom fixedly connected with connecting block of closing cap, the tower fin of bottom fixedly connected with of connecting block, the bottom fixedly connected with heat conduction piece of tower fin, the bottom of heat conduction piece be provided with the heat conduction silica gel that integrated circuit board laminated mutually, the surface of heat conduction piece just is located one side fixedly connected with backup pad of tower fin. The heat dissipation structure of the integrated photoelectric detector utilizes wind power to cool the heat on the surface of the tower-type radiating fin, so that the purpose of heat dissipation is achieved, the integrated circuit board cannot generate a high-temperature phenomenon under long-time work, the integrated photoelectric detector adapts to long-time work, and the service life of the integrated photoelectric detector is effectively prolonged.

Description

Integrated photoelectric detector's heat radiation structure
Technical Field
The utility model belongs to the technical field of photoelectric detector, especially, relate to an integrated form photoelectric detector's heat radiation structure.
Background
The principle of the photoelectric detector is that the conductivity of the irradiated material is changed due to radiation, the photoelectric detector has wide application in various fields of military and national economy, is mainly used for ray measurement and detection, industrial automatic control, photometric measurement and the like in a visible light or near infrared band, and is mainly used for missile guidance, infrared thermal imaging, infrared remote sensing and the like in an infrared band.
The existing integrated photoelectric detector has the defects that most elements are arranged on the circuit board, so that the circuit board with multiple elements is high in temperature after the photoelectric detector is used for a long time, the normal work of the elements is easily influenced by the high temperature, and the elements are easily damaged to a certain extent.
SUMMERY OF THE UTILITY MODEL
The utility model provides an integrated form photoelectric detector's heat radiation structure aims at solving when photoelectric detector after long-time use, can lead to the circuit board of multi-element to cause the problem of high temperature.
The utility model discloses a realize like this, a integrated form photoelectric detector's heat radiation structure, which comprises a housin, the inside detachably of casing transversely is provided with integrated circuit board, the top detachably of casing is provided with the closing cap, the bottom fixedly connected with connecting block of closing cap, the tower fin of bottom fixedly connected with of connecting block, the bottom fixedly connected with heat conduction piece of tower fin, the bottom of heat conduction piece be provided with the heat conduction silica gel that integrated circuit board laminated mutually, the surface of heat conduction piece just is located one side fixedly connected with backup pad of tower fin, the backup pad is provided with two sets ofly, and is two sets of be provided with a radiator fan between the backup pad, integrated circuit board's bottom is provided with heat radiation fins.
Preferably, the heat dissipation fins are provided with a plurality of groups, and the plurality of groups of heat dissipation fins are annularly distributed at the bottom of the integrated circuit board.
Preferably, a first vent opening is formed in one side of the shell, a second vent opening is formed in the other side of the first vent opening, a third vent opening is formed in the bottom of the shell in an arc shape, and filter screens are arranged inside the first vent opening, the second vent opening and the third vent opening.
Preferably, a motor is arranged on the inner side face of the filter screen inside the third ventilation opening, and fan blades located among the multiple groups of radiating fins are fixedly connected to an output shaft of the motor.
Preferably, the inner wall of the housing is located at two sides of the first ventilation opening and is fixedly connected with mounting frames, and a second cooling fan is arranged between the mounting frames.
Preferably, the bottom of the inner cavity of the shell is fixedly connected with a supporting seat, a thread groove is formed in the top of the supporting seat, and a bolt in threaded connection with the thread groove is rotatably and vertically arranged in the integrated circuit board in a penetrating mode.
Preferably, the two sides of the bottom of the shell are fixedly connected with fixing rods, and the bottom ends of the fixing rods are transversely and fixedly connected with mounting plates.
Advantageous effects
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses an integrated form photoelectric detector's heat radiation structure, lead to the connecting block, tower fin, heat conduction piece and heat conduction silica gel, heat radiation structure can be constituteed in backup pad and first radiator fan's setting, utilize heat conduction silica gel can give the heat conduction piece with the heat conduction that integrated circuit board produced, then utilize the temperature absorption of tower fin with the heat conduction piece, produce wind-force through first radiator fan's work at last, utilize wind-force to carry out the forced air cooling with the heat on tower fin surface, thereby reach radiating purpose, make integrated circuit board can not produce high temperature phenomenon under long-time work, thereby adapt to long-time work, effectively improve the device's life.
Drawings
FIG. 1 is a schematic sectional view of the front view of the structure of the present invention;
FIG. 2 is a schematic top view of the structure of the present invention;
fig. 3 is an enlarged schematic view of a structure a in fig. 1 according to the present invention.
In the figure: 1. a housing; 2. an integrated circuit board; 3. a closure cap; 4. connecting blocks; 5. a tower-type heat sink; 6. a heat conducting block; 7. heat conducting silica gel; 8. a support plate; 9. a first heat dissipation fan; 10. heat dissipation fins; 11. a first vent; 12. a second vent; 13. a third vent; 14. a filter screen; 15. a motor; 16. a fan blade; 17. a mounting frame; 18. a second heat dissipation fan; 19. a supporting seat; 20. a thread groove; 21. a bolt; 22. fixing the rod; 23. and (7) mounting the plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-3, the present invention provides a technical solution: a heat radiation structure of an integrated photoelectric detector comprises a shell 1, wherein an integrated circuit board 2 is detachably and transversely arranged inside the shell 1, a closed cover 3 is detachably arranged on the top of the shell 1, and the closed cover 3 can close the top of the shell 1, so that dust is prevented from entering the shell 1.
The bottom fixedly connected with connecting block 4 of closing cap 3, the tower fin 5 of bottom fixedly connected with of connecting block 4, the bottom fixedly connected with heat conduction piece 6 of tower fin 5, the bottom of heat conduction piece 6 is provided with the heat conduction silica gel 7 of laminating mutually with integrated circuit board 2, the surface of heat conduction piece 6 and one side fixedly connected with backup pad 8 that is located tower fin 5, backup pad 8 is provided with two sets ofly, is provided with first radiator fan 9 between two sets of backup pads 8.
The heat conducting silica gel 7 can conduct heat generated by the integrated circuit board 2 to the heat conducting block 6, then the tower type cooling fin 5 is used for absorbing the temperature of the heat conducting block 6, wind power is generated through the work of the first cooling fan 9, and the heat on the surface of the tower type cooling fin 5 is cooled through the wind power, so that the purpose of heat dissipation is achieved, the integrated circuit board 2 cannot generate a high-temperature phenomenon under the long-time work, the long-time work is adapted, and the service life of the device is effectively prolonged.
The bottom of the integrated circuit board 2 is provided with heat dissipation fins 10, and the heat dissipation fins 10 can collect high temperature generated at the bottom of the integrated circuit board 2 and then cool the integrated circuit board by other devices.
Further, the plurality of groups of heat dissipation fins 10 are arranged, and the plurality of groups of heat dissipation fins 10 are annularly distributed at the bottom of the integrated circuit board 2.
In this embodiment, the heat sink efficiency can be increased by using the annularly distributed heat dissipation fins 10, so that the heat dissipation effect is better.
Furthermore, a first vent 11 is provided at one side of the housing 1, a second vent 12 is provided at the other side of the first vent 11, a third vent 13 is provided at the bottom of the housing 1 in an arc shape, and a filter screen 14 is provided inside each of the first vent 11, the second vent 12 and the third vent 13.
In this embodiment, the first ventilation opening 11, the second ventilation opening 12 and the third ventilation opening 13 all play a role of ventilation, so that the outside air can exchange with the air inside the housing 1, further achieving a heat dissipation effect, avoiding the circulation of the hot air inside the housing 1, and preventing the impurities in the outside air from entering the inside of the housing 1 by using the filter screen 14.
Further, a motor 15 is disposed on an inner side surface of the filter screen 14 inside the third ventilation opening 13, and blades 16 located between the plurality of sets of heat dissipation fins 10 are fixedly connected to an output shaft of the motor 15.
In this embodiment, the motor 15 can drive the fan blade 16 to rotate when operating, and the fan blade 16 can disturb the air flow when rotating, so as to cool the heat collected in the surface of the heat dissipation fin 10.
Further, the inner wall of the housing 1 and both sides of the first ventilation opening 11 are fixedly connected with mounting brackets 17, and a second heat dissipation fan 18 is arranged between the two mounting brackets 17.
In this embodiment, the mounting frame 17 plays a role of fixing, and the second cooling fan 18 can blow air inside the casing 1 to the outside of the casing 1 by wind power when operating, thereby playing a role of ventilation, and reducing the temperature of the inner cavity of the casing 1.
Further, the equal fixedly connected with supporting seat 19 in bottom of casing 1 inner chamber, thread groove 20 has been seted up at the top of supporting seat 19, and the inside of integrated circuit board 2 rotationally vertically runs through be provided with thread groove 20 threaded connection's bolt 21.
In this embodiment, the bolt 21 may be screwed with the thread groove 20 when rotating, so as to fix the integrated circuit board 2, otherwise, the integrated circuit board 2 may be detached, so as to suspend the integrated circuit board 2 in the air, thereby facilitating heat dissipation.
Further, the both sides of casing 1 bottom are equal fixedly connected with dead lever 22, and the horizontal fixedly connected with mounting panel 23 in bottom of two dead levers 22.
In this embodiment, the mounting plate 23 may facilitate mounting and securing of the device.
The utility model discloses a theory of operation and use flow: when the shell 1 is used, heat generated by the integrated circuit board 2 can be conducted to the heat conducting block 6 by the heat conducting silica gel 7, then the temperature of the heat conducting block 6 is absorbed by the tower type radiating fin 5, wind power is generated by the operation of the first radiating fan 9, the heat on the surface of the tower type radiating fin 5 is air-cooled by the wind power, the purpose of heat dissipation is achieved, the air in the inner cavity of the shell 1 can be blown out to the outside of the shell 1 when the second radiating fan 18 works, the temperature in the inner cavity of the shell 1 is dissipated, the fan blade 16 can be driven to rotate when the motor 15 works, the heat dissipating fin 10 can be air-cooled when the fan blade 16 rotates, and the purpose of heat dissipation is further achieved.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (7)

1. A heat radiation structure of an integrated photoelectric detector is characterized in that: including casing (1), the inside detachably of casing (1) transversely is provided with integrated circuit board (2), the top detachably of casing (1) is provided with closing cap (3), bottom fixedly connected with connecting block (4) of closing cap (3), the tower fin (5) of bottom fixedly connected with of connecting block (4), the bottom fixedly connected with heat conduction piece (6) of tower fin (5), the bottom of heat conduction piece (6) be provided with heat conduction silica gel (7) that integrated circuit board (2) laminated mutually, the surface of heat conduction piece (6) just is located one side fixedly connected with backup pad (8) of tower fin (5), backup pad (8) are provided with two sets ofly, and are two sets of be provided with first radiator fan (9) between backup pad (8), the bottom of integrated circuit board (2) is provided with heat radiation fins (10).
2. The heat dissipation structure of an integrated photodetector of claim 1, wherein: the radiating fins (10) are provided with a plurality of groups, and the plurality of groups of radiating fins (10) are annularly distributed at the bottom of the integrated circuit board (2).
3. The heat dissipation structure of an integrated photodetector as claimed in claim 1, wherein: first vent (11) have been seted up to one side of casing (1), second vent (12) have been seted up to the opposite side of first vent (11), the bottom of casing (1) is the arc and has seted up third vent (13), the inside of first vent (11), second vent (12) and third vent (13) all is provided with filter screen (14).
4. The heat dissipation structure of an integrated photodetector of claim 3, wherein: the inner side face of the filter screen (14) inside the third ventilation opening (13) is provided with a motor (15), and fan blades (16) located among multiple groups of radiating fins (10) are fixedly connected to an output shaft of the motor (15).
5. The heat dissipation structure for an integrated photodetector as claimed in claim 4, wherein: the inner wall of casing (1) just is located equal fixedly connected with mounting bracket (17) in both sides of first vent (11), two be provided with second radiator fan (18) between mounting bracket (17).
6. The heat dissipation structure of an integrated photodetector of claim 1, wherein: the bottom of the inner cavity of the shell (1) is fixedly connected with a supporting seat (19), a thread groove (20) is formed in the top of the supporting seat (19), and a bolt (21) which is connected with the thread groove (20) in a threaded mode is rotatably and vertically arranged inside the integrated circuit board (2) in a penetrating mode.
7. The heat dissipation structure of an integrated photodetector of claim 1, wherein: the casing (1) both sides of bottom all fixedly connected with dead lever (22), two the horizontal fixedly connected with mounting panel (23) in bottom of dead lever (22).
CN202221417016.9U 2022-06-08 2022-06-08 Integrated photoelectric detector's heat radiation structure Expired - Fee Related CN218301994U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221417016.9U CN218301994U (en) 2022-06-08 2022-06-08 Integrated photoelectric detector's heat radiation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221417016.9U CN218301994U (en) 2022-06-08 2022-06-08 Integrated photoelectric detector's heat radiation structure

Publications (1)

Publication Number Publication Date
CN218301994U true CN218301994U (en) 2023-01-13

Family

ID=84788563

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221417016.9U Expired - Fee Related CN218301994U (en) 2022-06-08 2022-06-08 Integrated photoelectric detector's heat radiation structure

Country Status (1)

Country Link
CN (1) CN218301994U (en)

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Granted publication date: 20230113